ee130/230a discussion 13

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EE130/230A Discussion 13 Peng Zheng 1

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EE130/230A Discussion 13. Peng Zheng. Thin-Body MOSFET:. Gate. Gate. Source. Drain. “Silicon-on-Insulator” (SOI) Wafer. Buried Oxide. Substrate. Why New Transistor Structures?. Off-state leakage (I OFF ) must be suppressed as L g is scaled down - PowerPoint PPT Presentation

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Page 1: EE130/230A Discussion  13

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EE130/230A Discussion 13

Peng Zheng

Page 2: EE130/230A Discussion  13

Why New Transistor Structures?• Off-state leakage (IOFF) must be suppressed as Lg is scaled down

– allows for reductions in VT and hence VDD

• Leakage occurs in the region away from the channel surface

Let’s get rid of it!

DrainSource

Gate

Lg

Thin-BodyMOSFET:

Buried Oxide

Source Drain

Gate

Substrate

“Silicon-on-Insulator” (SOI)

Wafer

2

Page 3: EE130/230A Discussion  13

Thin-Body MOSFETs• IOFF is suppressed by using an adequately thin body region.

– Body doping can be eliminated higher drive current due to higher carrier mobility

Ultra-Thin Body (UTB)

Buried Oxide

Substrate

Source Drain

Gate

TSi

Lg

TSi < (1/4) Lg

Double-Gate (DG)

Gate

Source Drain

Gate

TSi

TSi < (2/3) Lg

3

Page 4: EE130/230A Discussion  13

Effect of TSi on OFF-state Leakage

IOFF = 19 A/mIOFF = 2.1 nA/mLeakage CurrentDensity [A/cm2]

@ VDS = 0.7 V

106

10-1

3x102

0.0

4.0

8.0

12.0

16.0

20.0

G

G

S D

G

G

S D

Si Thickness [nm]

Lg = 25 nm; tox,eq = 12Å

TSi = 10 nm TSi = 20 nm

4

Page 5: EE130/230A Discussion  13

Electrostatics:Under normal operating conditions, the BJT may be viewed electrostatically as two independent pn junctions

BJT Types and Definitions• The BJT is a 3-terminal device, with two types: PNP and NPN

VEB = VE – VB

VCB = VC – VB

VEC = VE – VC

= VEB - VCB

VBE = VB – VE

VBC = VB – VC

VCE = VC – VE

= VCB - VEB

EE130/230A Fall 2013 Lecture 25, Slide 5 R. F. Pierret, Semiconductor Device Fundamentals, p. 372

Page 6: EE130/230A Discussion  13

BJT Circuit Configurations

Output Characteristics for Common-Emitter Configuration

EE130/230A Fall 2013 Lecture 25, Slide 6R. F. Pierret, Semiconductor Device Fundamentals, Fig. 10.4

R. F. Pierret, Semiconductor Device Fundamentals, Fig. 10.3

Page 7: EE130/230A Discussion  13

BJT Modes of OperationCommon-emitter output characteristics (IC vs. VCE)

Mode Emitter Junction Collector Junction

CUTOFF reverse bias reverse bias

Forward ACTIVE forward bias reverse bias*

Reverse ACTIVE reverse bias* forward bias

SATURATION forward bias forward bias

*more precisely: not strongly forward biasedEE130/230A Fall 2013 Lecture 25, Slide 7

R. F. Pierret, Semiconductor Device Fundamentals, Fig. 10.5

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Sample Problem(a) The energy-band diagrams for a Si PNP BJT in forward-active and saturation modes of

operation are shown below.

Page 9: EE130/230A Discussion  13

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Sample Problem

(a) A family of common-emitter output characteristics (IC vs. VEC curves for different values of VEB) are drawn below.

Page 10: EE130/230A Discussion  13

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Questions regarding the MOSFET design project?

Happy Holidays!