fujitsu - seemless integration of ip cores into system lsi - ip & cores

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Seemless Integration

of IP Cores intoSystem LSI

of 4

Fujitsu’s SoC design methodology and solution platform provides seamless integration of IP cores into

system LSI. The IP library consists of diverse sets of re-usable system building blocks

Fujitsu Semiconductor Europe

FactsheetIP & Cores

As a leading global ASIC provider and total-

solutions provider, Fujitsu delivers innovative

solutions that enable customers to

differentiate their products and maximise their

time-to-market advantage. Together with

skilled engineers, this has created the

established environment required to developand produce advanced ASIC designs.

Fujitsu Semiconductor Europe operates its ASIC

Design Centres from Langen (Frankfurt) and

Munich, Germany and is supported by design

centres for ASIC and foundry services

throughout the world. Support can therefore

be delivered locally, which is increasingly

important in today’s complex ASIC designs.

By using third-party vendor tools and Fujitsu's

own CAD tools, we ensure an innovative,

mature design flow, providing customers at the

same time with a global network for system

development and support.

Fujitsu’s advanced technologies and products

include high-end deep sub-micron process

(40nm, 65nm, 90nm, 0.13µm, 0.18µm) and

standard process technology (0.25µm,

0.35µm). Embedded memory with access time

in the pico-second range helps to deliver the

system performance required for today’s SoC

designs.

The Fujitsu IP portfolio, in combination withour experienced application support, enables

customers to achieve right-first-time design

and shorter design cycle times.

Sample IP cores include:I Computational cores: ARM®, DSP,

multi-channel VoIPI Memory controller: SRAM controller,

DRAM controller, DDR controllerI Connectivity IPs: USB, PCI, I2C,

Ethernet, IEEE 1394

Packaging support options range from small

FBGA/QFP to high pin-count, enhanced-

performance FCBGA solutions.

Mobile PC

Industrial Automotive

28-nm

1000

100

10

G a t e L e n g t h ( n m )

Year

1999 2001 2003 2005 2007 2009 2011 2013

180-nm

130-nm

90-nm

65-nm40-nm

FSL Fab(Fujitsu Semiconductor Ltd.)

Outsourced Fab

(CS80A)

(CS90A)

(CS100A)

(CS200A)

(CS350LP)

(CS450LP) 22-nm(CS500LP)

CMOS technology roadmap



Factsheet Fujitsu IP & Cores

of 4

90nmI Standard Cells

- Multiple Vth

I Memory

- SRAM 1RW, 2RW

- RF 1R1W, 2R2W

- Mask ROM

- OTP

I Standard I/Os

- 2.5V/3.3V / 5V tolerant

- 3.3V PCI- Oscillator

- Analogue

I High Speed I/O

- CDR Tx/Rx

- FPD Link Tx+Rx

- HDMI Tx 2.25Gbps

- MIPI D-PHY Rx 650Mbps

- MIPI D-PHY Tx 650Mbps

- PCI Express 2.5Gbps PHY

- SATA 1.5G / 3.0G PHY

- SubLVDS Rx / Tx 650Mbps

- LVDS

- MDDR, DDR2, DLL

- SSTL2, SSTL18

- USB2.0 PHY

I APLLs

- Input frequency up to: 200MHz

- Output frequency: 50MHz...1.6GHz

- SSCG

- Low power, low jitter

I ADC / DAC

- Resolution: 6 - 14-bit

- Sample rate up to: 1Gsps

I Analogue

- POR, LDO

- Audio Codec

I Cores

- ARM7TDMI-S

- ARM926EJ-S, ARM946E-S

- ARM1176JZF-S- CortexTM-M0, M4, A5, A15

- Cortex-M3, Cortex-R4F

- Cortex-A9


- Multiple Vth

I Memory

- SRAM 1RW, 2RW

- RF 1R1W, 2R2W

- Mask ROM

- OTP

I Standard I/Os

- 3.3V LVCMOS

- Oscillator

- Analogue

I High Speed I/O

- CDR Tx/Rx

- FPD Link Tx+Rx

- HDMI Tx 1.20Gbps

- HDMI Tx 2.25Gbps

- MIPI D-PHY Rx 1Gbps

- MIPI D-PHY Tx 1Gbps

- PCI Express 2.5Gbps PHY


- SubLVDS Rx+Tx 650Mbps

- SubLVDS Rx+Tx 1Gbps

- MDDR, DDR2, DDR3, DLL

- SSTL2, SSTL18, SSTL15

- USB2.0, USB3.0 PHY

I APLLs



- SSCG


I ADC / DAC

- Resolution: 8 - 14-bit

- Sample rate up to: 200Msps

I Cores

- ARM7TDMI-S


- ARM1176JZF-S- Cortex-M0, M4, A5, A15


- Cortex-A9


- Multiple Vth

I Memory

- SRAM 1RW, 2RW

- RF 1R1W, 2R2W

- Mask ROM

- OTP

I Standard I/Os

- 3.3V LVCMOS

- Oscillator

- Analogue

I High Speed I/O

- HDMI Tx 1.5Gbps

- MIPI D-PHY Rx 1Gbps

- MIPI D-PHY Tx 1Gbps


- SubLVDS Rx+Tx 650Mbps

- MDDR, DDR2, DDR3, DLL

- SSTL2, SSTL18, SSTL15

- USB2.0, USB3.0 PHY

I APLLs



- SSCG


I ADC / DAC

- Resolution: 12-bit

- Sample rate up to: 220Msps

I Cores

- ARM7TDMI-S


- ARM1176JZF-S- Cortex-M0, M4, A5, A15


- Cortex-A9

Selection from Fujitsu IP Portfolio



of 4

ARM1176JZF-S

ARM926EJ-S

ARM946E-S

ARM7TDMI-S

ARM Core Line-up

Application

Real-Time

Microcontroller

2010 2011 2012 2013 2014

Cortex-R4F

Cortex-M3

Cortex-A9 Cortex-A15

Cortex-A5

Cortex-R7

Cortex-R5

Cortex-M4

Cortex-MO

ARM Processor Roadmap for ASIC/Foundry Service

ARM1176

ARM926

ARM946

ARM7 M3

A9

R4F

A5

M0

A15

R5

M4

Available

Designing

Planning

2010 2011 2012 2013 2014

Fujitsu ARM SoC Prototyping (FASP) Reference Design Roadmap



of 4

Factsheet Fujitsu IP & Cores

FSEU-C32-02AUG11

[email protected]://emea.fujitsu.com/asic

All company and product trade marks and registered trademarks used throughout this literature are acknowledged asthe property of their respective owners.

FASP-M3 reference design block diagram

Trace

JTAG/

SWD

AHB BusMatrix

Cortex-M3 Core HDMAC

CPU Block

SWJ-DP

ExternalMemory

Clock Reset

TPIU ETM WIC

CRG

MEMC

Ahb2ApbSRAM

(I code)

SRAM

(D code)

SRAM

(work)

EXIU GPIO TIMER UART WDT MRBC

Instruction Data System

APB

Fujitsu ARM SoC Prototyping (FASP)I Non application-specific base platform

- Only basic peripherals are implementedI Easy customisation, easy chip development

- By changing the configuration of

Cortex-M3- By adding or removing peripherals,

replace BusMatrix

- By changing interrupt signal assignment

I Deliverables

- Reference design of SoC (RTL)

- Simulation environment (Testbench,

simulation script)

- Boot code (initialisation of Cortex-M3 andperipherals)

- Documents (Specifications, User Guide,

Implementation Guide)

FASP-M3 reference design concept