dr. dongkai shangguan - meptec - ncap china-shangguan.pdf · soc cow wow tsv pe coc vity pitch 3 3d...
TRANSCRIPT
Dr. Dongkai Shangguan
CEO – National Center for Advanced Packaging
(NCAP China)
MEPTEC Semiconductor Roadmaps Conference
September 2013
3D Microelectronics Packaging:
Technology Development & Commercialization
1
NCAP Platform R&D; Commercialization; Services
NCAP Platform
TSV & Wafer Level Process
Line (8”/12”)
Advanced Substrate
Fabrication Line
Design & Simulation Platform
Packaging Assembly
Line
Test Platform
Reliability/FA Labs
• 2000𝑚2 Cleanroom
• Class 10/100/1,000/10,000
• 8”/12” wafer
Wuxi Headquarters
• 1000𝑚2 Cleanroom
• Class 1,000/10,000
Beijing Center
Influence Roadmap, Standards
Innovate R&D, IP
Incubate Transfer, incubation, commercialization
Impact Eco-system, Supply Chain
Focus Areas
SIP design & simulation
2.5D/3D IC Integration
High density WLP
RF & Opto-electronics
Test technology
Materials & equipment
technology
Industrialization
Reliability & FA
KGD ↑ SoC WoW CoW
TSV CoC F
PC
/ P
E
Cavity
Fin
e P
itch
3
3D SiP: Multi-tiered & Multi-faceted
(Illustration only)
Product
Smaller, Faster, Cooler, Cheaper
Technology
• Modularization
• Heterogeneous
Integration
• Functional Densification & Miniaturization
• Design guidelines & EDA tools • Cross domain
• Architecture & partition • Thermal management • Mechanical Reliability • Total optimization
from partitioned solutions to integrated platform solutions
• Equipment & tooling Alignment accuracy, …
• Warpage • Throughput / Yield • Metrology / Inspection methodology • Test methodology & equipment (BIST…)
• Cost (system cost, TCoO) • KGD • Multiple IC vendors • Multiple IC technologies • Process flow & partition • Inter-operability • Infrastructure • Standards & specifications • Convergence, Integration, and Business Model
• Wafer thinning & handling(<100um) • TSV forming & filling • RDL / Microbumps • Bonding / debonding • C2C, C2W, W2W • Underfill 4
Supply Chain • IDM / Fabless • EDA • Foundries • OSAT • Materials & equipment • R&D • Standards Bodies
Industry Challenges (2.5D/3D)
5
The Cost Factor Currently, cost is still a major barrier
– especially for high routing density applications
Current applications are primarily driven by high value/performance products, with limited volume
The main cost factor is equipment, followed by materials • Industry-wide collaboration is
needed to lower the total cost Interposer materials: silicon, glass,
organic, ceramic
Total Solution Design
Materials + Equipment + Process
Performance + CoO
Basic Unit Technology
Integrated Solution
Commercialization & System Product Application
Eco-System
