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Future Electronic Devices Technology in Cosmic Space
and Lead-free Solder Joint Reliability
Future Electronic Devices Technology Future Electronic Devices Technology in Cosmic Space in Cosmic Space
and Leadand Lead--free Solder Joint Reliabilityfree Solder Joint Reliability
Yoshinori EjiriHitachi Chemical Co., Ltd.
The 22nd Microelectronics Work
Key Points(1) High Speed Solder Ball Shear Test(2) Relationship between Surface Finishing
and Solder Ball Joint Reliability
Aero Space
Mobile Phone
Digital CameraApplication of Semiconductor PackagesApplication of Semiconductor Packages
Car
Mobile PC
Digital Video Camera
PCB
Airplane
SCP
1
TSOP (Thin Small Outline Package)
CSP(Chip Scale Package)
2
Metal LeadMetal Lead(Fe/Ni Alloy)(Fe/Ni Alloy)
Assembly Area Below 1/2 Assembly Area Below 1/2 Assembly Area Below 1/2
Solder BallSolder Ball
Increasing DensityDecreasing Size
Increasing DensityDecreasing Size
3
MoldingMaterial
Gold Wire Die BondingMaterial
SemiconductorChip
SolderBall
Printed Circuit Board
Package Substrate
Shock / Vibration
Stress Concentration
Shock / VibrationShock / Vibration
Stress ConcentrationStress Concentration
Structure of BGA AssemblyStructure of BGA Assembly
Solder Ball
Package SubstrateCopper Pad
Solder BallSolder Mask
4
ElectrolessNi-P/Pd/AuElectrolessElectrolessNiNi--P/Pd/AuP/Pd/Au
Solder Ball JointSolder Ball Joint
●●Organic Solder Preservative (OSP)Organic Solder Preservative (OSP)Immersion AgImmersion AgImmersion Immersion SnSnElectrolytic AuElectrolytic Au
●●Electrolytic Ni / Electrolytic AuElectrolytic Ni / Electrolytic Au●●Electroless Ni / Immersion Au / Electroless AuElectroless Ni / Immersion Au / Electroless Au
(ENIGEG)(ENIGEG)●●Electroless Ni / Electroless Pd / Immersion AuElectroless Ni / Electroless Pd / Immersion Au
/ Electroless Au (ENEPIGEG)/ Electroless Au (ENEPIGEG)
5
Surface Finishing for Copper PadSurface Finishing for Copper Pad
HighHigh--speed Solder Ball Shear Testspeed Solder Ball Shear Test
Solder BallSolder Ball
ShearTool
Shear SpeedShear Speed0.5, 20, 200, 1000 mm・s-1 High Speed
10mm/s or more(JEDEC JESD22-B117A)
High SpeedHigh Speed10mm/s or more10mm/s or more
(JEDEC JESD22(JEDEC JESD22--B117A)B117A)Low
Copper Pad
Ductile
High
Package Substrate
Brittle
Solder Mask
6
High-speed Solder Ball Shear TestHigh-speed Solder Ball Shear Test
0 200 400 600 80005
101520253035
Ductile
InterfacialStrength
SolderStrength
Displacement (μm)
Shea
r For
ce (N
)
7Ductile – Low SpeedDuctile – Low SpeedShear Strength
Solder<Interface
0 200 400 600 80005
101520253035
Displacement (μm)
Shea
r For
ce (N
)
8Brittle – High SpeedBrittle – High Speed
Brittle
Shear StrengthInterface <Solder
InterfacialStrength
SolderStrength
DAGE 4000HS Bond Tester (Dage Precision Industries, Ltd.)
DAGE 4000HS Bond Tester DAGE 4000HS Bond Tester ((DageDage Precision Industries, Ltd.)Precision Industries, Ltd.)
9
High-speed Solder Ball Shear TestHigh-speed Solder Ball Shear Test
Duc
tile
Frac
ture
Rat
e (D
FR) /
%
0.5
DuctileBrittle
Ni-P : 5 μmPd : 0.1 μmAu : 0.3 μm
20 2000
20
40
60
80
100
0.5 20 200Shear Speed/ mm・s-1
1000 1000
10
High-speed Solder Ball Shear TestHigh-speed Solder Ball Shear TestLow Speed
NiNi--P/AuP/Au NiNi--P/P/PdPd/Au/Au
Influence of Surface Finishing on Solder Joint Reliability
Relationship between Surface Finishing and Solder Ball Joint Reliability
Surface Finishing Solder Ball
OSP
E’less Ni-P/Pd/Au
E’lytic Ni/Au
OSP123
4
Reflow Cycles (Max Temp : 252℃) : 1, 3, 7Aging Time(Temp : 150℃) : 100, 300, 500, 1000 h
Evaluation Condition
Combination of Surface Finishing and Solder Ball
SAC305※
SnNiX (Sα)
※ : Sn3.0Ag0.5Cu,
SAC305※
SAC305※
11
Experimental ConditionExperimental Condition
1 3 70
20
40
60
80
100
OSP-SACOSP-Sα
E’lytic Ni/AuE’less Ni-P/Pd/Au
DFR
/ %
12
Reflow CyclesReflow Cycles
Shear Speed : 200 mm/sShear Speed : 200 mm/s
Reflow Cycles(Max Temp : 252℃)
1 3 70
20
40
60
80
100
DFR
/ %
OSP-SACOSP-Sα
E’lytic Ni/AuE’less Ni-P/Pd/Au
13
Shear Speed : 1000 mm/sShear Speed : 1000 mm/s
Reflow Cycles(Max Temp : 252℃)
Reflow CyclesReflow Cycles
ExcellentPoorSJR Excellent Excellent5μm
OSPSAC Sα
E’lessNi-P/Pd/Au
E’lyticNi/Au
1
3
7
ReflowCycles
5μm10 μm
Cu
Solder
Ni-PCu
Solder Solder Solder
Ni
14
IMC Growth - Reflow CyclesIMC Growth - Reflow Cycles
Crack of IMC
Poor Reliability
Crack of IMCCrack of IMC
Poor ReliabilityPoor Reliability
1 cycle 3 cycles
7 cycles
Cu
Solder
Crack
15
Reflow Cycles - OSP-SACReflow Cycles - OSP-SAC
Cu6Sn5
Ni : Thin IMC Layer
Better Reliability
Ni : Thin IMC LayerNi : Thin IMC Layer
Better ReliabilityBetter Reliability
Cu
Solder
1 cycle 3 cycles
7 cycles
16
(Cu,Ni)6Sn5
Reflow Cycles - OSP-SαReflow Cycles - OSP-Sα
Thick IMC Poor ReliabilityThick IMC Poor Reliability
Ni
Solder
(Cu,Ni)6Sn5
1 cycle 3 cycles
7 cycles
17
Reflow Cycles - Ni/AuReflow Cycles - Ni/Au
Ni-P
Solder
(Cu,Ni,Pd)6Sn5
1 cycle 3 cycles
7 cycles
18
Thin IMC Better ReliabilityThin IMC Better Reliability
Reflow Cycles - Ni-P/Pd/AuReflow Cycles - Ni-P/Pd/Au
OSP-SAC
Ni-P/Pd/AuNi/Au
OSP-Sα
19
(Cu,Ni,Pd)6Sn5
Cu6Sn5 (Cu,Ni)6Sn5
Ni
Brittle Fracture Surface(After 7 Reflow cycles)
Brittle Fracture Surface(After 7 Reflow cycles)
Crack
Cu
Cu6Sn5
OSP-SAC
Ni-P/Pd/AuNi/Au
OSP-Sα
Cu
Solder
Ni Ni-P
(Cu,Ni,Pd)6Sn5
(Cu,Ni)6Sn5
(Cu,Ni)6Sn5 Solder
Solder
20
Fracture Model (Reflow Cycles)Fracture Model (Reflow Cycles)
Crack Propagation
Aging Time / h
E’less Ni-P/Pd/AuE’lytic Ni/Au
OSP- SαOSP- SAC
0 100 300 500 1000
020
4060
80
100
DFR
/ %
21
Aging TimeAging Time
(Temp : 150℃)
Shear Speed : 200 mm/sShear Speed : 200 mm/s
0 100 300 500 1000
020
4060
80
100
DFR
/ %
E’less Ni-P/Pd/AuE’lytic Ni/Au
OSP- SαOSP- SAC
22
Shear Speed : 1000 mm/sShear Speed : 1000 mm/s
Aging Time / h(Temp : 150℃)
Aging TimeAging Time
Excellent Poor
100 h
500 h
1000 h
Ni-PCuCu
Solder Solder Solder Solder
5μm10 μm
OSPSAC Sα
SJR
AgingTime
E’lessNi-P/Pd/Au
E’lyticNi/Au
Ni
Excellent Excellent
23
IMC Growth - Aging TimeIMC Growth - Aging Time
100 h
500 h
1000 h
FE-SEM Sn Cu
10μm
AgingTime
EDX
24
Cu6Sn5
Cu3Sn
Aging Time - OSP-SACAging Time - OSP-SAC
10μm
FE-SEM
100 h
500 h
1000 h
AgingTime Sn Cu
EDX
25
(Cu,Ni)6Sn5
(Cu,Ni)3Sn
Aging Time - OSP- SαAging Time - OSP- Sα
Cu Cu
2 μm
FIB/SIM Analytical Results
26
SAC vs. SαSAC vs. Sα
Cu6Sn5(Cu,Ni)6Sn5
(Cu,Ni)3Sn
Cu3Sn
OSP - SAC OSP - Sα
0 h 100 h
500 h 1000 h
Ni
Solder
(Cu,Ni)6Sn5
27
Thick IMC
Poor Reliability
Thick IMCThick IMC
Poor ReliabilityPoor Reliability
Aging Time - Ni/AuAging Time - Ni/Au
Ni-P
0 h 100 h
500 h 1000 h
Solder
(Cu,Ni,Pd)6Sn5
SJR was excellent
28
Thin IMC
Better Reliability
Thin IMCThin IMC
Better ReliabilityBetter Reliability
Aging Time - Ni-P/Pd/AuAging Time - Ni-P/Pd/Au
Ni-P/Pd/AuNi/Au
OSP-SAC OSP-Sα
29
Cu6Sn5
Brittle Fracture Surface(After 1000 h Thermal Aging at 150℃)
Brittle Fracture Surface(After 1000 h Thermal Aging at 150℃)
(Cu,Ni)6Sn5
(Cu,Ni)3Sn
(Cu,Ni,Pd)6Sn5
Ni
Ni-P
Cu3Sn
CuOSP-SAC
Ni/Au
OSP-SαCu
Ni
Cu6Sn5
Cu3Sn
(Cu,Ni)6Sn5
(Cu,Ni)6Sn5
Ni-P/Pd/AuNi-P
(Cu,Ni,Pd)6Sn5
Solder
Crack Propagation
Solder
(Cu,Ni)3Sn
30
Fracture Model (Thermal Aging)Fracture Model (Thermal Aging)
(1)On the OSP surface finishing, the IMC growth and the solder joint reliability depended on the kind of Pb free solder.
(2) The solder joint reliability of the electroless Ni-P/Pd/Au plating was equivalent to that of the electrolytic Ni/Au on the high speed shear test.
31
SummarySummary
Ni-P/Au
Ni-PAu
Dissolution
Ni-P/Pd/Au
Ni-P Ni-P
AuPd
Ni-P
Corrosion at Ni-P Boundary3 μm3 μm
Dissolution
No Corrosion
Appendix
Electroless Ni-P Surfaceafter Au or Pd DissolutionElectroless Ni-P Surface
after Au or Pd Dissolution