FIB MANUAL

1. Mount sample, 2. Click exchange button on keyboard, reply yes to popup. 3. On Airlock: click pump>>open4. Switch to camera view..gate valve opens5. Attach rod to sample holder and insert and retract rod6. Unclick OPEN, click close..(wait for gate to close)7. Unclick PUMP, unclick close8. Click purge..unclick purge to stop flow of nitrogen9. Remove exchange rod..replace with plug10. Click resume button and OK on screen11. Scanning >> Dynamic focus

preparing the system12. Turn EHT ON..in gun panel set EHT=5 KV13. APERTURE tab>>60 m check the high current box14. Click on FIB toolbar launch FIB control panel.(confirm that FIB pressure< 7.5*10-8 torr. 15. Turn on FIB GUN16. SEM>>DETECTORS>>SIGNAL A = SE217. View image in SEM mode (At this point keep it 10 mm or far18. Find a reference feature on the SEM image that will be easy to re-find if moved away from the current field of view, and center it using the X-Y joystick (or by pressing Ctrl+Tab, and clicking on the feature with the ensuing small cross cursor)19. Eccentricize the stage by changing the tilt angles and focusing on a region and using M buttons..start with 10o and try out 20..and finally tilt the stage to 54ocheck at other angles if not centralized..repeat the above procedure. (now u cannot use Y-joystick..it will disturb)20. Check the track Z boxOnce sample is at 54o it must be raised in order to achieve coincidence between SEM and FIB. Before the coincident point alignment make FIB beam shift to 0 and of SEM21. Go to WD=5.2mm using CAM lens, set focus22. FIB>>Mill>>use probe current =80pA23. Toggle between SEM, FIB and coincide them24. To correct the focus of milling current use 80 pA reference current

Alignment procedure for FIB currents1. At WD=5mm SEM region far away from ROI.2. FIB>>imaging current >> 80pA,,,,FIB beam shift = 03. Put cross-hair using milling at 300pA/700pA for 50 sec4. Do the best focus using focus knob(u have to shift something)5. Do the same for other milling currents like 150 pA to 6.5 nA (to check all currents) Milling and chunk preparation1. Deposit Pt to avoid Ga implantationoutgas Pt if there is *Go to options check the box: when milling switch to.. Chunk preparation:2. Dwell time = 0.4 s , Milling pixel resolution = 1024 x 768 for ..pixel FF = 50% for Pt..Gas ID =PtDeposition mode3. Choose ROI current = 80pA focus, choose geometry to mill.4. 1st box: L X B = 4*20 mTilt angle = 24o .Mill for time 1st box: 4*20 m6.5 nA/2*100s (for L=2m)5. Select Compu+Rotate>>put R=180o with track Z option checked6. 2nd box: 2*20 m 6.5nA/100s (for L=2 m)7. 3rd box: cut one of the end (RIGHT) of the chunk u prepared.Chunk Preparation 2nd method:1. Deposition of a 20 x 2 m-width Pt or W protective layer2. (A) milled a first 4 x 22 m trench (6.5 nA/3*100s) under the 3. Pt-strip in FIB view. Take into account the beam tail of the milling current, 4. Tilt to 24 Adjust the region of interest using X, Y and Z, 5. (B) milled a second 2 x 22 m trench (6.5 nA/2*100s) above the Pt-strip in FIB view, 6. cut the wedge on the right, 7. (C) Tilt to 0, glue the micromanipulator to the wedge, 8. (D) cut the wedge on the left and lift-out.microtip; i = 80pA; gas wait time = 5sec Micromanipulation1. Switch on >> Decrease mag2. Rotate CCW the retract button and focus at WD=5mm3. Stage WD = 5.3...use high scan speedtake micromanipulator to right end of chunk>>press a little >> glue it using Pt4. Cut the other side of chunk>> retract it>> u r done with chunk5. Better to cut the end of W tip (you prepared) to smoothen it>> Go to 15o to shape your tip before putting the chunk6. Use 40 pA to put chunk on tip7. Gas wait time = 7 sec

Annular Milling1. Set tilt angle around 8-15 degrees around 102. FIB>>Batch tab>>feature mill (u can draw what u want)3. Start at around 1.5nA or higher..(use ESB camera during milling)4. Each time decrease the radius and update the background in feature mill 5. At 30kV=milling; at 2kV= cleaning

Unloading the sample25. Lower Z stage to far away Turn EHT off26. FIB>>turn off27. Put rod on..click Exchange>>yes28. Press PUMP>>>OPEN29. Insert rod >>pull it>>put it30. Press open>>press close (wait to fully close) and press PUMP (to deactivate pump)31. Press purge and open the airlock (when pressure is atm. Pressr) 32. Press Purge to turn off N233. Remove sample from airlock, close airlock . click RESUME Exchange34. Click File>>log offFacts and other notes:1. Pixel FF for Pt=50%, for W=70%2. Angle between Ga imaging and SEM is 54o so we tilt stage to this angle to make surface perpendicular to FIB3. On using higher currents for milling sharpness of hole created decreases., also the amount depends on surface of the sample4. Freeze the scan to avoid Ga implantation 5. There are two types of implantations: EBID (electron beam induced deposition and IBID)6. Dwell time = 0.4 s , Milling pixel resolution = 1024 x 768 for Pt..Gas

Shortcuts:1. To make your ROI horizontal, u can use blue cross right icon to FIB2. Ctrl+Shift+Tab = centralize and zoom ur desired ROI.3. Storing locations: Stage >> store/reach >> add posit 1>> roam in the city>> double click to reach there again

Cases:1. If FIB camera fail to give images: 2. Turn off FIB >> Turn off EHT >> In airlock >> close chamber valve >> open the same3. In FIB click on Power off >> then switch on everything again.

Notes: For CIGS use low energy Ga beam around 5 keV for the final ion-milling stage. W tips apex diameter must be close to chunks around 2 m. When cutting chunks on tip use deposition mode.

Final cleaning:Change current to 2 kV 30In SEM window switch to SEM+FIB