PATENTS GRANTED In the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 2023 1.

Acrylic-Coated Thermoplastic Substrate U 5. Patent $426,131. June 20, 1995 D Katsambew, awgnor to General Electric Co , PWeld, Mass.

A solventless L!V-curable coating con- position comprising ar least one multifunc- tonal acrylic ester monomer present at a level of 10 to 60% by weight; at least one acrylatefuncrionali7ed colloidal silica present at a level of 20 to 40% by weight; at least one multifunctional aliphatic acry- lated polyurethane preqent at a level of 5 to 40 percent by weight; at least one ultravi- olet light absorber present at a level of 5 to l(l% by weight; and at least one photoini- tixor present at a level ot 1 ro 5% by \scight.

Process for Treating Metals US. Patent 5,427,632. June 27 1995 S E Do/an, assignor to Heokei Carp , Plymouth Meeting, Pa.

A process for treating a metal surface. comprising coating with a substantially uniform liquid composition having a pH vldue within the range of 0.555.0 and con- si\ting essentially of a component of fluo- rometallate anions, each consisting of at least four fluorine atoms, al least one atom of an element selected from the group con- si\ting of titanium, zirconium. hafnium. sil- icon. aluminum, and boron, and, option- ally, ionizable hydrogen atoms, and. optionally, one or more oxygen atoms; a component of divalent or tetravalent cat- ionc of elements selected from the group consisting of cobalt, magnesium. manga- ne>e, rinc, nickel, tm. copper, zirconium, iron, and strontium in such an amount that the ratio of the total number of cations to the number of unions is at least 1:5 but not greater than 3:l; a component selected from the group consisting of phosphorus- containing inorganic oxyanions and phos- phate anions; and a component selected from the group consisting of water-soluble and water-dispersible organic polymers and polymer-forming resins; and. optionally, a dissolved uxidizing agent; and. optionally, a component selected from dissolved or dispersed complexes stabilized against set- tling, and drymg into place on the surface

of the metal the coating applied without intermediate rinsing.

Electrocoating Bath U.S. Patent 5,427,661. June 27, 1995 M. Gersf et a/., assignors to BASF Lacke & Farban AG, Munster, Germany

A method for reducing surface defects in electrodeposited films on electrically con- ducting substrates comprising immersing in an aqueous electrocoating bath contain- ing at lcast one synthetic resin to be depos- ited on a cathode, and surface defect fonn- ing contaminants, as well as an amount of a homopolymer of an alkyl vmyl ether effective to reduce defect formation by the contaminants; connecting the substrate as the cathode; depositing a film on the sub- strate by means of direct current: removing the substrate from the electrocoating bath; and baking the deposited paint film to pro- vide a coating substantially free of surface defects caused by contaminants.

Process and Apparatus for Reactive Coating of a Substrate U.S. Patent 5,427,665. June 27, 1995 K Hart/g and 1 Szczyrbowski, asstgnors to Leybold AG, Hanau, Germany

Apparatus for the reactive coating of a substrate comprising an evacuuble coating chamber; means for introducing a process gas into the chamber; means for introduc- ing a reactive gas into the chambel-; a cath- ode; a power source connected to said cath- ode; a plurality of magnets adjacent the cathode; a target; and a diaphragm between target and substrate to be coated, said dia- phragm having apertul-e means configured and aligned so that the part of the target having higher affinity for the reactive gas provides most of the reactive coating for the substrate.

Method for In-Situ Cleaning a Target U.S. Pafent 5,427,666. June 27, 1995 MA Mueller et al, assjgnors to Applied Materials Inc., Santa Clara, Calif.

A method of forming a multilayer con- ductive structure on a semiconductor sub- strate, which comprises forming a first layer of titanium in electrical contact with

the substrate; forming a first barrier layer of titanium nitride over the first titanium layer: formmg a layer of aluminum over the first layer of titanium nitride; forming an antiretlective coating of titanium nitride over the aluminum layer by sputtering tita- nium from a titanium target in the presence of nitrogen gas; and forming a second tits- nium layer over the antireflective titanium nitride layer by sputtering titanium from the titanium target, wherein the titanium layer is sufficiently thin to retain the anti- reflective properties of the underlying an- tireflective layer of titanium nitride, yet thick enough to accomplish removal of ti- tanium nitride from the titanium target de- posited thereon during sputter formation.

Thin Film Deposition System U.S. Patent 5.427,666. June 27, 1995 T Sate et al,, assignors to Ricoh Co. Ltd.. Tokyo

A thin film deposition system compris- ing a vacumll casing for introducing therein an active gas or an inert gas or a mixture of an active gas and an inert gds; an evapora- tion source for evaporating an evaporant in the vacuum casing; a confronting electrode for supporting a substrate on which a thin film is to be deposited; a grid for passing therethrough particles evaporated from the evaporant on the evaporation source; a fi- ament for ionizing the particles evaporated from the evaporant; a target electrode for holding a sputtering target; means for keep- ing the grid positive in potential with re- spect to the confronting electrode and fila- ment; and means for applyin& a high- frequency voltage to the target electrode.

Vacuum Coating Device U.S. Patent 5,427,671. June 27, 1995 N.A.G. Ahmed, assignor to Applied Vision Lid.. Leeds. Great Britain

An ion vapor deposttion apparatus and method.

Electroplating Apparatus U.S. Patent 5,427,674. June 27, 1995 C.G. Langenskidid et al, assignors to Cinram Ltd., Scarborough. Canada

An electroplating process, which uses an apparatus comprising an anode, a cathode, opposed first and second end walls and a

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