extreme soldering - retroactive
TRANSCRIPT
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marshallh
Toorcamp 071214
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Blundell.co.uk <video>
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1. Overview of BGA and surface mount
2. PCB design
3. Assembly / Rework
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Bosch Sensortec
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Much easier to assemble
More compact
Can use newer parts
BUT, rework more difficult
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Popular package for CPUs, memory, SoCs, interface
chips
High pin count, small space
Can be difficult to “break out”
Necessary for modern fast digital
Quick, cheap 4layer services mean small BGAs are
perfectly usable for prototyping
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Overmolded wirebond
Cutaway diagrams © Amkor 8
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Lidless flip chip
Cutaway diagrams © Amkor 9
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Lidded flip chip (heatspreader over die)
Cutaway diagrams © Amkor 10
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Image Zuken
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Pitch
Land size (usually function of pitch)
Pattern (any voids)
Total ball count
Most packages have
grid-aligned balls
Horiz/vertical pitch
may not be square
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Pitch
Ball count
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0.5mm (Low ball count, PoP)
0.8mm (SoC, DDR)
1.0mm (Large FPGAs)
1.27mm (Legacy devices)
Total balls can range from 4 to over 1000-2000
Leaded balls, leadfree (RoHS)
Larger pitches much easier to break out
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Can be done in just about any package
I’ve used Eagle, Altium, others used Kicad
Hand routing essential for layer count
Footprints easy, symbols not
Typical high speed layout rules apply
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4 layers is the sane minimum for most
256 balls possible on 4 layer
324 requires 6 layers
484 requires 8 layers
For example a high end
Stratix FPGA with ~1400
may take 16 layers
ENIG, Immersion Silver
PTH vs microvias
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Fanout all pads except 2 outer rings
Next two rings via’d to bottom layer
Ground, power fills
Land diameter: 2/3 of ball diameter ◦ Example: 1.0mm bga
0.8mm balls
0.48mm land size
1.0mm: ◦ 13mil drill, 21mil diameter, 6mil trace/space
0.8mm: ◦ 10mil drill, 18mil diameter, 5mil trace/space
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Outer two rings
Inner area
Ball land
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NSMD (Non-solder mask defined)
◦ Most common,
allows solder to
“grab” around
copper
SMD (Soldermask defined)
◦ Used when not enough space
Mentor Graphics
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DON’T!
Result: via steals solder, stressing
joint, outgassing causes voids
Real via-in-pad (VIP):
◦ Plugged vias
◦ Capped vias
Aids bypass caps, costs $$$
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1. Soldermask-copper alignment
2. Ensure annular ring on all vias
3. Pad coplanarity
4. Plating
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Image Russ Dill
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Overetch Plating
Drill breakout
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Apply paste
Place parts
Reflow
Process is critical!!
BGAs come preballed (leadfree)
Either paste, or just flux the pcb
Placement of BGA is super simple and easy
Alignment: Copper best
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Sitting on paste
(recommended)
Sitting on flux (A+ planarity needed)
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Buy quality; cheap paste sucks
BGAs come with leadfree balls
Good for 6mos
Store in fridge, don’t freeze
I use SMD291SNL10-ND
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Kapton (3,5mil)
Stainless steel
Soldertools.net
Oshstencils.com
Ohararp.com
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Heating paste past melting temp consistently and
holding for a bit
Exact timing/temps important for big runs
“Good enough” works for prototypes
Convection oven > skillet > hotair station
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Hotair station only works for very small (<200 pin)
monolithic BGA and QFNs
Hotplate gives uneven heating, only 1 side
Convection oven
best bet
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Consult datasheets of the critical parts on PCB such as
as main processor, large connector etc
Basically all the same depending
Leadfree and leaded are different of course
Always do dry run with
a dummy pcb of same
thermal mass
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NXP Semiconductor 43
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Preheat ramp speed
Soak time (deprecated for RoHS)
Time above liquidus
Cooldown speed (degrees/second)
For protos, exact rates not critical!
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Blundell.co.uk <video>
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<video>
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<video>
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Too long in soak will burn off flux
Excessive voiding in solder balls
Poor coplanarity of pads; bad wetting
Other failures can manifest in the field:
◦ Stress fractures caused by voids near joint
◦ Dendritic growth/tin whisker
◦ PCB failures such as via>plane shorts
◦ Thermal cycling stress
◦ Vibration/shock
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Image azonenberg
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Gideon Labs
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Bga.net
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Most BGAs only rated to withstand 3 cycles
Preheating is necessary
Hard to heat joints by blasting the top of the package
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Remove BGA
Site PCB prep
◦ Clean pcb lands, must be flat
◦ 99% isopropyl
Prep BGA
◦ Remove all solder
◦ Isopropyl
◦ Chip away flux residue again
◦ Flux and place balls
◦ Reflow in oven only
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Altera reflow guidelines http://www.altera.com/literature/an/an353.pdf
Intel process guidelines http://www.intel.de/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-09-databook.pdf
NXP reflow appnote http://www.nxp.com/documents/application_note/AN10365.pdf
Breakout out very large devices http://www.pa.msu.edu/hep/atlas/l1calo/reference/other/mentor/mentorpaper_bga_breakouts_and_routing_52590.pdf
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marshallgs at gmail.com
Twitter @fpga_nugga
IRC efnet, freenode <marshallh>
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