evolution in complexity
DESCRIPTION
Evolution in Transistor Count. Evolution in Complexity. Evolution in Speed/Performance. Intel 4004 Micro-Processor. Intel Pentium (II) microprocessor. Design Abstraction Levels. Silicon in 2010. Die Area:2.5x2.5 cm Voltage:0.6 V Technology:0.07 m. The Devices. Jan M. Rabaey. - PowerPoint PPT PresentationTRANSCRIPT
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Evolution in Complexity
Evolution in Transistor Count
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Evolution in Speed/Performance
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Intel 4004 Micro-Processor
Intel Pentium (II) microprocessor
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Design Abstraction Levels
n+n+S
GD
+
DEVICE
CIRCUIT
GATE
MODULE
SYSTEM
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Silicon in 2010
Die Area: 2.5x2.5 cmVoltage: 0.6 VTechnology: 0.07 m
Density Access Time(Gbits/cm2) (ns)
DRAM 8.5 10DRAM (Logic) 2.5 10SRAM (Cache) 0.3 1.5
Density Max. Ave. Power Clock Rate(Mgates/cm2) (W/cm2) (GHz)
Custom 25 54 3Std. Cell 10 27 1.5
Gate Array 5 18 1Single-Mask GA 2.5 12.5 0.7
FPGA 0.4 4.5 0.25
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Jan M. Rabaey
The Devices
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The MOS Transistor
n+n+
p-substrate
Field-Oxyde
(SiO2)
p+ stopper
Polysilicon
Gate Oxyde
DrainSource
Gate
Bulk Contact
CROSS-SECTION of NMOS Transistor
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Current-Voltage Relations
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Dynamic Behavior of MOS Transistor
DS
G
B
CGDCGS
CSB CDBCGB
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THE INVERTERS
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DIGITAL GATES Fundamental Parameters
• Functionality• Reliability, Robustness• Area• Performance
– Speed (delay)– Power Consumption– Energy
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The CMOS Inverter: A First Glance
VDD
Vin Vout
CL
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VTC of Real Inverter
0.0 1.0 2.0 3.0 4.0 5.0Vin (V)
1.0
2.0
3.0
4.0
5.0
Vou
t (V
)
VMNMH
NML
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Delay Definitions
tpHL tpLH
t
t
Vin
Vout
50%
50%
tr
10%
90%
tf
VDD VDD
VinVout
M1
M2
M3
M4Cdb2
Cdb1
Cgd12
Cw
Cg4
Cg3
Vout2
Fanout
Interconnect
VoutVin
CLSimplified
Model
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CMOS Inverters
Polysilicon
InOut
Metal1
VDD
GND
PMOS
NMOS
1.2 m=2
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Scaling Relationships for Long Channel Devices
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COMBINATIONAL LOGIC
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Overview
Static CMOS
Conventional Static CMOS Logic
Ratioed Logic
Pass Transistor/Transmission Gate Logic
Dynamic CMOS Logic
Domino
np-CMOS
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Static CMOS
VDD
VSS
PUN
PDN
In1In2In3
F = G
In1
In2In3
PUN and PDN are Dual Networks
PMOS Only
NMOS Only
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Example Gate: NAND
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Transistor Sizing
VDD
AB
C
D
DA
B C
12
22
6
612
12
F
• for symmetrical response (dc, ac)• for performance
Focus on worst-case
Input Dependent
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4-input NAND Gate
Out
In1 In2 In3 In4
In3
In1
In2
In4
In1 In2 In3 In4
VDD
Out
GND
VDD
In1 In2 In3 In4
Vdd
GND
Out
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Ratioed Logic
VDD
VSS
PDNIn1In2In3
F
RLLoad
VDD
VSS
In1In2In3
F
VDD
VSS
PDNIn1In2In3
FVSS
PDN
Resistive DepletionLoad
PMOSLoad
(a) resistive load (b) depletion load NMOS (c) pseudo-NMOS
VT < 0
Goal: to reduce the number of devices over complementary CMOS
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Pseudo-NMOS
VDD
A B C D
FCL
VOH = VDD (similar to complementary CMOS)
kn VDD VTn– VOLVOL
2
2-------------–
kp
2------ VDD VTp– 2=
VOL VDD VT– 1 1kpkn------–– (assuming that VT VTn VTp )= = =
SMALLER AREA & LOAD BUT STATIC POWER DISSIPATION!!!
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Dynamic Logic
Mp
Me
VDD
PDN
In1In2In3
OutMe
Mp
VDD
PUN
In1In2In3
Out
CL
CL
p networkn network
2 phase operation:• Evaluation
• Precharge
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Example
Mp
Me
VDD
Out
A
B
C
• N + 1 Transistors
• Ratioless
• No Static Power Consumption
• Noise Margins small (NML)
• Requires Clock
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Cascading Dynamic Gates
Mp
Me
VDD
Mp
Me
VDD
In
Out1 Out2
Out2
Out1
In
V
t
V
VTn
(a) (b)
Only 0 1 Transitions allowed at inputs!
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Domino Logic
Mp
Me
VDD
PDN
In1In2
In3
Out1
Mp
Me
VDD
PDN
In4
Out2
Mr
VDD
Static Inverterwith Level Restorer
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Where Does Power Go in CMOS?
• Dynamic Power Consumption
• Short Circuit Currents
• Leakage
Charging and Discharging Capacitors
Short Circuit Path between Supply Rails during Switching
Leaking diodes and transistors
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SEQUENTIAL LOGIC
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Master-Slave Flip-Flop
S
R
Q
Q Q
QS
R
Q
Q
J
K
MASTER SLAVE
QJ
K Q
PRESET
CLEAR
SI
RI
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CMOS Clocked SR- FlipFlop
VDD
Q
Q
RS
M1 M3
M4M2
M6
M5 M7
M8
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2 phase non-overlapping clocks
D
In
t12
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PipeliningR
EG
REG
R
EG
log.
RE
G
REG
RE
G
.
RE
G
RE
G
logOut Out
a
b
a
b
Non-pipelined version Pipelined version
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Arithmetic Building Blocks
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A Generic Digital Processor
MEM ORY
DATAPATH
CONTROL
INPU
T-O
UT
PUT
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Building Blocks for Digital Architectures
Arithmetic unit- Bit-sliced datapath (adder , multiplier,
shifter, comparator, etc.)
Memory- RAM, ROM, Buffers, Shift registers
Control- Finite state machine (PLA, random logic.)- Counters
Interconnect- Switches- Arbiters- Bus
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Bit-Sliced Design
Bit 3
Bit 2
Bit 1
Bit 0
Reg
ister
Add
er
Shift
er
Mul
tiple
xer
Control
Dat
a-In
Dat
a-O
ut
Tile identical processing elements
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Layout Strategies for Bit-Sliced Datapaths
Well
ControlWires (M1)
Well
Wires (M1)
GND VDDGND
GND
VDD
GND
Approach I —Signal and power lines parallel
Approach II —
Signal and power lines perpendicular
Sign
als W
ires
(M2)
Sign
als W
ires
(M2)
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Layout of Bit-sliced Datapaths
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COPING WITH INTERCONNECT
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Impact of Interconnect Parasitics
• Reduce Reliability
• Affect Performance
Classes of Parasitics
• Capacitive
• Resistive
• Inductive
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Using Cascaded Buffers
C2C1
Ci
CL
1 u u2 uN-1
In Out
uopt = e
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ISSUES IN TIMING
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The Ellmore Delay
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The Clock Skew Problem
CL1 R1 CL2 R2 CL3 R3In Out
t’ t’’ t’’’
tl,min
tl,max
tr,min
tr,max
ti
Clock Edge Timing Depends upon Position
Clock Rates as High as 500 Mhz in CMOS!