egraf electronics thermal solutions · egraf ® thermal management solutions non-structural...

eGRAF® Electronics Thermal Solutions

Introduction

eGRAF® Thermal Management Solutions

Non-Structural Engineered Graphite Foils

Graftech has developed a family of thermal interface materials named eGRAF® based upon

the science of engineered foil graphite.

The graphite foils are engineered to control the thermal conductivity both in the plane of

the material as well as through the plane.

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Business Confidential

© 2012 GrafTech International Holdings Inc. All Rights Reserved.

In-Plane

Thermal Conductivity

Through-Plane

Thermal Conductivity

eGRAF® Flexible Graphite Interface Materials

RoHS, REACH compliant

– Contains no hazardous materials

UL94V-0 flammability rated

– Non-flammable

Environmentally Friendly

Chemically inert to almost any substance

Easy disposal of waste

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eGRAF® Reliability

eGRAF® Not Affected by Electronics Operating Environment

eGRAF graphite foils retain thermal

performance over time and temperature

extremes

– eGRAF is stable up to 400 C

– Demonstrated over 50 years of graphite

gasket experience

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Weight Loss in eGRAF Flexible Graphite Material due to Oxidation in Air at High Temperatures Report dated May 2012

eGRAF is chemically inert

– Will not react with other material or fluids

Adhesives and coatings need to be

carefully selected to meet environmental

requirements

eGRAF® HITHERM™

Value Proposition

Carbon Based Material

- Thermal conductivity up to 16W/mK

- No outgassing

- Environmentally Friendly

Differentiating FeatureValue to Customer

and/or End User

Increases reliability of mission critical, long life electronics designs

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Foil Form Factor- Die-cut parts enabling lower cost.

- Pick and place manufacturing.

Material thickness between

125 μm (0.005”) & 500 μm (0.020”)

- Fills thicker bond lines.

- Greases degrade with bond line

thickness over 50 μm (0.002”.)

Increases reliability and manufacturability of

mission critical, long life electronics designs

eGRAF® HITHERM™ Grades

Product grades to meet design requirements

– Adhesive coating for “peel & stick” manufacturing

– PET coating for electrical isolation

HT-700General purpose- Low intensity LEDs

Design Options

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0 5 10 15 20

HT-2500

HT-1200

Thermal Conductivity (W/m-K)

Improved performance- High Brightness LEDs

- “Under the Hood” Applications

Polymer enhanced performance- Inverters

- Mission critical applications



eGRAF® SPREADERSHIELD™

Value Proposition

Carbon Based Material

- Thermal conductivity up to 1500W/mK

- Anisotropic: Spreads heat in-plane

- Environmentally Friendly

Differentiating FeatureValue to Customer

and/or End User

Unique passive thermal shielding and spreading solution

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Flexible Foil Form Factor

- Contours to shaped housings

- Die-cut parts enabling lower cost

- Pick and place manufacturing

Lightweight material with

Thickness as thin as

0.025mm

- Integrates into any existing design

- System weight reduction

- Non-structural

Increases reliability of electronics designs

by eliminating active thermal solutions

SS300General purpose• Thicker form factors

• Power cooling applications

eGRAF® SPREADERSHIELD™ Grades

Product grades to meet design requirements

– Thermal conductivity grades to match thermal demands

– Multiple adhesive and coating options available

Design Options

0 500 1000 1500

SS1500

SS600

SS500

SS400

Thermal Conductivity (W/m-K)

• Power cooling applications

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CuMg

High Performance• Thin form factors

• High thermal conductivity

Al

Designing with eGRAF® SPREADERSHIELD™

AluminumAluminum

0.9 g (200% Heavier)

CopperCopper

2.0 g (560% Heavier)

Lig

hte

rLi

gh

ter

eGRAF-SS600eGRAF-SS600

0.3 g

Case study of an 18 cm2 heat spreader

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18 cm2 part. Similar thermal conductance.

Th

inn

er

Th

inn

er

eGRAF-SS600eGRAF-SS600

0.003”

AluminumAluminum CopperCopper

0.005” (50% Thicker)0.007” (100% Thicker)

Same design, SS600 wins. SS600 is lighter and thinner than conventional metal spreadersSame design, SS600 wins. SS600 is lighter and thinner than conventional metal spreaders

Typical Applications

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Market Application: Lighting

Advantages

– Foil form factor

– Consistent thermal performance over time

Ideal for Indoor and Outdoor Lighting Applications

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Lighting applications include downlights, track lighting, and outdoor spot lights

Market Application: Inverters

Advantages

– Thermal conductivity up to 16W/m-K

thru-plane (z-plane)

– Consistent performance across entire

temperature range

– Reliable thermal interface for both

Unparalleled through plane thermal conductivity

– Reliable thermal interface for both

switches and capacitors

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Inverter applications include automotive, solar, and industrial motor controllers



Designing with eGRAF® HITHERM™

Characteristic Guideline

Thermal ConductivityInterface pressure and additional factors

contribute to performance

Electrical IsolationBalance between electrical and thermal

conductance.

Bond Line Thickness/SurfaceCompromise between ideal surfaces and

manufacturing costs.

When Does HITHERM™ Fit?

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manufacturing costs.

ReliabilityEnvironmental characteristics have

significant impact on most TIMs



Market Application: Displays

Advantages

– LED light-bar thermal management.

Heat efficiently spread to chassis

– Corner light mura reduced

– Heat from power supply board

shielded from display

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Advanced displays improved image quality

55” LED LCD TV

Market Application: Displays

Advantages

– Reduced heat of LEDs bright

enough to enable daytime viewing

of display

– Spread heat from LED lights to

aluminum frame

– Improved overall image quality

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– Improved overall image quality

relative to other thermal designs.

– Enabled operating range between

-20 C and +65 C

Ruggedized aftermarket

LCD monitor

Market Application: Computing


SPREADERSHIELD™ has enabled latest generation of advanced devices

Tablet Devices Smartphones

Market Application: Computing

Advantages

– Eliminated heat pipes and fans from

thermal solution which improves

system reliability and simplifies FMEA

analysis

– Improves thermal conductivity of full

magnesium alloy chassis

– Outperformed copper solution at

20% of the weight

– Extended battery life by eliminating

fans and heat pipes

– Conducts ~15 W of heat from the

CPU to keyboard underside

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Ruggedized Laptop

Market Application: LED Lighting

Performance Advantages

– Uniform thermal gradient

resulting in higher

luminance uniformity

– Reduces hotspot temperatures

which extends LED lifetime

over expected life of troffer


Ownership Advantages

– Lighter weight by reducing

gauge of aluminum housing

– Enables field replaceable

LED panels

Lighter weight, longer life, better light quality troffer

LED Lighting Troffer

Market Application: LED Lighting

Advantages

– Spread heat captured on top side of

headlight housing

– Reduced temperature of hot spot

below melting temperature of

plastic housing.

– Lower cost solution relative to

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– Lower cost solution relative to

complete housing replacement

with alternative, higher

temperature housing.

Headlight Retrofit Program

Advantages

– Thinner section optimizes volumetric constraints

– Lighter weight impacts overall vehicle efficiency

– Higher thermal conductivity moves more heat out of (and in to) the battery

– Flexibility allows for common design configuration

Market Application: Li-Ion Battery CoolingTechnology based on

Prototype Automotive Solutions

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Flexible Graphite Heat Transfer “Plates” enable battery Performance, Durability and Safety

Designing with eGRAF® SPREADERSHIELD™

Characteristic Guideline

Thermal ConductivityMultiple factors contribute to determine

required performance

WeightProvides weight reduction options to

systems engineering team

ReliabilityThermal requirements can be addressed

with passive cooling solution

When Does SPREADERSHIELD™ Fit?

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with passive cooling solution

Available Thickness Fits into most existing design tolerances.



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