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Equipment Engineering Capabilities (EEC)

Guidelines (Phase 2.5)

An International SEMATECH & JEITA/Selete Collaboration Equipment Engineering Capabilities (EEC) Guidebook

Version 2.5

July 2002

Table of ContentsTable of ContentsTable of ContentsTable of Contents

1 TABLE OF FIGURES.......................................................................................................... 4

2 PREFACE.............................................................................................................................. 5

3 INTRODUCTION................................................................................................................. 6 3.1 BACKGROUND.................................................................................................................. 6 3.2 PURPOSE .......................................................................................................................... 8 3.3 EQUIPMENT ENGINEERING DEFINITION............................................................................ 9 3.4 FUNDAMENTAL EEC EXPECTATIONS............................................................................... 9 3.5 GUIDELINE PHASING STRATEGY .................................................................................... 13

4 REVISION AND APPROVAL HISTORY ...................................................................... 15

5 GUIDELINE FORMAT DEFINITIONS ......................................................................... 16

6 GENERAL GUIDELINES................................................................................................. 17 6.1 EQUIPMENT ENGINEERING DATA SHARING ................................................................... 17 6.2 DETERMINATION OF EQUIPMENT ENGINEERING DATA .................................................. 18 6.3 EQUIPMENT ENGINEERING DATA SAMPLING AND TRANSMISSION CAPABILITY............. 19 6.4 CONTINUOUS MONITORING ........................................................................................... 20 6.5 �ON DEMAND� EQUIPMENT ENGINEERING DATA........................................................... 21 6.6 EQUIPMENT ENGINEERING DATA INTERFACE ................................................................ 22 6.7 EQUIPMENT PERFORMANCE INTEGRITY ......................................................................... 23 6.8 FRAMEWORK FOR EQUIPMENT ENGINEERING CAPABILITIES.......................................... 24 6.9 RELATIONSHIP BETWEEN MES AND EEC ...................................................................... 25 6.10 STANDARDIZATION OF EQUIPMENT ENGINEERING DATA INTERFACE ............................ 26 6.11 CATEGORY AND LEVEL OF EQUIPMENT ENGINEERING DATA ........................................ 27

7 EE DATA INTEGRITY GUIDELINES........................................................................... 28 7.1 EE DATA AVAILABILITY ............................................................................................... 28 7.2 EE DATA CONTEXT ....................................................................................................... 30 7.3 EE DATA QUALITY........................................................................................................ 31

8 RAMP-UP & MAINTENANCE SUPPORT CAPABILITY GUIDELINES................ 32 8.1 INITIATION OF EE DATA SHARING................................................................................. 32 8.2 HISTORICAL EE DATA ................................................................................................... 33 8.3 IMPROVED MAINTENANCE SUPPORT.............................................................................. 34 8.4 MAINTENANCE DOCUMENT GUIDELINE......................................................................... 35

9 E-DIAGNOSTICS CAPABILITY GUIDELINES .......................................................... 36 9.1 SECURITY....................................................................................................................... 36 9.2 REMOTE ACCESS SECURITY........................................................................................... 37 9.3 EQUIVALENT REMOTE AND LOCAL CAPABILITIES AND EE DATA.................................. 38 9.4 AUDIO-VISUAL COLLABORATION.................................................................................. 39

10 SINGLE POINT OF CONTROL GUIDELINES........................................................ 40 10.1 SINGLE POINT OF CONTROL AT THE PRODUCTION EQUIPMENT...................................... 42 10.2 SINGLE POINT OF CONTROL AT THE FACTORY LEVEL.................................................... 43

10.3 EQUIPMENT PROCESSING INTERRUPTION AND/OR TERMINATION................................... 44 10.4 EQUIPMENT LOGICAL INTERFACE (ELI) ........................................................................ 45 10.5 EQUIPMENT PERFORMANCE CONDITIONING, CONTROL AND CONFIGURATION.............. 47

11 PROCESS SPECIFICATION MANAGEMENT GUIDELINES.............................. 48 11.1 PARAMETER ADJUSTMENT............................................................................................. 49 11.2 PROCESS SPECIFICATION MANAGEMENT ....................................................................... 50 11.3 PROCESS SPECIFICATION VERIFICATION ........................................................................ 51

12 APPENDIX A � RELATED SEMI STANDARDS...................................................... 52 12.1 SEMI EQUIPMENT AUTOMATION SOFTWARE STANDARDS............................................ 52 12.2 SEMI CONTACT INFORMATION ..................................................................................... 52

13 APPENDIX B � CONTACT INFORMATION ........................................................... 53 13.1 JAPAN ELECTRONICS AND INFORMATION TECHNOLOGY INDUSTRIES ASSOCIATION (JEITA) ..................................................................................................................................... 53 13.2 SELETE RESEARCH DEPARTMENT 1 ............................................................................... 53 13.3 INTERNATIONAL SEMATECH EEC STUDY GROUP ..................................................... 54

14 APPENDIX C � GLOSSARY AND ACRONYMS...................................................... 55

1 Table of Figures Figure 1: Keeping on the Productivity Curve................................................................................. 6

Figure 2: Effective Productive Time Ratio of Process Equipment ................................................. 6

Figure 3: Two Main Areas for Equipment Improvement................................................................ 7 Figure 4: Distribution of Causes of Equipment Downtime ............................................................ 7

Figure 5: Equipment Engineering Data Interface to be Logically Separate.................................. 9

Figure 6: Multiple EEC Applications For a Single Production Equipment................................ 10

Figure 7: Possible Factory Integration Options .......................................................................... 10

Figure 8: Possible Equipment Supplier Integration Options ....................................................... 10

Figure 9: EEC Applications are Modular, Independent, and Optional ....................................... 11

Figure 10: Factory Diagram with New EES Components ........................................................... 12

Figure 11: Proposed Equipment Engineering Capabilities Guideline Phasing Strategy ............ 13

Figure 12: Equipment Engineering Data Sharing........................................................................ 17

Figure 13: Determination of Equipment Engineering Data......................................................... 18 Figure 14: Equipment Engineering Data Sampling And Transmission Capability ..................... 19

Figure 15: Continuous Monitoring............................................................................................... 20

Figure 16: �On Demand� Equipment Engineering Data .............................................................. 21

Figure 17: Equipment Engineering Data Interface...................................................................... 22

Figure 18: Equipment Performance Integrity .............................................................................. 23

Figure 19: Framework for Equipment Engineering Capabilities ................................................ 24

Figure 20: Relationship Between MES and Equipment Engineering Capabilities ...................... 25

Figure 21: Standardization of Equipment Engineering Data Interface ....................................... 26

Figure 22: Category and Level of Equipment Engineering Data ................................................ 27

Figure 23: Security ....................................................................................................................... 36 Figure 24: Remote Access Security .............................................................................................. 37

Figure 25: Equivalent Remote and Local Capabilities and EE Data .......................................... 38

Figure 26: Audio-Visual Collaboration........................................................................................ 39

Figure 27: Single Point of Control ............................................................................................... 40

Figure 28: ELI/Master Controller Concept.................................................................................. 46

Figure 29: Single Point to Single Point Configuration ................................................................ 46

Figure 30: Process Specification Management Mechanism ........................................................ 48

Figure 31: Process Specification Management Overview............................................................ 48

2 Preface This document was created jointly by International SEMATECH & JEITA/Selete as a collaborative effort for the purpose of providing joint consensus guidelines for and to the semiconductor industry. This set of guidelines is limited to the agreed-to expectations of the member companies in the area of manufacturing equipment and support systems. This document extends the existing joint consensus guidelines into Equipment Engineering Capabilities (EEC) and complements the earlier guidelines published for e-Diagnostics, carriers, equipment configuration, equipment operation, and facilities. These EEC guidelines are designed to add new capabilities to ensure that the industry fully realizes the productivity improvements that are needed.

A key goal of this collaboration is a set of guidelines and standard interfaces that will make it easy for Device Makers and Equipment Suppliers to add new capabilities as they become necessary and available.

3 Introduction

3.1 Background

In order to remain competitive semiconductor wafer manufacturers seek to continuously improve overall equipment effectiveness/efficiency (OEE). The International Technology Roadmap for Semiconductors (ITRS) has identified metrics that need improvement related to this area. A small sample of these metrics include cost per known good die, line and die yield, equipment utilization, cost of ownership (COO), mean time between failure (MTBF), mean time to repair (MTTR), and many others.

FactorFactor 19801980 1995 1995 FutureFutureShrinking feature sizes 12% 12-14% 12-14%Larger wafer sizes 8% 4% <2%Yield improvements 5% 2% <1%Other Equipment Productivity (OEE) 3% 7-10% >9-15%

Cos

t/Fun

ctio

n

Time

Future

Manufacturing Cost25%-30%/Yr.Improvement

19951980

� Feature Size

� Yield Improvement

� Overall Equipment Effectiveness

� Wafer Size

Source: International SEMATECH

FactorFactor 19801980 1995 1995 FutureFutureShrinking feature sizes 12% 12-14% 12-14%Larger wafer sizes 8% 4% <2%Yield improvements 5% 2% <1%Other Equipment Productivity (OEE) 3% 7-10% >9-15%

Cos

t/Fun

ctio

n

Time

Future

Manufacturing Cost25%-30%/Yr.Improvement

19951980

� Feature Size

� Yield Improvement

� Overall Equipment Effectiveness

� Wafer Size

Source: International SEMATECH

Figure Figure Figure Figure 1111: Keeping on : Keeping on : Keeping on : Keeping on the Productivity Curvethe Productivity Curvethe Productivity Curvethe Productivity Curve

In order to stay on the productivity curve, improvements of about 25 to 30% are needed each year. As shown in Figure 1 Cost/Function improvements can be obtained from decreases in device feature size, wafer size increases, yield improvements, and overall equipment effectiveness improvements. The relative importance of OEE improvement has grown significantly and is expected to require 9-15% improvement per year in order to stay on the productivity curve. An estimate of the average for the overall equipment effectiveness for all equipment is only 40-50%. It is apparent from Figure 2 that equipment productivity (OEE) improvements are needed now more than ever.

Non-ProductWafers

Non-ProductWafers

Net Processing

Time

Net Processing

Time

Idle/WaitingIdle/Waiting

ScheduledDowns

ScheduledDowns

UnscheduledDowns

UnscheduledDowns

Source - SEMATECH

Non-ProductWafers

Non-ProductWafers

Net Processing

Time

Net Processing

Time

Idle/WaitingIdle/Waiting

ScheduledDowns

ScheduledDowns

UnscheduledDowns

UnscheduledDowns

Source - SEMATECH

Figure Figure Figure Figure 2222: Effective Productive Time Ratio of Pr: Effective Productive Time Ratio of Pr: Effective Productive Time Ratio of Pr: Effective Productive Time Ratio of Process Equipmentocess Equipmentocess Equipmentocess Equipment

Figure 3 illustrates two key areas of concern for process equipment OEE improvement. The process equipment has some �base functions� which include, for example, wafer handling, vacuum generation, gas supply, electronic control, etc. The normal processing of the equipment is dependent on the sound operation of these functions. This is larger challenge for newer equipment being brought into the fab. Many of the problems encountered are in very basic functions of production equipment.

Process Capabilities


Tool�s Base FunctionalityTool�s Base

FunctionalityLeverage tool

base availability

Leverage tool base

availability

Widening process control

margin


marginTool

ProductivityTool

Productivity

TimeTime

Rapid Tool Ramp Up

Rapid Tool Ramp Up

Conventional Ramp Up


Tool

Ut

ilizat

ion

Tool

Ut

ilizat

ion Process

CapabilitiesProcess

Capabilities


Functionality




FunctionalityLeverage tool

base availability

Leverage tool base

availability


margin


marginTool

ProductivityTool

Productivity

TimeTime

Rapid Tool Ramp Up

Rapid Tool Ramp Up



Tool

Ut

ilizat

ion

Tool

Ut

ilizat

ion

FiFiFiFigure gure gure gure 3333: Two Main Areas for Equipment Improvement: Two Main Areas for Equipment Improvement: Two Main Areas for Equipment Improvement: Two Main Areas for Equipment Improvement

Figure 4 shows the distribution of the causes of equipment downtime. The left side of Figure 4 shows average data for current factory equipment. Two-thirds of the downtime is associated with the equipment�s �base functions� as quoted above. The right side of Figure 4 is another analysis on equipment downtime averaged over newer technology equipment. Again, nearly two-thirds of downtime is associated with the �base functions�. These analyses show that work on this aspect of downtime is critical to improve equipment productivity. The industry needs to pay even stronger attention to this problem if further productivity improvements are to be realized. Many Equipment Engineering Capabilities are planned to address this large portion of the problem.

The remaining causes of equipment downtime are related to the process. This area also provides opportunity for productivity enhancement through the implementation of Equipment Engineering Capabilities.

3 0 .9 %

7 .7 %1 0 .8 %4 .4 %

2 1 .2 %

4 .7 %

2 .7 %

6 .9 %

1 0 .7 %

Handling Vacuum/ExhaustGas Electr icProcess Chamber etc Par t ic leTemp.Cont rol Sensor /EPDOther

Current Technology New Technology

16.7%16.7%16.7%16.7%

8.2%8.2%8.2%8.2%

13.6%13.6%13.6%13.6%

7.8%7.8%7.8%7.8%

10.0%10.0%10.0%10.0%

12.1%12.1%12.1%12.1%

20.6%20.6%20.6%20.6%

11.0%11.0%11.0%11.0%

Source: FASL

3 0 .9 %

7 .7 %1 0 .8 %4 .4 %

2 1 .2 %

4 .7 %

2 .7 %

6 .9 %

1 0 .7 %

Handling Vacuum/ExhaustGas Electr icProcess Chamber etc Par t ic leTemp.Cont rol Sensor /EPDOther

Current Technology New Technology

16.7%16.7%16.7%16.7%

8.2%8.2%8.2%8.2%

13.6%13.6%13.6%13.6%

7.8%7.8%7.8%7.8%

10.0%10.0%10.0%10.0%

12.1%12.1%12.1%12.1%

20.6%20.6%20.6%20.6%

11.0%11.0%11.0%11.0%

Source: FASL

Figure Figure Figure Figure 4444: Distribution of Causes of Equipment Downtime: Distribution of Causes of Equipment Downtime: Distribution of Causes of Equipment Downtime: Distribution of Causes of Equipment Downtime

Another area of potential improvement includes the reduction or elimination of non-product wafers. For example, the number of pilot wafers can be reduced if we have the ability to monitor the stability of the equipment and it�s process.

In an effort to improve Overall Equipment Effectiveness, Device Makers are implementing more and more computer-based applications to improve and maintain equipment performance and drive down costs. These include applications such as equipment health monitoring, fault detection and classification (FDC), run-to-run control (R2R), real-time control, predictive maintenance, and others. All of these applications depend on the collection of detailed data from process equipment. The benefits of these activities are appearing in the literature in ever increasing numbers.

A major effort already underway for OEE improvement in the semiconductor industry is known as e-Diagnostics. This is being driven by International SEMATECH and includes many Device Makers, Equipment Suppliers, and Software Suppliers. The goal of this effort is to improve equipment productivity by making manufacturing equipment data readily available to both the Device Makers and to the Equipment Suppliers. The Equipment Supplier will then share the responsibility with the Device Maker to rapidly diagnose and repair, equipment. This will improve cost of ownership and availability.

International SEMATECH and JEITA/Selete are collaborating to develop a set of guidelines that will enable industry-wide implementation of Equipment Engineering Capabilities. This effort is called Equipment Engineering Capabilities (EEC) collaboration. This work complements ISMT�s e-Diagnostics effort in order to provide a more comprehensive set of guidelines for Equipment Engineering. This work will lead to the development of the necessary SEMI Standards.

This set of guidelines includes a high level set of requirements corresponding to implementation of EEC. In addition, detailed guidelines for three areas are presented. Future versions of this document will address further detailed guidelines for specific capabilities. These guidelines may be refined and clarified by consultation with Equipment and Software Suppliers.

3.2 Purpose

The semiconductor industry must rapidly move toward highly efficient factories. Factory structures and systems must also change. This transition must also be smooth in addition to being rapid. The entire industry must innovate, not just one company. International collaboration is required to control both the risk and the cost of this transition. The key goal of this collaboration between ISMT and JEITA/Selete is to enhance equipment performance and availability (OEE). To meet this goal Device Makers and Equipment Suppliers must share the responsibility. For example, as part of Equipment Suppliers' primary responsibility, they are expected to provide Device Makers with

• Equipment operation scenarios so that Device Makers can run the equipment according to the specification,

• Instruction on equipment health status monitoring, and

• Information about which data to monitor & when to exchange spare parts. The purpose of the EEC guideline rollout is to encourage efficient implementation of Equipment Engineering Capabilities to meet the needs of Device Makers. It provides a basis for non-competitive cooperation among Device Makers and Equipment Suppliers.

3.3 Equipment Engineering Definition

Equipment Engineering refers to all operations for equipment availability improvement and performance maintenance inside and outside of the factory. EE Capabilities may address any or all of the following areas:

• Line throughput maintenance and improvement

• Equipment health monitoring and troubleshooting

• Equipment performance improvement (especially newly introduced equipment)

• Collaboration with Equipment Suppliers (improvement, troubleshooting, re-design)

• Equipment parts, assembly versions, modification management

• Maintenance operation management and planning

• Process performance adjustment

3.4 Fundamental EEC Expectations

The creation of the EEC Guidelines was motivated by the needs of the Device Makers as described above. These needs yield certain basic expectations of the eventual Equipment Engineering Systems (EES). A list of these expectations follows.

The Equipment Engineering Data Interface is logically separate from the MES Host Interface The interactions between the equipment and the MES Host are different in intent than the interface between the equipment and the Equipment Engineering Capabilities. This is illustrated in the diagram below.

The MES Host view tends to focus on the production operations of the equipment and might include event reports of processing, alarm messages, equipment state information, and also includes production control messages to the equipment.

The EE View of the equipment focuses on the components and sub-assembly status, consumables and parts life status, process data and post process condition of the material. The data required for Equipment Engineering is more detailed than that necessary for the MES Host view.

ToolTool

MESHost

EE Capabilities

ToolTool

MESHost

EE Capabilities

Figure Figure Figure Figure 5555: Equipment Engineering Data Interface to be Logically Separate: Equipment Engineering Data Interface to be Logically Separate: Equipment Engineering Data Interface to be Logically Separate: Equipment Engineering Data Interface to be Logically Separate

Equipment will allow for multiple EEC applications of a similar type The expected Equipment Engineering Systems will be a collection of EE Capabilities. Capabilities of a similar type may be provided by multiple Equipment Suppliers and must be able to coexist in EES. So, for instance, multiple FDC applications may exist for a single process equipment, perhaps dealing with different device and process technologies. This is also true for run-to-run controllers. The active application may differ based on the type of product being run on the same equipment. This is illustrated by Figures 6, 7, and 8.

EEDataEE

DataEE

DataEE

Data

FDC App #1

FDC App #2

R2R App #1

R2R App #2

:

EEDataEE

DataEE

DataEE

Data

FDC App #1

FDC App #2

R2R App #1

R2R App #2

:

Figure Figure Figure Figure 6666: Multiple EEC Applications For a Single Production Equipment: Multiple EEC Applications For a Single Production Equipment: Multiple EEC Applications For a Single Production Equipment: Multiple EEC Applications For a Single Production Equipment

FDC-1

DataAcq

Run-Run

E-Diag

Equipment A

EquipmentCluster B

Equipment C

FDC-2

Fab Network

StandardizedCommunications

FDC-1

DataAcq

Run-Run

E-Diag

Equipment A

EquipmentCluster B

Equipment C

FDC-2

Fab Network


Figure Figure Figure Figure 7777: Possible Factory Integration Options: Possible Factory Integration Options: Possible Factory Integration Options: Possible Factory Integration Options

FDC-1

DataAcq

Run-Run

E-Diag

Equipment A

EquipmentCluster B

Equipment C


Fab NetworkFDC-1

DataAcq

Run-Run

E-Diag

FDC-1

DataAcq

Run-Run

E-Diag

FDC-1

DataAcq

Run-Run

E-Diag

Equipment A

EquipmentCluster B

Equipment C


Fab NetworkFDC-1

DataAcq

Run-Run

E-Diag

FDC-1

DataAcq

Run-Run

E-Diag

Figure Figure Figure Figure 8888: Possible Equipment Supplier Integration Options: Possible Equipment Supplier Integration Options: Possible Equipment Supplier Integration Options: Possible Equipment Supplier Integration Options

EEC applications are modular, independent, and optional In an implemented EES, the capability implementations must be modular, independent, and optional.

• Modular: Any EEC application from a third-party or Device Maker may be substituted for that provided by the Equipment Supplier.

• Independent: The purchase of any EEC applications is not dependent on the purchase or use of other EEC applications from the Equipment Supplier. Users must be able to independently purchase individual EEC capabilities such as e-Diagnostics, Run-to-Run control, Fault Detection and Classification. This is shown in the figure below.

• Optional: The use of EEC applications may significantly enhance process performance but such applications/systems must not be required in order to carry out basic wafer processing.

Users must be able to independently purchase individual EEC capabilities such as e-Diagnostics, Run-to-Run control, Fault Detection and Classification. This is shown in the figure below.

EEDataEE

DataEE

DataEE

Data

OEE App

R2R App

:

Developed by Device Maker

Developed by Supplier but

not purchased


not purchased

Developed by Supplier

OEE App

FDC App

Examples:� OEE apps may be developed by IC Makers

� Purchase of FDC does not require purchase of R2R

EEDataEE

DataEE

DataEE

Data

OEE App

R2R App

:

Developed by Device Maker


not purchased


not purchased

Developed by Supplier

OEE App

FDC App

Examples:� OEE apps may be developed by IC Makers

� Purchase of FDC does not require purchase of R2R

Figure Figure Figure Figure 9999: EEC Applications are Modular, Independent, and Optional: EEC Applications are Modular, Independent, and Optional: EEC Applications are Modular, Independent, and Optional: EEC Applications are Modular, Independent, and Optional

Equipment configuration should not dictate factory system architecture Selection of Equipment Engineering Capabilities should not impact the factory system architecture. EEC implementations from the Equipment Suppliers and from 3rd Parties must interact with the equipment and with the factory in the same (e.g. standard) way. For example, an Equipment Supplier may design an Equipment Engineering Capability into the equipment. The Device Maker may choose not to use this built-in capability. In such a case, the equipment must be able to perform as if the built-in capability does not exist, since it might pose a conflict with a 3rd Party solution.

EEC applications should not adversely affect availability or performance of either the factory systems or the equipment. The EES should be designed to deal with the complexities of the EE capabilities. Equipment availability should not be compromised by the addition of EE Capabilities. Care must also be taken in the design of the applications so that the burden of the EE capability does not lie too heavily on the factory or the equipment. EEC implementations should not adversely affect the required level of maintenance and support.

Minimal Equipment Engineering Capability is available today. Today, the equipment can only support existing event and alarm messages. In some cases auxiliary sensors are incorporated to augment equipment capability. Using these mechanisms, some EE capabilities have been implemented by the Device Makers and provide valuable service. However, the current communication scheme is insufficient for the needs of many critical applications.

The focus of initial EEC activity will be to obtain Equipment Engineering Data. The first challenge for EEC enabled OEE improvement is access to equipment data. This version of the EEC Guidelines addresses data access. Once data is acquired, new and existing analysis methods should lead to more-informed decision-making.

The next challenge will be how to implement those decisions with regard to the equipment operation. That will be dealt with in later versions of these guidelines.

A diagram of the factory, highlighting new EES components, is shown below in Figure 10. This diagram is intended to show the intent of this guideline book.

�Must use Std Interfaces �Access controlled by IC Makers through EE Access Control

EES ComponentsEE

Access ControlSupplier Remote Location

Remote monitoringRemote diagnosticsRemote de-bugging/fixRemote sensingModel tool behavior

SECS/GEM Interface Factory Network

APC App 1

APC App 2

e-Diag App 1

OEE App 1

OEE App2

FDC App1

EE Applications

� Applications that use EE data� Migrations from current MES� Can be developed by anybody

Supplier�s EEData Collection

And StorageSupplier�s EE Data

Optional

� Central Security Architecture� All access to all data and

applications controlled by IC Makers

Standard EE DataInterface

Contains all EE datafrom all equipment

Data filtersand buffers

Global EEData Collection

And StorageGlobal EE Data

StandardInterfaces Host System

or Cell Controller

Single Point of Control

(SPOC)

MES FunctionsWIP Tracking

Factory Scheduling

�Must use Std Interfaces �Access controlled by IC Makers through EE Access Control

EES ComponentsEES ComponentsEE

Access ControlSupplier Remote Location


EEAccess Control

Supplier Remote Location


Supplier Remote Location


SECS/GEM Interface Factory Network

APC App 1

APC App 2

e-Diag App 1

OEE App 1

OEE App2

FDC App1

EE ApplicationsAPC App 1

APC App 2

e-Diag App 1

OEE App 1

OEE App2

FDC App1

EE Applications

� Applications that use EE data� Migrations from current MES� Can be developed by anybody

Supplier�s EEData Collection

And StorageSupplier�s EE Data

OptionalSupplier�s EE

Data CollectionAnd Storage

Supplier�s EE Data

Optional

� Central Security Architecture� All access to all data and

applications controlled by IC Makers





Data filtersand buffers

Global EEData Collection

And StorageGlobal EE Data

StandardInterfaces Host System

or Cell Controller

Single Point of Control

(SPOC)

MES FunctionsWIP Tracking

Factory Scheduling

Figure Figure Figure Figure 10101010: Factory Diagram with New EES Components: Factory Diagram with New EES Components: Factory Diagram with New EES Components: Factory Diagram with New EES Components

3.5 Guideline Phasing Strategy

Due to the vast nature of Equipment Engineering, the Equipment Engineering Guidelines will be developed in at least three phases. This document represents Phase 1 and Phase 2. The Phasing Strategy is illustrated in Figure 11 below.

EEC Phase 1 developed guidelines for Device Makers and Equipment Suppliers to share the responsibility to improve and enhance equipment productivity. Phase 1 also developed guidelines for the generation and transmission of equipment data needed for productivity improvements and addresses infrastructure requirements corresponding to the implementation of EEC.

The second guideline rollout added new capabilities to the Phase 1 Guidelines such as e-Diagnostics, maintenance support, and equipment ramp-up support. This was called the �Phase 1.5 Guidelines�.

Previous Guidelines� EEC Big Picture� EEC Framework� Equipment Engineering Data Sharing� Equipment Engineering Responsibility Sharing� Equipment Standards� e-Diagnostics� Maintenance Support� Equipment Ramp-up Support

Previous Guidelines� EEC Big Picture� EEC Framework� Equipment Engineering Data Sharing� Equipment Engineering Responsibility Sharing� Equipment Standards� e-Diagnostics� Maintenance Support� Equipment Ramp-up Support

Phase 2.0 Guidelines � SEMICON Japan� Single Point of Control (SPOC)

Phase 2.0 Guidelines � SEMICON Japan� Single Point of Control (SPOC)

Phase 2.5 Guidelines � SEMICON West 2002� Equipment Logical Interfaces (ELI)� Run-to-Run Control (R2R)� Fault Detection and Classification (FDC)� Recipe Download and Parameterization� Enhanced e-Diagnostics� Machine-to-Machine Matching

Phase 2.5 Guidelines � SEMICON West 2002� Equipment Logical Interfaces (ELI)� Run-to-Run Control (R2R)� Fault Detection and Classification (FDC)� Recipe Download and Parameterization� Enhanced e-Diagnostics� Machine-to-Machine Matching

Phase 3 Guidelines � Direction will be taken from ITRS� IM and Standalone Metrology Equipment Operation� Integrated or Linked Equipment Operations � Predictive Maintenance� Spare Parts Management� Data Mining� Procurement� Yield Management

Phase 3 Guidelines � Direction will be taken from ITRS� IM and Standalone Metrology Equipment Operation� Integrated or Linked Equipment Operations � Predictive Maintenance� Spare Parts Management� Data Mining� Procurement� Yield Management

Figure Figure Figure Figure 11111111: Proposed Equipment Engineering Capabilities Guideline Phasing : Proposed Equipment Engineering Capabilities Guideline Phasing : Proposed Equipment Engineering Capabilities Guideline Phasing : Proposed Equipment Engineering Capabilities Guideline Phasing

StrategyStrategyStrategyStrategy

Phase 2.0 Guidelines were released in the December 2001 revision of this document. They focus on Single Point Of Control (SPOC � see Section 10) based on the current level of control implemented with E30, E40, E87, and E94. . Phase 2.0 guidelines provided a basis for Phase 2.5 guideline development.

The Phase 2.5 guidelines are released at SEMICON West of 2002.

Phase 2.5 Guidelines include • Equipment Logical Interfaces (ELI), • The APC related capabilities of Run-to-Run Control and Fault Detection & Classification,

plus • Recipe Download & Parameterization (see SEMI RaP Task Force), • Enhanced e-Diagnostics (control and security related), • Machine-to-Machine Matching

The �Equipment Logical Interfaces� topic is in support of Single Point of Control and refers to a possible division of the new message services into separate categories that could be assigned to different applications for use through the Equipment Engineering Data Interface (EEDI).

Phase 3 will expand the guidelines further and may include such capabilities as IM and standalone metrology equipment operation, integrated or linked equipment operations, predictive maintenance, spare parts management, data mining, procurement, and yield management. The exact content of Phase 3 will depend on the direction given by the ITRS.

4 Revision and Approval History

Date Revision Approved By

July 13, 2001 1.0 ISMT & JEITA/Selete

October 19, 2001 1.5 ISMT & JEITA/Selete

December 4, 2001 2.0 ISMT & JEITA/Selete

July 26, 2002 2.5 ISMT & JEITA/Selete

5 Guideline Format Definitions The following key words are used in this document with very specific meanings:

GUIDELINES - Statements that define requirements for factories and equipment.

WHO SHALL IMPLEMENT - Statement of who is responsible for the implementation of the guideline.

WHO IS THE USER - Statement of who will use the results of implementing the guideline.

BACKGROUND/PURPOSE - Paragraph that provides detail on the guideline and why it is needed.

STANDARDS - Listing of standards that are needed to supplement the efforts of all parties in the implementation of the guidelines.

REMARKS - Additional information about the guideline.

6 General Guidelines This section contains guidelines that apply generally to all Equipment Engineering Capabilities. It is intended to address concepts and guidelines related to one-way data collection from the equipment for the purposes of EE Capability implementation. Following sections address specific capability areas in greater detail.

6.1 Equipment Engineering Data Sharing

Selected Equipment Engineering Data must be shared between Equipment Supplier and Device Maker for Equipment Engineering operation purposes.

WHO SHALL IMPLEMENT: Equipment Suppliers and Device Makers

WHO IS THE USER: Equipment Suppliers and Device Makers

BACKGROUND/PURPOSE: Equipment Engineering data should be shared as needed in order to provide sufficient support and service to maintain the equipment�s performance against its specification. Device Makers and Equipment Suppliers will collaborate in order to determine which data will be shared.

STANDARDS: Standards are needed to define how to publish data from the equipment to an external system.

REMARKS: Equipment Engineering Capabilities must address network, communications, data encryption, and other relevant security issues. Device Makers may normalize recipe and process parameter information so as to avoid inadvertent sharing of proprietary information.

Device MakerEquipment Supplier

Equipment


Equipment Figure Figure Figure Figure 12121212: Equipment Engineering Data Sharing: Equipment Engineering Data Sharing: Equipment Engineering Data Sharing: Equipment Engineering Data Sharing

6.2 Determination of Equipment Engineering Data

The Equipment Supplier shall determine all the data related to Equipment Engineering with relevant documentation. It is the Equipment Supplier's primary responsibility to understand the scope of Equipment Engineering in order to maintain and improve equipment performance. The Device Maker will collaborate with Equipment Suppliers on the Equipment Engineering Data list.

WHO SHALL IMPLEMENT: Equipment Suppliers

WHO IS THE USER: Equipment Suppliers and Device Makers. BACKGROUND/PURPOSE: The Equipment Supplier has the best knowledge of the equipment.

STANDARDS: Standards are needed to specify the common data to be made available for a given type of equipment.

REMARKS: Equipment Engineering Data may be used for at least the following capabilities: maintenance and improvement of basic equipment performance and process performance, improvement in maintenance operations, and prediction of required maintenance operations.

Equipment

Device Maker

EquipmentSupplier

Data specDataspec

Equipment

Device Maker

EquipmentSupplier

Data specDataspec

Figure Figure Figure Figure 13131313: Determination of Equipment Engineering Data: Determination of Equipment Engineering Data: Determination of Equipment Engineering Data: Determination of Equipment Engineering Data

6.3 Equipment Engineering Data Sampling and Transmission Capability

The equipment shall sample, collect, and transmit Equipment Engineering Data. The Equipment Suppliers will propose sampling, collection, and transmission rates as part of their primary responsibility. The Device Makers will collaborate with Equipment Suppliers on the final rates.



BACKGROUND/PURPOSE: EE Data sharing implementations require the selection of concrete sampling plans and data transmission rates. These will vary for each equipment type, process, and EE application.

STANDARDS: TBD

REMARKS: None

Device MakerDevice MakerDevice MakerDevice Maker

EquipmentEquipmentEquipmentEquipmentSupplierSupplierSupplierSupplier

Right Sampling RateRight Transmission RateRight Timing

Device MakerDevice MakerDevice MakerDevice Maker

EquipmentEquipmentEquipmentEquipmentSupplierSupplierSupplierSupplier

Right Sampling RateRight Transmission RateRight Timing

Figure Figure Figure Figure 14141414: Equipment Engineering Data Sampling And Transmission Capability: Equipment Engineering Data Sampling And Transmission Capability: Equipment Engineering Data Sampling And Transmission Capability: Equipment Engineering Data Sampling And Transmission Capability

6.4 Continuous Monitoring

Equipment Engineering Data must be continuously available regardless of equipment status.

WHO SHALL IMPLEMENT: Equipment Supplier

WHO IS THE USER: Equipment Supplier and Device Maker

BACKGROUND/PURPOSE: This guideline enables Device Makers and Equipment Suppliers to better understand the equipment history and situation regardless of the current state. For example, the Equipment Engineering Data must be available regardless of the equipment control or operational state (On-line/Off-line, normal operation, controller malfunction, etc.).

STANDARDS: None

REMARKS: None

EECapabilities

EECapabilities

Monitoring Data

Equipment MonitoringCapabilities Always Available

Monitoring Data

EECapabilities

EECapabilities

Monitoring Data

Equipment MonitoringCapabilities Always Available

Monitoring Data

Figure Figure Figure Figure 15151515: Continuous Monitoring: Continuous Monitoring: Continuous Monitoring: Continuous Monitoring

6.5 �On Demand� Equipment Engineering Data

Equipment Engineering Data must be transmitted by the equipment upon demand. �Upon demand� means per a specific request or as scheduled.


WHO IS THE USER: Device Maker

BACKGROUND/PURPOSE: Equipment Engineering applications should be able to access the necessary data. Necessary data varies depending on the lifecycle stage of the equipment. During the qualification stage, the development stage, or the production stage different events and data will be required.

STANDARDS: None

REMARKS: Device Maker has final decision on what data to release outside of factory.

EEDataEE

DataEE

DataEE

Data

e-Diagnostics

Eqpt. Health Monitor

PerformanceImprovement

APC/ FDC :

EEDataEE

DataEE

DataEE

Data

e-Diagnostics



APC/ FDC :

Figure Figure Figure Figure 16161616: ‘On Demand’ Equipment Engineering Data: ‘On Demand’ Equipment Engineering Data: ‘On Demand’ Equipment Engineering Data: ‘On Demand’ Equipment Engineering Data

6.6 Equipment Engineering Data Interface

The Equipment Engineering Data Interface and the traditional SECS/GEM interface must be logically separated. The equipment must support single or dual physical network connections for this purpose.


WHO IS THE USER: Equipment Supplier and Device Makers

BACKGROUND/PURPOSE: Device Makers may decide single or dual physical connection based on individual equipment data bandwidth requirements or cost considerations. This allows for cost savings if low Equipment Engineering Capabilities are required or desired. This also allows legacy equipment to be retrofit with auxiliary CPU's to enable Equipment Engineering Capabilities.

STANDARDS: An Equipment Engineering Data Interface standard is needed.

REMARKS: The use of a single physical connection is encouraged. All components of the equipment must communicate through the (single or dual) physical ports as specified in this guideline.

SECS/GEM EE Connection(only for EE data)

SECS/GEMEE Connection

O.K. O.K.

SECS/GEM EE Connection(only for EE data)

SECS/GEMEE Connection

O.K. O.K.

Figure Figure Figure Figure 17171717: Equipment Engineering Data Interface: Equipment Engineering Data Interface: Equipment Engineering Data Interface: Equipment Engineering Data Interface

6.7 Equipment Performance Integrity

Equipment Engineering Data collection and transmission must not affect equipment processing or throughput performance.


WHO IS THE USER: Equipment Suppliers

BACKGROUND/PURPOSE: In many cases, current equipment performance is degraded when data is requested through the current SECS/GEM interface.

STANDARDS: None

REMARKS: None

EEData

Processing

Sensor DataImage Dataetc.

EEData

ProcessingProcessing

Sensor DataImage Dataetc.

Figure Figure Figure Figure 18181818: Equipment Performance Integrity: Equipment Performance Integrity: Equipment Performance Integrity: Equipment Performance Integrity

6.8 Framework for Equipment Engineering Capabilities

A framework for a system that supports Equipment Engineering Capabilities should be developed. The framework must be based on open, non-proprietary architectures, and mainstream computing technologies.

WHO SHALL IMPLEMENT: Equipment Suppliers, Third-Party Suppliers, and Device Makers

WHO IS THE USER: Equipment Suppliers, Third-Party Suppliers, and Device Makers

BACKGROUND/PURPOSE: Equipment Engineering Capabilities are different from MES capabilities. The current CIM Framework for MES does not cover all of the required EE capabilities.

STANDARDS: A standard should be developed. Mainstream computing standards for use in the semiconductor industry should be adopted.

REMARKS: None

Fault Detection

Spare Parts Mgmt

Run toRun

e-Diagnostics

EES

Other EEC Apps

Fault Detection

Spare Parts Mgmt

Run toRun

e-Diagnostics

EES

Other EEC Apps

Figure Figure Figure Figure 19191919: Framework for Equipment Engineering Capabilities: Framework for Equipment Engineering Capabilities: Framework for Equipment Engineering Capabilities: Framework for Equipment Engineering Capabilities

6.9 Relationship between MES and EEC

Equipment Engineering Capabilities and implementations must interact with MES. Equipment Engineering Capabilities, including data collection and transmission, should not adversely affect or interfere with the existing MES performance. Equipment Engineering Capabilities must be implemented in a modular fashion, with standard interfaces.

WHO SHALL IMPLEMENT: Equipment Suppliers, MES Suppliers, and Device Makers


BACKGROUND/PURPOSE: Equipment Engineering Capabilities may be developed separately from the current MES environment. The MES controls manufacturing, whereas Equipment Engineering Capabilities monitor equipment in detail. Equipment Engineering Capabilities should augment and enhance legacy factory CIM and/or MES systems. The Equipment Engineering Capabilities added to the factory will frequently need to share data with the CIM/MES systems but it is not the intention to force factories or process equipment to change their current CIM/MES systems in order to implement Equipment Engineering Capabilities. Equipment Engineering Capabilities will require information from the CIM/MES systems.

STANDARDS: Existing standards like the SEMI CIM Framework standards must be enhanced. New SEMI standards for Equipment Engineering Capabilities and MES interactions may be required.

REMARKS: Standard interfaces are needed from EES to equipment and EES to MES.

MES EE CapabilityImplementations

Standard Interactions and Interfaces

MES EE CapabilityImplementations

Standard Interactions and Interfaces Figure Figure Figure Figure 20202020: Relationship Between MES and Equipment Engineering Capabilities: Relationship Between MES and Equipment Engineering Capabilities: Relationship Between MES and Equipment Engineering Capabilities: Relationship Between MES and Equipment Engineering Capabilities

6.10 Standardization of Equipment Engineering Data Interface

The equipment interface and communication protocol for Equipment Engineering Data must be standardized.


WHO IS THE USER: Equipment Suppliers and Device Makers BACKGROUND/PURPOSE: Device Makers and Equipment Suppliers should follow the same standardized interface and protocol to facilitate the collection, transmission, and sharing of equipment data.

STANDARDS: Action is required by SEMI to develop this standard.

REMARKS: The DDA (Diagnostics Data Acquisition) Task Force is already working to define this standard in connection with the e-Diagnostics effort. It is fully anticipated that the results of this effort will meet the needs of this guideline.


Equipment

Standard Interfaces


Equipment

Standard Interfaces

Figure Figure Figure Figure 21212121: Standa: Standa: Standa: Standardization of Equipment Engineering Data Interfacerdization of Equipment Engineering Data Interfacerdization of Equipment Engineering Data Interfacerdization of Equipment Engineering Data Interface

6.11 Category and Level of Equipment Engineering Data

Equipment Engineering Data must be organized in a standard way according to equipment types and applications. Equipment Engineering Data must be organized into categories and levels.



BACKGROUND/PURPOSE: Categories may include process data, equipment health data, etc. Levels may include line, equipment, module, part, etc. Most effective usage of equipment data should be defined depending on the complexity of equipment. An application will acquire different data levels depending on the situation like upon equipment failure, or stage of equipment life.

STANDARDS: Action required for SEMI to develop data category and level standards. The DDA (Diagnostics Data Acquisition) Task Force is already working to define this standard in connection with the e-Diagnostics effort. It is fully anticipated that the results of this effort will meet the needs of this guideline.

REMARKS: None

e-Diagnostics



APC/ FDC

EEDataEE

DataEE

DataEE

Data

Categories Levels� Equipment Level� Module Level� Parts LevelEE

DataEE

DataEE

DataEEData

Equipment Types

EquipmentType A

EquipmentType B

e-Diagnostics



APC/ FDC

EEDataEE

DataEE

DataEE

Data

EEDataEE

DataEE

DataEE

Data

Categories Levels� Equipment Level� Module Level� Parts LevelEE

DataEE

DataEE

DataEEData

Equipment Types

EquipmentType A

EquipmentType B

Figure Figure Figure Figure 22222222: Category and Level of Equipment Engineering Data: Category and Level of Equipment Engineering Data: Category and Level of Equipment Engineering Data: Category and Level of Equipment Engineering Data

7 EE Data Integrity Guidelines As the industry moves toward e-Manufacturing the data each equipment generates is critical to improving equipment productivity. Today, the quality of data is insufficient and it must be dramatically improved if applications are to effectively improve equipment productivity. Message integrity, data accuracy, data resolution, sensor data calibration, data transmission rates, triggering, and filtering must all be accurate, reliable, timely, and complete if Device Makers and Equipment Suppliers are to use the data for productivity improvements, decision support, and automated decision making.

The Data Integrity Guidelines expand on the General Guidelines in Section 6 to provide more detailed expectations on data from the equipment.

7.1 EE Data Availability

Process related data should be made available from the equipment in combination with the following data:

• Product and process outcome objectives and equipment process condition set points;

• The actual values achieved by the equipment including: measured process conditions, measured process end results, and calibration values, and;

• Time-varying �actuator� control signals, measured controller outputs, and controller coefficients used by any embedded controllers.



BACKGROUND/PURPOSE: It is a basic requirement for the equipment to transmit not only the settings given to the equipment externally and actual measured values (at the sensors), but also the derived equipment set point values. This is required in order to carry out passive functions like health monitoring as well as for process adjustment capabilities. It is also required for predictive maintenance.

In cases where supplier Intellectual Property is involved, the transmission of data out of equipment may be limited. However, this should be the exception and should not include items that are well known within the industry to affect the end result of processing or the equipment�s base functionality.

In circumstances where either Intellectual Property, manufacturing performance or other business-sensitive information is at issue, the distribution of data externally to the fab may be limited.

In both cases, it is expected that Equipment Suppliers and Device Makers will collaborate and reach agreement on the conditions and limitations of data transmission and distribution.

The decision of which data shall be made available outside of the equipment shall be made in accordance with the General Guidelines in Section 6.

STANDARDS: TBD.

REMARKS: The following are examples of data that should be provided together for meaningful process monitoring and analysis of wafer temperature and metal thickness control

Process objective: 500nm at 10nm/sec deposition rate and 250 deg C starting wafer temperature.

• Wafer temperature case o Need the nominal temperature setting value given by the recipe at a step.

o Need the actual temperature setting value used by equipment during the deposition step as a function of time.

o Need the actual temperature value measured by the sensor during the deposition step as a function of time.

o Need actual voltage and current applied to heater block by equipment subsystem during the deposition step as a function of time.

o Need thermocouple calibration values used in the heater block.

• Metal thickness control case o Need nominal deposition rate setting given by the recipe at a step.

o Need actual thickness achieved by the equipment.

o Need actual deposition rate achieved by the equipment during the deposition step.

o Need actual DC applied to the sputtering target by the equipment subsystem as a function of time during the deposition step

7.2 EE Data Context

The following context data should be made available together with the high level and low level event EE data:

• The ID of any and all material directly involved in or affected by the event

• The date and time of the occurrence of each event



BACKGROUND/PURPOSE: Event/context information is the basis from which equipment diagnosis is performed. Understanding the time sequence of an event or combination of events allows the correct interpretation of process data.

Material ID could be information taken from Carrier ID readers, Wafer ID taken from either Wafer ID readers or a content map (SEMI-E87), Lot ID�s, etc.

STANDARDS: The following SEMI Standards should be referenced: E30, E40, E87, E90, E94. Other standards may be required.

REMARKS: The position and orientation of the material within the equipment is also useful context information.

Here are some examples of events:

• High Level Events: carrier arrival & departure, lot complete, recipe step 1, step 2, etc.

• Low Level Events: carrier clamping & releasing, wafer transfer start & end, valve opening start & end.

7.3 EE Data Quality

All data streams provided by the equipment must be complete, consistent, timely, accurate, properly sampled, and possess high enough resolution to serve the intended purposes.



BACKGROUND/PURPOSE: Data must be provided with sufficient accuracy, resolution and sampling frequency so as to allow high fidelity extraction of relevant data features for the purposes of process/equipment characterization, fault detection, failure diagnosis, and process control.

Event data and context information must be complete, consistent, correct, and reflect the actual time of, and conditions pertaining to the occurrence of the indicated event. Timely transfer of data is necessary to achieve fault interdiction.

STANDARDS: Many existing standards include related requirements.

REMARKS: Equipment Suppliers must characterize the time domain characteristics of data streams that are generated during typical fault conditions. Arcing, MFC turn-on transients and other dynamic characteristics of the equipment should be characterized and the sampling criteria met.

8 Ramp-Up & Maintenance Support Capability Guidelines The most critical time in the life of a factory, new equipment, or a new process is the period from introduction to full production use. Since more profits are available early in the life of a new technology, the more quickly this ramp-up occurs, the more successful a Device Maker can be. This section�s guidelines are intended to help speed the ramp-up process. A maintenance support guideline is included to designate Device Maker and Equipment Supplier cooperation for better maintenance operation.

8.1 Initiation of EE Data Sharing

EE Data collection, analysis, and distribution shall begin prior to shipment

• Equipment Suppliers and Device Makers shall initiate EE data sharing prior to the time the equipment is shipped from supplier to the user.

• The Equipment Supplier shall make EE data and any derived analysis/ reports from each individual equipment available to the Device Maker prior to shipment of the equipment.



BACKGROUND/PURPOSE: This guideline expands upon EE data sharing as described in the General Guidelines in Section 6. EE data obtained prior to shipment are important and may be used for many purposes such as those quoted in the examples.

STANDARDS: None.

REMARKS: Here are some examples:

• EE data obtained prior to shipment may be used as a reference performance data in later days to analyze some equipment malfunction by the user or by equipment Supplier.

• EE data obtained prior to shipment may be used by the Device Maker or by the Equipment Supplier as reference data to check if that equipment is correctly installed in the user�s factory.

8.2 Historical EE Data

EE Data collected during acceptance and ramp-up will be used as an historical baseline for equipment.

• The Equipment Supplier shall define and provide data to show detailed equipment performance through the ramp-up period and at the time of acceptance.

• The Device Maker may also choose to collect and analyze detailed equipment performance data for their own purposes, at their discretion and at any time before or after shipment of the equipment.



BACKGROUND/PURPOSE:

• The availability of detailed EE data allows for the verification of an equipment�s performance against specification.

• EE data taken at the time of acceptance may be used as a baseline that can be referred to when trouble occurs on the equipment.

• The EE historical data record may be used as a template by which to gauge the installation and ramp-up of subsequently installed equipment.

• EE data will be used for historical analysis of equipment performance. The Device Maker will collaborate with the Equipment Supplier to define EE Data needed at these occasions.

• Device Makers perform data collection and analysis in order to support supplier site acceptance immediately prior to shipment, final acceptance subsequent to equipment installation at the Device Makers factory and for other purposes.

STANDARDS: None.

REMARKS:

• Equipment Suppliers and Device Makers may agree to exclude certain highly proprietary information from this guideline on a case-by-case basis. The default expectation is, unless otherwise agreed, all data is to be available to both parties.

• It is understood that collaboration between the Device Maker and the Equipment Supplier is necessary in order to support EE data acquisition by the Device Maker prior to shipment of the equipment.

8.3 Improved Maintenance Support

It is the Equipment Supplier�s responsibility to recommend equipment operation and maintenance operation procedures and rules to assure normal operation of an equipment and full e-Diagnostics capability.

The equipment shall provide maintenance operation record data to the best of the equipment�s knowledge.



BACKGROUND/PURPOSE:

• The Equipment Supplier and the Device Maker should share equipment operation and maintenance operation procedures as a common assumption. Remote diagnosis depends upon the Equipment Supplier understanding the operational conditions in use.

• Maintenance record information is useful to drive equipment improvement for both Device Makers and Equipment Suppliers. Thus the record needs to be retained using standard language so that information exchange is eased.

STANDARDS: The form of the maintenance record needs to be standardized.

REMARKS: Maintenance guidance information provided by electronic means is strongly recommended. Access to e-Diagnostics data may be denied in cases where examination of such data enables the reverse engineering of process conditions or the inference of proprietary and/or business sensitive information.

8.4 Maintenance Document Guideline

Equipment Operation and Maintenance documents shall be provided in a standardized electronic format along with all the supplementary information required to read this electronic document. This set of information shall be maintained and accurate.



BACKGROUND/PURPOSE:

Today�s equipment documentation is difficult to use in the factory environment. Existing documents are inaccessible at the point of need (at the tool or on the factory floor), difficult to navigate, and not always current. It is desirable to move from hardcopy medium to electronic medium in order to increase maintenance activity flexibility. This will allow maintenance documentation to be stored and retrieved in a consistent manner, navigated easily, and automatically updated. This will lead to higher availability (improve MTTR), Quality to Repair (lower MTBF), and productivity.

STANDARDS: E36 should be investigated in terms of text and drawings, and enhanced if necessary.

REMARKS: None.

9 e-Diagnostics Capability Guidelines This section defines the primary guidelines for the e-Diagnostics capability. More detail on e-Diagnostics will be added to this document in the next release of these EEC Guidelines. The focus of these additions will be security & safety plus remote e-Diagnostics capabilities.

The ISMT driven effort to define e-Diagnostics already has a wealth of information defined. This can be found at the URL listed in the Glossary. In particular, please refer to the e-Diagnostic Guidebook in regard to safety & security issues for further discussion.

9.1 Security

Only authorized personnel may be able to access relevant data to perform diagnosis.



BACKGROUND/PURPOSE: The Device Makers are responsible to authenticate and authorize the remote support users to access EE data located in the Device Maker intranet. The Device Makers will provide or partner with the support companies to provide credentials and authentication to the remote users.

The equipment support companies shall be responsible for the identification of all remote support personnel. The remote support personnel may be employees of the OEMs or third parties. The responsibility includes the unique identification of the remote support personnel. The support companies shall ensure that the remote support personnel have current and proper credentials. The credentials shall either be provided by the Device Maker or by the support company trusted by the Device Maker.

The EE Systems components, such as e-Diagnostics shall be designed with the following aspects in mind: confidentiality, authentication, integrity, non-repudiation, authorization, administration, and logging.

STANDARDS: TBD.

REMARKS: e-Diagnostic solutions must comply with network, communications, data encryption, and other relevant implementation guidelines. See detailed security guidelines contained in the e-Diagnostics Guidebook for further discussion (see e-Diagnostics entry in the Glossary, Section 14 for document location).

Local Data Collection and Access Server

Network and communication

security

Remote Access ServerFactory SideFactory Side Supplier SideSupplier Side

Secure Data Access

Data encryption, network and communication security

Controlled access point


Network and communication

security

Remote Access ServerFactory SideFactory Side Supplier SideSupplier Side

Secure Data Access

Data encryption, network and communication security

Controlled access point

Figure Figure Figure Figure 23232323: Security : Security : Security : Security

9.2 Remote Access Security

Remote data access must be selectively provided. Equipment and other selected factory system components must have the capability to determine when to allow specific remote access, based on specific state or condition of the equipment.



BACKGROUND/PURPOSE: Authentication and authorization concepts within the equipment engineering systems are used to selectively provide data access. See detailed security guidelines contained in the e-Diagnostics guidebook for further discussion.

STANDARDS: TBD.

REMARKS: None


Security via local server in the Factory DMZ Remote Access

ServerFactory SideFactory Side Supplier SideSupplier Side

Secure Data AccessAllows remote

access based on equipment state


Security via local server in the Factory DMZ Remote Access

ServerFactory SideFactory Side Supplier SideSupplier Side

Secure Data AccessAllows remote

access based on equipment state

Figure Figure Figure Figure 24242424: Remote Access Security: Remote Access Security: Remote Access Security: Remote Access Security

9.3 Equivalent Remote and Local Capabilities and EE Data

The solutions must provide at least the same equipment monitoring/diagnostics data at the local site as at the remote sites. All analysis tools available at the remote site must also be available at the local site.



BACKGROUND/PURPOSE: Equivalent capabilities and data must exist in both the local and remote sites in order to allow analysis to take place from either location.

STANDARDS: TBD.

REMARKS: None


Remote Access Server

Factory SideFactory Side Supplier SideSupplier Side

Secure Data Access

Factory side capabilities and data

Supplier side capabilities and dataequivalent


Remote Access Server


Secure Data Access

Factory side capabilities and data

Supplier side capabilities and dataequivalent

Figure Figure Figure Figure 25252525: Equivalent Remote and Local Capabilities and EE Data: Equivalent Remote and Local Capabilities and EE Data: Equivalent Remote and Local Capabilities and EE Data: Equivalent Remote and Local Capabilities and EE Data

9.4 Audio-Visual Collaboration

EES solutions must allow audio-visual collaboration such as video teleconferencing to enable experts to view/diagnose equipment and sub-assembly problems in real-time and communicate with factory personnel.


WHO IS THE USER: Equipment Suppliers and Device Makers BACKGROUND/PURPOSE: The ability to view images is often helpful in remotely diagnosing equipment issues. This capability can reduce equipment support costs, speed ramp up, and reduce mean-time-to-repair.

STANDARDS: TBD.

REMARKS: Device Markers and Equipment Suppliers will collaborate on bandwidth requirements.

LocalAudio / Video

Station RemoteAudio / Video StationSecurity via secure video,

audio, and file x-fer


Video, Audio, and Document Sharing

LocalAudio / Video

Station RemoteAudio / Video StationSecurity via secure video,

audio, and file x-fer


Video, Audio, and Document Sharing

Figure Figure Figure Figure 26262626: Audio: Audio: Audio: Audio----Visual CollaborationVisual CollaborationVisual CollaborationVisual Collaboration

10 Single Point Of Control Guidelines The preceding EEC guidelines are focused on �passive and fundamental capabilities� about detailed EE data availability and its acquisition from the equipment. Now, for EEC to fulfill its potential, we must close the loop and address the control issues with signals from the EE capabilities to the equipment.

In the document �Global Joint Guidance for 300 mm Semiconductor Factories: Release Five�, the very first guideline for production equipment is entitled �Single Communication Link�. This guideline (also known as �single wire�) states: �A single physical communication connection must link the production equipment to the host.� The EEC collaboration recognizes and respects this guideline and its intent.

The wording for EEC has been changed to �Single Point of Control� in recognition of the need to channel the data from the equipment through a high performance interface. EEC continues to support the sentiment that the equipment �host� should not be asked to coordinate modules of the equipment in performance of equipment tasks. It also supports the notion that the equipment should not have to arbitrate among multiple �hosts� vying for control.

Selete and ISMT recognize that even with a single point of control at the factory and on the equipment, multiple applications and clients must at times interface with the equipment. These �logical� interfaces will be configured differently by individual device makers based on their factory architectures and processing requirements. Known examples of the logical interfaces include the well-defined SECS/GEM/HSMS interface and the �to be defined� Interface A (a.k.a. DDA, EDA or EEDI). A logical interface for recipe upload and download is currently being explored in the standards community. An external connection to an internal Sensor Bus Network is an existing example of a logical interface that varies in requirements and use from device maker to device maker.

Host System or

Cell Controller

EE Data I/F

Equipment

EEC System(s)

Control information provided to host based on results of the EES application�s

processing

SECS/GEM I/F

Application I/F

SECS/GEM Interface - Equipment control commands and event reports and logging between factory and equipmentEquipment Engineering Data Interface - EE data and data flow controlFactory Level Application Interface - Interface between Factory Applications, such as EEC Systems,

Cell Controllers, MES and others.In the future, new ELI interfaces may emerge that provide the functionality of the interfaces shown above.

Host uses Control/Process Job, GEM or Carrier Management services, to control equipment actions and execution

Equipment Engineering Data Interface provides data from

the equipment for use ine-diagnostics, FDC, R2R and

other monitoring applications

Figure Figure Figure Figure 27272727: Single Point of Control: Single Point of Control: Single Point of Control: Single Point of Control

Guidance from device makers on these requirements will aid the industry in standardizing the �Equipment Logical Interfaces,� or ELI. Standardization of these interfaces will reduce development cost for suppliers and integration cost for device makers. Guidelines for the ELIs are included in this section.

The following guidelines outline the agreement of ISMT and Selete with regard to �Single Point of Control�. Figure 27 illustrates the concepts defined in these guidelines.

10.1 Single Point of Control at the Production Equipment

Production equipment must present a Single Point of Control to the factory level system.



BACKGROUND/PURPOSE: It is required that all standard operational features, such as wafer transport, recipe upload/download, and data collection, be designed to function as a single entity irrespective of the modular nature of the equipment. These operational features must operate together and be controlled through a single point.

Additional equipment capabilities are to be specified as extensions to the current level of control implemented with existing SEMI Standards.

Current equipment implementations that used E30, E40, E87, and E94 are not to be made obsolete by the addition of new capabilities as a result of EEC collaboration activities.

STANDARDS: This guideline should be applied to all EEC related standards.

REMARKS: The specific implementation of data collection plans and requests (using EEDI) must be studied. However, it is intended that the final implementation of these data collection plans and requests will follow this guideline.

It is understood that as new standards emerge for the purposes of implementing EE capabilities, that for a short period there may be some functional overlap between the new standards and pre-existing standards. The goal is to minimize this overlap period.

10.2 Single Point of Control at the Factory Level

Factory level systems must present a Single Point of Control to the production equipment.


WHO IS THE USER: Equipment Suppliers

BACKGROUND/PURPOSE: Factory level systems include current MES and equipment host systems as well as EE systems.

Additional limited control points for specific manufacturing capabilities may be delegated by a Factory Master Controller (FMC). This delegation will be done strictly under the device makers� direction. These control functions will be defined by the equipment logical interfaces as proposed in guideline 10.4. Some device makers may choose to delegate or assign all control functions to a single application � equipment must accommodate this option.STANDARDS: TBD.

REMARKS: Requests for service from the production equipment by elements of the factory system may, at times conflict with each other or be inappropriate given the circumstances in place at the time. While it is possible for equipment suppliers to implement arbitration mechanisms to resolve such conflicts, it is often required that each individual Device Maker implement special business rules which define and manage their resolution. From a cost, supportability, and uniformity of implementation perspective it is required that such arbitration mechanisms be implemented on a factory wide basis and at the factory system level.

10.3 Equipment Processing Interruption and/or Termination

Production equipment must support graceful interruption and/or termination of processing via the SECS/GEM interface. Process interruption and/or termination options must include �immediately�, �after this step�, �after this wafer�, and �after this lot� where applicable.


WHO IS THE USER: Equipment Suppliers and Device Makers BACKGROUND/PURPOSE: �Interruption and/or termination� means the ability to pause or stop the equipment from processing at a known interval (example: after this wafer), leaving the equipment and wafers in known states.

Currently, interrupt and/or termination capabilities are supported through the control job and process job pause/stop/abort commands. The existing gap with the control job and process job standards is related to interruption and/or termination at a process step level (example: �after this step�/�after this wafer�).

STANDARDS: Action is required for SEMI to investigate a method for interruption and termination �after this step� or �after this wafer�. �Control Job Stop/Abort�, �Process Job Stop/Abort� or �Equipment Stop/Abort in GEM� cannot perform �after this step�/�after this wafer� type of direction from Host.

REMARKS: None.

10.4 Equipment Logical Interface (ELI)

Communication with the equipment shall be divided into separate logical interfaces (Equipment Logical Interfaces - ELI). Communication with these interfaces needs to be coordinated by SPOC as described in GL #10.2.

WHO SHALL IMPLEMENT: Equipment Suppliers.


BACKGROUND/PURPOSE: To support EEC goals efficiently, we must recognize the need to divide up the responsibilities to reduce integration complexity.

STANDARDS: The equipment logical interfaces will need to be defined by the SEMI standards. The current SECS/GEM interface and the Equipment Data Acquisition interface are examples of ELI�s.

REMARKS: The user shall have the capability to choose which clients may access each logical interface (e.g. using authentication and authorization provided by the equipment). It shall be possible to limit access to all ELIs to a single known client. Possible ELI�s

1. Job control and material management

�Parameter adjustment

�APC, EPC3

�Delivery, material movement

2. Data collection* (SECS, interface A**)

�Data Collection definition

�Sampling rate

�Transmission rate

�Data Collection activation

�Data transmission3. Recipe upload/download

4. Real time interdiction*

5. EPC3 (Non-job parameter adjustment)

• Indicates that multiple instances of an ELI might be acceptable.

• ** Interface A also known as DDA, EDA, EEDI.

EPC3: Equipment Performance Conditioning, Control, and Configuration

Equipment

ELI 1Job

Control

ELI 2Real TimeInterdiction

ELI 3Data

Collection

Factory Master Controller

Specify ELI Clients

Step 1: The Factory Master Controller specifies to the equipment which clients will use which ELI�s

Client 1Job

Control

Client 2Real TimeInterdiction

Client 3Data

Collection

Conceptual O

nly

Factory network

Step 2: ELI Clients communicate with the tool through their assigned ELI and shall continue to coordinate with master controller. The master controller can disable any ELI connection.

Conceptual O

nly

Equipment

ELI 1Job

Control


ELI 3Data

Collection


Client 1Job Control


Client 3Data

Collection

Factory network

Figure Figure Figure Figure 28282828: ELI/Master Controller Concept: ELI/Master Controller Concept: ELI/Master Controller Concept: ELI/Master Controller Concept

Conceptual O

nly

Equipment

ELI 1Job

Control


ELI 3Data

Collection


Client 1Job Control


Client 3Data

Collection

Single Point to Single Point Configuration: ELI Clients communicate with the tool through a single factory master controller.

Host level

Factory network

Tool level

Figure Figure Figure Figure 29292929: Single Point to S: Single Point to S: Single Point to S: Single Point to Single Point Configurationingle Point Configurationingle Point Configurationingle Point Configuration

10.5 Equipment Performance Conditioning, Control and Configuration

A standard interface for controlling equipment stability shall be provided by the supplier. The systems and algorithms used to achieve equipment performance conditioning, stability control and configuration may be provided by the equipment supplier, the IC maker, or third party supplier.


WHO IS THE USER: Equipment Suppliers and Device Makers BACKGROUND/PURPOSE: Stability control examples are as follows:

�Minimization of machine-to-machine difference

�Minimization of chamber-to-chamber difference

�Performance deterioration due to consumables life

�Performance variation due to idle time between processing

Device makers want to understand the gradual change in equipment performance and the impact that change has on yield. Examples of changes in equipment performance include consumables life, idle time between processing, etc.

Adjustment of process performance described above should be performed adequately as required. This adjustment function must comply with the Equipment Logical Interface Guideline, Guideline 10.4, through appropriate SECS/GEM messages or a new standard.

STANDARDS: Action required for SEMI to develop standards to implement this guideline in conjunction with the Equipment Logical Interface Guideline (GL10.4).

REMARKS: The process performance drift or deviation during the operation of equipment is always a serious problem especially for those devices with the most advanced process rules. This type of performance drift or deviation arises between runs of wafers, or runs of lots, or in the course of individual process chamber usages, therefore not directly linked with a particular process run.

This is also a serious problem in the case multiple tools of the same type; where this problem is known as �machine to machine matching� or �chamber to chamber matching�. This matching has to be managed as a function of time or as a function of usage to assure the process margin.

11 Process Specification Management Guidelines These guidelines are intended to address the management of recipes and/or other elements, which control processing. These guidelines augment currently defined standards (Process Job/Control Job) governing the run-time adjustment of variable parameters

Sequence Recipe(Reference by Name)

Run(Etch)

Run(Strip)

Run(Pre-Treat)

Process Description(Resolution ofname to ID) Module

RecipeID1

ModuleRecipeID3

ModuleRecipeID2

Etch = ID1

Strip = ID2

Pre-Treat = ID3

Reference by ID

� Recipes are multipart. Recipes often refer to each other by name, this can lead to significant recipe integrity problems. Reference by ID resolves integrity problems but can lead to additional management overhead. This is a fundamental problem in process specification management.

Figure Figure Figure Figure 30303030: Process Specification Management Mechanism: Process Specification Management Mechanism: Process Specification Management Mechanism: Process Specification Management Mechanism

User

Creates module recipes,sequence recipes, and

other elements of processdefinition. Selects

parameters for externaladjustment.

Process ManagementGuideline #1

All elements of processdefiniton are available for

transfer to andmanagement by the

Factory Information andControl System

Process ManagementGuideline # 2

All elements of processdefiniton are verified for

correctness,completeness when theyare created, and validated

and prior to execution.Process Management

Guideline # 3

EndpointAlgorithm

ModuleRecipe

ModuleRecipe

ModuleRecipe

SequenceRecipe

Recipe/Process ElementEditor Function (may be standalone or

part of FICS)

Equipment ControlFunction

EndpointAlgorithm

ModuleRecipe

ModuleRecipe

ModuleRecipe

SequenceRecipe

Factory Information and Control System

Equipment

These areboth

possibleverificationfunctions

Figure Figure Figure Figure 31313131: Process Specification Managem: Process Specification Managem: Process Specification Managem: Process Specification Management Overviewent Overviewent Overviewent Overview

11.1 Parameter Adjustment

Any parameter supporting value assignment by a user during the definition of a process element must be adjustable by both on- and off-equipment software systems.

WHO SHALL IMPLEMENT: Equipment Suppliers, Device Makers

WHO IS THE USER: Third Party Software Suppliers, Equipment Suppliers, and Device Makers.

BACKGROUND/PURPOSE: Process Engineers are able to specify fixed values for parameters in recipes or other process definition elements as a normal part of recipe (etc.) creation. Some of these parameters are used to adjust the process on a run-by-run basis. Often, this must be performed manually by editing the recipe and re-loading it. This guideline requires that any parameter whose value is assignable by the editor is likewise available for value assignment by the Factory Information and Control System via standard Process Job/ Control Job mechanisms. The selection of which parameters are made available for value assignment at run time by the Factory Information and Control System is selectable by the user during creation of the recipe or other element.

STANDARDS: RaP.

11.2 Process Specification Management

All elements that define control or affect the execution or outcome of a process or metrology run on a piece of equipment must all be available to be managed.

WHO SHALL IMPLEMENT: Equipment Suppliers, IC makers, third party suppliers.

WHO IS THE USER: Device Makers, Third party suppliers, Equipment Suppliers. BACKGROUND/PURPOSE:

• The Factory Information and Control System, being the system of record for quality, ISO compliance, factory management, and production process execution. In this role, the FICS must be able to manage all of the artifacts that contribute to or control the manufacture of product. In addition, in those cases where factory level systems are not available, other means of management shall be provided by the equipment supplier. Process elements to be managed may include equipment constants/settings, recipe parameters, recipes, data collection plans, fault detection plans, APC algorithms, endpoint algorithms, metrology images, etc.

STANDARDS: RaP.

11.3 Process Specification Verification

Verification of process elements must be supported. Verification may include checks for validity, integrity, correctness, and completeness of process parameter settings.

WHO SHALL IMPLEMENT: Equipment Suppliers, Device Makers.

WHO IS THE USER: Third Party Software Suppliers Equipment, Suppliers, and Device Makers. BACKGROUND/PURPOSE: Verifying the integrity of process elements avoids potentially unsafe operation of the equipment. Validation may include insuring that the process to be executed exactly matches the processing requested.

STANDARDS: RaP. Additional standard development effort is required for run time recipe and parameter verification.

12 Appendix A � Related SEMI Standards Note: Equipment Suppliers must use the most recent revision of standards that they implement. In all cases, revisions should not be earlier than those cited below.

12.1 SEMI Equipment Automation Software Standards E5-0701 SEMI Equipment Communications Standard 2 Message Content (SECS-II) E30-1000 Generic Model for Communications and Control of SEMI Equipment (GEM) E35-0701 Cost of Ownership for Semiconductor Manufacturing Equipment Metrics E36-0699 Semiconductor Equipment Manufacturing Information Tagging Specification E37-0298 High-Speed SECS Message Services (HSMS) Generic Services E37.1-96 HSMS � Single Session Mode E39-0600 Object Services Standard: Concepts, Behavior, and Services E40-0301 Standard for Processing Management E53-1296 Event Reporting E79-0200 Standard for Definition and Measurement of Equipment Productivity E81-0600 Provisional Specification for CIM Framework Domain Architecture E87-0301 Provisional Specification for Carrier Management (CMS) E90-0301 Specification for Substrate Tracking E93-0200 Provisional Specification for CIM Framework Advanced Process Control

Component E94-1000 Provisional Specification for Control Job Management E96-0200 Guide for CIM Framework Technical Architecture E97-0200A CIM Framework Global Declarations and Abstract Interfaces E98-1000 Provisional Standard for the Object-Based Equipment Model (OBEM) E116-0702 Provisional Specification for Equipment Performance Tracking (EPT)

12.2 SEMI Contact Information

Semiconductor Equipment and Materials International (SEMI) Bruce Gehman Vice President of International Standards Phone: (408) 943-6974 Fax: (408) 943-9600

SEMI - Japan Shigeyuki Otake Manager, Standards Division Phone 81-3-3222-5755 Fax: 81-3-3222-5757

Web Page: http://www.semi.org/

13 Appendix B � Contact Information For more information about this document or referenced material, please contact the following:

13.1 Japan Electronics and Information Technology Industries Association (JEITA)

Address: Mitsui Kaijo Bldg. Annex

11, Kanda Surugadai 3-chome, Chiyoda-ku, Tokyo 101-0062

Phone: +81-3-3518− 6421

Fax: +81-3-3295− 8721

Web Page: http://www.jeita.or.jp/

13.2 Selete Research Department 1

Address: Semiconductor Leading Edge Technologies, Inc.

16-1, Onogawa, Tsukuba, Ibaragi 305-8569, Japan

Phone: +81-298-49-1300

Fax: +81-298-49-1185

Web Page: http://www.selete.co.jp/

Name Company Phone Fax Email Tadashi Kiriseko Fujitsu 81-44-754-3423 81-44-754-3579 [email protected]

Tohru Tsurumi Fujitsu 81-42-532-1374 81-42-532-2404 [email protected] Eiji Yamanaka Hitachi 81-29-270-2664 81-29-270-2691 [email protected] Shintaro Matsuda Mitsubishi 81-727-84-7084 81-727-80-2561 [email protected] Michio Honma NEC/Selete 81-42-771-1342 81-427-71-1493 [email protected] Takao Katsuyama NEC 81-42-771-1342 81-427-71-1493 [email protected] Hiroshi Takegami Rohm 81-75-321-4429 81-75-312-4129 [email protected] Hidetaka Nishimura Sanyo 81-584-64-4897 81-584-64-5973 [email protected] Giichi Inoue Toshiba 81-3-3457-3395 81-3-5444-9338 [email protected] Koji Kitajima Toshiba 81-45-770-3273 81-45-770-3284 [email protected] Megumi Ohmori Toshiba/Selete 81-45-770-3273 81-45-770-3284 [email protected] Masato Fujita Selete +81-298-49-1300 +81-298-49-1185 [email protected] Shige Kobayashi Selete +81-298-49-1300 +81-298-49-1185 [email protected] Tomoyuki Masui Selete +81-298-49-1300 +81-298-49-1185 masui @selete.co.jp Kinji Mokuya Selete +81-298-49-1300 +81-298-49-1185 mokuya @selete.co.jp Koichi Kubouchi Selete/Hitachi +81-3-3258-1111 +81-3-3258-5809 [email protected]

13.3 International SEMATECH EEC Study Group

Address: International SEMATECH

2706 Montopolis Drive

Austin, Texas 78741

Phone: (512) 356-9000

Fax: (512) 356-7848

Web Page: http://www.sematech.org/

Name Company Phone Fax Email Jeff Toth AMD 1-512-602-2343 1-512-602-8135 [email protected]

Bob Wiggins IBM 1-802-769-6751 1-802-769-4287 [email protected] Raymond Bunkofske IBM 1-802-769-2808 1-802-769-9384 [email protected] Karl Gartland IBM 1-802-769-2529 1-802-769-4287 [email protected] Glen Stefanski IBM 1-845 894-6689 1-914 892-6597 [email protected]

David Bloss Intel 1-480-554-1099 1-480-554-5323 [email protected]

Lisa Pivin Intel 1-480-554-5991 1-480-554-5323 [email protected]

James Martin Intel 1-480-554-3287 1-480-554-5323 [email protected]

Blaine Crandell Texas Instruments 1- 214 567 5844 1-214-567-5528 [email protected]

Harald Linde Infineon 49-351 886-6232 49-351 886-1502 [email protected]

Giant Kao TSMC 886-3-5636688 886-3-5637000 [email protected]

Jye Jeng TSMC 886-3-6666999 886-3-5637000 [email protected]

Gino Crispieri International SEMATECH 1-512-356-7547 1-512-356-7848 [email protected] Randy Goodall International SEMATECH 1-512-356-7622 1-512-356-7848 [email protected] Lance Rist International SEMATECH 1-512-356-3153 1-512-356-7848 [email protected] Brad Van Eck International SEMATECH 1-512-356-3981 1-512-356-7848 [email protected] Harvey Wohlwend International SEMATECH 1-512-356-7536 1-512-356-7631 [email protected]

14 Appendix C � Glossary and Acronyms

Actuator: An analog or digital output device that is used to affect changes in the physical environment. Examples of actuators include mass flow controllers and open/closed valves. Administration (Security): It is defined, as the work required managing the lifecycle of security components such as Identification, Credentials, Policies, etc excluding application management.

APC - Advanced Process Control

Authorization (Security): It is defined as allowance by Device Makers to remote support users to access equipment based on roles and policies. Authentication (Security): It is defined as the capability to verify a remote user�s identity and credentials. It also includes the network location of the remote user, as each support company will use known networks to access the Device Makers. Calibration: A setting, adjustment, or graduation of a quantitative instrument for the purpose of measurement or control. CIM � Computer Integrated Manufacturing

Confidentiality (Security): It is defined as the capability to protect the data in remote sessions against unauthorized access or disclosure.

Context (of equipment data) � Information that helps to explain the meaning or circumstances of equipment data. Examples of context information include Material ID and time.

COO � Cost of Ownership (See SEMI Standards Document E35)

DDA � Diagnostics Data Acquisition, the name of a SEMI Standards Task Force.

DMZ - A DMZ (Demilitaried Zone) is the peripheral network that is created from firewalls. These networks are neither in the Intranet nor in the Internet, but are physically located in the firewall premises. Typically services that use DMZ�s, are email (SMTP gateways), DNS, HTTP Proxy, etc. that require frequent connectivity to both the Intranet and Internet.

e-Diagnostics � Capability to enable an authorized Equipment Supplier's service person to access any key production or facilities equipment from outside the Device Maker's facility/factory via network or modem connection. Access includes the ability to remotely monitor, diagnose problems or faults, and configure/control the equipment in order to bring it into full productive state rapidly, within security, safety, and configuration management guidelines. Detailed documentation of the e-Diagnostics effort can be found at the following URL: http://www.sematech.org/public/resources/ediag/index.htm

EE Network �The logical network used for EE information communication.

e-Manufacturing � Advanced manufacturing utilizing Information and Internet Technology to improve agility, efficiency, decision-making, etc.

Equipment Engineering (EE) - Refers to all operations for equipment availability improvement and performance maintenance inside and outside of the factory.

Equipment Engineering Capability (EEC) � An application that address a specific area of Equipment Engineering, such as fault detection, predictive maintenance, spare parts management, etc.

Equipment Engineering Data (EED) � All data required to support Equipment Engineering Capabilities. This includes data from the equipment and data from the factory.

Equipment Engineering Data Interface (EEDI) � The communication link between equipment and EE Capability with the task of transferring Equipment Engineering Data.

Equipment Engineering System (EES) � The physical implementation of Equipment Engineering Capabilities.

ELI - Equipment Logical Interface Equipment Performance Conditioning, Control and Configuration (EPC3) � EPC3 is a type of control of equipment performance, and usually intends to compensate the deviation of process performance between runs of wafers, or runs of lots, or in the courses of usages between maintenance

Equipment Supplier �A supplier that manufactures and markets equipment used in semiconductor manufacturing.

Fab � A term that refers to the semiconductor fabrication facility.

Factory Master Controller � The factory master controller is a conceptual factory application, which would be the �single point of control� for specifying which clients can talk to which Equipment Logical Interface (ELI). The factory master controller would be the ultimate authority for controlling the applications which control and interface with the equipment.

Fault Detection and Classification (FDC) � The analysis of process data taken during a process run to determine: (1) if the process is running normally or not (i.e. is a fault detected), and (2) the classification of faults for their source or cause.

Framework � A software implementation that provides base functionality and defines how component applications interact.

GEM � Generic Equipment Model (SEMI E30)

Integrity (Security): It is defined as protection of the data against unauthorized modification or substitution during the remote session. Intellectual Property: Technical information that provides a competitive advantage to the possessor. This may be protected through secrecy or via legal protections, such as patent, copyright, or trademark. In terms of semiconductor processing and EEC, this may for example include operational procedures, processing techniques, process recipes and settings.

ISMT � International SEMATECH

ISO � International Standards Organization JEITA � Japan Electronics and Information Technology Industries Association

Logging (Security): It is defined as the secure logging of all relevant activity during the remote sessions and between remote sessions. MES - The acronym stands for Manufacturing Execution System. In the context of the EEC document this MES is the factory control system that is connected to the SECS/GEM interface of the equipment. MES in this document includes the traditional functions like WIP Tracking, Specification Management, as well as the equipment integration function, such as cell or station controllers.

Material ID: The identifier of the material being tracked and processed in the factory. Identifiers are unique and may be assigned to wafers, carriers, durables or any other items that are required in the manufacturing of a semiconductor device.

MFC � Mass Flow Controller MTBF � Mean Time Between Failure (Reference SEMI E10)

MTTR � Mean Time to Repair (Reference SEMI E10)

Non-repudiation (Security): It is defined as the legal presumption that the remote support users cannot deny having originated the message in the interaction with the e-Diagnostics system.

OEE � Overall Equipment Effectiveness (Reference SEMI E79)

Predictive Maintenance �The prediction of maintenance that falls outside normal preventative maintenance schedules (supports �just in time� maintenance). Run-to-Run Control � The adjustment of recipe and/or equipment parameters for a subsequent process run based on either wafer metrology information and/or equipment history information from a prior process run.

SECS � Semiconductor Equipment Communications Standard (SEMI E4, E5)

Selete � Semiconductor Leading Edge Technologies, Inc.

SEMI � Semiconductor Equipment and Materials International

Setpoint - A value (usually numeric) given to specify a desired process condition, outcome, or end-effect.

SPOC � Single Point of Control

Third-Party Supplier � Supplier of EE capabilities other than equipment suppliers.

Back Cover of the Booklet

This document was printed and issued by International SEMATECH

The Japanese language version of the Phase 2.5 EEC Guidebook is in preparation. An August 2002 release

by JEITA/Selete is anticipated.

equipment engineering capabilities (eec) guidelines¼ˆ旧)/ライン生産... · called equipment...

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