expectation for rts materials for electronic applications

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June 22, 2007 Shinya Hasuo ISTEC/SRL Expectation for RTS materials for electronic applications Road to RTS Temperature ~250K

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Page 1: Expectation for RTS materials for electronic applications

June 22, 2007

Shinya Hasuo

ISTEC/SRL

Expectation for RTS materials for electronic applications

Road to RTS

Temperature ~250K

Page 2: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 3: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 4: Expectation for RTS materials for electronic applications

Electronic applications of superconductive devices

Superconductive

devices

Passive

device

Active

device

Thin film

Thick film

or bulk

Filter

Transmission line

Josephson

junction

Superconductive

transistor

SQUID

EM detector

Voltage standards

Digital circuit

FFT etc.

Antenna

Cavity

Magnetic shielding

Devices shown by red color

are commercially sold.

Page 5: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 6: Expectation for RTS materials for electronic applications

Example of commercially available or practical superconductive systems

Page 7: Expectation for RTS materials for electronic applications

Example of commercially available or practical superconductive systems

HTS filters

Page 8: Expectation for RTS materials for electronic applications

http://pr.fujitsu.com/jp/news/2002/09/20.html

Page 9: Expectation for RTS materials for electronic applications

Example of commercially available or practical superconductive systems

HTS filters

HTS and LTS SQUID systems

Page 10: Expectation for RTS materials for electronic applications

Magnet (0.1T)

Magnetic Shield

(inside the

cover)

Touch Panel

SQUIDs (inside

the cover)

PC controller

(inside the cover)

Belt

conveyer

SQUID for food inspection system

National University Corporation

Toyohashi Univ. of TechnologyAdvance Food Tech. Co.,Ltd.

Sumitomo Electric Hightechs Co.,Ltd.

Page 11: Expectation for RTS materials for electronic applications
Page 12: Expectation for RTS materials for electronic applications

Example of commercially available or practical superconductive systems

HTS filters

HTS and LTS SQUID systems

LTS SIS mixers (for ozone monitoring system, for radio observatory)

Page 13: Expectation for RTS materials for electronic applications

Ozone monitoring system

installed in 4K refrigerator

http://edevice.fujitsu.com/fvd/eco/siso_100.html

Page 14: Expectation for RTS materials for electronic applications

Nobeyama radio observatory

http://www.nro.nao.ac.jp/~nro45mrt/pictures/photo/image6/img203_800.jpg

From NRO home page

SIS mixersinside

Page 15: Expectation for RTS materials for electronic applications

Example of commercially available or practical superconductive systems

HTS filters

HTS and LTS SQUID systems

LTS SIS mixers (for ozone monitoring system, for radio observatory)

LTS voltage standard systems

Page 16: Expectation for RTS materials for electronic applications

Voltage standard system

From HYPRES home pagehttp://www.hypres.com/

Page 17: Expectation for RTS materials for electronic applications

High-speed digital circuit development

Page 18: Expectation for RTS materials for electronic applications

Present status of high-speed digital technology

LSI design technology

Semiconductor LSI designer can design SFQ LSIs.

Fabrication Process technology

One million JJ circuits are possible to make.

LTS circuits

High speed circuit operation

20-50 GHz clock operation is feasible.

Fabrication Process technology

100 JJ circuits are possible to make.

HTS circuits

Circuit operation

A few tens JJ circuits are feasible to operate.

Page 19: Expectation for RTS materials for electronic applications

Niobium junction integration

Features•Planarized 9 Nb layers•Nb/AlOx/Nb with critical current density of 10 kA/cm2

•Minimum junction size:1μm□

SiO2

Josephson junction

Mo resistor

Nb9

Nb8

Nb7

Nb6

Nb5

Nb4

Nb3

Nb2

Nb1

SiO2

1μm

Ref: T.Satoh et al, Physica C (2006) P.445

Page 20: Expectation for RTS materials for electronic applications

One million SQUID array for process check

Magnified view of 1/25 of

one unit cell of the left-

hand side picture

72 SQUID array

Left-hand side chip includes

72 x 25 x 24 x 24=

1,036,800 SQUIDsChip size: 8mm ☓ 8mm

Ref: M.Hidaka et al, Supercon. Sci. Tech. (2006) P.S138

Page 21: Expectation for RTS materials for electronic applications

LTS 4×4 SFQ switch

Number of JJ: 2812 JJ

(4×4 switch part: 1478 JJ)Maximum clock frequency: 45 GHz

Ref: S.Yorozu et al, HPSR 2004

Page 22: Expectation for RTS materials for electronic applications

Superconductive LAN system with SFQ switch

Exchanging the movie data

among four sets of computers

Total system installedin a refrigerator

4×4 SFQ switch

PC1PC2

PC3PC4

EthernetEthernet

Ref: Y.Kameda et al, ISEC2007

Page 23: Expectation for RTS materials for electronic applications

PC

制御系

High frequencymodule (24.7 g)

HTS sampler chip(2.5 mm□)

Refrigerator

Controller

HTS sampler system

Ref: H.Suzuki et al, ISEC2007

Page 24: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 25: Expectation for RTS materials for electronic applications

Wirings (LSI wirings, printed circuit board,

co-axial cables, and all other cables)

RTS material application to passive devices

Page 26: Expectation for RTS materials for electronic applications

6.0

6.0

2.0

0

-2.0

Voltage a

t lo

ad (

V)

0 100 200 300 400 500 600 700

Time (ps)

Wiring width: 1.8μmTemperature: 300K

Superconductor wiring (without termination)

SC wiring (with termination)

Al wiring (with termination)

Al wiring (without termination)

LSI operation at 300K with 1.8μm width wiring

M.Taguchi, Nikkei Electronics, 1987, Nov.30 issue, p.153

Page 27: Expectation for RTS materials for electronic applications

LSI operation at 77K with 1.8μm width wiring

Wiring width: 1.8μmTemperature: 77K

Superconductor wiring (without termination)

Al wiring (without termination)

SC wiring (with termination)

Al wiring (with termination)

0 100 200 300 400 500 600 700

Time (ps)

6.0

6.0

2.0

0

-2.0

Voltage a

t lo

ad (

V)

M.Taguchi, Nikkei Electronics, 1987, Nov.30 issue, p.153

Page 28: Expectation for RTS materials for electronic applications

6.0

6.0

2.0

0

-2.0

Voltage a

t lo

ad (

V)

0 100 200 300 400 500 600 700

Time (ps)

Wiring width: 0.5μmTemperature: 77K

Superconductor wiring (without termination)

Al wiring(without termination)SC wiring (with termination)

Al wiring (with termination)

LSI operation at 77K with 0.5μm width wiring

M.Taguchi, Nikkei Electronics, 1987, Nov.30 issue, p.153

Page 29: Expectation for RTS materials for electronic applications

LSI cross section

http://home.hiroshima-u.ac.jp/nanostr/sonota.pdf

Page 30: Expectation for RTS materials for electronic applications

Microwave components (filters, antennas, transmission lines and cavities)

Wirings (LSI wirings, printed circuit board,

co-axial cables, and all other cables)

RTS material application to passive devices

Page 31: Expectation for RTS materials for electronic applications

Superconductive filters

HTS filter should be installed in a refrigerator.

Easy for installingin a base stationRTS filter can be used as it is.

Page 32: Expectation for RTS materials for electronic applications

Microwave components (filters, antennas, transmission lines and cavities)

Wirings (LSI wirings, printed circuit board,

co-axial cables, and all other cables)

Magnetic shielding

RTS material application to passive devices

Page 33: Expectation for RTS materials for electronic applications

Superconductive magnetic shielding will be used with conventional high-μ shielding

Page 34: Expectation for RTS materials for electronic applications

RTS passive devices

Basically we can apply RTS materials to any passive electronic components and systems.

It is most important whether the RTS material can be processed to desired shape and it exhibits necessary performance.

Present HTS materials have some restrictions such as substrate selection and high processing temperature.

Page 35: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 36: Expectation for RTS materials for electronic applications

Effects of thermal noise

Performance of active devices are strongly

affected by thermal noise.

Passive devices are not fatally affected by

thermal noise.

Thermal noise

Vn= SQRT(4kBTRB)

in=SQRT(4kBTB/R)

Pn=4kBTB

Pn=16.56nW@300K, B=1THz

0.232nW@4.2K, B=1THz

Page 37: Expectation for RTS materials for electronic applications

Josephson Transmission Line (JTL)

L Ic =0.5φ0

β=1

R

TBki B

N

4=

Transmission line

Voltage pulsecaused by SFQ

Loop inductance L

iN iN iN

Thermalnoise

DCSFQ JTL x 5 JTL x 30 JTL x 5

with noisewithout noise

Observing pointSFQ

generation Transmission

Page 38: Expectation for RTS materials for electronic applications

Voltage

Current

Current-Voltage characteristics

of a Josephson junction

Ic

Vg

IcRn product of Josephson junction

τ=Φ0/2πIcRn

Rn

IcRn product is an important

parameter for digital circuit.

Page 39: Expectation for RTS materials for electronic applications

TN = 0K

@40GHz clock

Simulated by Akira Yoshida

TN = 4.2K

TN = 77K

TN = 300K

Temperature dependence of SFQ pulse waveform0.5

mV

Voltage

0 200 400 600 800 Time (ps)

IcRn=0.37mV, Ic=0.1mA for Nb junction

Page 40: Expectation for RTS materials for electronic applications

@40GHz clockIcRn=1mV, Ic=0.4mA, β=1

Temperature dependence of SFQ pulse waveform for larger Ic and IcRn

0.5

mV

Voltage

0 200 400 600 800 Time (ps)

TN =300K

TN =77K

TN =4.2K

Simulated by Akira Yoshida

Page 41: Expectation for RTS materials for electronic applications

@40GHz clockT=300K, Ic=0.4mA, β=1

IcRn dependence of SFQ pulse waveform at room temperature

5

Voltage

(mV)

0 200 400 600 800 Time (ps)

IcRn = 20mV

IcRn = 10mV

IcRn = 1mV

0

0

0.5

0

3

Simulated by Akira Yoshida

Page 42: Expectation for RTS materials for electronic applications

SQUID sensitivity

10-14 10-10 10-8 10-6 10-4 10-2 1 10210-12

Magnetic filed (T)SQUID

Optical pumping magnetometer

Magneto resistance (MR) device

Hall effect device

Terrestrialmagnetism

MRIMCGMEG

Unborn baby MCG

SΦ1/2=(16kBTLs

2/R)1/2 ∝ T1/2

Page 43: Expectation for RTS materials for electronic applications

SQUID sensitivity

10-14 10-10 10-8 10-6 10-4 10-2 1 10210-12

Magnetic filed (T)SQUID

Optical pumping magnetometer

Magneto resistance (MR) device

Hall effect device

SΦ1/2=(16kBTLs

2/R)1/2 ∝ T1/2

HTS SQUID: ~30fT/Hz1/2

LTS SQUID: ~3fT/Hz1/2

RTS SQUID??

Page 44: Expectation for RTS materials for electronic applications

SIS mixer (EM detector)

Noise temperature (Sensitivity limit)TN=~hν/kB

=48K@1THz=4.8K@100GHz

Ambient temperature: 300K

Experimental result (Example)TN=~60K@430GHz

=~3hν/kB

Page 45: Expectation for RTS materials for electronic applications

RTS material application to active devices

Voltage standards may be possible if we can make uniform Josephson junction array.

High-quality Josephson junction is a key for active device applications of RTS.

Handy SQUID system may be useful for a convenient MCG or other applications.

SFQ digital circuits are not hopeful because of crucial thermal noise.

SIS mixers has also problem of thermal noise.

Page 46: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples nt status of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 47: Expectation for RTS materials for electronic applications

Role of LTS, HTS and RTS devices

LTS(T=4.2K)

HTS(T=77K)

RTS(T=300K)

・High-sensitive SQUID

・High-speed digitalcircuit for computersand routers

・SIS mixers

・Compact SQUID

・Digital receiver systemfor telecommunication

・Measurement systems such as a sampling oscilloscope

Key feature: High-speed, high-sensitivity and extremely low-noise

Key feature: Compact system, high-speed, and high-sensitivity

Key feature: Refrigerator free and improvementof metal conductivity

Lower temperature operation, such as 4.2K operation ofHTS devices and 77K operation of RTS active devices,

may be possible to improve their performance.

・Wirings

・Microwave components

・Magnetic shielding

・Handheld SQUID (?)

・Voltage standards (?)

Page 48: Expectation for RTS materials for electronic applications

RTS world

Ubiquitous Superconductive Electronics !!!

In office At home

: RTS electronic device

Page 49: Expectation for RTS materials for electronic applications

Contents

Classification of superconductive electronic devices

Examples of LTS and HTS devices

RTS material application to passive devices

RTS material application to active devices

Expectation for RTS materials for electronic applications

Request for RTS materials from the viewpoint of an

electronic device researcher

Page 50: Expectation for RTS materials for electronic applications

RTS material should be ・・・

easy to process with physical and/or chemical treatment.

deposited on any substrate at low temperature (<200℃).

stable for long term preservation.

uniform in nm-scale in the case of active device application.

Page 51: Expectation for RTS materials for electronic applications

Roughness Ra = 0.7 nm Roughness Ra = 1.2 nm

●Optimization of deposition condition with SrSnO3(SSO) insulation layer

●Reproducible deposition of smooth layer with surface roughness less than 2 nm

3 HTS layer structure with smooth surface

2-layer structure 3-layer structure

Page 52: Expectation for RTS materials for electronic applications

RTS material should be ・・・

easy to process with physical and/or chemical treatment.

deposited on any substrate at low temperature (<200℃).

stable for long term preservation.

uniform in nm-scale in the case of active device application.

able to carry high current density as high as 107 A/cm2 .

Page 53: Expectation for RTS materials for electronic applications

Conclusion

Refrigeration free is the most important nature of RTS materials for electronic applications.

Passive device applications are quite hopeful in various field of electronics, especially in consumer market.

Active device applications are doubtful. But, if RTS Josephson junction characteristics exhibit high-quality and uniformity, active devices may be practical.

Page 54: Expectation for RTS materials for electronic applications

Supplements

Page 55: Expectation for RTS materials for electronic applications

Access network

Superconductingrouter

Superconducting intelligent home

receiver

Base station with superconducting

devices, such as filters and A/D converters

Superconductingserver

Back born Network

Base Station

Handy phonePDA

HTS systems

Image of HTS and LTS applications

LTS systems

Page 56: Expectation for RTS materials for electronic applications

Difference of HTS and LTS systems from the view point of users

LTS systems・Suitable for large scale system ・Competitors are conventional high-end systems・The larger the system becomes, such as supercomputers, the better the performance

Big difference is cooling scale !

HTS systems・Operated in a small cooler (sometimes in a palm-top cooler)・Suitable for small scale system・Competitors are conventional low-end systems, such as high-speed measurement systems

Page 57: Expectation for RTS materials for electronic applications

Nb vs HTS (Y, Bi, Tl, Hg-systems, etc)

Applications of LTS

High-speed routerLarge scale low power server

(Large scale systems)

Superconductors

Comparison of HTS and LTS applications referring semiconductors

Applications of HTS

・A/D converter system・High-speed measurement system(Small scale systems)

Applications of Si

SupercomputerHigh-speed processor(Large scale systems)

Applications of Compound Semiconductors

・Optical communication system・Satellite communication system(Small scale high-speed systems)

Semiconductors

Si vs Compound semiconductors (GaAs, InP, GaN, InAs, InGaAs, etc)

Page 58: Expectation for RTS materials for electronic applications

HTS device structure

Via hole for oxidizing

ground plane

GP(La-YBCO)

SrSnO3(SSO)

MgO substrate

BE(La-YBCO)

SSO

Superconducting

contactAu

CE(La-YbBCO)

JJV-Ti

Smooth surface

with Ra=1.2 nm

Standard deviation of Ic: 8.1%

for Ic= 0.5 mA junctions

Deposition of gold for

decreasing contact

resistance

V-Ti resistor with sheet

Resistance of 20W

Page 59: Expectation for RTS materials for electronic applications

Demonstration of elementary SFQ circuits

JTL Voltage amplifier

∑-Δ AD modulator (13 JJ, Hitachi) 100 GHz @20K

SQUID-array interface (25 JJ, SRL)

・ Latch-type interface (10 JJ, Fujitsu) >I mV output @30 K

・ Sampler circuit with JTL buffer (25 JJ, NEC)20 GHz signal observation @35 K

・ QOS comparator (10 JJ, SRL)82 GHz @40 K

Ring Oscillator (21 JJ, Toshiba) 57 GHz @20K

Page 60: Expectation for RTS materials for electronic applications

Design of HTS circuits

Input

(0.5mA/div)

Reset

(0.2mA/div)

Output

(0.2mV/div)

Time (0.2ms/div)

Input

(0.5mA/div)

Reset

(0.2mA/div)

Output

(0.2mV/div)

Time (0.2ms/div)

●SFQ-dc circuit suitable for HTS devices was designed.●Operating margin was increased twice (±22%)@22K operation.●Confluence buffer, splitter, and RS-flip flop circuits were also operated.

Page 61: Expectation for RTS materials for electronic applications

HTS 100 JJ circuit

Operation at 29 K

Reset

(100mA/div)

Signal

(1mA/div)

Output

(0.2mV/div)

Reset

(100mA/div)

Signal

(1mA/div)

Output

(0.2mV/div)Circuit

dc-SFQ SFQ-dcJTL(16JJx6)dc-SFQ

Conv.

SFQ-dcJTL(16JJx6)

Conv.

Circuit including 101 JJs

Ref: H.Wakana et al (ISTEC), ISS2004

Page 62: Expectation for RTS materials for electronic applications

Superconducting sampling oscilloscope

SamplingOscilloscopePrototype

Chip and Package

-0.025

-0.015

-0.005

0.005

0.015

0.025

0 20 40 60 80 100 120 140

Tim e (ps)

Measured I s (mA)

(c) 20 G Hz

Waveform of 20GHz

Superconductors

Semiconductors

10

2

3

4

5

6

100

2

Band W

idth

(G

Hz)

2010200019901980

Year

Ref: M.Hidaka (NEC) et al., ASC2000

Page 63: Expectation for RTS materials for electronic applications

Research items for low temperature packaging

Signal conversion from semiconductor to SFQ

Multi-chip module (MCM)

Signal conversion from SFQ to semiconductor

Low temperature cooling

Latency between low temperature and room temperature

Page 64: Expectation for RTS materials for electronic applications

Superconducting MCM

LSI

LSI

LSI

LSI

Multi Chip Module

Input

Input

Output

Output

I/F

I/F

Top view

SFQ signal can propagate

in between LSIs.

Cross sectional view

MCM board

Page 65: Expectation for RTS materials for electronic applications

Overcome the difficulties

FiltersSQUIDsSea of Darwin

Routers

Processors

Oscilloscopes

A/D Converters

Death Valley

Dawn of Superconducting

Electronics

Page 66: Expectation for RTS materials for electronic applications

Technology strategic map

We are here(2006)

Demonstration(2007)

PracticalUsage(2010)

MarketIntroduction

(2015)

A-system (1)Technology map

(2)Deployment scenario

(3)Road map

Page 67: Expectation for RTS materials for electronic applications

Hurry up!

The roadmap

Engineer or researcher

Manager or officer

Page 68: Expectation for RTS materials for electronic applications

Thank you for your kind attention.

Page 69: Expectation for RTS materials for electronic applications

SFQ circuits

Thermal limit

CMOSNMOS

ECLCryo-

CMOS GaAs

HEMT

SFQ

- 8

- 9

- 10

- 11

- 12

- 13

- 14

10-10

10- 8

10- 6

10- 4

10-2

Power consumption (W/gate)

10

10

10

10

10

10

10

Op

era

tio

n s

pe

ed

(s/g

ate

)

300K77K

Semiconductors

Operation Speed vs power consumption

F0= h /2 e

(2.07x10-15 W b)

Superconducting loop

Bias current

Output

Josephsonjunction

SFQ

Reset signalSet signal

Input

SFQ

Josephson junction

Superconducting loop

Transmission line

SFQ

L

Voltage pulse

0

F0

t0=F0 / 2Ic RnLoop inductance

SFQ circuit

↓ ↓→

Input AO u t p u t

L 4

L 1

L 2

L 3 L L 5

T

J 1

J 2

J 3

J 4

J 5

J 6 J 7

J 8I b 1 I b 2

OR Cell

Input B