Electro Etching Technology Probe PinVision Inspection System
World Wide SAE HAN MICRO TECH
Jinjeop Factory : 739-4, Palya-ri, Jinjeop-eup, Namyangju-si, Gyeonggi-do, Korea (Zip code : 472-868)TEL : +82-31-529-8800 FAX : +82-31-528-1345
Seongnam Factory : SK APT. Factory #214/#08(09), 223-28, Sandaewon 1-dong, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea (Zip code : 462-705)
TEL : +82-31-732-1770 FAX : +82-31-625-1704 E-MAIL : [email protected] 2009
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www.probepin.com
Sae han Micro Tech co., Ltd. www.probepin.com02 03
Greetings! I am Hak Jun Kim, CEO of Saehan Microtech Co., Ltd.Despite its short 20-year history, the Korean semiconductor industry has grown remarkably, greatly contributing to the development of the Korean economy as a core growth booster.As a venture company for semiconductor-related nanotechnology, Saehan Microtech Co., Ltd. manufactures Probe Pin, a key component for semiconductor inspection, and Vision Microsystem for ultra-microcomponent inspection and is doing all that it can to become a significant part of the development of the Korean semiconductor industry.
Through untiring efforts to come up with technological advancements, effective business strategies such as selection and concentration, and to establish strategic alliances and technical cooperation with advanced companies, Saehan Microtech Co., Ltd. expects to acquire up-to-date technologies and to develop extensive marketing networks.
Also Saehan Microtech Co., Ltd. will try to maximize its production techniques and to develop new value-added products. Through these efforts, we promise to become a real nanotechnology leader ensuring utmost satisfaction to its customers.We are counting on your continued interest in and support of Saehan Microtech Co., Ltd. On behalf of the whole family, thank you very much, and may God bless all of you.
Hak Jun KimCEO of Sae Han Micro Tech Co., Ltd.
Introduction CompanyCompany Information
CEO’s Greetings
Saehan Microtech Co., Ltd. is a high-tech venture enterprise that develops the critical parts of inspection equipment for memory semiconductors, such as probe pins, vision inspection systems, and micro springs for microrobots. Its market was dominated by imported products before its establishment. With its excellent products, Saehan Microtech Co., Ltd. has maintained a continuous revenue growth rate over the past few years since its foundation in October 1999.
Having begun with a 50% domestic-market share for its products in 1999, the year it commenced with succeeding in developing its products, Saehan Microtech Co., Ltd. now supplies its products to 80% of the domestic market. The U.S., Japan, and Taiwan are also major markets for its products, which Saehan Microtech Co., Ltd. has been exporting since August 2002, beginning with the U.S., which has source technologies for its products, to Japan and Taiwan, which have the biggest demand for its products.
Participating actively in the Industry-University-Research Consortium for advice regarding R&D and process reform, Saehan Microtech Co., Ltd. has also developed a vision inspection system based on its own technologies by hiring quality control experts, has raised the competitiveness of its products to the world-class level, and is dedicated to building its own brand image. Further, Saehan Microtech Co., Ltd. maintains major R&D performance records, such as the development of microprecision products and comprehensive inspection equipment, and takes part in national research projects supervised by the Ministry of Commerce, Industry and Energy and by the Ministry of Science and Technology.We will do our very best to grow as a strong and robust firm equipped with competitive quality and technologies that can fully satisfy the needs of our international and domestic customers.
Company History1999. 102000. 062002. 062003. 102003. 12
2004. 042005. 022005. 032005. 052006. 032006. 032007. 042008. 01
2008. 09
Founded Saehan Microtech Co., Ltd.
Was registered as a venture business
Obtained ISO9001 certification
Moved the Saehan Microtech Co., Ltd. to Jinjeop Factory
Obtained ISO14001 certificationCEO Hak Joon Kim was awarded “2003 Excellent Small and Medium Enterpriser”
Founded and obtained approval for Saehan Microtech Co., Ltd. R&D Center
Was approved as an INNO-BIz company
Founded Propin USA, its local subsidiary in the U.S.A.
Founded YOTOKU, its joint-venture corporation in Taiwan
Established the Saehan Microtech Co., Ltd. Sungnam branch
Was approved as an advanced technical center (ATC)
Was approved as a components and materials specialty company
Registered Domestic PatentPatent name: visual checking method for sheet-type devices
Expanded and moved the Saehan Microtech Co., Ltd. Sungnam branch
Company Mission and VisionMission We will contribute to advancing the national cutting-edge industry and to enhancing human civilization and welfare through the development and utilization of precision processing technology.
VisionWe will introduce the Initial Public Offering (IPO) and the Employee Stock Ownership Plan (ESOP) in 2012.
Vision DeclarationWe will advance our technology with much passion and effort, and will achieve continuous growth by training our human resources and meeting all our customers’ demands. In 2012, we will realize transparent administration by introducing IPO, and all our employees will become co-owners of the company through ESOP.
Sae han Micro Tech co., Ltd. www.probepin.com04 05
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Wire Etching Probe Shape
Wire Etching ProbeCantilever type
(Type A) (Type B)
Location Location
Wire Etching Probe Specification
Specification(type A)
W : TungstenR : RheniumN : NickelP : Plated
Taper Length(1.75㎜)
Needle Diameter (150㎛)
Needle Length (64㎜)
WRNP - 150 - 175 - 640
X - Position
Taper Diameter
Taper Length
Probe Length
Probe Diameter
①
②
③
④
⑤
ITEM
Name Dimension Acceptable Error
InspectionRemark
WRNP 150 - 175 - 640
175㎛ ~ 215㎛
67㎛
1.75㎛
64㎛
150㎛
※ If you want detail, please email to [email protected]
-
± 2㎛
± 100㎛
± 1㎛
± 5㎛
Distance from the tip to the positionwhere its Diameter is 30㎛.
Diameter of the Taper measured at 400㎛ from the 30㎛ Diameter location
Taper Length
Probe needle Length
Probe needle Diameter
Probessummary
Probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitthe testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a PCB and some form of contact elements, usually metallic, but possible use of other materials as well. Probe cards are broadly classified into Cantilever type, Vertical type, and MEMS type depending on shape and forms of contact elements.
MEMS TypeIn 2006 an electroforming section of R&D department in SHMT was settled and with a high technology, the electroforming section is carrying on a high performance plating.
Vertical TypeVertical probe is based on the well known cobra but substantially improved on alignment, planarity and reliability performances.
Cantilever TypeSHMT cantilever probe offers a suitable solution for a broad range of wafer test appliation. SHMT cantilever technology has been upgraded year by year reaching now a superior level.
Sae han Micro Tech co., Ltd. www.probepin.com06 07
Insulation Tubeless ProbeCantilever type
Full Coated Probe
Probe Length
Coating Length
Probe Diameter
CoatingThickness
Coatingmembrane
Probe
Coatingmembrane
Probe
Probe Length
Coating Length
Probe DiameterNon Coating LengthCoating
Thickness
Partial Coated Probe
Coating Probe SpecificationMaterial
Coating thickness
Probe diameter
Coating color
W, ReW
5㎛ ~ 30㎛
Ø80㎛ ~ Ø200㎛
Black, Red, Light Brown, Green
※ If you want detail, please email to [email protected]
Machine Grinding Probe Specification
Advantage• New material(high Electrical, Mechanical properties)• Low pad damage & particle
Application• Memories, Non-memories, Logic, Automotive, Imaging, Microprocessor
Mechanically Grinding ProbeCantilever type
※ If you want detail, please email to [email protected]
Manufacturing Process
Grinding Inspection
Paliney7, Neyoro G, BeCu
Ø70㎛~Ø300㎛, 25㎜~89㎜
1.0~4.0㎜,2.3°~6.0°(±0.2°)
7㎛↑ (±2㎛), Flat Tip
Available Materials
Diameters & Length
Taper Length & Angle
Tip Diameter & Tip Shape
Sae han Micro Tech co., Ltd. www.probepin.com08 09
Vertical ProbevertiCal type
Vertical Probe Shape
P7, BeCu
2.0, mil, 2.5mil, 3.0mil, 3.15mil, 4.0mil
30° & 60°(±1°)
Point tip, Flat tip, Spherical
Headed type, Headless type
2~3㎛±1㎛ (Parylene, Polyimide)
Vertical Probe Specification
P7 : Paliney7, BeCu : Beryllium Copper, 1mil : 25.4㎛※ If you want detail, please email to [email protected]
Applicable Material
Diameter
Tip angle & Shape
Tip shape
Head shape
Coating thickness
Head part
tip part
<Head Type> <Headless Type>
<Point tip> <Flat tip>
Advantage• Long life time • High electrical properties • Low particle
Application• Memories, logic, automotive, imaging, BGA, LCD panel devices with low pad damage requirements
head parT
bendinG
Tip
Bent ProbeCantilever type
Bent Probe Shape
Single bent probe
Bending Anlge : PASSReference Diameter : PASSBending Length : PASSTip Dia : PASS
Bending Anlge : 104.8Reference Diameter : 79.2Bending Length : 30.9Tip Dia : PASS
Two bent probe Inspection of bent probe
Double bent probe
Specification
※ If you want detail, please email to [email protected]
Spec.
Production range
Standard error
Material
Tip diameter
10㎛ ~ 40㎛
± 2㎛
Bending angle
90˚ ~ 150˚
± 1˚
Bending length
350㎛ ~ 1200㎛
± 15㎛
Tip shape
FlatRadius
Probe - Whole item
Sae han Micro Tech co., Ltd. www.probepin.com10 11
Blade Probeplate type
Manufacturing Process
Blade Probe Specification• Material : BeCu, BeNi, STS304, Phosphor Bronze, etc
Raw Material
Etching Stripping Inspection
PR Coating Exposure Development
Blade Probe Au plated Insulation coating
BeCu
BeNi
STS 304
H 210 ~ 250
HT Over 370
XHMS Over 330
TM Over 400
- -
Material Heat Treatment(Hv) Hardness Hole Length Min. Width Min. Round ±5㎛ ±10㎛ 20㎛ 30㎛
±5㎛ ±10㎛ 25㎛ 35㎛
±5㎛ ±10㎛ 25㎛ 40㎛
±10㎛ ±15㎛ 30㎛ 60㎛
±10㎛ ±20㎛ 50㎛ 120㎛ ±10㎛ ±20㎛ 50㎛ 180㎛
±10㎛ ±20㎛ 70㎛ 200㎛
±5㎛ ±10㎛ 20㎛ 20㎛
±5㎛ ±10㎛ 20㎛ 30㎛
±5㎛ ±10㎛ 25㎛ 35㎛
±15㎛ ±20㎛ 70㎛ 200㎛
Thickness(㎛)20253050100150200152025200
Advantage• Freely shape • Fine pitch probe • Supply shortly • Low particle
Application• Memory, Non-memory, Display
Wire ProbevertiCal type
Wire Probe Shape
Tungsten, Paliney7, Beryllium Copper
40㎛, 50㎛, 70㎛, 90㎛, 100㎛Flat tip, Round tip
Flat tip, Round tip, Taper tip
5~10㎛
Applicable Material
Diameter
Head Shape
Test Point Shape
Coating thickness
Head
W au-070-30 (HF-tr)Test point tip shape: round
head tip shape : Flat
pin Length : 30mm
pin diameter : 0.07mm
Surface : au plating
Material : Tungsten
test point
<Flat> <Round> <Flat> <Round> <Taper>
Wire Probe Specification
Applications• FPC, FPCB, TCP, COF Open/Short test
Sae han Micro Tech co., Ltd. www.probepin.com12 13
Fine Pitch Array ShapePhotolithography
Order Poducts
MEMS Probemems type
Advantage• Freely shape • Fine pitch probe • High - precision
Application• Memory, Non-memory, Display
Metal Blade Probeplate type
Metal Blade Shape
Probe
Blade
Advantage• Freely shape • Supply shortly
Advantage• Freely shape • Supply shortly
Application• LED, High-frequency test
Application• LED, High-frequency test
Specification Probe Sheet Material BeCu, W, ReW, P7 Sn Plated PhBz Thickness Ø80㎛ ~ Ø200㎛ 400㎛ Assembly SnPb SnPb Spec. Order Production Order Production
※ If you want detail, please email to [email protected]
Specification Probe Sheet Material BeCu, W, ReW, P7 Ceramic(Au patterning) Thickness Ø80㎛ ~ Ø200㎛ 250㎛ Assembly SnPb SnPb Spec. Order Production Order Production
Ceramic Blade ProbeCeramic Blade Shape
Substrate
Conductive Element
Probe
MEMS Probe Specification Pitch Thickness Precision Material Hardness Max. size
10㎛ ~ 10㎛ ~ 100㎛ ± 5% Ni, NiCo 400 ~ 450Hv 8”
Pitch = 30㎛, aspect ratio = 2:1 pitch = 40㎛, aspect ratio = 1.3:1 line = 6㎛, space = 4㎛
line = 6㎛, space = 4㎛ (1st & 2nd layer)
line = 15㎛, space = 25㎛ (4th layer)
A. Single layer
B. Multi layer
Pitch = 30㎛, aspect ratio = 3:1
Pitch = 20㎛, aspect ratio = 4.7:1
Stamp Metal mesh Micro gear
PR
wafer
PR
wafer
PR
wafer
15㎛
10㎛
15㎛
6㎛
6㎛
Ni/Ni alloy
Ni/Ni alloy
10㎛
47㎛
47㎛
20㎛20㎛
Sae han Micro Tech co., Ltd. www.probepin.com14 15
OEM Products Reliability Equipments
Bio-Medical Needle Probe
Auto Focus Spring
Measurement Device
Vision Inspection System
Reliability Test M/C
Specification Probe Shield Material W, ReW, P7, Pt, BeCu BeCu Dia. Ø50㎛ ~ Ø250㎛ Normal Assembly Epoxy Epoxy Spec. Order Production Order Production
Applications• High Frequency, Low-current, Low-capacitance
Specification Spec Material SUS, BeCu, MX215, YCuT, PhBr Thickness 25㎛ ~ 100㎛
Shape Order Production
Applications• Mobile phone camera module, Mobile vibrator, Slim speaker module
Specification Spec Electrode Stainless steel Insulator Teflon Length Order production Gauge 23G, 25G, 26G, 28G, 30G
Applications• Electromyography
Coaxial Cable Probe