fogale nanotech

Download Fogale Nanotech

Post on 28-Dec-2016

235 views

Category:

Documents

2 download

Embed Size (px)

TRANSCRIPT

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    Goal

    FOGALE nanotech provides standard and customized

    systems well suited to new metrology requirements for

    MEMS and semiconductor applications

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    4 patents /year

    Installed base for optics, MEMS and semiconductor > 400 units

    Web site: www.fogale-semicon.com

    Turnover: 8M

    Staff: 47 (Headquarter)

    World-class specialist for conception and manufacturing of

    non-contact dimensional metrology systems

    Capacitive, eddy currents and optical technologies

    Engineering and studies

    Conception and manufacturing of standard products

    Founded 1983, spin-off of a French national research laboratory: CEA & ONERA

    http://www.fogale-semicon.com/http://www.fogale-semicon.com/http://www.fogale-semicon.com/

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    Compagny organization

    FOGALE Headquarter: 47 employees: 80% are scientists & engineers

    Optical

    &

    semiconductor

    Touchless HMI

    System for

    Bioprocess

    key technologies: Capacitive, Interferometry, optics and Inductive

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    FOGALE Nanotech

    Hardware development

    Software development

    Integration

    Tool development (Beta)

    Automation

    New applications/market

    analysis & potential

    solutions review

    R&D

    Applications

    Technology Beta tools &

    upgrades

    Applications/technologies

    Common lab in Orsay:

    IEF/FOGALE

    Research

    FOGALE Headquarter

    NIMES Application Lab

    Aix en Provence

    Manufacturing

    Toulouse

    ORGANIZATION

    Subsidiaries:

    FOGALE Inc.

    Boston USA

    FOGALE Asia

    Tainan Taiwan

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    FOGALE

    DISTRIBUTORS & FIELD SERVICE

    WORLDWIDE Network

    FOGALE ASIA

    Taipei

    Tainan: Field Service

    FOGALE nanotech France Headquarter

    Ville Active Acti +

    125, Rue de lHostellerie

    30900 NIMES

    FOGALE nanotech Inc.

    Main Office:

    1714, Lombard Street

    San Francisco, CA 94123

    Tel: 818 206 8525

    Fax: 818 518 1085

    Dean Turnbaugh NVT VTC

    Engineering: Boston Mass.

    South East Asia

    India

    APP System

    China

    First Technology China

    Korea

    Jung Wong Corporation Japan

    APPEX Corporation

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    Semicon market

    3D integration: Stacking of multiple chips on top of each

    other within a single semiconductor package

    MEMS: Micro Electro Mechanical System

    Substrate dimensional control

    TTV, bow, warp and surface topography

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    R&D Labs

    Technology center, pilot lines & MEMS medium size facilities

    Large size facilities

    PRODUCTS: FROM LAB TO FABS

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    DEEPROBE

    Qualified and certified by IMEC

    Technology Low coherence IR interferometry for step height measurement

    (Patented)

    Applications High A/R TSV depth measurement for 200 and 300 mm wafer

    (Via first & middle)

    Benefits Non destructive technology

    Fast and easy to use

    CCD camera for spot positioning and pattern recognition

    Adjustable metrology spot size

    TSV diameter > 2 m A:R up to 30

    Calibration and maintenance free

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    T-MAP

    Technology Optical Metrology: single or dual sensor configuration

    Multi sensor configuration

    IR and/or White Light

    Applications Substrate Thickness, TTV, bow and warpage

    Wafer on temporary carrier: inspection & metrology

    Multi layer substrates

    Thickness, TTV of mono and SOI wafers: Si,III-V, InP, Sapphire, Glass, Pyrex, Polymers, CdTe, etc

    Microscopy and pattern recognition for measurement on product wafers

    Surface profiling

    Benefits Microscopy and pattern recognition for measurement on product wafer.

    Multiple sensor configuration depending on applications.

    Refractive index calculation in DUAL configuration mode

    Signal quality factor calculation

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    T-MAP MEMSCAN

    Technology IR transmission microscopy for inspection and metrology spot positioning (Patented)

    Low Coherence IR interferometry

    Confocal Chromatic (optional)

    Applications Visual Inspection and defect detection by IR microscopy

    Profiling and high A:R trench/Via depth measurement.

    Membrane thickness mapping

    SU8 resist thickness

    Detection of membrane non planarity after wafer level packaging

    MEMS WLP applications

    IR bonded alignment control

    Benefits Inspection and metrology performed in one shot with one tool: unique on the market

    Tool configuration entirely designed for MEMS applications

    Edge contact

    vacuum chuck

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    T-MAP DUAL 3D

    Unique solutions for R&D and pilot lines

    3D IC TSV

    FEOL

    Transistor manufaturing

    TSV formation

    Through Silicon Vias

    BEOL

    Transistors interconnection

    Wafer Thinning Backside processing and

    Die stacking PROCESS FLOW:

    FOGALE Solutions:

    Std process New process

    TSV depth

    measurement

    Thickness & Bonding inspection

    copper nails dimensional control & die stacking process control

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    3D PROFILER

    3D Profilers and MEMS Solution The Optical 3D surface topography is performed by optical interferometry with vertical resolution down to 0.1

    nm. All kind of materials can be measured (from 1% to 100% reflectance)..

    Technology Full field White light interferometer: z-scan and phase shifting mode

    Stroboscopic full field phase and amplitude vibration measurement

    Phase shifting measurement for small step height and nanometer level roughness measurement

    Applications Bumps process control

    Surface topography

    MEMS in motion analysis: in-plane and out-of-plane

    Analysis under controlled atmosphere (vacuum, temperature or pressure)

    Membrane shape

    Benefits Sub-nanometer resolution

    Fast results

    System stability

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    In collaboration since 10 years

    Competences Micro and NanoSystems. Focused on innovative micro and nano electromechanical or

    electromagnetic devices Strong competences allow the study and realization of test

    microdevices, microsensors and MEMS/NEMS in different technologies.

    Means Metrology platform and micro & nano technologies center MINERVE: MEMS fab facility, and

    Metrology & instrumentation laboratory.

    Lab team FOGALE: 2 R&D Engineer

    IEF: 4 scientists, 2 Phd, 1 Technicien

    Goal Development of new and advanced technologies for killer applications.

    Common lab FOGALE/IEF

    The Institute of Fundamental Electronic

    White Light interferometry

    MEMS in motion analysis

    Environmental chamber for MEMS analysis

    Long working distance interferometric objectives

    Wafer Level Packaging

    Hermiticity

    Contacts: Alain Bosseboeuf

    Gilles Fresquet/ Philippe Coste

  • SEMICONDUCTOR & OPTICAL

    METROLOGY SOLUTION

    Company Products Applications Organisation Technologies R&D Road map 3D IC customers

    Market: MEMS

    Killer applications: wireless, smart phon