One designer will win a free registration for

The Dieline Package Design

Conference!

ELEVATE YOUR PROFILE AS A DESIGNER VIA

Your creativity could win you a free pass to The Dieline Package Design Conference 2013 in San Francisco this June. The Dieline Conference Papercraft Challenge 2013 is a pure design challenge where designers can showcase their package design skills by transforming blank three-dimensional letters or icons with customized art. Projects submitted by the finalists and winner will be featured on TheDieline.com and on screen at The Dieline Package Design Conference held in conjunction with HOW Design Live at the Moscone Center in San Francisco June 22-26, 2013.

Deadline for entry is May 15, 2013. For complete details on this The Dieline Conference website:

www.packagedesignconference.com

Don’t dwell on it. Get designing!

PAPERCRAFTCHALLENGE

JOIN THE CHALLENGE!