Transcript
Page 1: Track e   low voltage sram - adam teman bgu

May 4, 2011

Low Voltage SRAM Design

Challenges and Solutions

May 4, 2011

Adam Teman, Janna Mezhibovsky, Dr. Alexander FishLow Power Circuits and Systems Lab (LPC&S)

The VLSI Systems CenterBen-Gurion University

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Lecture Contents

• Introduction

• Standard SRAMs at Low Voltages

• Existing Solutions

• LPC&S SRAM Design Activities

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Introduction

• SRAMs are one of the main on-chip power consumers, often comprising 50% of silicon area and 50% of static power.

www.anandtech.comTotal cache size per chip

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Introduction

• The standard SRAM implementation is the 6T bitcell. Both write and read power are quadratically dependenton VDD.

M2 M5

M3

M1

M6

M4

BLBBL

Q QB

WL WL

2

read WL DD BL DD swing SAE C V C V V E

2 2

write WL DD BL DDE C V C V

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Introduction

• During hold cycles, the 6T SRAM presents both subthreshold (DIBL) and gate leakage.

• Both are exponentially dependent on supply voltage.

32

328 2 1 1

exp3

GBox B

B

GB

GB ox

Vm

IhqV t

(1 )

GS T DS DS

t t t

V V V V

nv v nv

subI e e e

DIBLGate Bias and

Oxide Thickness

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M2 M5

M3

M1

M6

M4

BLBBL

Q QB

WL WL

0 VDD

VDD VDD

M2 M5

M3

M1

M6

M4

BLBBL

Q QB

WL WL

0 VDD

VDDVDD

Introduction

• Cutoff Devices with VDS=VDD

suffer from DIBL.• Devices with VGB=VDD suffer

from Gate Leakage.

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Introduction

• The best way to aggressively reduce SRAM power is to lower the operating voltage.

– Quadratic reduction of Dynamic Power

– Exponential Reduction of DIBL

– Exponential Reduction of Gate Leakage

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Standard SRAMs at Low Voltages

• The positive feedback of the 6T structure provides strong bi-stability and large noise margins.

QB

[V

]

VDD

VDD0

Q [V]

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Standard SRAMs at Low Voltages

• However, under read and write operations, the noise margins are depleted.

QB

[V

]

VDD

VDD0

Q [V]

QB

[V

]

VDD

VDD0

Q [V]

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Standard SRAMs at Low Voltages

• Read and write accesses are ratioed operations and require two basic drive strength constraintsto succeed.

M2

M1

BL=VDD

Q=0

WL=VDD

QB=VDD

M2

M3

BL=0

Q=VDD

WL=VDD

QB=0

Read Constraint

K1>K2Write Constraint

K2>K3

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Standard SRAMs at Low Voltages

• Under strong-inversion operation, sizing the devices is usually sufficient.

• However, global and local mismatch cause loss of functionality at voltages under ~700mV-800mV

M2

M3

BL=0

Q=VDD

WL=VDD

QB=0

M2

M1

BL=VDD

Q=0

WL=VDD

QB=VDD

M2

M3

BL=0

Q=VDD

WL=VDD

QB=0

Read Constraint

K1>K2Write Constraint

K2>K3

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Existing Solutions

• The basic solution to the read margin problem is decoupling the readout path.

M2M5

M3

M1

M6

M4

WBLBWBL

QQB

WWLWWL

M8

M7

RWL

RBL

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Existing Solutions

• A differential decoupled readout provides better Sense Amplifier operation:

AL1 AR1

M3

M1

M5

M4

BL

QQB

WWL WWL

AR2

WL

NR

AL2

WL

NL

VGND

BLB

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Existing Solutions

• Write margin still limits 8T operation to ~700mV, therefore write assist techniques are required.

M2M6

M3

M1

M5

M4

BLBBL

QQB

WWLWWL

M8

M7

RWL

M9

M10

VVDD VVDDRBL

Virtual Supply

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Existing Solutions

• Word Line boosting and RSCE sizing have been implemented to improve 8T functionality.

M2M5

M3

M1

M6

M4

WBLBWBL

QQB

WWLWWL

M8

M7

RWL

RBL

Boosted WL

RSCE

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Existing Solutions

• Several readout path implementations have been proposed to fight off-row leakage.

QB

M8

M7

RWL

RBL

M9QB

QB

M8

M7

RWL

RBL

M9QB

M10 QB

M8

M7

RWL

RBL

M9

M10

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Our work

• Very few groups have tried to “think outside the box” and modify the internal cell structure.

• We have proposed an internal supply feedback concept that cuts off the supply to reduce internal leakage.

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Our work

• One example is the Quasi-Static RAM cell that floats the internal nodes, drastically reducing leakage.

• This and other solutionsare under intensiveexamination and testing.

M9

M4M1

M6M3

M5M2

WB

L

WB

LB

WW

L

WW

L

M7

M8

RW

L

RB

L

QBQRB

VVDD

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Questions?


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