from circuit-level to component-level simulaon and back
TRANSCRIPT
From Circuit-Level to Component-Level
Simula4on and Back -
PDK Driven Design Automa4on
THE 3RD INTERNATIONAL WORKSHOP ON OPTICAL/PHOTONIC INTERCONNECTS FOR COMPUTING SYSTEMS (OPTICS WORKSHOP)
MARCH 31S T , 2017
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UHD&3DTVs,smartphones,IoThomesensorsandVRgaming.
Industrialaugmentedreality,machinevision,laserprocessingandautomatedop?calinspec?on.
Op?calcommunica?ons,structural&environmentalsensors,autonomousvehiclenaviga?on,LEDligh?ngandsolarenergy.
Medicalimaginganddiagnos?cs,lasersurgery,labonachip,andenhancedsurgery.
Op?caltransceivers,ac?veop?calcables,op?calstorage,next-genprocessorsandquantumcompu?ng.
A Photonic Future
Example: mul4channel op4cal transceiver
*TomPalkert,“TechnicalFeasibilityUsingSiliconPhotonics”,Luxtera,NextGeneraIon100Gb/sOpIcalEthernetStudyGroup,PlenaryMeeIngMaterial,Nov8th-10th,2011,Atlanta,GA,USA
*DARPA-EPICprogram
100111010
100111010
Laser
modulator
detector
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DemuxMux
Integrated photonics electro-opIcmodulator
photodetectorlaser
graIngcoupler
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System modeling
Fiber:• Loss• Dispersion• NonlineariIes
• Gain• NoiseOpIcalsub-circuit:
• Wavelength• Linewidth• ReflecIons• Carrierdynamics• Mode• Loss/Coupling
Analysis:• BER• Loss• Dispersion• Phasenoise• Chirp
Receiver
Electricalsub-circuit:• Pre-emphasis• Feedbackloops• D/A
DSP• EqualizaIon(FFE/DEF• DispersioncompensaIon• LOFrequencyOffset• PhaseTracking• PolarizaIoncrosstalk• SynchronizaIon• Filtering
OpIcalsub-circuit:• Wavelength• Linewidth• ReflecIons• Carrierdynamics• Mode• Loss/Coupling
Electricalsub-circuit:• TIA• AmplificaIon• A/D
Transmi^er
• PolarizaIondynamics• Inter-symbolinterference• DutycycledistorIon)• InteracIonofNoiseandSignal
Circuit / System simula4on challenges § PhotoniccircuitsimulaIonneedstosupport:§ FrequencydomainsimulaIon,e.g.transmissionspectrum,inserIonloss,…§ TimedomainsimulaIon,e.g.BER,powerbudget,…
§ Electronic/photonicco-simulaIon§ …andalsothermal
§ OpIcalsignalvselectricalsignal§ Electricalsignal:Voltage/Current§ OpIcalsignal:propagatesbidirecIonally(reflecIons!),ismulI-mode,inmulIplefrequencybands,andaccumulatesaphase.
§ Lackofphotoniccompactmodels(behaviouralmodels)§ ValidaIonofcalibratedmodelstofabricaIonprocess
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Integrated Photonics Designers Challenges:§ SinglephotonicsPhDsinchargeoftheenIreframework
§ UsuallylayoutdrivenratherthanschemaIcdriven
§ Limitedcircuit/systemsimulaIoncapabiliIes
§ InhousecodetoIedifferenttoolstogether
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Fabricate
ComponentModels/PDKCircuitLayoutMask
SpecializedVendorsCustomPackagingMPW&Lowvolume
DesignTechnologyFocusManytoolsLimitedintegraIonPhDlevelexperIse
Today
Component-level simula4on
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ThermalOpIcal Electrical
Example: CMOS Image Sensors
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Supposetheobjecttoimageisgreen§ Lightarrivingonthedetectorisgreen
Redfilter
Active region
Active region
Active region
Active region
Greenfilter Greenfilter Bluefilter
Electronsarecreatedasthelight(photons)areabsorbed.Thenumberofcollectedelectronsineachpixelgivesthepixelbrightnessandcolorforthefinalimage§ FurtherelectricalsimulaIonwithDEVICE
Challenges of component level simula4ons ThedesignandanalysisoffundamentalpassiveandacIveoptoelectronicbuildingblocksrequiresvarioussolvers:§ OpIcalsolverstosimulatetheinteracIonofEMwavewithmaterial§ PropagaIonproperIes,generaIonrates,absorpIon,…
§ Electricalsolverstomodelchargetransport§ DC,large/smallsignalanalysis,transient,…
§ Thermalsolverstomodelheattransfer§ Steadystateandtransient,self-heaIng,…
§ Stressandstrain§ ProcesssimulaIon§ Dopingprofiles,lithographycorrecIon,etchprofile,sidewallangle,roughness
Extractaccurate,andcalibratedcompactmodelsfromsimulaIonsandmeasureddataforcircuitsimulaIon.
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Integrated Photonics Designers
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Fabricate
ComponentModels/PDKCircuitLayoutMask
Design ComponentModels/PDK
Circuit
LayoutMask
Fabless,highvolumeCustom,fullwaferStandardPackaging
SpecializedVendorsCustomPackagingMPW&Lowvolume
Fabricate
DesignTechnologyFocusManytoolsLimitedintegraIonPhDlevelexperIse
ApplicaIonFocusEDAstyletoolsTightintegraIonDesignteams
Today Future
Design framework PICdesignismuchmorethanjustsimulaIon.Fromandefficient,scalableEDAdesignframeworkstoanEPDAframework:§ Designcapture(layout-drivenvsschemaIcdriven)§ Pre-layoutsimulaIon(onlyforSDL)§ Curvilinearshapes!
§ Useofpre-characterizedbuildingblocks(PDKs)§ IncludingcompactmodelsforcircuitsimulaIon
§ HierarchicalDRC&LVS§ ExtracIonandback-annotaIonforre-simulaIon§ StaIsIcalAnalysis/Yield§ Designfortest,designformanufacturing,regressiontesIng,…
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EDA-style flow with a process design kit (PDK)
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PDKs Design Rules,
Compact models Component parameters Process data
LayoutandMaskGeneraIonCadence,Mentor,PhoeniX,…
VerificaIonMentor,Cadence,….
PhotonicCircuitSimulaIon
SchemaIcCaptureCadence,Mentor,…
FabricaIon
INTERCONNECT
PhotonicComponentDesignOptoelectronicsolvers,Experimentaldata
ComponentDesign
FDTDSoluIons
MODESoluIons
DEVICE
NetlistExchange
ElectricalCircuitSimulaIon
NetlistExchange
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The photonic PDK
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Photonic PDK Design Rules (for manufacturability,
optical performance)
Mask layer and material information
Die (and package) templates
Library of validated components
Measured data
Compact models (CML)
System/CircuitDesign&FabricaIon
Component&ModelLibraryDesign
DefineCompactModel
MeasuredResults
ComponentSimulaIonOptoelectronicsolvers Circuit
Design,Layout,VerificaIon
FabricaIonandTest
ApplicaIonFocusTechnologyFocus
Virtuoso driven design capture
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OpIcalSubcircuit
ElectricalSchemaIc
SchemaIcdrivenlayout§ Designcapture–singlegoldenschemaIc§ DedicatedopIcalcircuitsimulator(INTERCONNECT)andSpectreallowforco-simulaIon
§ ElectricalandopIcalcomponentsfromgenericPDK(availabilityofcompactmodels
§ SupportsopIcalsignaltype(inclusiveerrorchecking)
Electro-opIcoscillator
PhotodiodeModulator
Waveguidedelayline
Laser
OpIcalsignaltype
Photonic layout Curvilinearlayout§ non-Manha^anandrequiresallangledesignfeatures(locaIonofports,rotaIon,smoothcurves,connecIvity
§ TheprovidedlibraryofvalidatedcomponentsisnotsufficientforacompletePICdesign–waveguiderouIng
TradiIonallyICdesigntoolsaremissinggenericphotonicelementsandcomponents.§ OpImizeddiscreIzaIon
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Sta4s4cal analysis – layout aware
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Z.Lu,J.Jhoja,J.Klein,X.Wang,A.Liu,J.Flueckiger,J.Pond,andL.Chrostowski,“PerformancepredicIonforsiliconphotonicsintegratedcircuitswithlayout-dependentcorrelatedmanufacturingvariability”,submi^ed,22pp.(2017).
Design for Manufacturability (DFM)
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Z.Lu,J.Jhoja,J.Klein,X.Wang,A.Liu,J.Flueckiger,J.Pond,andL.Chrostowski,“PerformancepredicIonforsiliconphotonicsintegratedcircuitswithlayout-dependentcorrelatedmanufacturingvariability”,submi^ed,22pp.(2017).
Conclusion ThereisclearadvantagetocombinetheeffortsofEDAandPDAtodeliveracompleteandefficientsoluIonforIntegratedPhotonics§ 3decadesofCMOSEDAtools+overadecadeofopIcalcomponentdesignsouware
development
ButPhotonicsisnotthesameaselectronics§ Newsignaltypes
§ AllowssegregaIon(andautomaIon)ofelectricalvs.opIcal(V,IvsTEandTM,…)
§ Dealingwithcurvilinearshapes§ IncludingdiscreIzaIonchallenges
§ Awaveguideisusuallyacomplex3Dstructurevs.awireinelectronics§ Typicallyawaveguidewillbemodeledasadevice,notapieceof“interconnect”
§ OpIcalconnecIvityisNOTthesameaselectricalconnecIvity…§ 2electricalsignalscrossingmakeashort...2opIcalcrossingmake...Acrossing...
FoundriesareanintegralpartofthesoluIonandneedtoupgradetheir“PhotonicsPDK”toasimilarlevelofcompletenessandfeaturestowhatisthestandardinelectronics
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