ECE 300 Microprocessor

Project MSP 430

Group MembersGroup Members

Demetric Banahene Demetric Banahene

David FishDavid Fish

Zack PannellZack Pannell

ObjectivesObjectives

The purpose of this project is multi-fold. To learn to interpret a printed circuit board layout. To learn some basic skills of making ultra-fine solder connections. To link files to form a project and compile and link the programs of the project. To learn the basics of using the debugging tool, C-Spy, of the IAR Software to program the boardTo select a proper temperature sensor.

Board Components - ChipBoard Components - Chip

The first component that was soldered The first component that was soldered onto the board was the MSP430 onto the board was the MSP430 Microprocessor Chip using the provided Microprocessor Chip using the provided Microscope.Microscope.This was done by aligning the chip with This was done by aligning the chip with the circuit traces and keeping it stable with the circuit traces and keeping it stable with a tiny bit of flux.a tiny bit of flux.There were 100 solder connections which There were 100 solder connections which proved to be difficult at first.proved to be difficult at first.

Board Components-LCD DisplayBoard Components-LCD Display

The LCD Display had 40 pins to solder.The LCD Display had 40 pins to solder.

It was hard to line up the pins to fit in the It was hard to line up the pins to fit in the slots on the board.slots on the board.The holes on the board sucked the solder down into board.

Board Components – Resistor and Board Components – Resistor and CapacitorsCapacitors

These components These components were placed on the were placed on the board and held in board and held in place by a small place by a small amount of flux.amount of flux.

They were then They were then soldered down.soldered down.

C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4 0.1 uf C5 0.1 uf C6 10 uf (polarized) C9 1.0 uf C10 0.1 uf R5 47 kohms

Board Components- Other partsBoard Components- Other parts

The components were placed on the board in the following order: Push button switch, voltage regulator, 5 volt input plus, slider switch, JTAG connector, and finally the 32.7 kHz crystal.

These parts were soldered onto the board.These parts were soldered onto the board.

Board Components – Banana Board Components – Banana Jacks and Stand OffsJacks and Stand Offs

Holes were drilled into the board to make Holes were drilled into the board to make room for the two banana jacks and four room for the two banana jacks and four stand offs.stand offs.

The parts were then screwed in through The parts were then screwed in through the holes.the holes.

Programming the ChipProgramming the Chip

The software given in the kit was installed.The software given in the kit was installed.The files provided by Dr. Green, The files provided by Dr. Green, lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c, were placed in a designated project folder.The MSP430 Flash emulation tool was connected to the board and the computer.A new project was created and the procedure in the project manual was followed.

Temperature SensorTemperature SensorThe AD590LH was selected.The AD590LH was selected.

Specifications:Specifications:

Output Type:Output Type: Analog Analog

Sensor Output:Sensor Output: +1 µA/°K+1 µA/°K

Supply Voltage Range:Supply Voltage Range: +4V to +30V+4V to +30V

Temp Range(s):Temp Range(s): -55 to +150-55 to +150

AD590 Pin Diagram

Temperature SensorTemperature Sensor

The temperature sensor circuit was built using The temperature sensor circuit was built using the following:the following: AD590LH temperature sensorAD590LH temperature sensor 1000 ohm potentiometer1000 ohm potentiometer 100 ohm potentiometer100 ohm potentiometer 1000 ohm resistor1000 ohm resistor LM741 Op AmpLM741 Op Amp 10,000 ohm resistor10,000 ohm resistor 1800 ohm resistor1800 ohm resistor 2 9-Volt Batteries2 9-Volt Batteries

Calibrating the SensorCalibrating the Sensor

The 100 ohm potentiometer was adjusted The 100 ohm potentiometer was adjusted until the output was (273 + until the output was (273 + °°C) mVC) mV

The 1000 ohm potentiometer was adjusted The 1000 ohm potentiometer was adjusted until the circuit produced a gain of 5.until the circuit produced a gain of 5.

Programming the BoardProgramming the Board

The files lcd.c, delay.c, sensor.c were The files lcd.c, delay.c, sensor.c were compiled and flashed to the board.compiled and flashed to the board.

The banana jacks were connected from The banana jacks were connected from the sensor to the board.the sensor to the board.

The temperature was then displayed on The temperature was then displayed on the LCD screen in both Fahrenheit and the LCD screen in both Fahrenheit and Celsius.Celsius.

Temperature SensorTemperature Sensor

The temperature The temperature sensor took sensor took approximately 8 approximately 8 cycles (40 seconds) cycles (40 seconds) to settle to the correct to settle to the correct temperature.temperature.

This can be seen in This can be seen in the graph to the right.the graph to the right.

Temperature Settling

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0 20 40 60 80 100 120 140

Time (s)

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What we learnedWhat we learned

How to solderHow to solderHow to use a microscope to make ultra-How to use a microscope to make ultra-fine solder connectionsfine solder connectionsCircuit troubleshootingCircuit troubleshootingHow to use the IAR Systems toolsHow to use the IAR Systems toolsPatiencePatienceA basic understanding, at a first level, on A basic understanding, at a first level, on how several aspects of engineering are how several aspects of engineering are brought together to form a useful systembrought together to form a useful system

The Completed Board and SensorThe Completed Board and Sensor