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Electronic Manufacturing Eric Pan

seeed.cc

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Eric PanMaker, BikerFounder of Seeed

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Chapter 0

Overview

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Today’s Sharing

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HOW?

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Electronics Firmware

MechanicsEnclosure

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Design Prepare Produce Package

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Cost * Quality * Schedule

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Quality

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Expectations

Schedule

ALL shall arrive on time.

But,- Supply chain is very dynamic- Production line has queue- Problems are unexpected

Project Management is Serious.

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Cost

BOMManufacturing

Engineering

Marketing

CertificationLogistics

Defects

Management

Mistakes, Mistakes, Mistakes,

Tooling

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Chapter 1

Design from manufacture

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Be Responsible For what you started.

p.seeed.cc 14https://en.wikipedia.org/wiki/Design_for_X

Development phaseDesign for short time to marketDesign for reliabilityDesign for testDesign for safety Design for quality Design against corrosion damageDesign for minimum risk

Production-operations phaseDesign to costDesign to standardsDesign for assemblyDesign for manufacturabilityDesign for logisticsDesign for postponement Design for Electronic AssembliesDesign for Low-Quantity Production

Use phaseDesign for user-friendlinessDesign for ergonomicsDesign for aesthetics Design for serviceabilityDesign for maintainabilityDesign for repair-reuse-recyclability

Disposal phaseDesign for EnvironmentDesign for recyclingDesign for Remanufacturing)

Design for X

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Hardware

OrchestraSoftware

Band

Unarmed to the new field.

p.seeed.cc 16https://en.wikipedia.org/wiki/Design_for_X

Development phaseDesign for short time to marketDesign for reliabilityDesign for testDesign for safety Design for quality Design against corrosion damageDesign for minimum risk

Production-operations phaseDesign to costDesign to standardsDesign for assemblyDesign for manufacturabilityDesign for logisticsDesign for postponement Design for Electronic AssembliesDesign for Low-Quantity Production

Use phaseDesign for user-friendlinessDesign for ergonomicsDesign for aesthetics Design for serviceabilityDesign for maintainabilityDesign for repair-reuse-recyclability

Disposal phaseDesign for EnvironmentDesign for recyclingDesign for Remanufacturing)

Design for X

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Design FROMManufacturing

700+ popular components

Open testing/Open process/Open manufacturing capability/Open schedule

3D printer/Laser cutting/CNC/Automated SMT line/flexible cell line/Tools

500+ different kinds of module for MCU/Sensors/Shield/Prototyping/Tools/Wearables…

Open Parts Library for

Supply Chain

Open Source Hardware for Prototyping

Open Manufacturing for Process

Distributed Manufacturing as a Service

1

2 3

4

Design based on Open Hardware

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Beginner

Professional

Expensive Free

More Free, Cloud basedCollaborative CAD tools

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PCB Design process

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Chapter 2

Prepare the materials

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Materials and Risks

• Printed Circuit Board / Stencils ★★ (quality)

• Active/Passive Components ★★★ (lead time/ quality)

• Standard Mechanic Components ★

• Standard Accessories ★

• Package ★★ (quality)

• Customized parts ★★★★ (lead time/ tolerance)

• Injection Molding ★★★★★ (lead time/ tolerance)

Bill of Materials template

BOM DFM hints

• Don’t assume people knows

• Always have Plan B

• Leave no room for ambiguity

• Consider availability in long run

• Consider lead time, in worst scenario

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PCB

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• PCB board house use Gerber file for production. Gerber files should be with standard file extensions:GTO-- Top Silkscreen GTS-- Top SoldermaskGTL-- Top Copper GBL-- Bottom CopperGBS-- Bottom SoldermaskGBO-- Bottom SilkscreenGML/GKO/GBR*-- Board Outline*TXT-- Routing and Drill

PCB into production

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Other way to manufacture PCB

PCB desktopPrinter/miller

Homebrew PCB

Voltera OtherMill 29p.seeed.cc

PCB DFM hint

• Follow supplier process spec, leave some buffer if possible

• Polarized component must be marked.

• Designator for each components.

• Silkscreen must be clear. 6mil width, 40mil height.

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Stencils for mass production

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Active/Passive components

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example: Espruino

20 days from PO to Shipping 4k pcs(Normal Priority)

100 popular components consists ~30% of BOMs

Sharing the library = Sharing the Supply Chain

Cost, Lead time, Quality, and Knowledges

Components DFM hint

Standard Accessories

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Package

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Customized Parts

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Injection Molding

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Chapter 3

Assembly

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Assembly and Test Process

Y

Y

Y

Stencil print paste

SMT

SMT Assembly

DIP Assembly

PCB incoming inspection

Print quality check

QC check beforereflow Owen

Assembly quality check

Functional check

Assembly quality check

IQC check

Clean

Inform Engineer improve

I PQC confirm

Repairing

Adjustment

Inform engineer improve

Remove components

FQC

Repairing

Y

Y

Y

Y

N

N

N

N

N

N

N

N

Y

Inform engineer improve

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Solder Paste Screen Printing

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Pick and Place Reflow QC

40℃

130℃

200℃

217℃

230℃

0℃

PH1PH2

PH3

PH4

Peak value 240 ℃±5℃

Sec

Tem

p(℃

)

IMG 2

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SMT Reflow Soldering

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Preheat Zone：Preheat PCB and components, in order to achieve thermal

equilibrium for soldering

Thermal soak zone：In the thermal soak, typically a 60 to 120 second exposure for

removal of solder paste volatiles and activation of the fluxes,

where the flux components begin oxide reduction on component

leads and pad.

Reflow zone：It is the part of the process where the maximum temperature is

reached. Components will be stick to the pads.

Cooling zone：The last zone is a cooling zone to gradually cool the processed

board and solidify the solder joints

1) Tomb stoningCauses: Components don’t match the dimension of the actual designSolutions:Make sure the design of the pad matches the package of the components

2) Pseudo SolderingCauses: a. pitch of the pad does not match the component’s dimensionb. Through-hole pads Solutions: a. design from actual package b. avoid via hole of the pad

1.SMT issues

1.SMT issues3) Wrong-placed componentsCauses: No marks of the padsSolutions: a. Mark the PCBb. Mark the Polar components’ pad

4) Mismatch between the design and pads, delaying the manufacturing processCauses:Mismatch between the design and padsSolution:Rational designOPL design

SMT DFM hints

• Compassion for machines

• Align same components in order

• Leave adequate spacing for thermal parts

• Leave enough margin to PCB edge

• Avoid double side placement if possible

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Through Hole Soldering

Semi Auto Through Hole Soldering

Temperature should set 300℃+-10℃, Flux spraying evenly for3-4 seconds, dry for 2-4 seconds, move the PCB into the tin surface for 3-4 seconds, then move it to the cooing zone.

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Automatic Soldering

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According to thecomponents, the tempshould set about 380℃-405

And select differentsolder iron to ensurethe quality

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1) Components can’t be Wave soldered Causes and Solutions:

Design from Wave-soldering, improve manufacturing efficiency

2) Components can’t be soldered by handCauses:

Wrong Through-Hole dimension

Solutions:

Design from Through-hole Manufacturing

2. Through-Hole Soldering

2. Through-Hole Soldering

3)Short distance between two components

Causes and Solutions:

Ensure Standard distance between two through-holes

4)Tilted parts after wave-soldering

Causes and Solutions:

Design from the wave-soldering standard

• Keep space for each components, 0.5mm at least.

• Ensure space is able for manual soldering, repairing and verifying.

• Avoid, if you can

Through Hole DFM hints

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Chapter 4

Test and Package

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Basically,

Verification before mass production

• PCB inspection systems ★ usually done by supplier

• ICT In circuit test ★★★★ common for simple projects

• Functional testing ★★ for complex circuits/IC/RF

• JTAG Boundary scan testing ★★ for complex logic systems

• Combinational test ★★★ a combination of tests

Test method and priorities

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Be a good killer of defects,

• No under-kill

• Fewer overkill

• Fast

• Easy

• Cheap

• Duplicable

A good test plan:

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Test jig for small scale manufacturing

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Test Jig Underhood

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Packaging with SOP

3. PCB Testing Process

1)Can’t make test jigCauses:No test feasibility plan before design Solutions:Consider test plan before design

2) No test plan Solutions:Provide test plan before new product introduction

1) Unable or difficult to assembly.

Causes:

Do not verify the mechanical part after designing.

Solutions:

Should consider tolerance, and verify the mechanical part.

4. Assembly Process

1) Uncertain packaging

Causes and Solutions:

Customer do not have packaging nearly production. IT should be prepared in thedesigning stage.

2) Unreasonable packaging method

Causes:

Unable to pack according to the packaging method

Solutions:

Should confirm Packaging method beforehand

5. Packaging

Assembly and Test hints

• Try to involve less process

• SOP (standard operation procedure) is critical

• Invent when there is no other choices

• Don’t expect Pilot run will expose every error

• Wherever might be problem, there will be problem.

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Chapter 5

Takeaways

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Setup7-42 days

Manufacturing3-15 days

Engineering1-30 days

• Unclear BOM

• Process Tolerance

• Inadequate Test Plan

• Long Lead Time Components

• Consistency Problem

• Supply Chain Complexity

• Unexpected Error

• Low Yield

• Uncontrollable Assembly Time

Prototype Productmanufacture

Key Phrases and Risks

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Maker Supplier

5 simple tips for indie products

• 1. Balance Cost, Quality, Schedule

• 2. Consider overall cost

• 3. Use the popular components

• 4. Involve fewer processes

• 5. Use only SMD components if possible.

More info can check the link

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Chapter 6

Practice

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Let’s redefine hat

Cost = How many basic material per hat

Volume = How many hats manufactured

Consistency = Same among the batch

Promise = Final Deliver matches Pitch

Votes = Peer to Peer vote for favourite

Team

Score = x

x

x

x

Basic Components20 pcs A4 paper, 1*Adhesive tape,

Shared componentsAnything you can find(legally)

Equipment

1*Scissors, 1*Stapler, 2*Colors pens,

Design – Pitch – Manufacture – Deliver

DESIGN15 min

PITCH2 min

MANUFACTURE20 min

DELIVER5 min

DESIGN15 min

Objectives:Design and make the 1st hat

Optional:Define RolesOutstandingChoose materials wiselyThink how to make more laterFind a popular lighthouse userPrepare to Pitch

PITCH2 min

Objectives:Sell your design to backers

Optional:AWESOME!

MANUFACTURE20 min

Objectives:Manufacture more hats!

Optional:Collect enough materialPrepare a operation procedureOptimize the processApply Quality Control

Objectives:Show us the results!

Optional:A moving storyImprovement (downgrade) appliedShare your hints

DELIVER5 min

A free fusion PCB coupon for the submitterA free fusion PCBA coupon for the winner

Share your result photo/thoughts via twitter @seeedstudio #fusion, to win

Diving by sport in touch UK, from Pinterest

Good Luck

To the mass

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This work is created under CC BY 3.0All rights of contents not listed is belong to its original authors.

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Disclaimer:This material is still in beta stage, not all contents cited are properly listed in the reference. Also we didn’t cover full spectrum of electronic manufacturing but sharing most common practices.

Video:PCBhttps://www.youtube.com/watch?v=sFMFmrCur08&list=PLpH_4mf13-A17zy-k0oiaTNSXBisxqxyR&index=1

Stencilhttps://www.youtube.com/watch?v=ya8N4RWNo_s&list=PLpH_4mf13-A17zy-k0oiaTNSXBisxqxyR&index=3

Jet Printhttps://www.youtube.com/watch?v=Voe-z0qCEvY

SMThttps://www.youtube.com/watch?v=6e4AMTmURVw&list=PLpH_4mf13-A17zy-k0oiaTNSXBisxqxyR&index=4

Semi Automatic DIP solderinghttps://www.youtube.com/watch?v=PSOaUNxIDZ8

Automatic DIP solderinghttps://www.youtube.com/watch?v=fmvFO3rfw7M

Packaginghttps://www.youtube.com/watch?v=mrZOSpGZliQ&feature=youtu.be

Reference• http://www.protel.net/• http://www.cadsoftusa.com/• http://www.altium.com/• https://123d.circuits.io/• http://kicad-pcb.org/• https://upverter.com/• https://easyeda.com/• http://www.techtimes.com/articles/114088/2015120

7/independent-analysis-kickstarter-project-fulfillment-finds-9-percent-campaigns-fail.htm

• http://www.instructables.com/id/Making-A-Customized-Circuit-Board-Made-Easy/

• http://voltera.io/images/printRender.png• https://othermachine.co/• http://electronicdesign.com/embedded/engineer-s-

guide-high-quality-pcb-design• https://www.youtube.com/watch?v=PSOaUNxIDZ8• http://www.radio-

electronics.com/info/t_and_m/ate/automatic-test-equipment-basics.php