Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

a4 series

2

a4 series

Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

Wafer production

New generation of harsh duty process pumps

Pfeiffer Vacuum introduces the new A4 series. Harsh duty processes in semiconductor production always provide new challenges for vacuum pumps. Based on the proven and energy efficient multi-stage Roots technology, the A4 series offers a wide range of dry pump solutions, with different pumping speeds from 100 to 2,300 m3/h. Compared to previous process pumps, the corrosion and by-product condensation resistance have been increased significantly to address the latest requirements of 20 nm technology nodes and below. With an extended process lifetime - associated with a low power consumption - the A4 series pumps are counted among those with the lowest cost of ownership in the market.

Complete solutions for multiple applications

Our new A4 series comprises two product lines which are fully compatible with pumps from predecessor series. You have the choice: We offer three pump models dedicated to non-critical applications and ten different models for even the harshest processes in critical applications.

Extended operating temperature range

The pumps are equipped with an extended temperature management covering low and high operating temperature to prevent by-product deposition or cracking within the pumping stages. Associated with high temperature precision bearings, this results in enhanced process reliability.

High corrosion resistance Using corrosion-resistant materials, the lifetime of our A4X series pumps has drastically improved - up to a factor 2 on some processes. This makes these dry pumps the optimum choice for demanding CVD and etch processes.

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Customer benefits ■ High energy efficiency thanks to multi-stage Roots technology, high efficiency motors and limited use of electrical heaters

■ Wide operating temperature range protects the pump against precursor cracking or condensable deposition

■ Corrosion resistant materials for increased lifetime ■ High MTBF and low cost of ownership ■ High particle tolerance increases tool uptime ■ Extended monitoring functionalities provide

better control of pump conditions ■ Semi S2 and UL compliant

The most energy efficient solution for CVD applications

Thanks to its multi-stage Roots technology and high efficiency motors, the power consumption of the A4 series under process operation is amongst the lowest of its class. Combined with the idle mode capability and user-friendly rotational speed adjustments, the usage of these dry pumps supports an optimal reduction of operating costs.

Intelligent Equipped with a new sophisticated monitoring system, the A4 series includes new functionalities to improve trouble shooting and prevent wafer scrap during process operation.

Low maintenance Through the improved particle tolerance, corrosion and condensation resistance, the maintenance intervals and the lifetime of the pumps could be extended, which means an additional reduction of operating costs. There is no required on-site routine maintenance.

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Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

Dimensions

a4 series

66865

50

983

542 371

911

926

A

B

C

50

65 66857

8

539

723 189

596

171

284

388

788

775

50

65 668

845

638 274

171

284

388

Dimensions in mm

A 124 HA 204 H/X

A 604 HA 804 H/X

A 1204 HA 1504 H/XA 1804 H/XA 2404 H/X

A B CA 1204 H 388 171 284

A 1504 H/X 388 171 284

A 1804 H/X 388 171 284

A 2404 H/X 544 213 440

A 204 H/X, A 804 H/X, A 1504 H/X, A 1804 H/X, A 2404 H/XFor critical applications (Harsh/Extreme)

a4 series

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Pumping speed

A 124 H, A 604 H, A 1204 HFor non-critical applications

Pu

mp

ing

sp

eed

[m

3/h

]P

um

pin

g s

pee

d [

m3/h

]

Pressure [hPa]

Pressure [hPa]

No N2 purge

A 124 H

A 604 H

A 1204 H

A4H pumping speed

1·10-4 1·10-3 1·10-2 1·10-1 1·100 1·101 1·102 1·103

Pu

mp

ing

sp

eed

(m

3 /h

)

Inlet pressure (hPa)

1

10

100

1000

10000

1·10-4 1·10-3 1·10-2 1·10-1 1·100 1·101 1·102 1·103

Pu

mp

ing

sp

eed

(m

3 /h

)

Inlet pressure (hPa)

1

10

100

1000

10000

A4H/X pumping speed No purge

A 204 H/X

A 804 H/X

A 1504 H/X

A 1804 H/X

A 2404 H/X

Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

A 204 H/X A 804 H/X A 1504 H/X A 1804 H/XA 2404 H/X

A 124 H A 604 H A 1204 H

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a4 series

Technical data

Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

Pump type A 124 H A 604 H A 1204 H A 204 H / A 204 X A 804 H / A 804 X A 1504 H / A 1504 X A 1804 H / A 1804 X A 2404 H / A 2404 XMax. Peak pumping speed – N2 110 m3/h 560 m3/h 1,150 m3/h 160 m3/h 700 m3/h 1,200 m3/h 1,700 m3/h 2,300 m3/h

Maximum Ultimate pressure (No Purge) 2 · 10-2 hPa 2 · 10-3 hPa 1 · 10-3 hPa 5 · 10-2 hPa 4 · 10-3 hPa 4 · 10-3 hPa 4 · 10-3 hPa 4 · 10-3 hPa

Maximum ultimate pressure (50 slm Purge) 1 · 10-1 hPa 6 · 10-3 hPa 6 · 10-3 hPa 2 · 10-1 hPa 9 · 10-3 hPa 9 · 10-3 hPa 9 · 10-3 hPa 9 · 10-3 hPa

Max continuous inlet flow at full rotational speed 80 slm 60 slm 55 slm 150 slm 100 slm 100 slm 70 slm 30 slm

Power supply 200–230 V / 380–480 V, 3 phases ± 10%, 50/60 Hz 200–230 V / 380–480 V, 3 phases ± 10%, 50/60 Hz

Power consumption at ultimate pressure No exhaust heater

1.5 kW 2.0 kW 2.3 kW 1.8 kW 2.3 kW 2.6 kW 2.6 kW 2.6 kW

Max. exhaust overpressure 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa

Cooling water flow 2 – 3 l/mn 2.5 – 4 l/mn 2.5 – 4 l/mn 2 – 4 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn

Cooling water temperature 1) 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C

Water connect 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT

N2 purge flow 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm

Operating temperature 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C

Inlet flange DN 50 ISO-KF DN 100 ISO-K DN 160 ISO-K DN 50 ISO-KF DN 100 ISO-K DN 160 ISO-K DN 160 ISO-K DN 160 ISO-K

Exhaust flange DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF

Dimensions

Length (to exhaust flange) 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm

Width 388 mm 388 mm 388 mm 388 mm 388 mm 388 mm 388 mm 544 mm

Height (to inlet flange) 578 mm 775 mm 911 mm 578 mm 775 mm 911 mm 911 mm 911 mm

Weight 250 kg 370 kg 530 kg 260 kg 380 kg 540 kg 540 kg 640 kg

Maximum vibration level at pump inlet flange < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s

Maximum noise level (at ultimate pressure) < 65 dB(A) < 68 dB(A) < 69 dB(A) < 65 dB(A) < 68 dB(A) < 69 dB(A) < 69 dB(A) < 69 dB(A)1) Subject to pump T° setting

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Pump type A 124 H A 604 H A 1204 H A 204 H / A 204 X A 804 H / A 804 X A 1504 H / A 1504 X A 1804 H / A 1804 X A 2404 H / A 2404 XMax. Peak pumping speed – N2 110 m3/h 560 m3/h 1,150 m3/h 160 m3/h 700 m3/h 1,200 m3/h 1,700 m3/h 2,300 m3/h

Maximum Ultimate pressure (No Purge) 2 · 10-2 hPa 2 · 10-3 hPa 1 · 10-3 hPa 5 · 10-2 hPa 4 · 10-3 hPa 4 · 10-3 hPa 4 · 10-3 hPa 4 · 10-3 hPa

Maximum ultimate pressure (50 slm Purge) 1 · 10-1 hPa 6 · 10-3 hPa 6 · 10-3 hPa 2 · 10-1 hPa 9 · 10-3 hPa 9 · 10-3 hPa 9 · 10-3 hPa 9 · 10-3 hPa

Max continuous inlet flow at full rotational speed 80 slm 60 slm 55 slm 150 slm 100 slm 100 slm 70 slm 30 slm

Power supply 200–230 V / 380–480 V, 3 phases ± 10%, 50/60 Hz 200–230 V / 380–480 V, 3 phases ± 10%, 50/60 Hz

Power consumption at ultimate pressure No exhaust heater

1.5 kW 2.0 kW 2.3 kW 1.8 kW 2.3 kW 2.6 kW 2.6 kW 2.6 kW

Max. exhaust overpressure 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa 1,200 hPa

Cooling water flow 2 – 3 l/mn 2.5 – 4 l/mn 2.5 – 4 l/mn 2 – 4 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn 2.5 – 5 l/mn

Cooling water temperature 1) 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C 10 to 35 °C

Water connect 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT 3/8 NPT

N2 purge flow 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm 10 to 120 slm

Operating temperature 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C 5 to 40 °C

Inlet flange DN 50 ISO-KF DN 100 ISO-K DN 160 ISO-K DN 50 ISO-KF DN 100 ISO-K DN 160 ISO-K DN 160 ISO-K DN 160 ISO-K

Exhaust flange DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF DN 40 ISO-KF

Dimensions

Length (to exhaust flange) 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm 962 mm

Width 388 mm 388 mm 388 mm 388 mm 388 mm 388 mm 388 mm 544 mm

Height (to inlet flange) 578 mm 775 mm 911 mm 578 mm 775 mm 911 mm 911 mm 911 mm

Weight 250 kg 370 kg 530 kg 260 kg 380 kg 540 kg 540 kg 640 kg

Maximum vibration level at pump inlet flange < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s < 0.1 g / 1.5 mm/s

Maximum noise level (at ultimate pressure) < 65 dB(A) < 68 dB(A) < 69 dB(A) < 65 dB(A) < 68 dB(A) < 69 dB(A) < 69 dB(A) < 69 dB(A)1) Subject to pump T° setting

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a4 series

Order number guide A4 series

Energy efficient dry multi-stage Roots process pumps for all semiconductor and coating applications

a – VersionH: HarshX: Extreme

b – Pump modelA: A 204B: A 804C: A 1504D: A 1804E: A 124F: A 604G: A 1204H: A 2404

c – Application4: Large volume1)

7: Standard

e – Functional block temperature managementS: STD version (STD)L: ELT version (Cold)H: EHT version (Hot)

f – Roots pump temperature managementS: STD version (STD)L: ELT version (Cold)H: EHT version (Hot)0: NA (no Roots)

g – Voltage1: Low voltage 60 Hz6: High voltage 60 Hz

j – Inlet flange connection0: Without1: DN 50 ISO-KF

k – Roots by-pass0: NA (no Roots)1: With standard by-pass

A4 a b c C e f g 6 1 j k 1 0

Pro

du

ct r

ang

e

Ver

sion

Pu

mp

mod

el

Ap

plic

atio

n

Res

erve

d

Fun

ctio

nal

blo

ck

tem

per

atu

re m

anag

emen

t

Roots

pu

mp

tem

per

atu

re m

anag

emen

t

Volt

age

Res

erve

d

Res

erve

d

Inle

t fl

ang

e co

nn

ecti

on

Roots

by-

pas

s

Res

erve

d

Res

erve

d

A4

H or X

A 4 C S, L, H 0 1, 6 6 1 1 0 1 0

A 7 C S, L, H 0 1, 6 6 1 1 0 1 0

B 4 C S,L,H S 1, 6 6 1 0 1 1 0

B 7 C S, L, H S 1, 6 6 1 0 1 1 0

C 4 C S, L, H S, L, H 1, 6 6 1 0 1 1 0

C 7 C S, L, H S, L, H 1, 6 6 1 0 1 1 0

D 4 C S, L, H S, L, H 1, 6 6 1 0 1 1 0

D 7 C S, L, H S, L, H 1, 6 6 1 0 1 1 0

H 7 C S, L, H S or H 1, 6 6 1 0 1 1 0

H

E 4 C S 0 1, 6 6 1 1 0 1 0

E 7 C S 0 1, 6 6 1 1 0 1 0

F 4 C S S 1, 6 6 1 0 1 1 0

F 7 C S S 1, 6 6 1 0 1 1 0

G 7 C S S or H 1, 6 6 1 0 1 1 0

1) Large volume versions:A 124 and A 604: max. 5 m3 chamber volumeA 204, A 804, A 1504, A 1804: max. 50 m3 chamber volume

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Order number matrix A4 series Order number A4 a b c C e f g 6 1 j k 1 0Version a

Harsh H

Extreme X

Pump model b

A 204 A

A 804 B

A 1504 C

A 1804 D

A 124 E

A 604 F

A 1204 G

A 2404 H

Application c

Large volume1) 4

Standard 7

Functional block temperature management e

STD version (STD) S

ELT version (Cold) L

EHT version (Hot) H

Roots pump temperature management f

STD Version S

Cold Version L

Hot Version H

NA (no Roots) 0

Voltage g

Low voltage 60 Hz 1

High voltage 60 Hz 6

Inlet flange connection j

Without 0

DN 50 ISO-KF 1

Roots by-pass k

NA (no Roots) 0

With standard by-pass 11) Large volume versions:A 124 and A 604: max. 5 m3 chamber volumeA 204, A 804, A 1504, A 1804: max. 50 m3 chamber volume

All d

ata

subj

ect t

o ch

ange

with

out p

rior n

otic

e. P

M 0

004

PEN

(Jan

uary

201

6/10

)

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www.pfeiffer-vacuum.com

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