engineering manual loctite gc 3w t3 & t4 solder paste · pdf file• measured

Suitable for use with: Standard SAC Alloys

Engineering ManualLOCTITE GC 3W T3 & T4 Solder Paste

GC 3W – The Game Changer

January, 2016 Engineering Manual GC 3W Solder Paste2

1. Introduction: Basic Properties, Features & Benefits

2. Operating Parameters

• IPC Slump

• Tack Force

• Print Process Window & Capability

• Print Abandon Time

• Continuous Print

• Reflow Performance

• Humidity Resistance

• Surface Finish

• Voiding

3. Cleanability

4. Operating Parameters: Storage

5. Reliability and Specification Testing

6. Product Summary

Contents

1. IntroductionBasic Solder Paste Properties

Flux Description GC 3W GC 3W

Alloy SAC305 SAC305

Henkel Powder Size Type 3 Type 4

Powder Size range, m 45-25 38-20

Metal Content, % wt. 89.5 89.5

Malcom Viscosity, 10rpm (Typical) 150 Pa.s 150 Pa.s

TI (Typical) 0.45 0.48

IPC slump at182C (0.33mm x 2.03mm)

first space no bridge

0.20 mm 0.20 mm

IPC Solder Balling Preferred Preferred

3 Engineering Manual GC 3W Solder PasteJanuary, 2016

4

1. IntroductionGC 3W Features & Benefits

Product Attribute Process Benefit

Halogen Free • No added halogen

• Measured <900ppm chlorine and bromine and <1,500ppm total by

oxygen (O2) bomb test

Halide Free • Flux classification ORM0 in accordance to J-STD-004B

Application • Lead-free water-washable solder paste

• Halogen-free flux technology

• Designed for high-reliability applications

• Excellent humidity resistance and storage stability

• Storage stability: 5-25oC for six months

• Excellent abandon time: 4 hours for 0.5 mm pitch ball devices or 0.4 mm

pitch leaded devices (QFP)

Cleanability • Designed to be cleanable in deionized water

• Residues cleanable after double reflow

• Low corrosivity of flux residues- boards can be cleaned up to 1 week after

soldering

January, 2016 Engineering Manual GC 3W Solder Paste

1. Handling Guidelines

For more detailed information on handling please refer to the Handling Guidelines document for GC 3W solder paste

Storage: It is recommended that GC 3W solder paste is stored at temperatures below 25oC (77oF). Storage below this

temperature down to a temperature of 0°C (32oF) will have no negative effect on the material.

Working Environment: GC 3W solder paste performs best when used in a controlled environment. Maintaining an

ambient temperature of between 20 and 25oC (68-77oF) at a relative humidity of 30 – 60% RH will ensure consistent

performance and maximum life of the paste.

Stirring: To restore GC 3W solder paste to its specified rheology, it can be stirred using a non-metallic or round-edged

spatula for 1 – 2 minutes before being applied to the printer. Solder paste dispensed from a cartridge does not require

stirring as the rheology is restored during the dispensing and printing (knead) process.

GC 3W solder paste packed in jars may show some separation after storage at higher temperatures, if this is observed

the paste can be restored by stirring until it appears homogeneous.

GC 3W solder paste can also be conditioned using commercially available solder paste autostirrer systems. A mixing

time of 1 – 2 minutes is recommended.

Paste Life: As a general rule GC 3W solder paste can be used on the stencil for at least 8 hours at 25oC, 60% RH.

Stencil life may be extended at lower ambient humidity. Paste which has been on the printer can be stored at room

temperature for up to 72 hours before being re-used.

5 January, 2016 Engineering Manual GC 3W Solder Paste

1. Paste Equilibration at Room Temperature

6

Equilibration: If GC 3W is stored under refrigerated conditions a minimum time of two hours is required for

paste to reach an acceptable use temperature, a time of four hours is recommended to ensure equilibration.

Paste stored at room temperature required no equilibration.

GC 3W solder paste equilibrationThermocouple placed in solder paste container during equilibration at room temperature


2. Operating ParametersIPC Slump

7

Stencil

Design/

thickness

GC 3W

A 21

200m

GC 3W

A 20

100m

Aperture 0.63 x

2.03mm

0.33 x

2.03mm

0.33 x

2.03mm

0.20 x

2.03mm

Pass

mark0.63mm 0.30mm 0.30mm 0.20mm

25C 0.33mm 0.10mm 0.15mm 0.125mm

182C 0.33mm 0.20mm 0.15mm 0.125mm

GC 3W A20 @182oC

100mGC 3W A21 @182oC

200m

• Slump evaluation was performed in accordance with J-STD-005A, IPC-TM-650 2.4.35

• First spacing with no bridge recorded after 10 minutes at 182C (35C below melting point 217C)

No bridging observed at 0.20 mm gap at 182oC, this represents the typical spacing of 0.4 mm pitch leaded devices


2. Operating ParametersTackiness

Preload 300g

Preload time 5 secs

Retraction Speed 2.5mm/sec

Deposit diameter 5.1mm

Deposit height 0.25mm

8

• Solder paste should remain tacky after deposition to hold components in place between

placement and the reflow process

• Method IPC-TM-650 2.4.44 (J-STD005)

• GC 3W tack-life >48hours

• Paste tested Loctite GC 3W SAC305 T4 895VMalcom TK1 Tackiness Tester

The tackiness of GC 3W solder paste does not show a marked decrease over a 48-hour period


2. Operating ParametersPrint Process Window (example 0.5 mm CSP)

9

GC 3W solder paste can be printed using a wide range of print conditions

Print Condition Value

Stencil thickness 125 µm

Separation Speed 0.5 -100mm/s

GC 3W solder paste can be printed

using a wide range of conditions,

additional print pressure is required at

achieve the best process at higher

print speeds.

As a general guide to process setup

sufficient pressure should be applied

to achieve good topside stencil

wiping.


2. Operating ParametersPrint Process Window (example 0.4 mm QFP)

10


Stencil thickness 125 µm

Separation Speed 0.5 -100mm/s

GC 3W solder paste can be printed

using a wide range of conditions,

additional print pressure is required at

achieve the best process at higher

print speeds.

As a general guide to process setup

sufficient pressure should be applied

to achieve good topside stencil

wiping.

GC 3W solder paste can be printed using a wide range of print conditions


Type 3 Powder Type 4 Powder

Typical minimum aperture

diameter0.25 mm 0.22-0.20 mm

Smallest minimum aperture

diameter (best process)0.23 mm 0.20 mm

11

2. Operating ParametersPrint capability (circular aperture, 100 micron stencil)

T4 paste, 0.21 mm

aperture

T3 paste, 0.23 mm

aperture


2. Operating ParametersPrinter abandon time at 25oC/ 50% RH

12

No knead cycle done

on recommencing

printing


Print Pressure 7kg

Print Speed 50mm/s

Separation Speed 10mm/s

Stencil Thickness 125µm

Aperture width TQFP 0.20 mm

GC 3W shows long abandon time- no knead cycle required after 4 hrs abandon for 0.40 mm QFP apertures

Initial 2 hours 4 hours

Printer abandon time is the time the

paste can be left on the printer and

still produce an acceptable first

print.

The abandon time achievable with

a solder paste is dependent on the

finest pitch devices on the board.

Print volume data is presented for a

typical 0.4 mm pitch leaded device

and a 0.5 mm ball device.


2. Operating ParametersPrinter abandon time at 25oC/ 50% RH

13

No knead cycle done

on recommencing

printing

GC 3W shows long abandon time - no knead cycle required after 4 hrs abandon for 0.5 mm CSP device

Initial 2 hours 4 hours


Print Pressure 7kg

Print Speed 50mm/s



Aperture width TQFP 0.20 mm


2. Operating ParametersContinuous Printing, 8 hours at 25oC/50% RH

14


Print Pressure 7kg

Print Speed 50mm/s



Print time 8 hrs

Print cycles 1,200

GC 3W solder paste shows similar print performance after continuous printing for eight hours

0.4 mm TQFP 120, before and after 2000 cycle print (8 hrs)


2. Operating ParametersContinuous Printing, 8 hours at 25oC/50% RHIPC Slump Performance

15

Stencil

Design/

thickness

GC 3W

A 21 200m

Initial

GC 3W

A 21 200m

8 Hours

Aperture 0.63 x

2.03mm

0.33 x

2.03mm

0.63 x

2.03mm

0.33 x

2.03mm

Pass

mark0.63mm 0.30mm 0.63mm 0.30mm

25C 0.33mm 0.10mm 0.33mm 0.10mm

182C 0.33mm 0.20mm 0.33mm 0.20mm

Initial slump 182oC

(0.33 mm pad)

Slump after 1,200 cycles

(0.33 mm pad)

GC 3W solder paste passes IPC slump before and after continuous printing for 8 hours


2. Operating ParametersContinuous Printing, 8 hours at 25oC/50% RH, IPC SlumpSolder Balling and Reflow (coalescence)

16

Solder Ball Test CSP 56 coalescence

6543210

250

200

150

100

50

0

Time / minutes

Te

mp

era

ture

(C

)

217

Reflow Profile

Reflow Condition Value

Time Above 217oC 49s

Peak Temperature 244oC

GC 3W solder paste shows good reflow performance after continuous printing for 8 hours


Linear type profile

Mean heating rate 0.8 – 1.5oC/s

Peak temperature 225 – 250oC

Time above liquidus (217oC) 20– 50s

2. Operating ParametersReflow Process Guidelines, summary

17

There is no single profile that works for all applications and processes should be assessed individually.

During applications testing good results were achieved using profiles within the reflow guidelines below.

Reflow was assessed using a Heller 1826 forced convection

reflow oven, example profiles are provided on the following slides


2. Operating ParametersReflow Process Guidelines (aerobic reflow)

18

Time above 217oC 20-50s

Peak temperature 225-250oC

Ramp rate 0.8-1.5 oC/s

The optimum reflow process range is shown by the green (solid line) profiles, this optimum range is

summarized in the table


2. Operating ParametersReflow Process Guidelines (anaerobic reflow, N2)

19

Time above 217oC 20-65s

Peak temperature 225-250oC

Ramp rate 0.7-1.5 oC/s

O2 concentration <1000 ppm

The optimum reflow process range is shown by the green (solid line) profiles, this optimum range is

summarized in the table


2. Operating ParametersSolder Balling / Humidity Resistance

20

GC

3W

Initial 4hr @ 27C/60%RH

6543210

250

200

150

100

50

0

Time / minutes

Te

mp

era

ture

(C

)

217

Reflow Profile

GC 3W solder paste shows preferred category reflow after testing to the IPC solder balling test IPC TM-650 2.4.43

A solder balling test is a method of assessing the ability of a solder paste to coalesce.

A circular deposit of paste is printed on a non-wettable substrate and the paste is reflowed in an

oven, the paste should reflow into a single large solder ball with few or no satellite balls.

Results are presented below for the IPC solder balling test (IPC TM-650 2.4.43)

IPC Solder Balling TM-650 2.4.43

Stored 4 hours at 27oC/60% RH

Result: IPC Preferred category

Paste tested initially and after storage

of printed solder paste for four hours

at 27oC/ 60% RH


2. Operating ParametersHumidity Resistance- Reflow

21

Initial (Print) Initial (Reflow) 8hr 27oC/80% RH 24hr 27oC/80% RH

GC 3W solder paste shows good solder balling performance after exposure to high humidity conditions

Solder balling and coalescence was also tested to an internal Henkel test method.

Good coalescence was achieved after storage of printed FR4 substrates for 24 hours

at 27oC/80% RH

6543210

250

200

150

100

50

0

Time / minutes

Te

mp

era

ture

(C

)

217

Reflow Profile

Reflow

Condition

Value

T> 217oC 49s

Peak 244oC


Au

1206 0805 0402 0201

Component

OS

P C

u2. Operating Parameters Placed Components – Au & OSP Cu

22


Print Pressure 7kg

Print Speed 50mm/s



BGA196 SOIC Side


2. Operating Parameters Reflow – Au & OSP Cu(shown prior to cleaning)

23

Au

1206 0805 0402

Component

OS

P C

u

0201

76543210

300

250

200

150

100

50

0

Time (minutes)

Te

mp

era

ture

(C

)

217C

Reflow ProfileReflow Condition Value



Mean Slope 0.9

BGA (Side) SOIC (Side)


2. Operating ParametersVoiding

24

GC 3W meets voiding requirement IPC7095B Class 3

• Void performance on unpopulated OSP-Cu & Au

surfaces with different reflow profiles.

Finish

Profile

OSP-CuAu

Profile 2Profile 1Profile 2Profile 1

25

20

15

10

5

0

IPC

Vo

idin

g %

Class 3

Class 2

Class 1

Boxplot of IPC Voiding Percentage

Reflow Condition Profile 1 Profile 2

Time Above 217oC 42s 49s

Peak Temperature 243oC 244oC


2. Operating ParametersVoiding: 0.5mm CSP56 component

25

GC 3W meets voiding requirement IPC7095B Class 3

Boxplot of CSP56 voiding Histogram of CSP56 voiding

Reflow Condition Value



Mean Slope 0.9

OSP copper board finish, SAC component ball

• Void performance on CSP component


3. Operating ParametersCleaning, Typical Parameters

26

Parameter Typical Range

Wash Temperature 40-60oC 104-140oF

Wash Time 5-15minutes

Rinse Temperature 30-50oC 86-122oF

Number of Rinses (30s each) 2-6

*Typical range for batch aqueous cleaner, both wash and

rinse stages deionized water

The post-reflow residues of GC 3W solder paste must be removed using a cleaning process after reflow. GC 3W

solder paste residues can be removed using aqueous or semi-aqueous cleaning processes. Boards can be cleaned

after a delay of up to seven days after soldering if required.

There is no single cleaning process that can be recommended for all applications and assemblies as the processes

and cleaning equipment used may vary. Guidelines based on laboratory testing of GC 3W solder paste in a

representative batch aqueous cleaner are provided as a starting point for process setup.


3. Operating ParametersCleaning, Typical Parameters

27

GC 3W shows acceptable cleaning under this range of conditions, ionic contamination <0.03 µg cm-2 (IPC 2.3.25)

• Visual cleanliness similar within above range

• Residues can be cleaned after a delay of up to 1

week (assessed by SIR testing)

• Number of rinses is the most influential factor

for ionic cleanliness

Parameter Typical Range

Wash/ rinse solution Deionized water

Wash Temperature 40-60oC

Wash Time 5-15 minutes

Rinse Temperature 30-50oC

Number of Rinses 2-6 (30s each)


3. Operating Parameters Single & Double Reflow after Cleaning

28

Sin

gle

Reflow

1206 0805 0402 BGA

Component

Double

Reflow

76543210

300

250

200

150

100

50

0

Time (minutes)

Te

mp

era

ture

(C

)

217C




Mean Slope 0.9

BGA (Removed)

• Reflowed on OSP-Cu

• Aqueous batch cleaner

• Deionised water at 50oC

• 5 minute Wash Cycle

• 4x30 seconds Rinse Cycle

GC 3W residues can be removed after processing through two typical reflow cycles

0201


4. Operating Parameters: StorageStorage Stability at 40oC

29

0.0

50.0

100.0

150.0

200.0

250.0

300.0

350.0

0 5 10 15 20 25 30 35

Vis

cosi

ty /

Pa.

s

Speed /rpm

Initial 4 weeks 40C

GC 3W paste shows little change in viscosity on storage for one month at 40oC

Shows typical print performance and good appearance

Malcom viscosity (mean of multiple batches) Initially and after storage at 40oC

GC 3W solder paste is tolerant to short-term high temperature storage (1 month at 40oC)


4. Operating Parameters: StoragePrint Capability (initial)

30


Print Pressure 7kg

Print Speed 50mm/s



Initial, 0.5 mm CSP56 (Cp 3.4) Initial, 0.4 mm TQFP120 (Cp 5.8)

GC 3W solder paste shows good print capability(Cp > 1.33 for 0.5 mm pitch ball components and 0.4 mm pitch leaded components)


4. Operating Parameters: StoragePrint capability after storage for 4 weeks at 40oC

31

1000

0000

9000

000

8000

000

7000

000

6000

000

5000

000

4000

000

LSL USL

LSL 3.52189e+006

Target *

USL 1.05657e+007

Sample Mean 7.31507e+006

Sample N 2520

StDev (Within) 351562

StDev (O v erall) 430165

Process Data

C p 3.34

C PL 3.60

C PU 3.08

C pk 3.08

Pp 2.73

PPL 2.94

PPU 2.52

Ppk 2.52

C pm *

O v erall C apability

Potential (Within) C apability

PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00

O bserv ed Performance

PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00

Exp. Within Performance

PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00

Exp. O v erall Performance

Within

Overall

Process Capability of CSP56 VolumeLoctite GC 3W SAC305 T4 895V Paste, 4wks 40C

4950

0000

4500

0000

4050

0000

3600

0000

3150

0000

2700

0000

2250

0000

1800

0000

LSL USL

LSL 1.74187e+007

Target *

USL 5.2256e+007

Sample Mean 2.7142e+007

Sample N 1800

StDev (Within) 997023

StDev (O v erall) 1.75909e+006

Process Data

C p 5.82

C PL 3.25

C PU 8.40

C pk 3.25

Pp 3.30

PPL 1.84

PPU 4.76

Ppk 1.84

C pm *

O v erall C apability

Potential (Within) C apability

PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00

O bserv ed Performance

PPM < LSL 0.00

PPM > USL 0.00

PPM Total 0.00

Exp. Within Performance

PPM < LSL 0.02

PPM > USL 0.00

PPM Total 0.02

Exp. O v erall Performance

Within

Overall

Process Capability of TQFP VolumeLoctite GC 3W SAC305 T4 895V Paste, 4wks 40C

Stored, 0.5 mm CSP56 (Cp 3.3) Stored, 0.4 mm TQFP120 (Cp 5.8)

GC 3W solder paste shows good print capability after 1 month storage at 40oC


Print Pressure 7kg

Print Speed 50mm/s




4. Operating Parameters: StoragePrint capability after storage for 6 months at 26.5oC

32

Stored, 0.5 mm CSP56 (Cp 3.3) Stored, 0.4 mm TQFP120 (Cp 5.6)

GC 3W solder paste shows good print capability after 6 months storage at 26.5oC


Print Pressure 7kg

Print Speed 50mm/s




4. Operating Parameters: StorageReflow after 6 months storage at 26.5oC (after cleaning)

33

1206 0805 0201

Component

76543210

300

250

200

150

100

50

0

Time (minutes)

Te

mp

era

ture

(C

)

217C




Mean Slope 0.9

• Reflow on OSP copper board

• Aqueous batch cleaner

• Deionised water at 50oC

• 5 minute Wash Cycle

• 4x 30 seconds Rinse Cycle

GC 3W solder paste shows good reflow after six months storage at 25oC

0402 SOIC


HF 2W flux has been classified as ORM0 according to reliability test methods defined in the J-STD004b specification

• OR designates an organic flux- the largest part of the non-volatile portion of GC 3W flux is best described as organic

• M designates moderate flux activity, GC 3W flux must be cleaned in order to meet the IPC Surface Insulation Resistance requirement

• 0 designates a material that is halogen-free

5. GC 3W Reliability & Specification TestingSummary

34

Standard Test Result

ANSI/

J-STD-004B

Cu Corrosion

IPC TM-650 2.6.15C

Pass

Cu Mirror

IPC TM-650 2.3.32D

Pass

Halogen Pass (no added halogen)

Surface Insulation Resistance

IPC TM-650 2.6.3.3 &

IPC TM-650 2.6.3.7

Pass

(cleaned)3.2 x108 Ohms (2.6.3.3, after 168 hrs.)

Electromigration

IPC TM-650 2.6.14.1

Pass

(cleaned)1.1x1011 Ohms after 21days

GC 3WControl

GC 3W has been assigned the flux classification ORM0 according to ANSI/ J-STD004B


5. GC 3W Reliability Surface Insulation Resistance (SIR) to IPC TM-650 2.6.3.3(85oC/ 85% RH)

SIR / Ohms

24 hours 96 hours 168 hours

Loctite GC 3W

Cleaned after reflow(deionized water)

1.8 x108 2.3 x108 3.1 x108

Loctite GC 3W

Cleaned seven days after

reflow(deionized water)

1.8 x108 2.5 x108 3.2 x108

Passmark 1.0 x108 1.0 x108 1.0 x108

35

GC 3W passes surface insulation resistance test to method IPC TM-650 2.6.3.3 after cleaning

200 µm track gap, 85oC/85% RH, 5V bias, measured after cleaning

(deionized water, 50oC)


5. GC 3W Reliability Electrochemical Migration Resistance (electromigration)To IPC TM-650 2.6.14.1

36

GC 3W passes electromigration to method IPC TM-650 2.6.14.1 after cleaning

65oC/85% RH, 5V bias, tested after cleaning (deionized water, 50oC)


5. GC 3W ReliabilitySurface Insulation Resistance (SIR) to IPC TM-650 2.6.3.7

37

GC 3W passes surface insulation resistance test to method IPC TM-650 2.6.3.3 after cleaning

200 µm track gap, 40oC/93% RH, 5V bias, measured after cleaning (deionized

water, 50oC)


38

5. GC 3W Specification Testing

• SGS report for GC 3W.

• Sample reflowed flux residue.

• Reference EN14582/IC Analysis.

• To meet halogen free requirements.

• Br<900ppm, Cl <900ppm, and

• combined <1500ppm

• Halogen – Fluorine - ND

• Halogen – Chorine - ND

• Halogen – Bromine – ND

• Halogen – Iodine – ND

GC 3W contains no detectable halogen and is designated as halogen free


5. GC 3W Reliability Summary

39

Copper Mirror (IPC TM-650 2.3.32D) Pass

Corrosion (IPC TM-650 2.6.15C) Pass

Halogen content (EN 14582, O2 bomb) Pass

SIR (IPC TM-650 2.6.3.3)

• Cleaned same day as reflowPass (when cleaned)

SIR (IPC TM-650 2.6.3.3)

• Cleaned after delay of 1 weekPass (when cleaned)

SIR (IPC TM-650 2.6.3.7

5V/200m spacingPass (when cleaned)

Electromigration (IPC TM-650 2.6.14.1) Pass (when cleaned)

IPC Flux classification, J-STD004B, Dec 2008 ORM0


6. Performance Summary

• Flux

• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582

• Halogen-free flux classification: ANSI/J-STD-004 Rev. B, ORM0 classification

• Paste

• Lead-free, water-washable solder paste

• Storage stability: 5-25oC for six months

• Suitable for fine pitch, high speed printing up to 150 mm/s (6”/s)

• Excellent resistance to humidity

• Long printer abandon time and open time

• Designed to be cleanable in deionized water

• Residues cleanable after two reflow cycles

• Low corrosivity of flux residues: boards can be cleaned up to seven days after

soldering

40 January, 2016 Engineering Manual GC 3W Solder Paste

Thank you!

engineering manual loctite gc 3w t3 & t4 solder paste · pdf file• measured

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