g2100 maintenance manual basic version v1
TRANSCRIPT
G2100 Maintenance Manual Basic Version
V1.0 (Maintenance of the basic version)
Prepared by Maintenance Documentation Support Team Date 2010-07-21
Reviewed by Date
Approved by Date
Huawei Technologies Co., Ltd.
All rights reserved
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Revision Record
Date Revision Version
Revision Reason
Section Number
Change Description Author
2010-07-21 V1.0 Maintenance Documentation Support Team
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Contents
1 PRODUCT INTRODUCTION................................................................................................................................. 5
1.1 PRODUCT VIEW................................................................................................................................................... 5
1.2 PRODUCT FEATURES........................................................................................................................................... 6
2 MAINTENANCE INSTRUCTIONS........................................................................................................................ 7
2.1 DOCUMENT APPLICATION .................................................................................................................................. 7
2.2 MAINTENANCE PRECAUTIONS............................................................................................................................ 7
2.3 OBTAINING MAINTENANCE INFORMATION........................................................................................................ 7
3 EXPLODED VIEW OF THE WHOLE UNIT ........................................................................................................ 8
4 LOCATION OF COMPONENTS ON THE MAIN BOARD............................................................................... 10
5 SOFTWARE UPGRADE ........................................................................................................................................ 11
5.1 PREPARATIONS BEFORE UPGRADE ................................................................................................................... 11
5.2 HARDWARE CONNECTION................................................................................................................................. 11
5.3 UPGRADE PROCEDURE ..................................................................................................................................... 11
5.4 EXCEPTION HANDLING..................................................................................................................................... 23
6 MAINTENANCE TOOLS ...................................................................................................................................... 24
7 DISASSEMBLY PROCEDURE ............................................................................................................................. 25
8 ASSEMBLY PROCEDURE.................................................................................................................................... 28
9 TROUBLESHOOTING FOR COMMON FAULTS............................................................................................. 31
9.1 PRINCIPLE SUMMARY ....................................................................................................................................... 31
9.2 PHONE CAN NOT BE POWERED ON .................................................................................................................... 32
9.2.1 Phone can not be powered on-High Current ........................................................................................ 32
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9.2.2 Phone can not be powered on-Small Current ...................................................................................... 33
9.3 CHARGE FAILURE ............................................................................................................................................. 35
9.4 KEYPAD FAILURE.............................................................................................................................................. 36
9.5 DISPLAY FAILURE.............................................................................................................................................. 37
9.6 SPEAKER AND RECEIVER FAILURE................................................................................................................... 38
9.7 VOICE TRANSMITTING FAILURE ....................................................................................................................... 40
9.8 VIBRATION FAILURE ......................................................................................................................................... 40
9.9 THE SIM CARD CAN’T BE IDENTIFIED ............................................................................................................ 41
9.10 FM FAILURE...................................................................................................................................................... 41
9.11 SIGNAL FAILURE ............................................................................................................................................... 43
9.12 RF TRANSMITTING FAILURE ............................................................................................................................ 45
10 FUNCTIONAL TEST.............................................................................................................................................. 46
10.1 INTRODUCTION TO THE KEY AND ICONS .......................................................................................................... 46
10.2 MMI TEST......................................................................................................................................................... 46
10.3 VOICE CALL TEST............................................................................................................................................. 47
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1 Product Introduction
1.1 Product View
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1.2 Product Features
Item Specifications
Technical standard GSM
Operating frequency
GSM 900/1800/1900M
GSM 900M: 880~915 MHz UL / 925~960 MHz DL
GSM 1900M: 1850~1910MHz UL / 1930~1990MHz DL
GSM 1800M: 1710~1785MHz UL / 1805~1880MHz DL
External interfaces USB interface: Micro USB/Headset interface SIM card interface: standard 6 PIN SIM card interface
Battery
Type: Li
Capacity : 3.7V,700mAh
Typical talk time: 240 minutes Typical standby time: 200hours
LCD Type: 1.47"TFT
Typical: 128×160 65K
Function Feature Support : MP3/FM
Temperature Operating: -10℃~+55℃ Storage: -40℃~+70℃
Humidity 5%~ 95%
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2 Maintenance Instructions
2.1 Document Application This document provides instructions for the maintenance of Huawei products for the maintenance personnel in
senior authorized service sites. This manual is Huawei proprietary and is only permitted to be used by authorized
service sites or companies. Mistakes may be found in the document. If you have found any mistake or have any
suggestion, please contact our customer service personnel.
2.2 Maintenance Precautions Maintenance and adjustment can only be conducted by qualified technical personnel.
Always wear an antistatic wrist strap during the operation and conduct the maintenance in an antistatic room.
Ensure that all the components, screws, and insulators are properly installed after maintenance or adjustment.
Ensure that all the cables are properly connected.
Ensure that the welder job shall comply with the environmental requirements and is lead-free.
Electrostatic discharges are the major cause for the damage of sensitive electronic components. Each
service site should attach great importance to the electrostatic discharges and strictly observe the antistatic
measures described in this manual.
2.3 Obtaining Maintenance Information To obtain related product knowledge and maintenance information, please visit Huawei website at
http://www.huaweidevice.com/worldwide/technicaIndex.do
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3 Exploded View of the Whole Unit BOM list match the exploded view below:
No. Name Description Quantity
1 Lens Protection Film 1
2 Lens 1
3 Speaker Net 1
12
3
4
56
7
8
9
10 11
12
13 14
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No. Name Description Quantity
4 Top Cover Sponge 1
5 Top Cover 1
6 LCD Sponge 1
7 Keypad 1
8 LCD 1
9 PCBA 1
10 Speaker 1
11 Motor 1
12 Bottom Cover Sponge 1
13 Bottom Cover 1
14 Battery Cover 1
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4 Location of Components on the Main Board
Z300 SAW Filter It damaged result: No signal; Weak signal; Can’t register network
U501 FLASH It damaged result: No signal; No powered on; Other failures etc
J700 Headset Connector It damaged result: No powered on; No charged
J300 RF Connector It damaged result: No signal; Weak signal; Can’t register network
音 不搜网
U401 CPU It damaged result: No signal; No powered on; Other failures etc
X400 Crystal-32.768KHz It damaged result: No signal; No powered on
U302 RF Multi, Functional Component It damaged result: No signal; Weak signal; Can’t register network
X300 TCXO-26MHz It damaged result: No powered on; No signal
J500 IO Connector It damaged result: No powered on; No charged
Q500 Transistor-PNP It damaged result: No powered on; No charged
J600 SIM Socket It damaged result: Can’t identify SIM card
J501 Power Receptacle It damaged result: No powered on No charged
Q501 Dual Transistor-NPN It damaged result: No powered on; No charged
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5 Software Upgrade
5.1 Preparations before Upgrade
Item Contents Remark
PC Windows 2000 /Windows XP system
Battery Upgrade environment
G2100 USB Data Cable BOM: 02450712
Upgrade File HUAWEI G2100
V100R001ENGC01B117SEC.fls
Mobile Studio-R Upgrade Software Tool
GH0G2200ML01ULC2MLVer1004
The version is only for your reference.
Download or use the latest version.
USB drive PL2303_Prolific_DriverInstaller_10311.exe Install automatically
Upgrade mode Upgrade by USB date cable Normal
5.2 Hardware connection
5.3 Upgrade Procedure 5.3.1 Install USB Driver
The G2100 will automatically install USB driver as it is connected to PC. As following figure:
PC
G2100 USB Cable
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NOTE: If it can’t install automatically, please install USB driver by manually.
303_Prolific_DriverInstaller_10311.exe.
5.3.2 Install Upgrade Software Tools
(1) Double click to install Mobile Studio-R
MobileStudio-R.lnk
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(2) Select “I accept…”, show as below figure:
(3) Input the information, click “Next ”,show as below figure:
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(4) Click “Install”, show as below figure:
(5) Start installation, show as below figure:
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5.3.3 Install Upgrade Project File
(1) Double click icon
GHULC2MLVer1004.exe.lnk
(2) Click “Install”
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(3) Installation finish
5.3.4 Upgrade
(1) Double click Mobile Studio-R, select project.
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(2) Select product type “ULC3”
(3) Select “Others OWM”, click “Init”.
(4) Click “Download Type and Files Settings”, select download type “Batch Upgrade”.
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(5) Select upgrade files of safety project version, click “Apply”
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(6) Connect the phone to the PC by USB cable, click “Start Download”. Insert the battery
according to prompt
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(7) Start to download file
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(8) Upgrade finish
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Remark: The upgrade software supports multi-upgrade.
5.4 Exception Handling
Failure Type Solution
Start download failure Ensure Inserting battery time less than 2 minutes, and suggest inserting the
SIM card to try.
The phone cannot be
connected
Ensure that the phone is power on and the power of battery enough.
Ensure that the USB cable is normal and connect is stably.
Open the upgrade file failure Ensure that select the upgrade file is correctly.
Download is intermitted
abnormity
Ensure that the power of battery is enough.
An error is prompted during
the download Ensure that whether the pull out the USB cable when downloading.
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6 Maintenance Tools
Tool Figure Description
Name: constant-temperature gun Application: It is used to heat the components.
Name: Solder the iron Application: It is used for Solder the during maintenance.
Name: DC power Application: It is used to supply power.
Name: Solder the fixture Application: It is used to fix the main board.
Name: lead-free Solder the wire Application: It is used for Solder.
Name: digital multimeter Application: It is used for measuring during maintenance.
Name: Tool kit Application: It is used to assembly and disassembly the PHONE.
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7 Disassembly Procedure
4.Remove the battery.
2.Make sure the ESD antistatic wrist strap connect to the ground is normal.
3.Remove the battery cover by the arrow direction.
1.The G2100 disassemble procedure.
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8. Screw off two screws. 7. Remove the front cover.
10. Remove the LCD. 9. Turn up and remove the mainboard.
6. Disassemble the front cover from the back cover. 5.Screw off three screws.
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15. The disassembly procedure is completed.
12. Remove the motor. 11. Remove the speaker.
14. Remove the antenna. 13. Remove the function keys.
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8 Assembly Procedure
4.Install the motor.
3.Install the keypad.
2.Install the antenna. 1.Make sure the ESD antistatic wrist strap connect to the ground is normal.
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10. Assemble the front cover. 9. Install the front cover.
8. Install the two screws. 7. Install the mainboard to the back cover.
6. Plug the LCD. 5.Install the speaker.
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14. Assembly procedure is completed.
12. Install the battery.
13. Install the battery cover.
11. Install the six screws.
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9 Troubleshooting for Common Faults Before performing the following troubleshooting operations on the hardware, ensure that the software on the PHONE is in good condition and is restored to default settings.
9.1 Principle Summary
The G2100 phone develops basing on INFINEON ULC3, integrates Baseband、RF module、Power Management(PM) system. It mostly consists of baseband、RF and PM. The part of baseband is divided into RF signal disposal and intelligent interface, the part of RF achieves among phone and base station communications, the power management supports whole power supply for phone.
The baseband includes power management 、clock、MCU processor、FLASH、electroacoustic components、vibration、SIM card 、LCD、keypad、FM etc. The PM module controls power input and output. The RF module is divided into receiving channel and transmitting channel, it includes LO、receiver、transmitter、antenna components etc.
Principle Diagram
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9.2 Phone can not be powered on
9.2.1 Phone can not be powered on-High Current
Analysis:The current is above 1A as power supply by DC-power. Short circuit of the VBAT line
causes high current usually. (Reference Figure 1)
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9.2.2 Phone can not be powered on-Small Current
Analysis:The current is among 10mA-400mA scope as power supply by DC-power. The software or
FLASH damaged cause the failure usually. (Reference Figure 1)
J501 Pin3 (VBAT)
Q500
U302 U501 FLASH
U401 CPU
VDDTDC/VDDXO Test Point C303
VDD1V8/VRF1 Test Point L401
VBAT≈3.05V-5.5V VDDTRX=1.4V VRF1=1.8V VRF2=2.5V VDD1V8=1.8V VDDTDC=1.3V VDDXO=1.3V VRCORE=1.2V
VRCORE Test Point C409
VRF2 Test Point C302
Figure 1
J500Pin1 (VCHG)
U302-VBAT Test Point C324
VDDTRX Test Point C301
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9.3 Charge Failure
Analysis: The IO Connector damaged causes the failure usually. (Reference Figure 2)
Charge Fault
Measure J500 Pin1 whether voltage is
5V?
Insert charger
Replace J500
Measure R500 whether resistance is
0?Replace R500
Measure Q500 Pin1 and Pin4 whether
voltage is different?
Replace Q500 or Q501
Replace U401
No
Yes
No
Yes
No
Yes
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9.4 Keypad Failure
Analysis: The DOME of keypad damaged causes the failure usually.
J501 Pin3 (VBAT)
Q500 Pin4
U401 CPU
VBAT≈3.05V-5.5V VCHG≈5.0V
Figure 2
J500Pin1 (VCHG)
Q501
R500 R=0Ω
Q500Pin1
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9.5 Display Failure
Analysis: The LCD module damaged causes the failure usually.
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9.6 Speaker and Receiver Failure
Analysis: Above all, should restore all setting. (Reference Figure 3)
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C706C707
Figure 3
L705 R≈0Ω
L703 L709 L707 L708
L706 R≈0Ω
LB706 R≈0Ω
LB705 R≈0Ω
R607 R≈4.6KΩ
J600 SIM card socket
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9.7 Voice transmitting Failure
(Reference Figure 3)
9.8 Vibration Failure
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9.9 The SIM Card can’t Be Identified
(Reference Figure 3)
9.10 FM Failure
(Reference Figure 4)
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Figure 4
Q700 FM-LNA
J700Headset socket
J700Pin2
J700Pin1
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9.11 Signal Failure
Analysis:Above all, check RF parameter whether is correct, the wrong RF parameter can cause
the failure usually. (Reference Figure 5)
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U302Multi-function IC
U401 CPU
VDD1V8/VRF1 Test Point L401
VBAT≈3.05V-5.5V VRF1=1.8V VRF2=2.5V
VRF2 Test Point C302
Figure 5
U302-VBATTest Point C324
J300
Z300RX SAW Filter
X300 TCXO
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9.12 RF Transmitting Failure
Analysis:Above all, check RF parameter whether is correct. The U302 cause the failure usually.
(Reference Figure 5)
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10 Functional Test
10.1 Introduction to the Key and icons
10.2 MMI Test Insert the SIM card. Enter MMI test command *2846570+Down to access the MMI keypad binding combination test mode.
No. Item Procedure
Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.)
1 SIM Card Test 1
Whether the SIM card is identified
Enter the test command to access the SIM card test. If the SIM card is identified, the "SIM card test succeeded" is displayed. Otherwise, the "SIM card test failed" is displayed.
2 LCD Test 2 White screen Press the Send key and the LCD displays the white screen, and LCD Test display in middle.
Right Soft Key
Right Key
End Key
Down Key
Up Key
Send Key
Left Soft Key
Left Key
OK Key
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No. Item Procedure
Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.)
3 Black screen
Press the Send key and the LCD displays the dark screen.
4 multicolor stripe
Press the Send key and the LCD displays the color panel grids.
5 Dot Press the Send key and the LCD displays the black and white dots.
6 Black and white blocks
Press the Send key and the LCD displays a black block overlapped with a white block. (Note: There is a white block amid the black block.)
7 Black and white blocks
Press the Send key and the LCD displays a white block overlapped with a black block. (Note: There is a black block amid the white block.)
3 LED and motor test 8 LED and
motor Press the Send key. Then all the keypad LEDs are on and the motor vibrates.
4 Key test 10 Keypad
Press the Send key to display the keypad diagram. When you press any key except Send and End the keypad, a blue square grid appears on the key in the diagram.
5 Sound Test
11 Speaker Press the Send key,LCD displays Sound. then the speaker makes sound. When you use the headset,sound can be heard through the headset.
6 Call test 12
MIC and headset
Press the Send key and speak to the microphone, then you can hear your sound from the receiver; When you use the headset, your voice can be heard through the headset.
7 FM test 13 FM
Insert the headset first, Press the Send key to test FM function.
Press the Send key display MMI Test Result, all the test Item and test result displays. If test pass, will display succeed after test Item, otherwise display failed after test Item. Completed MMI test, press End key to exit MMI Test Mode.
10.3 Voice Call Test Insert a normally used SIM card and the battery into the phone to be tested. Press and hold the End key to power on the phone. Check whether the signal strength is changed normally in normal network environment. Dial the number of a fixed-line phone to test the voice quality during a call. If the preceding tests are normal, end the voice call test. Otherwise, perform the test again or send the phone
to advanced maintenance center for repair.