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Electronics Final Finishes ENiPdAu

Advanced Surface Finish Chemistry Provided by MacDermid

June 2012

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MacDermid Electronic Solutions

We research, formulate, and deliver specialty chemicals and services that

enable the manufacture of electronic goods used in a wide

variety of end-use applications

Selective Plastics Metallization LED Lighting and Packaging Solderable & Bondable

Gold Alternatives

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Why MacDermid?

Well-Established Geographic Infrastructure

Customer-Specific Applications Know How

High Investment in Innovation - Track Record of Success

Customer-Focused

High Quality, Technically Superior Products

Financially Stable Company with Long-Term

Management

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• Smooth inter-face

• Uniform Nickel Deposit

• No Thickness Variation at Knee

CROSS SECTIONS OF THRU-HOLES

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Planar Ultra 46 - ENEPIG

• Excellent solderability

• Excellent wire bondability

• Superior contact characteristics

– comparable to Nickel/Hard gold

• Elimination of Black line nickel

• Superior tarnish/corrosion

resistance

Electroless nickel/electroless palladium/immersion gold

process from MacDermid.

Designed to deliver:

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Electroless Palladium

• Electroless palladium

added between the

nickel and gold

eliminates any concerns

for black line nickel

– No additional chemical

activation

– No lead in the Pd

formulation

• Palladium offers an

excellent wire bondable

surface

PALLADIUM

NICKEL

GOLD

ACTIVATION

MICROETCH

CLEANER

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Wirebond data

• Testing was conducted at a third party facility

– Pull was taken at mid span of the wire

– 1 mil diameter gold wire

• Varying palladium thickness were tested for

comparison

– 0.3, 0.5 and 1 micron Pd thickness

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Wire Bond Pull

0.3 micron 0.5 micron

1.0 micron

• All pull strengths above 9gf

– 0.3 = 9.84

– 0.5 = 9.28

– 1.0 = 9.12

– All std dev below 0.5gf

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Ball Shear Testing

• Test is conducted using a BGA design with metal and soldermask defined pads.

• Solder spheres are manually placed after required preconditioning on to the pasted BGA

• Ball shear conducted on Xyztec bond tester

• Metal defined pads have higher shear strengths due to the collapse of the solder around the pad

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Leaded Solder

Panel A – Lead Solder – AsIs

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel B – Lead Solder – AsIs

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel A – Lead Solder – 4X Reflow

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel B – Lead Solder – 4X Reflow

0

2

4

6

8

10

12

14

16

18

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

0.05 microns Pd 0.275 microns Pd

Very strong forces all above the required 1.5kgm

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Lead Free Solder 0.05 microns Pd 0.275 microns Pd

Very strong forces all above the required 1.5kgm

Panel A – Lead Free – AsIs

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel A – Lead Free – 4X Reflow

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel B – Lead Free – AsIs

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

Panel B – Lead Free – 4X Reflow

0

2

4

6

8

10

12

14

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7

Force (kgm)

Fre

qu

en

cy

Metal Defined Soldermask Defined

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Planar Ultra 46 Summary

• MacDermid’s ENEPIG process utilizes a low

temperature Electroless nickel

• One electroless palladium bath can

accommodate standard Pd thickness

requirements ranging from 2 to 12 microinches

as well military requirements over 30

microinches

• Planar Ultra 46 is OEM qualified.