dram

28
PRESENTATION ON “DRAM”

Upload: rohitladdu

Post on 17-Jun-2015

487 views

Category:

Engineering


6 download

DESCRIPTION

THIS PPT IS ALL ABOUT THE DYNAMIC RAM.

TRANSCRIPT

Page 1: DRAM

PRESENTATION ON “DRAM”

Page 2: DRAM

“DRAM

(DYNAMIC RANDOM ACCESS MEMORY….)

Page 3: DRAM

WHY “DRAM”????

SRAM , may be volatile to use, but it is not the least expensive in significant densities.

In SRAM , each bit of memory requires between 4 & 6 transistors. When millions or billions of bits are required , the complexity of all those transistors becomes substantial.

Page 4: DRAM

CONCEPTS OF DRAM

In DRAM , the binary data is stored as charge in capacitor where the presence and absence of charge determines the value of stored bit . But data in capacitor cannot be stored for a long time because a capacitor holds an electrical charge for a limited amt. of time as the charge gradually drains away. DRAM cells require a periodic refreshing of the stored data .The use of capacitor as the primary storage device generally enables the DRAM cell to be realized on a much smaller area. Access devices or switches are used for RD/WR operations. DRAM arrays can achieve higher integration densities than SRAM arrays.

Page 5: DRAM

KEY FEATURES OF “DRAM”

A very efficient volatile storage element can be created with a capacitor & a single transistor , but that capacitor loses its contents soon after being charged.

We need to periodically refresh or update each DRAM bit before it completely loses its charge.

A single capacitor takes the place of multi-transistor latch. This significant reduction in bit complexity makes the DRAM more convenient to implement main memory in most computers.

Page 6: DRAM

6

Volatile Memory Comparison

SRAM Cell

Larger cell lower density, higher cost/bit No refresh required Simple read faster access

DRAM Cell

Smaller cell higher density, lower cost/bit

Needs periodic refresh, and refresh after read

Complex read longer access time

word line

bit line bit line

word line

bit line

The primary difference between different memory types is the bit cell.

addr

data

Page 7: DRAM

ONE TRANSISTOR DRAM CELL

Page 8: DRAM

ONE TRANSISTOR DRAM CELL

Here we use one transistor and one explicit capacitor. This cell has 1 RD/WR control and 1 I/O line .

The control line is controlled by the row address decoder.

Capacitors- C1=STORAGE CAPACITOR.

C2=PARASITIC COLUMN CAPACITOR.

Information stored between c1 and c2 . For READ operation, an elaborate read refresh ckt.

Has to be built because data read operation in one transistor DRAM cell is destructive.

For WRITE 0 operation the bit line (D) is pulled to logic 0 and the control line is pulled high by the row address decoder . The storage capacitor discharges through the access transistor resulting in a stored 0 bit.

Page 9: DRAM

“3 TRANSISTOR DRAM CELL”….

Page 10: DRAM

THREE TRANSISTOR DRAM CELL

This DRAM cell utilize a single transistor as the storage device and one transistor each for RD & WR access switches . The column pull up transistors and the column RD/WR circuitry is also there.

Here the binary data is stored in the form of charge in capacitor c1 . The cell has 2 control and two I/O lines , which separate RD & WR select lines make fast .

The storage transistor m2 is turn OFF or ON depending on the charge stored in c1 and the pass transistors m3 and m1 act as access switches for data WR & RD operations.

Page 11: DRAM

PRINCIPLE OF OPERATION

OF 4-T DRAM CELL…………..

Page 12: DRAM

“4-TRANSISTOR DRAM CELL”

Page 13: DRAM

“READ” & “WRITE” OPERATION OF 4-

Transistor DRAM cell

•“READ” and “WRITE “ operation of “4-T DRAM CELL” IS performed By W (write) ,R(read) & Data line signal.•IF write operation is not performed for a long time , the charge of the capacitor is lost due to leakage. Therefore refreshing is needed & its done by brief access of VDD to the cell. This is done by making T11& T12 ON.

Page 14: DRAM

OPERATIONS TO “READ” A DATA BIT FROM A DRAM STORAGE CELL….

Page 15: DRAM

1.The sense amplifiers are disconnected.

2. The bit-lines are precharged to exactly equal voltages that are in between high and low logic levels. The bit-lines are physically symmetrical to keep the capacitance equal, and therefore the voltages are equal.

3. The precharge circuit is switched off. Because the bit-lines are relatively long, they have enough capacitance to maintain the precharged voltage for a brief time. This is an example of dynamic logic.

4. The desired row's word-line is then driven high to connect a cell's storage capacitor to its bit-line. This causes the transistor to conduct, transferring charge between the storage cell and the connected bit-line. If the storage cell's capacitor is discharged, it will greatly decrease the voltage on the bit-line as the precharge is used to charge the storage capacitor. If the storage cell is charged, the bit-line's voltage only decreases very slightly. This occurs because of the high capacitance of the storage cell capacitor compared to the capacitance of the bit-line, thus allowing the storage cell to determine the charge level on the bit-line.

Page 16: DRAM

5.The sense amplifiers are connected to the bit-lines. Positive feedback then occurs from the cross-connected inverters, thereby amplifying the small voltage difference between the odd and even row bit-lines of a particular column until one bit line is fully at the lowest voltage and the other is at the maximum high voltage. Once this has happened, the row is "open“.

6. All storage cells in the open row are sensed simultaneously, and the sense amplifier outputs latched. A column address then selects which latch bit to connect to the external data bus. Reads of different columns in the same row can be performed without a row opening delay because, for the open row, all data has already been sensed and latched.

7.While reading of columns in an open row is occurring, current is flowing back up the bit-lines from the output of the sense amplifiers and recharging the storage cells. This reinforces (i.e. "refreshes") the charge in the storage cell by increasing the voltage in the storage capacitor if it was charged to begin with, or by keeping it discharged if it was empty. Note that due to the length of the bit-lines there is a fairly long propagation delay for the charge to be transferred back to the cell's capacitor. This takes significant time past the end of sense amplification, and thus overlaps with one or more column reads.

Page 17: DRAM

8.When done with reading all the columns in the current open row, the word-line is switched off to disconnect the storage cell capacitors (the row is "closed") from the bit-lines. The sense amplifier is switched off, and the bit lines are precharged again.

FINISHED WITH “READING”

OPERATION….

Page 18: DRAM

OPERATION TO “WRITE”A DATA BIT INTO MEMORY….

Page 19: DRAM

To store data, a row is opened and a given column's sense amplifier is temporarily forced to the desired high or low voltage state, thus causing the bit-line to charge or discharge the cell storage capacitor to the desired value. Due to the sense amplifier's positive feedback configuration, it will hold a bit-line at stable voltage even after the forcing voltage is removed. During a write to a particular cell, all the columns in a row are sensed simultaneously just as during reading, so although only a single column's storage-cell capacitor charge is changed, the entire row is refreshed (written back in).

Page 20: DRAM

Initially let T1 is ON & T2 is OFF….Then capacitor C1 is charged up to

voltage Vc1>Vt & capacitor C2 is at voltage Vc2= 0V ( because T2 is OFF).

When refresh signal is given ….during this refresh interval VDD is applied through T12 , T6 & C1. Since T2 is off ,so all current goes through C1,allowing to replenish (recover) any charge lost due to leakage.

Page 21: DRAM

DIMM (Dual Inline Memory Module)

The 168-pin DIMM is the most popular DRAM package in use today◦144-pin SO-DIMMs (small outline) are used

in laptops.◦Extra pins to handle functions such as

buffering and ECC

Page 22: DRAM

VARIETIES OF DRAM….

1.Synchronised DRAM (SDRAM).2.Rambus DRAM (RDRAM).

Page 23: DRAM

“SDRAM”

SDRAM (synchronous dynamic RAM) are tied to the system clocks◦ Synchronized with system clock◦ SDRAM is always a DIMM.◦ Wide number of pins ◦ Small-outline DIMM (SO-DIIMM) used on laptops◦ Faster than DRAMs

Page 24: DRAM

“RDRAM”

RDRAM (Rambus DRAM) is a new type of RAM ◦Speeds of up to 800 MHz◦Comes on sticks called RIMMs◦184-pin for desktops and 160-pin SO-

RIMM for laptops

Page 25: DRAM

ADVANTAGES OF “DRAM”1.LESS POWER DISSIPATION.2.HIGH INTEGRATION DENSITY.3.LESSER AREA REQUIRED.4.LOW COST.5.HIGH RELIABILTY.

Page 26: DRAM

DISADVANTAGES OF “DRAM”….INTERSIGNAL COUPLING.

Page 27: DRAM

ANY QUERY????

Page 28: DRAM

THANK YOU !!!!!