electronic cooling solutions

Thermal Management Solutions for for Electronic Systems using CFD SimulationsElectronic Systems using CFD Simulations

Thermal Management Solutions

+91 9916 296131 | Email: [email protected] | www.fexilon.com)7760 854854 /

• Fexilon Technologies offers Thermal Management Solutions (TMS) for Electronic Systems.

• TMS is an in-depth assessment of the enclosures and cooling-systems for electronic devices.

• TMS simulates the Flow and Thermal interactions using the state-of-art Computational Fluid Dynamics (CFD) Technology.

• TMS maximizes performance and reliability of electronic circuits.

Thermal Management Solutions (TMS)


Thermal Management Solutions for Electronic Systems using CFD Simulations

• At the early stage of a design, we can identify and resolve thermal issues rapidly using these tools. Early, up-front analysis is important in order to have cost-effective cooling approaches with the least

About our CFD Simulations



• For precise analysis, FEXILON uses state-of-the art computational software programs.

• STAR-CD and STAR-CCM+ are used by our engineers to perform thermal and air-flow modeling. Both are effective computational fluid dynamics (CFD) tools for completing the thermal analyses at any stage of the design cycle.

impact to the rest of the system's design requirements.

• Models both the air flow and heat transfer in a system.

• Aids in understanding the cooling requirements of the product.

• Enables rapid design optimization and parametric studies.

• Simplifies the evaluation process of new hardware that must be housed in an existing platform.

WHY CFD?



• Provides a platform for quick evaluation of cooling designs and problems without the need for physical hardware.

• Offers a graphical 3D thermal analysis that solves for conduction, convection and radiation heat transfer.

Airflow / Thermal Simulations and Evaluation

• Simulations at high and low temperature conditions as well as simulated high-altitude conditions

• Volumetric Air Flow Simulations

• Airflow through systems and assemblies

Air Velocity Measurements

- Impedance characterization of filters, screens, assemblies - Performance characterization of fans and blowers

- Quantify airflow at specific locations - Simulation of airflow distribution

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Our team has the expertise and access to resources to conduct:

Contd...

Airflow / Thermal Simulations and Evaluation

• Component Characterization - Single and Tandem Fan Testing - Performance enhancement of the fan chassis enclosure through empirical characterization of fans - Configurations: single & multiple fan configurations, in open and in-situ conditions, with and without inter-stage flow straighteners

• Thermal Simulations - Simulate the thermal-distribution of Casing, Component, Enclosure and air temperatures - Simulation of Elevated temperature and high altitude conditions

• Thermal Performance Characterization CPU heat sinks - : Carry out thermal performance characterization

DIMMs - : Carry out thermal performance characterization Carry out air fluid flow characterization for the air-side Heat Exchangers : - of rack, system, and module level liquid-air heat exchangers



Nature of Engagement…



At the early design stages, we review a customer's design concepts, perform feasibility studies, carry out risk assessments, complete a high-level analysis of cooling requirements, and provide architectural-level consulting.

Our analysis and recommendations include an assessment of package and board requirements. We address package selection, component placement, and heat sink requirements, as well as high performance cooling solutions if they're needed.

At the system level, we can determine air flow requirements, recommend air movers, and address plenum requirements. Our recommendations are based on a careful analysis of the thermal load, power density, space available for cooling and system impedance.

We work with our customers from the initial concept stage through the final system testing stage. This end-to-end focus ensures that critical design issues are resolved in a timely manner and that the cost of the design is managed effectively. In many cases we are able to reduce the cost of prototype testing and its impact on schedule.

Manufacturing and cost issues are taken into consideration in each of the solutions we recommend.

• Assessment of Thermal distribution

• Air-flow Analysis

• Identification of Hot-spots

• Failure-mode & Risk Assessment

• Improved layout design

• Safe & Compact Enclosure design

• Improve heat-sinks & cooling-systems

Our Services



Benefits

• Improved Performance

• Minimized power-consumption of cooling systems

• Increases Reliability & Longer life

• Optimized space-utilization of enclosures

• Elimination of heat & flow related problems in design-stage itself




Fexilon Technologies19/4, Saranchal Arcade,Dinnur Main Road,R.T. Nagar,Bangalore - 560032Karnataka, India.Web: www.fexilon.comEmail: [email protected]


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