F3 Board for CAP3

Project Talk for Physics 476 Final Presentation

May 12th , 2005

Jim Kennedy

2Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Talk Overview

� The Belle experiment at KEK-B Factory.

� Vertex detector and the Monolithic Active Pixel Sensor (MAPS) technology.

� Continuous Acquisition Pixel (CAP): A series of sensors developed in Hawaii.

� The 3rd CAP prototype: CAP3.

� Development of a setup for CAP3 testing.

� Plans for the future & Conclusion.

3Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

The Belle detector at KEK-B

~1 km in diameter

Mt. Tsukuba

KEKB Belle

µµµµ / KL detection14/15 lyr. RPC+Fe

Central Drift Chambersmall cell +He/C2H5

CsI(Tl) 16X0

Aerogel Cherenkov cnt.n=1.015~1.030

Silicon Vertex Detector

TOF counter

SC solenoid1.5T

8 GeV e-

3.5 GeV e+

Belle detectorBelle detector KEK-B: A e+ e- collider to

produce ‘B-mesons’

BELLE: The detector to study

the production of ‘B-mesons’

4Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Principle of Vertex Detector

Primary interaction point

Production of secondary particles

Decay length

1) Decay length gives a hint at which particle was produced and when.

2) Need accuracy in our extrapolation from recorded hit→ Need good hit resolution in layers of detector: small size of detection units, and not so much material

3-layer vertex detector

Error on hit reconstruction

Possible area of decay

5Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

MAPS technology

Principle of MAPS

10µm

- Possibility to implement

some electronics logic

directly on the SI die.

- A very small thickness is

achievable: the sensor can

be ground down to the epi

layer.

- No High Voltage needed.

6Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Correlated Double Sampling (CDS)

-

Frame 1 - Frame 2 =

Hit candidate!

- Leakage current

Correction

time

Vreset

∆VtypαIleak

∆VsigαQsignal

Integration timetfr2tfr1

reset

VDD VDD

GND

M1

M2

M3

Reset

Column

Row BusCollectionElectrode

M1

M2

M3

Bus

Output

Reset

Collection

Electrode

GND

7Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

The CAP series:

928 x 128 pixels = 118,784

Active area

20.88 mm

~4.5M transistors !CAP1 & CAP2: First 2 prototype sensors

developed in Hawaii: small size array, tests

successful.

CAP3: 2.1cm x 0.3 cm ‘full-size’ prototype.

The F3 board to test the

CAP3 sensor.

8Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

System for CAP3

MC1

card

Serialized data out

from the MC1 card and

control signals to the

MC1 card through RJ-

45 connectors.

CAP3

F3

BE

MOBCADS

9Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Project Overview

� Proto eval board and system for the CAP3.

� Massive data transfer from Sensor.

� Send the data at high speed (LVDS).

� F3 alignment with the beam with a movable platform.

� Prepare for a beam test this June at the KEK “B”

factory.

10Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

System Diagram

Pixel

Data

Bias control

16 pairs of signals

per F3 board,

6 F3 boards

PMTs

FPGA

F3

Mother

board

MC1

card

Back-end

board

CPU

software

RAM

~1.43 millions bits for

each entire readout

Pixel

Data Pixel

Data

11Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Conclusion

� System integration near completion: tests of hardware, firmware developments (MC1 & BE control).

� First CAP3 data to be acquired soon.

� Base evaluation of system to be done in the laboratory.

� The time schedule is critical: Planning for a beam test with 6 boards in June at KEK test beam.

12Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

BACKUP SLIDES

13Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Silicon Vertex Detector 1 & 2

SVD1 SVD2

• 3 layers →→→→ 4 layers

• 23º<θθθθ<139º→→→→ 17º<θθθθ<150º

• 1 MRad →→→→ >20 MRad

• Rbp = 2.0 cm →→→→ 1.5 cm

Better I.P. resolution

SVD1

SVD2

Summer 2003

14Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation

Hybrid Pixels (CMS example)

92

Ladders

~50M~12k752Barrel

PixelsChipsModules

Pixel size: 150µm x 100µm

3 barrel layers / 2 disks: ‘grand total’: ~66M channels

Baseline for vertexing at LHC. Complex rad-hard ROC, fast electronics (25ns bc), R&D on sensor, thick structure.

> T.Rohe et al, ‘Charge collection properties of irradiated CMS Pixel Barrel Sensors’, RSSMDD oct 10-13 2004, Firenze, Italy

> M.B. ‘Design & Test of the CMS pixel readout chip’, NIM A 517 (2004) 349-359