electroplating copper interconnects

1
ABRASIVE ARTICLE U.S. Patent 6,245,406. June 12, 2001 H. Kuramochi and Y. Kubota, assignors to Tosoh Corp., Yamaguchi, Japan An abrasive polishing disk com- prising at least one abrasive shaped polishing article and a supporting auxiliary; said shaped polishing article being a molded article made by molding a silica powder and fitted to the support- ing auxiliary, and comprising at least 90% by weight. ELECTROPLATING COPPER INTERCONNECTS U.S. Patent 6,245,676. June 12, 2001 K. Ueno, assignor to NEC Corp., Tokyo, Japan In a method of manufacturing a semiconductor device comprising the steps of providing a trench along a wiring scheduled portion of an insulating film formed on a substrate; forming a metal seed layer on the insulating film in- cluding the trench; forming a de- posit layer of a metal wiring ma- terial on the metal seed layer to completely bury the trench with the aid of an electrical plating method where the metal seed layer is used as one electrode; and polishing and removing the de- posit layer of the metal wiring material until the insulating film is again exposed, to form a buried wiring in the trench, the improve- ment being wherein the method further comprises upon forming the buried wiring protruding the deposit layer of the metal wiring material on said trench and one a peripheral area by controlling a current of the electrical plating method; and polishing and remov- ing the deposit layer until the in- sulating film is exposed. SPRAYBQOTH WALL U.S. Patent 6,247,290. June 19, 2001 W. Kimmerle and R. Bnzinge, assignors to Eisenmann Maschinenbau KG, Germany A wall for the booth of a coating plant comprising a frame consist- ing of at least two hollow vertical posts and at least two hollow hor- izontal crosspieces; at least one plate, which covers a zone spanned by the posts and the crosspieces; a securing device for each plate by means of which the plate is secured in a removable manner to the posts and cross- pieces bounding the correspond- ing zone, characterized in that the securing device consists of a plu- rality of spaced blocking devices, which each have at least one re- taining portion and one contact portion. SEALING ANODIZED ALUMINUM U.S. Patent 6,248,184. June 19, 2001 D.L. Dull and F.B. Mansfeld, assignors to The Boeing Co., Seattle, Wash., and University of Southern California, Los Angeles, Calif. A chemical solution for sealing the surface coating formed by an- odizing an aluminum or alumi- num alloy substrate, said sealing solution consisting of a dilute so- NEWACT PLATING DANGLERS NoMoreLeaky Sleeves! Circle 084 on reader card or go to www.thru.to/webconnect Why not operate with a EnergyEfficient Money Saving system? Replacement Parts or Complete Turnkey Systems Scrubbers • Fans ° Ducts • Hoods PVC - Polypro - FRP. - Stainless Steel Fabrication/Installation CELESTCO Air Pollution ControlSystems E-mail:[email protected] 11449 Applewood Warren, MI 48093-2662 Phone:586-751-3291 Fax: 586-751 -! 701 Circle 025 on reader card or go to w~nN,thru.to/webconnect JP Tech Amp/Hour meters offer an extensive feature set, unsurpassed reliability and economy. The dual peristaltic pump model includes every- thing necessary to start chemical adds immediately Amp/Hour Systems $175.00 Totalizer Systems $300.00 Pump Controller Systems $575.00 Pump Controller Systems w/2 pumps JP Tech, Inc. 2920 Main Street • P.O Box 863 East Troy • W153120 Phone: 262-642-7671 * Fax: 262~42-7681 e-rr~il: [email protected] wwwJptechinc.com See us at SUR/FIN 2002, Booth 1228 Circle 064 on reader card or go to w~wv.thru.to/webconnect 162 Metal Finishing

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Page 1: Electroplating copper interconnects

A B R A S I V E ARTICLE U.S. Patent 6,245,406. June 12, 2001 H. Kuramochi and Y. Kubota, assignors to Tosoh Corp., Yamaguchi, Japan

An abrasive polishing disk com- pr i s ing at l eas t one ab ras ive shaped polishing article and a supporting auxiliary; said shaped polishing article being a molded article made by molding a silica powder and fitted to the support- ing auxiliary, and comprising at least 90% by weight.

ELECTROPLATING COPPER INTERCONNECTS U.S. Patent 6,245,676. June 12, 2001 K. Ueno, assignor to NEC Corp., Tokyo, Japan

In a method of manufacturing a semiconductor device comprising the steps of providing a trench along a wiring scheduled portion of an insulating film formed on a substrate; forming a metal seed layer on the insulating film in- cluding the trench; forming a de- posit layer of a metal wiring ma-

terial on the metal seed layer to completely bury the trench with the aid of an electrical plating method where the meta l seed layer is used as one electrode; and polishing and removing the de- posit layer of the metal wiring material until the insulating film is again exposed, to form a buried wiring in the trench, the improve- ment being wherein the method further comprises upon forming the buried wiring protruding the deposit layer of the metal wiring material on said trench and one a peripheral area by controlling a current of the electrical plating method; and polishing and remov- ing the deposit layer until the in- sulating film is exposed.

S P R A Y B Q O T H WALL U.S. Patent 6,247,290. June 19, 2001 W. Kimmerle and R. Bnzinge, assignors to Eisenmann Maschinenbau KG, Germany

A wall for the booth of a coating plant comprising a frame consist-

ing of at least two hollow vertical posts and at least two hollow hor- izontal crosspieces; at least one pla te , which covers a zone spanned by the posts and the crosspieces; a securing device for each plate by means of which the plate is secured in a removable manner to the posts and cross- pieces bounding the correspond- ing zone, characterized in that the securing device consists of a plu- rality of spaced blocking devices, which each have at least one re- taining portion and one contact portion.

SEALING A N O D I Z E D A L U M I N U M U.S. Patent 6,248,184. June 19, 2001 D.L. Dull and F.B. Mansfeld, assignors to The Boeing Co., Seattle, Wash., and University of Southern California, Los Angeles, Calif.

A chemical solution for sealing the surface coating formed by an- odizing an aluminum or alumi- num alloy substrate, said sealing solution consisting of a dilute so-

NEWACT

PLATING DANGLERS No More Leaky Sleeves!

Circle 084 on reader card or go to www.thru.to/webconnect

Why not operate with a Energy Efficient Money Saving system?

Replacement Parts or Complete Turnkey Systems

Scrubbers • Fans ° Ducts • Hoods PVC - Polypro - FRP. - Stainless Steel

Fabrication/Installation

C E L E S T C O Air Pollution Control Systems

E-mail: [email protected] 11449 Applewood Warren, MI 48093-2662

Phone: 586-751-3291 Fax: 586-751 -! 701

Circle 025 on reader card or go to w~nN,thru.to/webconnect

JP Tech Amp/Hour meters offer an extensive feature set, unsurpassed reliability and economy. The dual peristaltic pump model includes every- thing necessary to start chemical adds immediately

Amp/Hour Systems $ 1 7 5 . 0 0 Totalizer Systems

$ 3 0 0 . 0 0 Pump Controller Systems

$ 5 7 5 . 0 0 Pump Controller Systems w/2 pumps

J P T e c h , Inc . 2920 Main Street • P.O Box 863 East Troy • W153120

Phone: 262-642-7671 * Fax: 262~42-7681 e-rr~il: [email protected] wwwJptechinc.com

See us at SUR/FIN 2002, Booth 1228 Circle 064 on reader card

or go to w~wv.thru.to/webconnect

162 Metal Finishing