Transcript
Page 1: Thin Wafer Handling Robot

Thin Wafer Handling Robot

Jordan Hall, Fang Li, Joel Neff, and Alex Podust

Page 2: Thin Wafer Handling Robot

• Background– Handling of thin silicon wafers for solar cells– Reducing handling stress and characterizing

residual stresses are part of manufacturing research

• Objective– Design a robot to move wafers between

conveyor and inspection station without dropping or imposing large gripping forces

– Minimize energy consumption and handling time

Page 3: Thin Wafer Handling Robot

Overall System

Page 4: Thin Wafer Handling Robot

Bernoulli Gripper

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Bernoulli Gripper Model

• Used an mass flow input to create a vertical “lift” force– Gripper force depends on

distance to wafer– Rubber pads keep wafer from

impacting gripper frame

• The friction of the pads keeps wafer “stuck” to the gripper as the robot accelerates

-1 -0.8 -0.6 -0.4 -0.2 00

0.05

0.1

0.15

0.2

rrel (m)

Forc

e grip

per (N

)

Gripper Force vs. Relative Distance

Page 6: Thin Wafer Handling Robot

Gripper Force Balance

Friction force is only active when the wafer is contacting the posts

Gripper – Modelica Code

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Gripper - Verification

0.0 2.5 5.00

10

20

30

40

50

60

Mas

s Fl

ow R

ate

(L/m

in)

Time (sec)

gripper_correct_lift.m_dot_in

0.0 2.5 5.0-0.05

0.00

0.05

0.10

0.15

0.20

[N]

Time (sec)

gripper_correct_lift.bernoulliForce

Wafer separates

WaferPick-up

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Gripper Model Challenges• Required text-based Modelica

modeling – No MultiBody sliding friction model– Required pneumatic->mechanical

energy conversion– Force balance and direction vectors

defined “from scratch.”

• Interaction between gripper and wafer was highly coupled; required in-depth Dymola experience

Fgripper

Ffriction

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Actuator

Electric MechanicalEMFV Torque

DC MOTOR

OutputController(PID) MotorCommand

+ -

AXIS CONTROLLER

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Chassis

Base

Rotating Joint

Lin. joint

Axis 1 θ

Rotating Joint

Rotating Joint

Rotating Joint

Arm 1

Arm 2

Arm 3

Axis 2 θ

Axis 3 mm

Axis 4 θ

Axis 5 θ

Gripper position

ROBOT ARM

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Model Limitations• Inflexibility - Path hard coded as joint angle

start and end values.• Multiple simplifying assumptions s.a.

– Motor– Gripper– Chassis– Cost of robot components not considered.

• Hard to determine safety factor for wafer flying off gripper.

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Results

Energy usage (J) vs time (s)

Gripper friction and lateral force (N) vs time (s)

Page 13: Thin Wafer Handling Robot

Lessons learned• Value of using simulation software to solve

engineering design problems• Gained appreciation for information

economics• Do not underestimate complexity of

modeling details of a system• How to make good decisions under

uncertainty


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