electroplating on various electrolyte thin film prepared
TRANSCRIPT
Microstructure And Resistivity Of Cu/NiThin Film Prepared By Magnetized
Electroplating On Various ElectrolyteTemperature
By M. TOIFUR
WORD COUNT 3406 TIME SUBMITTED 13-MAY-2020 01:25AM
PAPER ID 58626233
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Microstructure And Resistivity Of Cu/Ni Thin Film Prepared ByMagnetized Electroplating On Various Electrolyte TemperatureORIGINALITY REPORT
PRIMARY SOURCES
Jumratul Wustha, Moh. Toifur, Azmi Khusnani."Thickness and Resistivities of Cu/Ni Film Resulted byElectroplating on the Various Electrolyte Temperature", Journal ofPhysics: Conference Series, 2019Crossref
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Buddhadev Purohit, Ashutosh Kumar, Kuldeep Mahato,Pranjal Chandra. "Electrodeposition of MetallicNanostructures for Biosensing Applications in Health Care",Journal of scientific research, 2020Crossref
Magdy A?M Ibrahim. "Improving the throwing power ofacidic zinc sulfate electroplating baths", Journal ofChemical Technology & Biotechnology, 2000Crossref
Muthi’ah Lutfia Khansa, Moh. Toifur, AzmiKhusnani, Yudhiakto Pramudya. "Deposition TimeVariation on Thickness and Resistivity of Cu/Ni ThinFilm Obtained by Magnetic Field-Assisted Electroplating Process",Journal of Physics: Conference Series, 2019Crossref
Ganesh, V.. "Fine grain growth of nickelelectrodeposit: effect of applied magnetic field
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during deposition", Applied Surface Science, 20050215Crossref
eprints.uny.ac.idInternet
dyuthi.cusat.ac.inInternet
worldwidescience.orgInternet
chalcogen.roInternet
M Toifur, Y Yuningsih, A Khusnani. "Microstructure,thickness and sheet resistivity of Cu/Ni thin filmproduced by electroplating technique on the variation of electrolytetemperature", Journal of Physics: Conference Series, 2018Crossref
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