etron technology, inc....1 etron technology, inc. since 1991 month day, 2017 presented to etron...

1

Etron Technology, Inc. Since 1991

Month Day, 2017

Presented to

Etron Quality System Introduction and Automotive Quality Support

by

Quality Service & Customer Satisfaction Management Div.

2

This following presentation contains forward-looking

statements, which involve known and unknown risks and

are subject to uncertainties that could cause actual

performance, financial results, or operation conditions to

be materially different from those contained in the forward-

looking statements.

Except as required by law, we undertake no obligation to

update any forward-looking statement, whether as result of

new information, future events, or otherwise.

Safe Harbor Notice

Outline

◼ Etron Quality Management System

– Quality Management System

– Quality Control System

– Subcon. Management System

◼ Automotive-Grade Quality Management

3

Outline






4

Quality Management System

◼ Quality Policy– With a customer-oriented approach, all Etron employees

strive to provide premium products and services on time,

to continuously improve quality, and to achieve full

customer satisfaction

◼ Objectives / Plan– Define and deploy quantitative yearly KPI / PI goals with

quarterly management review for continuous improvement

5

Quality / Reliability Organization

CEO Nicky Lu

President Elvis Deng

RD Center

B.D. Rong, Sr. VP

Quality Service

Mgt. Dept.

Mickey Chen

Product & Quality

Assurance Center

Mickey Ken, VP

Quality / Environment

Mgt. Representative

Mickey Ken, VP

QS & CSM Div.

Lennon Chang

Package RE Dept.

J.M. Lin

Product RE Dept.

T.H. Chen

QC: Quality Control

SQE: Subcon. Quality Eng.

PKE: Package Eng.

RE: Reliability Eng.

Assy.: Assembly

QE Div.

Mickey Ken (Act.)

Subcon. Quality

Mgt. Dept.

Y.J. Lee

SQE

Sec. I

SQE

Sec. II

Customer Sat.

Mgt. Dept.

Lennon Chang

QC

Sec.

PKE

Sec.

Assy.

RE Sec.

6

Management System Certification◼ Etron quality and environment management system is

ISO9001/ IATF16949/ ISO14001/ OHSAS18001 certified

Certification Time 3rd Party Certifier

ISO-9001:1994

ISO-9001:2000

ISO-9001:2008

ISO-9001:2015

Oct. 1998

Nov. 2001

Nov. 2002

Sep. 2009

Jul. 2018

|

Jul. 2021

KEMA

KEMA

UL DQS

UL DQS

ISO-14001:2004

ISO-14001:2015

Nov. 2005

May 2017

|

May 2020

UL DQS

UL DQS

OHSAS-18001:2007 Jun. 2008

|

May 2020

UL DQS

ISO/TS-16949:2002

ISO/TS-16949:2009

IATF-16949:2016

Sep. 2009

Jul. 2010

Jul. 2018

|

Jul. 2021

UL DQS

UL DQS

UL DQSP7

Quality Systems: Searching for Excellence

- ISO9001 QMS

- Intel SSQA_Lite Supplier

1998 ~2004- ISO14001 EMS

- OHSAS18001

- Green Certificates

- Electronic Industry

Code of Conduct

(EICC)

2004 ~ 2008- TS16949:

Qualification in

2009

- Total Quality

Management (TQM)

- Continuous

Improvement

Program (CIP)

2009 ~2011

2012 ~ Now

- QCC Excellent Award

- Ishikawa Quality Award

SSQA: Standardized Supplier Quality Assessment

TS16949: Quality management system for Automotive

8

Document Control (PDM System)

On-line group signoff

in parallel

Daily summary notices

for new releases

On-line application and review for

extra-privilege of view / hard copy

On-line contract review

On-line establish/

change/void

On-line check for

signoff status

On-line view with security

level & protection Automatic distribute

production doc. to subcon.

9

Change Control Management

◼ Change Control Board (CCB) is the mechanism for

all engineering change review, approval and

implementation

◼ Necessary CCB members:

– Quality Assurance Division Head (host)

– The host determine the members according to the change

requirement

◼ Change classification are clearly defined and

documented. Will follow customer’s special

requirement if any

Ref. Doc. : Change Control Work Instruction (A10400109)

10

Internal Audit System

◼ Internal audit will be conducted at least once a year

◼ All internal auditors have been trained and certified

◼ Auditor will not self-audit their own works

◼ Internal audit results will be the input of Mgt. review meetingTechnical Document & Quality Audit Section

Technical Document & Quality Audit Section

Management RepresentativeManagement

RepresentativeAudit TeamAudit Team AuditeesAuditees

Establish the annual

audit planApprove

Establish the detailed audit schedule

Audit

Issue the nonconformity

reports

Take corrective actions

Follow up & issue audit

summary reports

Analyze audit resultsApprove & report to

management review

Technical Document & Quality Audit Section

Quality system Management

Audit TeamAudit Team AuditeesAuditees

Establish the annual

audit planApprove

Establish the detailed audit schedule

Audit

Issue the nonconformity

reports

Take corrective actions

Follow up & issue audit

summary reports

Analyze audit resultsApprove & report to

management review

11

Outline






12

Generic Production Flow (Discrete IC)

CP: Circuit Probing

FT: Final Test

PLBI: Package Level Burn-In

: QC Gating

Wafer In CP2WLBI

PLBI FT2

Marking * Lead / Ball Scan

E-Test

Baking Dry Pack

Warehouse Shipping

Assembly

Redundancy

Replacement

FT1

CP1 *CP0 *

* : Optional

13

Generic QC Engineering Chart for Discrete IC Product (#1/3)

Flow ProcessSampling

Freq.Sampling Plan Criteria Reference Record Site

1 Wafer FAB Every LotIn-line (Thin Film, Photo, Etch,

Diffusion)FAB In-line spec

Abnormal handling

procedureFAB e-Runcard FAB

8 inch: Wafer appearance: inspect

1/5 pcs & 5 sites/pc,5 dies /site


1/5 pcs & 9 sites/pc, 9 dies /site

3 Wafer FAB Every MonthIn-line (Thin Film, Photo, Etch,

Diffusion), WAT SPCCpk >= 1.67 A10300111 (Wafer SPC) Cpk Report FAB

4 IQC Every Lot WAT data for all wafersWAT Data OOS < 3

Sites / per-wafer

A10300106 (WAT Review

and Trace)

Inspection

RecordEtron

5 Warehouse Every Lot 100%No product & quantity

error

A10400252 (Handling,

Storage Procedure)

Wafer into stock

sheetEtron


1/5 pcs & 5 sites/pc,5 dies /site.


1/5 pcs & 9 sites/pc, 9 dies /site.

7 WLBI Every Lot 100% Performance Production Flow CP Run Card Subcon

8CP0

(Optional)Every Lot 100% Performance Production Flow CP Run Card Subcon

9 WLBI+CP1 Every Lot 100% Performance Production Flow CP Run Card Subcon

10Redundancy

replacementEvery Lot

Replace weaknesses detected by

CP1Performance Production Flow CP Run Card Subcon

6 IPQC Every LotWafer defect sites

<3/pc

FAB

A10400244 (Wafer Visual

Inspection Spec)

Inspection

RecordSubcon

Wafer FAB Every Lot2Wafer inspection

criteria


Inspection Spec)FAB e-Runcard

14




11 CP2 Every Lot 1 wafer Performance Production Flow CP Run Card Subcon





13Generate

Wafer MapsEvery Lot 100% No Missing Production Flow Wafer Map Subcon

14Packing /

WarehouseEvery Lot 100%

No packing error

allowed

A10400249 (Wafer

Packing spec.)

Wafer into stock

sheet

Subcon /

Etron



12 inch: Wafer appearance:inspect


16 Assembly Every Month

SPC reviews for Key parameter

such as Wire pull, Ball shear and

Mold Temp.

Cpk >= 1.67A10400257 (Assembly

SPC Review Spec.)

Cpk monthly

reportSubcon

17 IPQC Every Lot

MIL-STD-105E,

Normal/Single/General/ Level-II,

AQL=0.1%

Package visual

inspection criteria

A10400208 (IC Visual

Inspection Spec),

A10400246 (Subcon

Marking Requirement

Inspection

RecordSubcon

18 PLBI Every Lot 100% Performance Production Flow FT Run Card Subcon

19 FT1 Every Lot 100% Performance Production Flow FT Run Card Subcon

20 FT2 Every Lot 100% Performance Production Flow FT Run Card Subcon

12 IPQC Every LotWafer inspection

criteria

15 IPQC Every LotWafer inspection

criteria

CP Run Card Subcon


Inspection Spec)

Inspection

RecordSubcon


Inspection Spec)

15

Remark: The above flow is the Etron generic QC operation flow. The actual flow might be

different by product and need to refer to the corresponding production flow.




21 E-Test Every Lot

MIL-STD-105E,

Normal/Single/ General/Level-II,

AQL= 0.065%

No Bin swap allowed

A10400219 (In-process

Inspection Procedure),

A10400215 (E-Test

Inspection Spec.)

FT Run Card Subcon

22Lead / Ball

ScanEvery Lot 100%

No visual inspection

defect

A10400247 (Lead-Scan,

Tape-and-Reel Operation

Spec.)

FT Run Card Subcon

23Baking /Dry

PackingEvery Lot 100% No packing defect

A10400217 (Packing

Operation Spec.)FT Run Card Subcon

24 FQC Every Lot

MIL-STD-105E,

Normal/Single/General/Level-II,

AQL=0.1%;

By sampling plan; No

D/P, T&R or mark

permanency defect

allowed

A10400221 (Final

Inspection Procedure),

A10400208 (IC Visual

Inspection Spec.),

A10400217 (Packing

Operation Spec.)

Inspection

Record

Subcon /

Etron

25Warehouse

PreparationEvery Batch 100%

No product & quantity

error

A10400252 (Handling,

Storage Procedure)Shipping Notice Etron

26 OQC Every Batch

1. 100% inspect all residual parts.

2. Inspecting listed customer

special packing / labeling requests.

No defect allowed

A10400221 (Final

InspectionProcedure)

,A10400208 (IC Visual

Inspection Spec.),

A10400217 (Packing

Operation Spec.)

QC-10 (IC

Shipping

Inspection

Record)

Etron

16

Abnormal Handling FlowANF Issuer Lot Disposition Owner Issue Owner ANF Close

ANF: Abnormal Notice Form PC: Production Control

PUR: Purchasing MRB: Material Review Board

ANF S/N rule:

-- By Etron: #Exxxxxxx

-- By Subcon: #Sxxxxxxx

1. Issue ANF on

Etron sys.

2. Sys. inform PC

1. Issue verification

2. Lot disposition

3. Containment

1. Root cause

2. Corrective action

3. Preventive action

Need

8D report*

?

1. Release after

disposition

2. Sys. inform PC

Need

Compensation

?

PUR request for

compensation

QC

approval

Top mgr

approval

Y

Y

QC

approval

Cross-team co-sign

For lot disposition

verification

* 8D report request: 1. Customer complain due to production mis-operation

(Doc. #A10400404) 2. Production mis-operation induced product yield loss

3. Major or repeating operation problems impacting product quality or reliability

4. Operation/Process problems impacting Automotive/ Industrial/ Pachinko product or reliability

Meet

shipping criteria

?

Y

Stop shipping

N

Notify

customer

for MRB

approval

Hold MRB meeting

17

Product Identification and Traceability◼ Product Identification:

– All Etron parts are manufactured and controlled by lot, with lot ID

printed on IC top mark or chip ID for identification

◼ Traceability: – Forward: Notify customers proactively if confirmed any defect parts

shipped to minimize customer impact

– Backward: All production records are traceable by lot, with IT

supporting systems, to facilitate quick containment actions

– Manufacturing Execution System (MES) for WIP tracking / status control

– Electronic Data System (EDS) for real-time test data collection / analysis

– Oracle Enterprise Resource Planning (ERP) for lot management

– Warehouse Automatic Storage / Retrieval System (AS/RS) for lot control

– Data Retention: Production records will be preserved at least for 5

years, 15 years in electronic form with periodic backup

18

Outline






19

Subcon. Management System◼ Structure:

New subcon

qual. for AVL

15%PUR / PCService (Price)

30%PCProduction Logistic

15%EngineeringTechnical Capability

40%QAQuality System

WeightingOwnerEvaluation Items

15%PUR / PCService (Price)

30%PCProduction Logistic

15%EngineeringTechnical Capability

40%QAQuality System

WeightingOwnerEvaluation Items

• Qualified for AVL:

Total Score ≥ 60,

with each item score

≥ 60% of its

weighting

WeightingOwnerWeightingOwner

Engr. team

PC

PUR

QA

Back-end

35%

15%

15%

35%

25%PURDelivery

30%PURCost

15%DEEngineering

30%QAQuality

Front-endEvaluation

Items WeightingOwnerWeightingOwner

Engr. team

PC

PUR

QA

Back-end

35%

15%

15%

35%

25%PURDelivery

30%PURCost

15%DEEngineering

30%QAQuality

Front-endEvaluation

Items

Subcon monthly

QCDE performance

appraisal

• Improvement

actions will be

required if any

non-compliance.

Total Score ≤ 60

will be disqualified.

PC: Production Control PUR: Purchasing DE: Device Eng.

QCDE: Quality, Cost, Delivery, Engineering Service

20

Subcon. Quality Audit

◼ Subcon. Quality Audits

– Yearly subcon. quality system and operation audit

– QA on-site quality check timing:

– Yearly quality audit

– Non-periodic line audit for quality event

– WIP product operation line-check

– Audit key items checklists available

◼ Audit Corrective Action Follow-up

– Improvement progress will be followed up closely in

monthly review meeting for effective closure

– Confirm implementation in next on-site audit

21

Fab. Management Review Activity

Activity Freq. Owner Content

Engineering

Review

Meeting

Weekly DE

QA

PUR

1. Yield, QA, WIP, FA cases … etc.

2. Focus on major failure modes for defect

reduction.

3. Notify any major baseline process quality issues

proactively and share containment & CA

experience.

Executive

Review

Meeting

Monthly QA

DE

1. Review FAB baseline failure mode and

continuous improvement actions.

2. In-line & WAT SPC review.

3. Key process outlier control review.

Quality Audit Yearly QA

DE

Review QA system implementation and conduct line

audits, including equipment maintenance, particle

control and abnormal handling activities.

DE: Device Eng. QA: Quality Assurance PUR: Purchasing

22

Subcon. Management Review Activity

Activity Freq. Owner Content

Periodic

Report

Weekly,

Monthly

QA 1. Review Etron IQC LRR, assembly yield, testing

yield / correlation, SPC, Cpk reports and trend

2. Abnormal event handling (impact, disposition, root

cause, improvement actions, status)

Quality

Meeting

Monthly QA

PC

Related

Eng. Team

1. Review assembly monthly Cpk, process capability,

MRB or major quality event tracking, OCAP,

reliability monitor results

2. Quality appraisal scorecard review

Quality Audit Yearly QA

Related

Eng. Team

1. Audit quality system implementation, line process

operations, reliability monitor, environmental, supply

chain management, restricted material control,

social duty

2. Previous audit action follow-up and verification

3. Non-periodic audit will be arranged for WIP monitor,

major quality event or customer issues

LRR: Lot Reject Rate MRB: Material Review Board OCAP: Out-of-Control Action Plan

23

Summary of Etron QMS

◼ Etron’s Quality Management System is ISO/TS-16949

(now IATF-16949) certified since Sep. 2009, to meet

the most stringent automotive industry expectation

and fulfill customer-specific requirements

◼ All Etron’s subcontractors for automotive are ISO/TS-

16949 (now IATF-16949) certified to provide top-

quality service throughout the supply chain

◼ Production Part Approval Process (PPAP) package

can be prepared for targeted products upon request

24

Etron PPAP Standard Format

25

Outline






26

◼Coverage on All Products: A Series of Tests Standardized In

AEC-Q100 and JEDEC Are Performed

– Assure better Quality & Reliability to meet the automotive

requirements and standards

◼ Etron Can Support Automotive Grade-2 & Grade-3 Products

AEC-Q100 Compliance Grade-2/3

Grade 3: -40°C to 85°C; Grade 2: -40°C to 105°C

No Check Item Test MethodJEDEC

Sample Size

AEC-Q100

Sample Size

Commercial

Level

Industrial

Level

Automotive

Grade 3/Grade 2

1 EFR JESD22-A108 JESD47 1000 ea 800 X 3 Lots 0°C&70°C -40°C&85°C -40°C&85°C/-40°C&105°C

2 HTOL JESD22-A108 JESD47 77 X 3 Lots 77 X 3 Lots 0°C&70°C -40°C&85°C -40°C&85°C/-40°C&105°C

3 HTST JESD22-A103 JESD47 75 ea 45 X 1 Lot 25°C 25°C&85°C 25°C&85°C/25°C&105°C

4 Pre-Con JESD22-A113 JESD47 300 ea 231 X 3 Lots 25°C 25°C&85°C 25°C&85°C/25°C&105°C

5 TCT JESD22-A104 JESD47 75 ea 77 x 3 Lots 25°C 25°C&85°C 25°C&85°C/25°C&105°C

6 PCT JESD22-A102 JESD47 75 ea 77 x 3 Lots 25°C 25°C&85°C 25°C&85°C/25°C&105°C

7 HAST JESD22-A110 JESD47 75 ea 77 x 3 Lots 25°C 25°C&85°C 25°C&85°C/25°C&105°C

8 TH JESD22-A101 JESD47 75 ea - 25°C 25°C&85°C -

9 Latch-up JESD78 JESD47 6 ea 6 x 1 Lot 25°C 25°C&85°C 25°C&85°C/25°C&105°C

10

ESD (HBM) JESD22-A114 JESD47 3 ea 3 x 1 Lot 25°C 25°C&85°C 25°C&85°C/25°C&105°C

ESD (MM) JESD22-A115 JESD47 3 ea 3 x 1 Lot 25°C 25°C&85°C 25°C&85°C/25°C&105°C

ESD (CDM) JESD22-C101 JESD47 3 ea 3 x 1 Lot 25°C 25°C&85°C 25°C&85°C/25°C&105°C

27

Commercial Automotive Remarks

Application TV, DVD, STB, Printer,

Panel, etc.

Car Electronics With different

product part number

Ta temperature 0~70 degree C -40~85 degree C (Grade 3)

-40~105 degree C (Grade 2)

With different

production flow,

wafer selection,

enhanced burn-in,

and testing

PPM Target < 200 ppm Target < 10 ppm

Reliability Standard &

Specification

JEDEC JEDEC

AEC-Q100

Spec Customization

Product Life 2~5 years 7~10 years

FA Priority Normal priority 24 hrs initial response

Top priority

Discussable by case

Comparison of Commercial/Automotive Grades

AEC-Q100: Quality test procedure developed by the AIAG (Automotive Industry Action Group) for IC

28

Product Level Qualification◼ Complete full product qualification before releasing for mass

production, by following AEC-Q100 and JEDEC standards

檢驗項目檢驗條件數量批量接受/退回參考標準

Inspection

Item

Inspection

ConditionsQuantity Lot Accept/Reject

Reference

Standard

EFR >1.2*Vint, Ta=125°C 800 3Predict 0.5~1year

AECQ100-0081000DPM

OLT >1.1*Vint, Ta=125°C 77 31000H

JESD22-A10850FIT

ESD

≥±2KV (HBM)

R=1.5K-ohm, C=100pF3 1 0/1 AECQ100-002

≥±200V (MM)

R=0K-ohm, C=200pF3 1 0/1 AECQ100-003

≥±500V (CDM) 3 1 0/1 AECQ100-011

Latch-up

Vtr(+) ≥ 1.5xVcc

Vtr(-) <= -0.5xVcc

Itr(+) ≥ 100mA

Itr(-) <= -100mA

6 1 0/1 AECQ100-004

29

Note: PCT duration is 96H for BGA type product

檢驗項目檢驗條件數量批量接受 /退回參考標準Inspection

Item

Inspection


Reference

Standard

HTST Ta=150°C, 1000hrs 45 1 0/1 JESD22-A103

Pre-condition Level III

Sum of

HAST, PCT

and TCT

3 0/1 JESD22-A113

HASTV=Vmax, Ta=130°C,

85%R.H., 2.3atm, 96Hrs77 3 0/1 JESD22-A110

PCTTa=121°C, 100%R.H.,

2.0atm, 168Hrs77 3 0/1 JESD22-A102

TCT-65°C ~ +150°C, 500Cycles

(air to air)77 3 0/1 JESD22-A104

Package Level Qualification◼ Complete full package qualification before releasing for mass

production, by following AEC-Q100 and JEDEC standards

30

◼ Product routine test after releasing for mass production, by following AEC-Q100 and JEDEC standards

Note: PCT duration is 96H for BGA type product

Routine monitor starts from the product shipment >150Kpcs/qtr

檢驗項目檢驗條件數量批量接受 /退回參考標準Inspection

Item

Inspection


Reference

Standard

Predict 0.5~1year

1000DPM

1000H

50FIT

HTST Ta=150°C, 1000hrs 45 1 0/1 JESD22-A103

Pre-condition Level IIISum of HAST,

PCT and TCT3 0/1 JESD22-A113

HASTV=Vmax, Ta=130°C,

85%R.H., 2.3atm, 96Hrs77 3 0/1 JESD22-A110

PCTTa=121°C, 100%R.H.,

2.0atm, 168Hrs77 3 0/1 JESD22-A102

TCT-65°C ~ +150°C, 500Cycles

(air to air)77 3 0/1 JESD22-A104

AECQ100-008

OLT >1.1*Vint, Ta=125°C 77 3 JESD22-A108

EFR >1.2*Vint, Ta=125°C 800 3

Quarterly Product Reliability Monitor

31

Failure Analysis Flow

Customers Inform CE Issue FA Team Support CA Owner

Responsibility

Clarification

Claim Notice

Disposition /

Containment

Action (CA)

Contact Window,

FA Issue,

Assign Owner

Sample Return

(If needed)

Investigation /

Root Cause

Clarification

Impact review,

Notify Issuer

Notify CustomerConfirm

Implementation

Prod. Record

Tracking

& Review

Customer

Approves

for Case Closure

32

Product FA Flow Sample Return

External Inspection

& Re-Ball

Electrical Test

Go/NG Result

Good NG

PFA

(if applicable)

Define Failure

MechanismChar/Shmoo

Check

Notify CustomerEFA Report*

PFA Report

(if applicable)

Return Sample

Fail

Pass

EFA: Electrical Failure Analysis

PFA: Physical Failure Analysis

33

34

Etron 8D Report Outline

◼ Discipline 0: Plan for Solving Problem

◼ Discipline 1: Team Approach

◼ Discipline 2: Problem Description

◼ Discipline 3: Containment Action

◼ Discipline 4: Root Cause Analysis

◼ Discipline 5: Verification of Effectiveness

◼ Discipline 6: Permanent Corrective Action

◼ Discipline 7: Prevent Recurrence

◼ Discipline 8: Congratulate the Team

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etron technology, inc....1 etron technology, inc. since 1991 month day, 2017 presented to etron...

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