engineering presentationowner: marf rev *b tech lead: rajv design win replication: fx3 solution for...
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Design Win Replication:
FX3 Solution for 3-D Imaging
001-88003 Rev. *B
Simplify Your 3-D Imaging Design With a Flexible, One-Chip, USB 3.0 Solution
Presentation: To provide an engineering overview to customers for a Cypress solution.Title slide: To define what the presentation will cover. The subtitle is a short sentence stating the key opportunity.
Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
3-D Imaging: Next Killer App for USB 3.03-D Imaging is changing the way consumers interact with content3-D video cameras create the perception of depth, offering a more immersive viewing experience
3-D game consoles track body movements, eliminating the need for game controllers
3-D motion sensors track finger gestures, eliminating the need for keyboards and mice
3-D Imaging requires high data bandwidthUses two image sensors instead of one, doubling the image data
Requires higher frame rates to enable precise motion sensing and fast-action games
3-D Imaging is the trend in video, gaming and motion-sensing products
Market Vision: To define the market opportunity. Presents compelling data and end product photos relevant to the local market.
XBOX 360 Game Consoleby Microsoft
3-D Video Camera by Panasonic
3-D Motion Sensorby Leap Motion
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation.To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.
ApplicationColumn Pixels
Row Pixels Resolution
Frame Rate
Color Depth Bandwidth
Video 1,920 1,080 2.07 megapixels 30 fps 24 bits (RGB) 3.0 Gbps
Gaming 1,280 720 0.92 megapixels 120 fps 8 bits (B&W) 1.8 Gbps
Motion Sensing 640 480 0.31 megapixels 60 fps 8 bits (B&W) 0.3 Gbps
Common Image Sensor Configurations for 3-D Imaging (Two Sensors)
Terms You Will Hear Today
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Additional Terms
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation.To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.
USB Camera ControllerA microcontroller that converts an image sensor data stream into USB traffic
USB 3.0 Peripheral ControllerA microcontroller in a USB 3.0 Device that handles USB 3.0 protocol and communicates with the USB Host
USB 3.0 DriverA software program in the host system that operates or controls the USB 3.0 Device attached to it
FirmwareA set of instructions programmed on a USB 3.0 Peripheral Controller
USB Video Class (UVC)A specification that defines the standard behavior of a USB video camera, known as a “UVC camera”
Widely adopted in consumer cameras supported by major PC operating systems
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
FX3 Terms
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation.To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.
EZ-USB® FX3™ ControllerCypress’s programmable USB 3.0 Peripheral Controller with integrated USB 3.0 transceiver
Includes a powerful on-chip ARM9 processor and 512KB RAM for firmware storage and data buffering
Supports additional peripheral connectivity via I2C, I2S, SPI and UART
Includes a Software Development Kit (SDK) with example code to reduce your design effort
GPIF™ II: Second-Generation General Programmable InterfaceProgrammable 100-MHz, 32-bit interface that allows FX3 to communicate with systems that have a parallel interface
GPIF II DesignerDesign software that installs on your PC
Contains simple graphical user interface (GUI) to configure the GPIF II
GPIF II DescriptorA set of commonly predefined GPIF II configurations used to program FX3 more quickly
FX3 Application Programming Interface (API)A software interface in the SDK library that enables firmware programs to interact with each other to create specialized USB functions
Cypress Control CenterA part of the FX3 SDK that installs on your PC
A simple GUI used to configure the FX3 Development Kit (DVK)
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Design Problems Engineers Face
Traditional Approach and Challenges: To present the traditional approach and the challenges engineers will face when using it to realize the Market Vision. Ends with a one-sentence segue clearly stating the benefit of the Cypress solution.
Camera controllers
USB 2.0 Multichip Solution for 3-D Imaging
FX3 One-Chip Solution for 3-D Imaging
8
8
8-16
16-32 USB 3.0
USB 2.0
PC
USB 2.0 hub
FX3
USB 2.0PC
Image sensors
Image sensors
8-16
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
To get started, you should:Buy the FX3 DVK online (CYUSB3KIT-001)
Choose your image sensors
Download and install the FX3 SDK on your PC
Read App Note: How to Implement an Image Sensor Interface with FX3 in a UVC Framework
Configure the GPIF II interface for two sensors with the GPIF II Designer software
Write FX3 3-D Imaging firmware using the FX3 SDK
Prototype your firmware design quickly with the FX3 DVK
0.5
inch
Prototyped quickly using the FX3 Development Kit…
FX3 Solution: 3-D Imaging Made Easy
Upgrading a complex USB 2.0 3-D Imaging design to use USB 3.0…
Is simplified by FX3 with programmable GPIF II…
And miniaturized into a small 3-Dmotion sensor by Leap Motion.
FX3
USB 3.0connector
1 inch
3 inches
The state diagram of an image sensor interface
The GPIF II is programmed to match the interface
GPIF II connector
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.
A USB 2.0 multi-chip solution costs more and requires more PCB area
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Configuring GPIF II for Two Sensors FX3 Example Project Demonstrating GPIF II Interface Customization for Two Image Sensors
1. Initiate a new project using Cypress-supplied interfaces, or start from scratch
2. Select the type, bus width, and I/Os of the desired interface
3. Create a state machine that matches interface timing by adding state blocks and transitional conditions
4. Visualize state transitions and associated output signals
5. Generate GPIF II descriptor to be used in the next step: Design FX3 firmware
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide.To provide a short, clear list of what to do to get started.
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Write Firmware Quickly Using FX3 SDKFX3 Example Project Demonstrating 3-D Imaging Firmware Design in FX3 SDK
1. Use the UVC example code as a reference to write your FX3 3-D Imaging firmware in C code. Insert the GPIF II descriptor into the project directory.
2. Compile the firmware by clicking the “Build All” button under the “Project” tab
3. Use the App Note “How to Implement an Image Sensor Interface with FX3 in a UVC Framework” for completedesign guidelines
4. Learn about FX3 functionality by reading the “FX3 Programmers Manual” and the “Firmware API Guide” included in the SDK
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide.To provide a short, clear list of what to do to get started.
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Prototype 3-D Imaging designs quickly with FX3 DVKBuild a custom dual-image-sensor daughter board based on your image sensor of choice
Connect the daughter board to the FX3 DVK using the GPIF II connector
Connect your DVK to the PC using a USB 3.0 cable and install the Cypress USB 3.0 driver
Program the FX3 DVK with 3-D Imaging firmware using the Cypress Control Center
The FX3 DVK will reconnect to the PC as a UVC camera
Run video-capture software (e.g., AMCap or equivalent) to watch the live video from two image sensor sources
Prototype Quickly with FX3 DVK
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide.To provide a short, clear list of what to do to get started.
Two Aptina Image Sensors (MT9V024)
FX3 DVK (CYUSB3KIT-001)
GPIF II Connector
FX3USB 3.0Connector
5-V Power
Jack
RS232Connector
JTAG Headers
I2S Headers
SPI Headers
Example: 3-D Motion Sensor Prototype by Leap Motion FX3 DVK + Dual-Image-Sensor Daughter Board
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Example End-Product Design
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide.To provide a short, clear list of what to do to get started.
3-D Motion Sensor by Leap Motion
FX3 SPI Flash
19.2-MHz Crystal
Factory Debug Connector
Image Sensor #1
Image Sensor #2
USB Connector
For a quick 3-D Imaging demonstration, buy a Leap Motion 3-D Motion Sensor
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
EZ-USB® FX3™ Solution Example:
3-D Motion SensorBlock Diagram
USB 3.0 Enabled
HostSPIUART I2C I2S
GP
IF I
I
US
B 3
.0
ARM 9
JTAG 512KB RAM (32 End
Points)
EZ-USB® FX3™ One-Chip Solution
Control
323232
32
Solution Examples: To give detailed one-page Solution Examples from the field in the specified format.
8-16Image Sensor
#1
Image Sensor
#2
3-D Motion Sensorby Leap Motion
Design ChallengesDeliver 3-D Imaging without bandwidth limitationsEliminate need for multiple ICs to reduce BOMProvide flexibility to meet customer design requirementsShrink PCB to achieve smaller form factor
EZ-USB FX3 Solution5-Gbps bandwidth enables high-bandwidth 3-D ImagingGPIF II connects FX3 directly to two image sensorsPowerful on-chip ARM9 CPU and 512KB RAM provided4.7-mm x 5.1-mm, 131-ball wafer-level chip-scale package
EZ-USB FX3 Value
App Notes: Getting Started with FX3FX3 Hardware Design GuidelinesHow to Implement an Image Sensor
Interface with FX3 in a UVC Framework
Videos: FX3 3-D Imaging Demo
Documents: FX3 Programmers Manual (included in SDK)
FX3 Firmware API Guide (included in SDK)
Suggested Collateral
Kit: EZ-USB FX3 DVK (CYUSB3KIT-001)Software: EZ-USB FX3 Software Development Kit
GPIF II Designer
Boards and Software
8-16
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
Feature FX3Two USB Camera Controllers + USB 2.0 Hub
One-Chip Solution Yes No
Design Miniaturization 24 mm2 150 mm2, including layout space
USB 3.0 Data Rate (5 Gbps) Yes, 10x USB 2.0 No, USB 2.0 only (480 Mbps)
Programmability 32-bit ARM9 8-bit MCU (8051 or home brew)
Software Development Kit Yes No
On-Chip Memory 512KB SRAM 1KB SRAM
FX3 Solution vs. Competition’s
Competitive Comparison: To define key features of the Cypress solution and demonstrate its superiority over the Next Best Alternatives (NBA’s). Must be credible and objective to the salesperson and customer.
6 mm
8 mm
4.7 mm
5.1 mm
6 mm
6 mm
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
BOM Integration Value
Competitor
Total Value Delivered
Total Additional Value
FX3 3-D Imaging Solution ValueCompetitorTwo USB 2.0 Camera Controllers: OmniVision OV538Price: $1.75 x 2 = $3.501
BOM IntegrationUSB 2.0 Hub: Microchip USB2512BPrice: $1.332
Additional ValueDesign Miniaturization: FX3 = 24 mm2 CSP enables smaller enclosure size vs. competition = 150 mm2 (Savings = $0.02 per mm2)Value added: $2.52
USB 3.0 Data Rate: FX3 5-Gbps bandwidth supports higher resolution and higher frame rate vs. USB 2.0 480-Mbps competitionValue added: $2.253
Programmability: 32-bit ARM9 CPU enables encryption, vendor-specific device class, and other customization vs. 8-bit 8051 competitionValue added: $3.114
SDK: FX3 provides industry standard tools, saving up to 30 man-weeks of engineering effort at $5k per man-week; amortized over 100ku Value added: $1.50
On-Chip Memory: FX3 512KB SRAM allows large buffers (8 x 16KB) for higher data throughput vs. 1KB competition (Savings = $0.01 per KB)Value added: $5.11 Target Cypress Solution: CYUSB3014-FBXCT
Total Cost: $13.9428% Total Savings: $5.38
$1.33
$3.50
$1.33
$2.52
$14.49
$2.25
$19.32
$3.11
$1.50
USB 2.0 Hub
Design Miniaturization
USB 3.0 Data Rate
Programmability
SDK
$5.11On-Chip Memory
1 Estimated1ku pricing per customer input on 2/25/2015 3 1ku pricing from Microchip Direct: price delta between USB 3.0 Hub (USB5532B) and USB 2.0 Hub (USB2512B) on 2/25/20152 1ku pricing from Microchip Direct (USB2512B) on 2/25/2015 4 1ku pricing from TI: price delta between ARM9-based MCU (AM1802) and 8051-based MCU (TUSB3210) on 2/25/2015
EVC Slide: To clearly define the value of the Cypress solution, including BOM integration and unique functionality. 14
Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
1. Watch our demo video: FX3 3-D Imaging Demo
2. Read the Getting Started with EZ-USB FX3 App Note: AN75705
3. Buy the $397 EZ-USB FX3 Development Kit: CYUSB3KIT-001
Here’s How to Get Started
Call to Action: To tell customers how to start their design process.
3-D Motion Sensorby Leap Motion
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Engineering Presentation Owner: MARFRev *B Tech lead: RAJV
References and LinksFX3 3-D Imaging Demo Video: FX3 3-D Imaging Demo Machine Vision Camera Demo Video: FX3 MV Camera Demo FX3 HD 720p Camera Kit Demo Video: FX3 Camera Kit Demo
EZ-USB FX3 App Note:Getting Started with EZ-USB FX3: AN75705Gives highlights of USB 3.0 technology and an overview of the FX3 architecture, software, and collateralShows FX3 SDK setup, Cypress USB driver installation, firmware download, and USB 3.0 traffic verification
EZ-USB FX3 Hardware Design Guidelines and Schematic Checklist: AN70707Shows how to design a board with 5-Gbps USB 3.0 traces
How to Implement an Image Sensor Interface with FX3 in a UVC Framework: AN75779Describes a UVC video streaming application in which FX3 streams images from an image sensor to a USB Host
EZ-USB FX3 Development Kit: CYUSB3KIT-001 EZ-USB FX3 HD 720p Camera Kit: FX3 Camera Kit
Software Development Kit: EZ-USB FX3 Software Development KitProvides Eclipse IDE, ARM GCC, Cypress USB 3.0 driver, example code, FX3 Programmers Manual, and API Guide
GPIF II Designer: GPIF II Designer
References and Links: Provide comprehensive view of resources to assist in learning about and adapting the solution. 16