embedding high description reliability & safety critical

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[email protected] Visitors address: Kungsängsgatan 12 Uppsala, Sweden Unibap AB (publ) Kungsängsgatan 12 SE – 753 22 Uppsala, Sweden Phone: +46 18 32 03 30 Contact: [email protected] Web: unibap.com Sales: +46 18 32 03 30 [email protected] This product is distributed in the United States by Moog Inc trough Moog Broad Reach SPECIFICATION HIGHLIGHTS AMD SoC CPU AMD® Embedded G-series SOC Series 1st gen (e2000), 2nd gen (e2100), LX (e2190), 64 bit x86 Jaguar/Puma architecture. AMD SoC GPU HD RADEON GPU, 2 CU (Up to 77 GFLOPS) DirectX™ 11.1, OpenCL™ 1.2, OpenCL 1.2+, OpenGL 4.5+, Vulcan 1.0, H.264 encoding/decoding Graphics Output HDMI, LCD/LVDS (e2000), eDP (e21xx) Memory SoC: 2 GB DDR3 1066 to 1333 with ECC FPGA: 512 MB DDR3 up to 667 with ECC Board size 70 × 70 mm 2 Connectors/IO Qseven® MXM 230, Unibap Ext Connector 120 IO Temp. range 0 °C to 70 °C (Commercial) -40 °C to 70 °C (Ext. temperature, special) Power reference Depending on SoC selection and operational modes: 4-20 W. Typ. 10 W. FPGA Safety MCU Microsemi® SmartFusion2™ ARM® Cortex™-M3 MCU AMD OS Linux (typ. LUbuntu) Opt. Windows 7, Solaris, VxWorks FPGA OS Typ. Bare metal / FreeRTOS Optional. RTEMS, Ada Ravenscar USB / SATA 2×USB 3.0, 4×USB 2.0, 2× SATA v3 Interconnect PCIe x4, 20 GT/s PCIe 2x1 Lanes, 5 GT/s PCIe x2 10 GT/s (AMD/FPGA) Ethernet 1 x 1000Base-T Gigabit (AMD) SGMII Interface (FPGA) Other Serial/UART, CAN, I2C, SPI, GPIO, LVDS, SERDES. Qualification IPC 6012C Class 2/3 PCB, IPC 610 Class 2/3 solde- ring, ECSS-Q-30 std derated components Description UNIBAP’s e20xx/e21xx heterogeneous computing product families are radiation tolerant high-performance compute modules for onboard data processing. The products have spaceflight heritage and uses low power embedded x86 compatible AMD® G-series SOC products from the 1st, 2nd, and LX families. The SOC is paired with a powerful Microsemi® SmartFusion2™ FPGA which provides IO extension and board supervisory management through IP core state-machines or embedded ARM® Cortex™ M3 micro-controller. The e20xx/e21xx products provides common interfaces for command and data handling, robots, intelligent automation, and autonomous systems, including: Gigabit Ethernet, USB v2.0/v3.0, PCIexpress®, SerDes, LVDS, SATA v3.0, Serial ports, GPIO, CAN 2.0b, I2C, and SPI. The GPIO capabilities of the FPGA can be used for optional interfaces using different (not included) IP cores. UNIBAP® e20xx/e21xx families of products are the perfect choice for autonomous systems with high demands for data fusion and sensor interfaces using optimized heterogeneous parallel algorithms and extensive IO. Reference: Bruhn, F.; Brunberg, K.; Hines, J.; Asplund, L.; Norgren, M., ”Introducing radiation tolerant heterogeneous computers for small satellites,” in Aerospace Conference, 2015 IEEE, vol., no., pp.1-10, 7-14 Embedding High Reliability & Safety Critical Heterogeneous Data Processing Information may change at any time. Doc. reference: 1004001 e20xx/e21xx Qseven® Compute Products Heterogeneous Computing Platform with spaceflight heritage

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Page 1: Embedding High Description Reliability & Safety Critical

[email protected]

Visitors address:Kungsängsgatan 12Uppsala, Sweden

Unibap AB (publ)Kungsängsgatan 12SE – 753 22 Uppsala, Sweden

Phone: +46 18 32 03 30Contact: [email protected]: unibap.com

Sales: +46 18 32 03 [email protected] This product is distributed in the United States

by Moog Inc trough Moog Broad Reach

SPECIFICATION HIGHLIGHTS

AMD SoC CPU AMD® Embedded G-series SOC Series1st gen (e2000), 2nd gen (e2100), LX (e2190), 64 bit x86 Jaguar/Puma architecture.

AMD SoC GPU HD RADEON GPU, 2 CU (Up to 77 GFLOPS)DirectX™ 11.1, OpenCL™ 1.2, OpenCL 1.2+, OpenGL 4.5+, Vulcan 1.0, H.264 encoding/decoding

Graphics Output HDMI, LCD/LVDS (e2000), eDP (e21xx)

Memory SoC: 2 GB DDR3 1066 to 1333 with ECCFPGA: 512 MB DDR3 up to 667 with ECC

Board size 70 × 70 mm2

Connectors/IO Qseven® MXM 230, Unibap Ext Connector 120 IO

Temp. range 0 °C to 70 °C (Commercial)-40 °C to 70 °C (Ext. temperature, special)

Power reference Depending on SoC selection and operational modes: 4-20 W. Typ. 10 W.

FPGASafety MCU

Microsemi® SmartFusion2™ARM® Cortex™-M3 MCU

AMD OS Linux (typ. LUbuntu)Opt. Windows 7, Solaris, VxWorks

FPGA OS Typ. Bare metal / FreeRTOSOptional. RTEMS, Ada Ravenscar

USB / SATA 2×USB 3.0, 4×USB 2.0, 2× SATA v3

Interconnect PCIe x4, 20 GT/sPCIe 2x1 Lanes, 5 GT/sPCIe x2 10 GT/s (AMD/FPGA)

Ethernet 1 x 1000Base-T Gigabit (AMD)SGMII Interface (FPGA)

Other Serial/UART, CAN, I2C, SPI, GPIO, LVDS, SERDES.

Qualification IPC 6012C Class 2/3 PCB, IPC 610 Class 2/3 solde-ring, ECSS-Q-30 std derated components

DescriptionUNIBAP’s e20xx/e21xx heterogeneous computing product families are radiation tolerant high-performance compute modules for onboard data processing. The products have spaceflight heritage and uses low power embedded x86 compatible AMD® G-series SOC products from the 1st, 2nd, and LX families. The SOC is paired with a powerful Microsemi® SmartFusion2™ FPGA which provides IO extension and board supervisory management through IP core state-machines or embedded ARM® Cortex™ M3 micro-controller.

The e20xx/e21xx products provides common interfaces for command and data handling, robots, intelligent automation, and autonomous systems, including: Gigabit Ethernet, USB v2.0/v3.0, PCIexpress®, SerDes, LVDS, SATA v3.0, Serial ports, GPIO, CAN 2.0b, I2C, and SPI. The GPIO capabilities of the FPGA can be used for optional interfaces using different (not included) IP cores.

UNIBAP® e20xx/e21xx families of products are the perfect choice for autonomous systems with high demands for data fusion and sensor interfaces using optimized heterogeneous parallel algorithms and extensive IO.

Reference: Bruhn, F.; Brunberg, K.; Hines, J.; Asplund, L.; Norgren, M., ”Introducing radiation tolerant heterogeneous computers for small satellites,” in Aerospace Conference, 2015 IEEE, vol., no., pp.1-10, 7-14

Embedding High Reliability & Safety Critical Heterogeneous Data Processing

Information may change at any time.

Doc.

ref

eren

ce:

1004

001

e20xx/e21xx Qseven® Compute ProductsHeterogeneous Computing Platform with spaceflight heritage

Page 2: Embedding High Description Reliability & Safety Critical

[email protected]

Visitors address:Kungsängsgatan 12Uppsala, Sweden

Unibap AB (publ)Kungsängsgatan 12SE – 753 22 Uppsala, Sweden

Phone: +46 18 32 03 30Contact: [email protected]: unibap.com

Sales: +46 18 32 03 [email protected] This product is distributed in the United States

by Moog Inc trough Moog Broad Reach

Information may change at any time.

e2000/e2100 Series Block Diagram and Connectivity (Qseven+)

Qseven MXM-230 pin

5 V SOC PCIe x 4

Gb LAN LPC

RTC & FAN I2C

2 x SATA3 SMBus

2 x USB 3.0

4 x USB 2.0

HDMI & LCD

HD Audio

Embedded Probe Header

SPI

SD/MMC

2 UART CAN

12 GPIO 5 V FPGA

UNIBAP™120 pin EXT+

PCIe x 1

SGMII

Safe Recovery

Reset / Good

SERDES

FPGA_ULPI

2 x I2C/GPIO

2 x SPI/GPIO

JTAGARM/FPGA

24 x LVDS / 48 GPIO

AIO

AMD x86_64 SOC Power Management/Sequencer

AMDx86_64SOC

UNIBAP™ safe boot

FPGA

Gb LAN PHY

2 GB DDR3 ECC

512 MB DDR3 ECC

FPGA Power Management/Sequencer

BIOS FLASH

ADC 16 channel

(12 bit)

LPC100 Mbps

PCIe5-10 GT/s

Block diagram of e20xx an e21xx family of heterogeneous computational modules.

e2000/e21000 family Optimized Development Environment (ODE kit)

ADVANCED HEALTH MONITORING & REMOTE MAINTENANCE

Extensive tracking of

• voltages

• currents

• power consumption

• temperatures

• bit error detection & correction

• SoC power optimization

Doc.

ref

eren

ce:

1004

001

e20xx/e21xx Qseven® Compute ProductsHeterogeneous Computing Platform with spaceflight heritage