euso balloon instrument assembly, integration and tests plan

9th EUSO-B Progress Meeting, Naples, November 9th 2012

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EUSO BALLOON INSTRUMENTAssembly, Integration and Tests

Plan

Sylvie Dagoret-CampagneLAL


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TABLE OF CONTENT1 Scope of the document 52 Documentation 52.1 Applicable documents 52.2 Reference documents 52.3 glossary53 Instrument overview 63.1 Sybsystems configurations 83.1.1 EUSO Balloon instrument in C1 configuration 83.1.2 EUSO Balloon instrument in C2 configuration 93.1.3 EUSO Balloon instrument in FLIGHT configuration 94 AIT organisation94.1 General overview of the AIT 94.2 Constitution of the AIT teams 104.3 Management 104.3.1 Schedule and activities Management 104.3.2 TraçabilitY 114.3.3 Risk 115 GROUND FACILITIES 115.1 Electrical Segment Equipement 115.2 Photometric Segment Equipement 115.3 Mechanical Segment Equipement 115.4 Optical Segment Equipement 12


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6. subsystem AIT activity 126.1 PDM 126.1.1 AIT activities overview 126.1.2 PDM AIT detailed activities 166.1.3 PDM delivery to the instrument 316.2 DP AIT activities316.2.1 AIT activities overview 316.2.2 DP AIT detailed activities 316.2.3 DP delivery to the instrument 356.3 Lenses AIT activities 356.3.1 AIT activities overview 356.3.2 Lenses AIT detailed activities 356.3.3 Lenses delivery to the instrument 356.4 PWP AIT Activity 35


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7 EUSO Balloon Instrument AIT activities 367.1 Activities overview 367.2 AIT of the Instrument phase 1 377.2.1 Preparation of the mechanical integration 377.2.2 Assembly of the electrical section 377.2.3 Good health tests 387.2.4 Assembly of the Optical Section 387.2.5 Optical alignment397.3 AIT of the Instrument phase 2 397.3.1 Functional tests of the TM with NOSYCA 397.3.2 Autonomous gondola tests 407.3.3 Campaign simulation tests 407.4 AIT of the Instrument phase 3 407.4.1 disassembly of the instrument 407.4.2 Instrument packaging for transportation 417.5 AIT of the Instrument phase 4 417.5.1 Reception control and preparation 417.5.2 Assembly of the whole instrument 417.5.3 Optical alignment of the instrument 417.5.4 Instrument good health tests 417.5.5 Gondola finalization 427.5.6 Instrument recovery 427.5.7 Instrument integrity control 427.5.8 Instrument packaging for transportation 42


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INSTRUMENT OVERVIEW


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EC-HV

EC-DYNODE

HVPS2

HVPS1

MAP

MT

EC-ANODE

EC-ASIC

PDM-B

IR-CAM

Batteries

PWP

LVPS

-DP1

LVPS

-DP2

LVPS-PDM

LVPS

-HK

HK

CCB

CLKB

GPSR

CPU

DST

SIREN

CNES Telemetry

EXT

Bat Controller

TLS

Sensors

Motors

SPACEWIRE/PCI

EC-Front

EC-Back

DP PDM


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PDM AIT


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ComponentPre-assembly

Component test

EC-Unit

HVPS

EC-ASIC

PDM-B

ComponentManufacturing

Pre-Integration Assembly

IntegrationTests &Validation

PAECM2

PAECM1

THV1

THV2

TECA2

TECA1

TPD1..N

IEC1

IEC2

IEC3

IEL1

IEL2

AP1

AP2

AP3 CAPHEC1

TrigPDM


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NIM/CAMAC

Pre-Integration IEC3(@APC)

Light Source

&Opt. Bench

Power 28 V

Special EC Frame (1)

HV Box(1)

EC-Unit1

EC-ASICs1

Test-EC-Unit(2- ?)

FAST-DAQOr

LAbView

• Slow control parameters can be downloaded and read back,

• Trigger curves obtained by DAC threshold slopes (S-Curves) measured on each of the 64 channel of the photon counting,

• No particular check will be done on KI channels at this stage.

Power 3.3 V & 1.5 V


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PDM Frame (1)

EC-Unit(9)

EC-ASICs(6)

Assembly

AP1 AP2

PDM Frame (1)

HV Box(1)

EC-Unit(9)

EC-ASICs(6)36 EC-Anode Flex

256 HV cables


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NIM/CAMAC

Integration AP1,AP2,AP3, CAPHEC1(APC)

Light Source

&Opt. Bench

Power 28 V

PDM Frame (1)

HV Box(1)

EC-Unit(9)

EC-ASICs(6)

Test-EC-Unit(2- ?)

FAST-DAQOr

LAbView

Assembly (AP1,AP2,AP3) : mount all Electronics at the rear of the PDM• EC-ASIC• HV

Integration put the cables in the connectors:• Connect the EC-Units to the EC-ASIC through the FS frame though the EC-Anode flex cables,

Test and validation , CAPHEC1 at APC• Photon detection efficiency for each channel,• Gain of each MAPMT,• Electronic gain matching• S-Curves for each pixel,• KI-S-curve,• Voltage for each EC,

Power 3.3 V & 1.5 V


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Data analysis for each of the 64 channels- Quantum efficiency- Gain

EC-Units EC-ASIC

Pulser

LED

PhotocathodeUniform illuminationIn single photoelectronmode

HV 900 V HVPS

K and dynodes

Test and Validation CAPHEC1 (Calibration@APC)

Integrand sphere

collimators

TEST-ECASIC


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FSEC-Units EC-ASIC

HV 900 V HVPS

K and dynodes

Trigger Validation TrigPDM

PDMB

AbsorberTo work inUV and low light mode


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Electronic Integration IEL1 (Resp LAL)

(1) (6)

PDM-B EC-ASIC

5 V PDM-B5 V EC-ASICs

PDM-B Analysis tools

Pulse Generator

40 MHz clock


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Electronic Integration IEL2 (Resp LAL)

LAL (1) (1) (6)PDM-B EC-ASICDP Pulse

Generator

clock4 x 28 V

CPU software


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NIM/CAMAC

Final PDM Integration AP4 (APC)

Light Source

&Opt. Bench

Power 28 V

PDM Frame (1)

HV Box(1)

EC-Unit(9)

EC-ASICs(6)

• Assembly (AP4) : put all calbles at PDM-B• EC-ASIC• HV

• Integration put the cables in the connectors:• Connect the EC-Units to the EC-ASIC through the FS frame though the

EC-Anode flex cables,• Test and validation

• Test EC-ASICs R&W by PDM-B to retrieve LAL integration tests

PDM-B(1)

Power 5 V


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INTEGRATION OF DP

CPUHK

CLKB

GPSR

CCB

LVPSHK

LVPSDP1LVPS

DP2

LVPSPDM


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Summary of DP Integration (@Naples)

• 3 monthes (TBC)• Mechanical and electrical compatibility• Hardware tests• Software tests

ID1:LVPS+

HK+CPU

ID2:+GPS+CLK+SPI

ID3:+CCB

ID4:+CCB+SPI

UNAM+INFN(Na-Ba-Roma2)

UNAM+INFN(Na-Ba-Roma2)

IAAT+Naples+Bari

IAAT+(Na-Ba-Roma2)

ID5:SpaceWire

IAAT+(Na-Ba-Roma2)


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DP Integration Phase 1 (ID1)

• Integration ID1 : participants UNAM, Naples/INFN, Bari/INFN and Roma2/INFN The first step of the integration will regard the LVPS modules, the HK and the CPU. During this phase, after the verification of all the mechanical and electrical compatibilities, the communication between CPU and HK system on the RS422 port will be faced and tuned. (HK configuration, switch-on/off sequence etc etc)

LVPS HK CPU

DP-Box

DP-Box

RS422


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• Integration ID2 : participants UNAM and INFN (NA-BA-Roma2)

the introduction in the system of the CLK board and GPS board in order to test the relative LVPS and to verify the SPI interfaces HK-CLKb and HK-GPSb. The interface CLKb-GPSb with the two boards powered by the LVPS will be tested too.

LVPS HK CPU

DP-Box

DP-Box

CLKGPS

SPI


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Integration ID3 : participants IAAT and INFN (Na-Ba-Roma2)the introduction in the system of the CCB. Also in this case we have to test mechanical and electrical compatibilities, the interface with CLKb in order to provide a clock to the board and all the ancillary functionality.

LVPS HK CPU

DP-Box

DP-Box

CLK CCB PDM-B EmulatorGPS

SPI


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Integration ID4 : participants IAAT, UNAM and INFN(NA-BA-Roma2)

we have to test the SPI interface HK-CCB

LVPS HK CPU

DP-Box

DP-Box


SPI


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Integration ID5 : participants IAAT and INFN (NA-BA-Roma2)The fiveth step will be the test of the the SpaceWire interface and the full simulation of the different operational mode of the system.

LVPS HK CPU

DP-Box

DP-Box


SpaceWireSPI


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INTEGRATION OF PWP


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Integration of PWP1

Power Pack box: Riken

PWP

Batteries cells : CNES

AP1:PWP

Assembly

TP1:Test of PWP

IP1:Integration

of PWP

Assembly of the cellsInside the PWP box

IRAP

Test of the PWP(external power as well as batteries )

IRAP

Integration with the electronics

IRAP


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FINAL INTEGRATION


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NIM/CAMAC

FINAL PDM+DP Integration before IRAP Light

Source &

Opt. Bench

Power 28 V/PWP

PDM Frame (1)

HV Box(1)

EC-Unit(9)

EC-ASICs(6)

• Assembly connect PDM-B to DP• CCB, HK

• Integration put the cables in the connectors:• Connect the EC-Units to the EC-ASIC through the FS frame though the

EC-Anode flex cables,• Test and validationData from CPU to computer / from storage, Monitoring,

PDM-B(1)

DPLVPS2DP

LVPS3DP

LVPS1PDMLVPS

CCBGPSRCLKB

HK CPU


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OPTICS


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Lenses


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Validation and Acceptance tests for the lenses

RIKEN : estimation of theFocal length of each lens in visible and UV.s

UAH : precision measurementOf the focal length of each lensIn UV


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BACKUP


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EC-HV

EC-DYNODE

HVPS2

HVPS1

MAP

MT

EC-ANODE

EC-ASIC

PDM-B

IR-CAM

Batteries

PWP

LVPS

-DP1

LVPS

-DP2

LVPS-PDM

LVPS

-HK

HK

CCB

CLKB

GPSR

CPU

DST

SIREN

CNES Telemetry

EXT

Bat Controller

TLS

Sensors

Motors

SPACEWIRE/PCI

EC-Front

EC-Back

DP PDM


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EC-HV

EC-DYNODE

HVPS2

HVPS1

MAP

MT

EC-ANODE

EC-ASIC

PDM-B

IR-CAM

Batteries

PWP

LVPS

-DP1

LVPS

-DP2

LVPS-PDM

LVPS

-HK

HK

CCB

CLKB

GPSR

CPU

DST

SIREN

CNES Telemetry

EXT

Bat Controller

TLS

Sensors

Motors

SPACEWIRE/PCI

EC-Front

EC-Back

DP PDM


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EC-HV

EC-DYNODE

HVPS2

HVPS1

MAP

MT

EC-ANODE

EC-ASIC

PDM-B

IR-CAM

Batteries

PWP

LVPS

-DP1

LVPS

-DP2

LVPS-PDM

LVPS

-HK

HK

CCB

CLKB

GPSR

CPU

DST

SIREN

CNES Telemetry

EXT

Bat Controller

TLS

Sensors

Motors

SPACEWIRE/PCI

EC-Front

EC-Back


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Pre-Assembly of EC-Front Units

Integrand sphere

Data analysis for each of the 64 channels- Quantum efficiency- Gain

MAPMT QADC

Pulser

LED PhotocathodeUniform illuminationIn single photoelectronmode

HV 900 V

Voltage divider

64anodes

K and dynodes

Gate

euso balloon instrument assembly, integration and tests plan

Documents

instrument phase

ait teams104

instrument packaging

instrument recovery427

instrument overview5

ait activities overview316

ait activities overview356

ait activities overview126