electroplating system

enclosure, to uniformly deposit onto the entire surface of each object.

Abrasive Member U.S. Pafenf 5,755.946. May 26, 1998 S.G.G. Ferronafo, Et E/burg, Nefherlands

A method of making a flexible abrasive member comprising applying electrically insulating material to selected areas of a first side of a first porous layer; connecting the first porous layer to a cathode in an electrolytic deposition process; electrolyti- cally depositing a first layer of metal onto the first side of the first porous layer between the selected areas and onto an edge of the insulating material adjacent the selected areas until the metal is deposited to a height that exceeds a height of the insulating material to bond the first deposited metal layer to the first porous layer and to form a first metal rim on the edge of the insulating material, an abrasive material being added to the deposited metal: invert- ing the first porous layer so that the deposited metal is a cathode in the electrolytic deposition process; laying a second porous layer on a second side of the first porous layer opposite the first side: and electrolyt- ically depositing a second layer of metal onto the second porous layer and onto the edge of the insulating material to bond the second deposited metal layer to the second porous layer and to form a second metal rim opposite the first metal rim that, with the first metal rim. sandwiches the edge of the insulating material.

Adhesion Enhancement for Underplating Problem U.S. Patent 5,755,947. May 26, 1998 R. W Mcflhanon and WK. Bums, assignors to The United States of America as represented by the Secretary of the Navy, Washington, DC.

A method for reducing or eliminating underplating without an adhesion promoter, the underplating being between a plating base and a resist layer disposed thereabove comprising providing a sacrificial layer between the plating base and the resist layer; exposing and completely removing the resist layer from at least one selected area; removing the uncovered sacrificial layer from the at least one selected area. thus uncovering a portion of the plating base; depositing a metallic material on the uncovered plating base; and removing the remaining resist layer and the sacrificial layer.

Electroplating System U.S. Patent 5,755,946. May 26, 1998 A.E. Lazaro and PH. Tremmel, assignors to Hardwood Line Mfg. Co., Chicago

An electroplating system comprising a tank of solution that is recirculated during processing of parts to be plated in a rotat- able drum; means for rotating. loading. and

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METAL FINISHING l NOVEMBER 1998 103

unloading the parts located in the electroplating drum; and means for cleansing the parts that have been electroplated after they have been loaded and processed and there- after unloaded from the drum.

the workpiece in an electrolyte to an AC treatment of a voltage and an alternating current end voltage having a frequency of 0.1 to 25 Hz, wherein an anodic potential is imposed on the workpiece during the AC treatment, the surface of the workpiece has

Electrochemical Graining Method U.S. Patent 5755,949. May 26, 1998 ME Amor, assignor to AGFA-Gevaeri AG, Leverkusen, Germany

previously been coarsely grained, and the alternating current results in a total charge input of anodic charge input and cathodic charge input of from-10 tb h0 Kc/m>.

A method of electrochemically graining Tin and Tin-Lead Stripping a surface of a plate-, foil- or web-shaped U.S. Patent 5,7.55,950. May 26, 1998 workpiece of aluminum or an aluminum N.J. Bell, assignor 10 Win Metals Co., Schlller alloy, which method comprises subjecting Park. 111.

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An integrated process for removing plating materials from a plated substrate comprising a copper-based alloy with a tin-based or tin-lead-based surface plated layer. comprising treating at 50 to 150’F with an aqueous etchant solution consisting essentially of I to 50% by weight of an acid and 0.1 to 5%

nitric acid, the surface plated layer metals being removed by, and dissolved in. the aqueous etchanr solution and an intermetallic layer containing tin or tin-lead remaining on the treated surface; separating the treated xub- strate from the aqueous etchant solution and recovering the aqueous etchant solution: rins- ing the separated substrate with water: treating the rinsed substrate at 70 to 2 IO”F with an aqueous immersion solution consisting essentially of 1 to 50% by weight of an acid and 1 to 150 g/L of copper cation in the form of

a copper (II) salt, the tin or tin-lead in the intermetallic layer being removed from the substrate and the substrate being rendered essentially free of tin or tin-lead from the surface plated layer; and separating the substrate from the aqueous immersion solution and recovering the aqueous immersion solution, wherein the recovered aqueous etchant solution and the recovered aqueous immei-- sion solution are sep2u-ately treated to recover at least a portion of the tin or tin-lead con- tained therein and to regenerate aqueous etchant solution or aqueous immersion solution; and wherein the etchant acid and the immersion acid are independently selected from the group consisting of sulfuric acid and alkane sulfonic acids.

Method of Monitoring Constituents in Electroless Plating Baths U.S. Patent 5,755,954. May 26, 1998 EA. Ludw/g et al., assignors to Technrc Inc., Cranston, RI.

A method for monitoring the concentra- tions of constituents present in a solution used in an electroless plating process wherein the constituents affect plating deposit properties, said method comprising applying a selected DC potential to a work- ing electrode; superimposing a constant AC voltage on the DC potential havng a rool mean square potential and a frequency and producing an AC current; varying the DC potential at a chosen sweep rate over a chosen range; and measuring at one 01 more reference phase angels as the DC potential i< varied over the range. the DC and/or AC (current in relation to varying DC potential hcing expressed as current spec- tra, which are used to determine and mon- itor the constituents in the solution.

Inspecting Copper or Molybdenum Lines on a Substrate U.S. Patent 5.756.146. May 26, 1998

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electroplating system

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