european 3d tsv summit - semi for closing.pdf · european 3d tsv summit ... january 22-23, 2013...
TRANSCRIPT
European 3D TSV Summit On the road towards Manufacturing
January 22-23, 2013 Grenoble
SPECIAL THANKS ….
To our Steering Committe
• Eric Beyne, director of Advanced Packaging, IMEC
• Kevin Crofton, EVP and COO, SPTS
• Albert Koller, VP and head of Semiconductor, Oerlikon Systems
• Hannes Kostner, director of R&D Datacon, BESI
• Thorsten Matthias, director of Business Development, EV Group
• Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics
• James Quinn, VP of Marketing and Sales, Multitest
• Martin Schrems, director of R&D, austriamicrosystems
• Nicolas Sillon, head of 3D Integration, CEA-Leti
• Juergen Wolf, department head of HDI WLP/ ASSID, Fraunhofer-IZM
• Margarete Zoberbier, Business Development Manager 3D, SUSS Microtec
To our partners
• Minatec event
• Insight Outside
• Pierre Jaillet
• Papillon
• Feu Follet
• Balades gourmandes
• Pignol
• etc…