gas or water meter with two lc sensors - texas · pdf filean lc sensor consists of an inductor...
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TI DesignsGas or Water Meter with Two LC Sensors
TI Designs Design FeaturesTI Designs provide the foundation that you need • Ultra-Low Power Designincluding methodology, testing and design files to • Contactless Rotation Detectionquickly evaluate and customize the system. TI Designs
• Two LC Sensorshelp you accelerate your time to market.• Self-Calibration for Long-Term Operation
Design Resources • Full Platform Design with Socket for Add-OnModule and Flow Emulation by a Motor Board
Design PageTIDM-LC-WATERMTR• Onboard Debugging CircuitMSP430FR6989 Product Folder
MSP430G2333 Product Folder Featured ApplicationsDRV8837 Product Folder
• Gas MeterTPS62237 Product Folder• Water Meter• Heat Meter
ASK Our E2E Experts • Rotation DetectionWEBENCH® Calculator Tools• Motor Position Detection
An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and otherimportant disclaimers and information.
All trademarks are the property of their respective owners.
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Copyright © 2014, Texas Instruments Incorporated
System Description www.ti.com
1 System DescriptionThis reference design for a rotational flow meter is built using the Extended Scan IF (ESI) ofMSP430FR6989, two LC sensors, and the EVM EVM430-FR6989.
The whole EVM can be divided into three boards: the main board, sensor board, and motor board. Themain board of the EVM consists of MSP430FR6989, a sensor board connector, an RF module socket, anda debugger circuit. The sensor board is constructed with two LC sensors. The motor board drives a rotordisc to emulate water flow, which moves the rotating disc in a flow meter.
This system is an ultra-low power design using the latest TI MCU MSP430FR6989 with FRAM to store theprogramming code. The MSP430FR6989 has a built-in module of ESI. The system block diagram showsall the elements that the EVM has and the potential add-on modules, like the RF sub-system or theNFC/RFID module, that can be connected to the EVM (Figure 2).
The main board of EVM consists of MSP430FR6989, a socket for add-on module, USB connection, and asensor board connector. The bottom side of the main board features an onboard eZ-FET lite connected tothe MCU. Program and debug the MCU firmware by directly connecting the board with a USB cable toPC. The IDE is TI's Code Composer Studio™. The debugging circuit also consists of an HID connection,which can receive the command of a dedicated PC GUI for this EVM.
2 Design Features
2.1 Ultra-Low Power DesignMSP430FR6989 is an ultra-low power MCU that has a FRAM of up to 128 KB for code and data.Peripherals include ESI, RTC, ADC12, CRC, AES256, MPY32, eUSCI for communication, Comp_E fortouch key module, an LCD, and six timers.
When operating this design, only the ESI, a timer, and the LCD continuously work with an oscillationcrystal of 32,768 Hz. The CPU and other peripherals are off, in low power mode 3 (LPM3). The wholesystem uses around 7 µA for a sample rate of 500 Hz with two LC sensors without an LCD.
2.2 Contactless Rotation DetectionWhen gas or water flows through the meter, the rotating plate inside the meter rotates according to theflow rate. The sensors can detect the number of the plate's rotations without direct contact, which preventscorrosion and safety issues.
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Copyright © 2014, Texas Instruments Incorporated
Sensor 1
Sensor 2
Anti-Clockwise direction
S1 S1S1 S1 S1S1
S2 S2S2 S2 S2 S2
www.ti.com Design Features
2.3 Two-LC Sensor BoardAn LC sensor consists of an inductor and a capacitor to form a tank oscillator. This sensor is the provensolution of low power consumption and reliable for the long-term, continuous operation of flow meters.With a very short pulse within 1 µs, The sensor starts oscillating in its resonant frequency. The inductorthen generates a magnetic field. Once the metal part of the rotating plate is cutting the magnetic field, aneddy current is formed in the metal, which will absorb the magnetic energy from the inductor. Theamplitude of the oscillating signal will be reduced. The comparator and the DAC of the ESI can detect thischange of signal to detect the position of the rotating plate and count the number of rotations.
Two LC sensors are used for the detection of both clockwise and anti-clockwise rotation. A flow meter, likea water meter, has a bounce back of water flow when the tap is closed, making the rotor disc turnbackwards and forwards repeatedly before the flow rate becomes zero. To eliminate the counting error ofa single sensor, two sensors can count the number of rotations for both directions and give a correctresult.
In Figure 1, a logic low is given out when the sensor is detecting the metal part and a logic high whenlocated in the non-metal part. Two sensors are located 90 degrees apart. In this setting, the signal of onesensor will always be 90 degrees out of phase to the other sensor, giving out four states of the twosensors: 00, 01, 11, and 10. The sequence of these four states identify the rotating direction.
Figure 1. Logic Signal Compiled from LC Sensors
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Copyright © 2014, Texas Instruments Incorporated
Design Features www.ti.com
2.4 Self-Calibration for Long-Term OperationDue to the temperature, humidity, aging components, and signal drifts, a continuous adjustment circuit isnecessary to ensure the system is within the range of reliable operation. The ESI has a duplicated circuitinside, which can be used for detecting the overall drift of the system. This circuit will only be activatedperiodically to save power consumption. Once the drift is found, the circuit adjusts the DAC values of thecontinuously operating part of the ESI to align it to the signal position of maximum reliability.
2.5 Full Platform Design with Add-On Module Socket and Flow Emulation by a MotorBoardThe motor board provides a tool to emulate the rotating plate driven by the flow of gas or water. Adjust therotating speed either manually or by the main board through the I2C link. The socket connects withvarious communication ports, SPI, UART, and the I/O of the MCU. Some existing TI RF modules candirectly plug into this socket to add on more features to the EVM. Engineers can also design their ownmodules, like NFC/RFID, valve control, and so on, and test it with the system without reconfiguring thewhole board.
The sensor board is standalone. Engineers can design their own customized sensor board and plug intothe main board for testing.
2.6 Built-In Debugging CircuitThe built-in debugging circuit facilitates the system setup without too many external connections ofdebugging tools. The bottom side of the main board has an onboard eZ-FET lite connected to the MCU.Engineers can program and debug the MCU firmware by directly connecting the board with a USB cableto the PC. The IDE is TI's Code Composer Studio™. The debugging circuit also has an HID connection,which can receive the command of a dedicated PC GUI for this EVM.
3 Block Diagram
Figure 2. System Block Diagram
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Copyright © 2014, Texas Instruments Incorporated
www.ti.com Circuit Design
4 Circuit Design
4.1 Main Board
Figure 3. Main Board of EVM
This main board is built on the MCU MSP430FR6989 with an LCD display. This board is powered by USBto provide 3.3 V through a buck converter. This board can be divided into seven parts and is a platform fordeveloping flow meters with RF and USB connections. The application software has code for the ESImodule for flow measurement, but the software does not connect to Part 1 and Part 6 in Table 1.
Table 1. Description of Main Board Layout
PART NUMBER DESCRIPTIONA socket for RF modules of sub-1 GHz or 2.4 GHz, connecting
Part 1 to the MCU with SPI and I/O. For details of RF modules, readthe CC1120 development kit.Through holes connecting to I/O of no connection. The headersPart 2 are the I2C connection.The JTAG debugger and a USB HID interface. The HIDPart 3 interface can connect the board to PC with a dedicated GUI.A reset button. This board does not have an on/off switch. ToPart 4 restart the firmware, push the reset button.This device has five push-button switches. The firmware does
Part 5 not have code for this part. Designers can use it to implement akey control.LED indicator, connecting to PJ.2 and PJ.3. For saving currentPart 6 consumption, remove the jumpers.The socket for the sensor board and connecting to the ESI ofPart 7 MCU.
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Copyright © 2014, Texas Instruments Incorporated
474
474
Circuit Design www.ti.com
The core part of the hardware for flow measurement is the connection of the MCU's ESI to the sensorboard. A 470-nF capacitor connecting to ESICOM stabilizes the voltage of Vcc / 2. The ESI is a self-contained module inside the MCU.
For a low-power design, a 32,768-Hz crystal is used to continuously operate. To lower the powerconsumption further, turn on the LCD only when taking a reading is necessary. The rest of the MCUperipherals and its CPU are kept idle to save power. The CPU should only be active during a readingupdate and self-calibrating, which is done in a periodical manner lasting a few seconds to hoursdepending on the timer setting.
4.2 Sensor Board
Figure 4. Sensor Board
The sensor board is designed for LC sensors only. The sensors can be placed in different orientations.For the half-covered metal rotor disc, the two sensors are placed 90 degrees apart.
The selection of the inductor (L) and capacitor (C) is an important factor to affect the power consumption.Find a detailed selection guide as an application note for other types of sensors.
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Copyright © 2014, Texas Instruments Incorporated
www.ti.com Circuit Design
4.3 Motor BoardThe motor board is to drive the rotor disc to emulate a gas or water flow. The battery socket is on the backof the board. The board consists of the following parts:
Figure 5. Motor Board
Table 2. Description of Motor Board Layout
PART NUMBER DESCRIPTIONPart 1 Two pins connecting to external powerPart 2 Switch to power on and off the motor board
2-wire (Spy-Bi Wire) mode of JTAG. This mode can be used toPart 3 program and debug the firmwarePart 4 Variable resistor to vary the rotation speed
Buttons to select the rotation's direction. Also acts as a stopPart 5 buttonAn infrared sensor that provides feedback on the rotation speedPart 6 of the rotor disc
Part 7 A rotor disc half covered by copperPart 8 A connection header for I2C and UART
An I2C link can connect to the main board. The motor board will receive the command from main board torotate in a proper speed and send back the record of the number of rotations.
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Copyright © 2014, Texas Instruments Incorporated
Start
Initialization
Start Timer for Re-Calibration
Update LCD
Re-Calibration
Q6 Flag?
Time to Re-Cal
Y
Y
Q6 Flag?YStart Timer for Re-Calibration
Re-Cal Done?
Time out?
Y
Y
Software Description www.ti.com
5 Software Description
Figure 6. Software Flowchart
The software optimizes the system's power consumption. As shown in Figure 6, the software starts withinitialization, which includes port settings for low current leakage, LCD, ESI internal oscillator calibration,ESI registers, sampling rate, timing state machine (TSM) with auto-TSM calibration, optimal DAC level,and processing state machine (PSM) table setting. After initialization, the EVM can work well in low powermode with ESI and LCD as the only modules actively running. To avoid too many interrupts to wake upthe CPU, the system uses the Q6 flag in the PSM table. This flag is set only when the rotor disc isrotating.
The system is in LPM3 mode when the rotor disc does not rotate. To lower the power consumptionfurther, disable the LCD. Construct a key button to wake up the LCD when reading is necessary. For astable, long-running lifetime for the system, the design includes a runtime re-calibration to track the drift ofthe sensors and system. A timer with the variable constant Time_to_Recal is used to count the period forre-calibration.
For a detail description, see LC Sensor Rotation Detection with MSP430 Extended Scan Interface (ESI).
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Copyright © 2014, Texas Instruments Incorporated
Jumper 3V3
www.ti.com Test Setup
6 Test Setup
Figure 7. System Setup
Before testing, the main board and motor board have to be programmed with firmware. Follow thisprocedure to test the current consumption of the reference design:1. Remove all jumpers of the main board except the jumper 3V3 and the ground jumper next to it.2. Disconnect the jumper 3V3 and connect it with a current meter.3. Set the rotor disc at 5 mm from the sensor board and switch off the motor.4. Power up the main board with a USB cable.5. Calibrate the TSM after powering up the main board. The LCD will show 0. wait until it turns to 8888,
then go to the next step.6. Switch on the motor and do not adjust the distance between the rotor and sensors. At this step, a
calibration for searching proper reference voltages of DAC is working. This calibration will last for onesecond.
7. Finish initial calibration. The LCD will keep counting the number of rotations.8. Turn off the LCD by pushing the black button.9. Read the current meter indicating the current consumption of the reference design without the LCD.
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Copyright © 2014, Texas Instruments Incorporated
Sampling Rate (Hz)
Cur
rent
(µ
A)
0 200 400 600 800 1000 12000
5
10
15
20
25
D001
FW42XSystem with ESI and SensorsSystem with ESI only
Test Results www.ti.com
7 Test Results
Figure 8. Test Results
Figure 8 shows the current consumption of the MCU with three LC sensors, not including all currentflowing into the LCD, power, and other modules on the board. The data is taken by measuring the currentflowing into the MCU connected to the two LC sensors with the LCD switched off, varying with differentESI sampling rates of the MSP430FR6989.
From the experimental data, the current consumption in the MSP430FR6989 takes 9 nA per sample withtwo LC sensors. Compared to the recorded data of 17 nA per sample from the MSP430FW42x systemwith the same type of LC sensors, the MSP430FR6989 has an improved power consumption.
The current consumption of the MSP430FR6989 running with ESI without sensors is also given. Theseresults show that the LC sensors take half of the total current consumption of the system. To furtherreduce the current consumption, use well-designed LC sensors.
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Copyright © 2014, Texas Instruments Incorporated
DNPR11
DNPR12
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P8.5/A6/C660
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P9.2/ESICH2/ESITEST2/A10/C1069
P9.3/ESICH3/ESITEST3/A11/C1170
P9.4/ESICI0/A12/C1271
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56
78
PORT_1_4
MHDR2X4
12
34
56
78
PORT_2_3
MHDR2X4
12
34
56
78
PORT_6_8
MHDR2X4
12
34
56
78
PORT_J
MHDR2X4
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
RF2
MHDR2X10
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
RF1
MHDR2X10
0.1uFC32
TARGET_GND
0RR440RR450RR46
0RR47
TARGET_GND
0RR480RR490RR500RR51
TARGET_GND
0RR570RR560RR550RR54
0RR530RR52
TARGET_3V3
RF_SPI1_CSNRF_GPIO_82RF_SPI1_MISO/RF_UART_TXDRF_SPI1_MOSI/RF_UART_RXD
RF_GPIO_17RF_GPIO_13
RF_SPI_CSNRF_SPI_SCLKRF_SPI_MOSIRF_SPI_MISO
RF_RESETRF_GPIO_81RF_GPIO_10
RF_SPI1_SCLK
LF
XO
UT
LF
XIN
HF
XO
UT
HF
XIN
PJ.0
PJ.1
PJ.1LED1LED2LFXINLFXOUTHFXINHFXOUTP6.0
P6.1P6.2
P6.0P6.1P6.2
RF_RESET RF_GPIO_81RF_GPIO_10 RF_GPIO_82
RF_SPI1_MOSI/RF_UART_RXDRF_SPI1_MISO/RF_UART_TXDRF_SPI1_SCLKRF_SPI1_CSN
RF_SPI_CSNRF_SPI_SCLKRF_SPI_MISORF_SPI_MOSI
RF_GPIO_17RF_GPIO_13
I2C_SDAI2C_SCLUART0_RXD UART0_TXD
P4.3P1.7
P1.0P1.1
P1.6P4.2
P2.0P2.1P2.2P2.3P3.4
P3.5 P3.6P3.7
P6.0P6.1P6.2P8.4P8.5P8.6P8.7
PJ.0PJ.1PJ.2PJ.3PJ.4PJ.5PJ.6PJ.7
EZFET_TARGET_TEST_SBWTCK
EZFET_TARGET_RST_SBWTDIO
BR
IDG
E_T
AR
GE
T_U
AR
T_
RX
D
BR
IDG
E_T
AR
GE
T_U
AR
T_
TX
D
0.1uF
C36
TARGET_GND
COM1
COM2
Up3
Down4
Select5
Right6
Left7
BUT
TARGET_GND
BUT_AIN
BUT_AIN2
BUT_AIN3
BUT_AIN4
BUT_AIN5
BUT_AIN2
BUT_AIN3
BUT_AIN4
BUT_AIN5 TARGET_GND
TARGET_GND TARGET_GND
DNP
R41
DNP
R40
TARGET_3V3
TARGET_3V3
www.ti.com Design Files
8 Design Files
8.1 SchematicsTo download the schematics, see the design files at TIDM-LC-WATERMTR.
8.1.1 Main Board without the Debugging Circuit
Figure 9. MSP430FR6989 Schematic
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8.1.2 Sensor Board
Figure 10. Sensor Board Schematic
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8.1.3 Motor Board
Figure 11. Motor Board Schematic
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8.2 Bill of MaterialsTo download the bill of materials (BOM), see the design files at TIDM-LC-WATERMTR.
Table 3. BOM: Main Board
MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPNCAPACITORSC100, C101, C200, Alternatives:GRM1555C1H100JC201, C405, C406, 10 pF (NP0/C0G) 8 Chip Capacitor, C0G, 50 V, ±5% C0402 490-5921-1-ND NP0/C0G, 10 V, MurataA01DC410, C412 ±5% or better
Alternatives:C10, C11, C403, GRM1555C1H220J22 pF (NP0/C0G) 4 Chip Capacitor, C0G, 50 V, ±5% C0402 490-5868-1-ND NP0/C0G, 10 V, MurataC404 A01D ±5% or betterAlternatives:GRM1555C1H330JC109, C110 33 pF (NP0/C0G) 2 Chip Capacitor, C0G, 50 V, ±5% C0402 490-5936-1-ND NP0/C0G, 10 V, MurataA01D ±5% or betterAlternatives: X5R,Chip Capacitor, X7R, 50 V, GRM155R71H102C111, C210 1000 pF 2 C0402 490-1303-1-ND 10 V, ±10% or Murata±10% KA01D betterAlternatives: X5R,Chip Capacitor, X7R, 100 V, GRM155R72A222C1 1 C0402 490-6367-1-ND 10 V, ±10% or Murata±10% KA01D better
C3, C5, C7, C9,C32, C36, C102, Alternatives: X5R,Chip Capacitor, X7R, 16 V, GRM155R71C104C104, C108, C202, 100 nF 16 C0402 490-3261-1-ND 10 V, ±10% or Murata±±10% KA88DC204, C205, C400, betterC402, C407, C408
Alternatives: X5R,C105, C106, C206, Chip Capacitor, X7R, 16 V, GRM155R71C224220 nF 4 C0402 490-5418-1-ND 10 V, ±10% or MurataC207 ±10% KA12D betterAlternatives: X5R,Chip Capacitor, X5R, 10 V, GRM155R61A474C107, C208 470 nF 2 C0402 490-3264-1-ND 10 V, ±10% or Murata±10% KE15D betterAlternatives: X5R,Chip Capacitor, X7R, 25 V, GRM188R71E105C411, C415, C417 1 µF 2 C0603 490-5307-1-ND 10 V, ±10% or Murata±10% KA12D betterAlternatives: X5R,Chip Capacitor, X7R, 16 V, GRM21BR71C475C33, C401 4.7 µF 1 C0805 490-4522-1-ND 10 V, ±10% or Murata±10% KA73L betterAlternatives: X5R,C103, C203, C209, Chip Capacitor, X7R, 25 V, GRM31CR71E10610 µF 4 C1206 490-6518-1-ND 10 V, ±10% or MurataC409 ±10% KA12L better
RESISTORS
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Table 3. BOM: Main Board (continued)MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPN
R44, R45, R46,R47, R48, R49, Alternatives: ±5%R50, R51, R52, 0 R 15 Chip Resistor R0402 RC0402JR-070RL 311-0.0JRCT-ND Yageoor betterR53, R54, R55,R56, R57, R420
Alternatives: ±5%R65 10 R 1 Chip Resistor R0402 RC0402JR-0710RL 311-10JRCT-ND Yageoor betterR407, R409, R412, Alternatives: ±5%22 R 6 Chip Resistor R0402 RC0402JR-0722RL 311-22JRCT-ND YageoR413, R416, R417 or betterR100, R101, R201, Alternatives: ±5%27 R 5 Chip Resistor R0402 RC0402JR-0727RL 311-27JRCT-ND YageoR203, R406 or better
Alternatives: ±5%R405 33 R 1 Chip Resistor R0402 RC0402JR-0733RL 311-33JRCT-ND Yageoor betterRC0402JR- Alternatives: ±5%R211 100 R 1 Chip Resistor R0402 311-100JRCT-ND Yageo07100RL or better
R105, R202, R204, RC0402JR- Alternatives: ±5%390 R 4 Chip Resistor R0402 311-390JRCT-ND YageoR205 07390RL or betterR9, R10, R104, RC0402JR- Alternatives: ±5%470 R 2 Chip Resistor R0402 311-470JRCT-ND YageoR200 07470RL or better
Alternatives: ±5%R103, R206, R408 1.5 k 3 Chip Resistor R0402 RC0402JR-071K5L 311-1.5KJRCT-ND Yageoor betterAlternatives: ±5%R600, R601 2.2 k 2 Chip Resistor R0402 RC0402JR-072K2L 311-2.2KJRCT-ND Yageoor betterAlternatives: ±5%R40, R41 10 k 2 Chip Resistor R0402 RC0402JR-0710KL 311-10KJRCT-ND Yageoor better
R400, R401, R402, Alternatives: ±5%R403, R410, R411, 15.0 k 8 Chip Resistor R0402 RC0402JR-0715KL 311-15KJRCT-ND Yageoor betterR414, R415R1, R106, R209, Alternatives: ±5%47 k 4 Chip Resistor R0402 RC0402JR-0747KL 311-47KJRCT-ND YageoR404 or better
Alternatives: ±5%R102, R210 1 M 2 Chip Resistor R0402 RC0402JR-071ML 311-1.0MJRCT-ND Yageoor betterRC0402FR- Alternatives: ±1%R5, R6, R7, R8 5.6 k 4 Chip Resistor 1% R0402 311-5.6KLRCT-ND Yageo075K6L or betterRC0402FR- Alternatives: ±1%R3 100 k 1 Chip Resistor 1% R0402 311-100KLRCT-ND Yageo07100KL or betterRC0402FR- Alternatives: ±1%R109 150 k 1 Chip Resistor 1% R0402 311-150KLRCT-ND Yageo07150KL or betterRC0402FR- Alternatives: ±1%R107, R108 220 k 2 Chip Resistor 1% R0402 311-220KLRCT-ND Yageo07220KL or better
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Table 3. BOM: Main Board (continued)MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPN
RC0402FR- Alternatives: ±1%R110 240 k 1 Chip Resistor 1% R0402 311-240KLRCT-ND Yageo07240KL or betterINDUCTORS, DIODES, CRYSTALSL400 2.2 µH 1 SMD Inductor 3×3 mm NR3010T2R2M 587-1638-1-ND Taiyo YudenD100, D200 Red 2 LED, Red, SMD 603 LTST-C190CKT 160-1181-1-ND Lite-On IncD101, D201, D202, Green 4 LED, Green, SMD 603 LTST-C190GKT 160-1183-1-ND Lite-On IncD203LED1, LED2 Amber 2 LED, Amber, SMD 603 LTST-C190AKT 160-1180-1-ND Lite-On Inc
CSTCR4M00G15LQ100, Q200 4 Mhz 2 Ceramic Resonator CSTCR 490-7861-1-ND Murata99-R0CSTCR6M00G55-Q400 6 Mhz 1 Ceramic Resonator CSTCR 490-5997-1-ND MurataR0
Cylindrical Can, CMR200T-X1 32.768 kHz 1 Crystal Oscillator 300-8340-1-ND CitizenRadial 32.768KDZF-UTICsU1 MSP430FR6989PZ 1 Mixed Signal Microcontroller MSP430FR6989 MSP430FR6989 N/A Provided by TI Texas Instruments
MSP430F5528IRG MSP430F5528IRGU100, U200 2 Mixed Signal Microcontroller TI_RGC0064B_N 296-27930-1-ND Texas InstrumentsC CRU400 TPD2E001DRL 1 15-kV ESD-Protection Array DRL0005A TPD2E001DRLR 296-21883-1-ND Texas InstrumentsU401 TUSB2046BIRHB 1 4-Port Full-Speed USB Hub RHB0032E TUSB2046BIRHBR 296-21926-1-ND Texas InstrumentsU403 TPS62237DRY 1 3.3-V Buck Step Down Regulator DRY0006A TPS62237DRYT 296-25630-1-ND Texas InstrumentsCONNECTORS
micro-USB Type B, Reverse, CONN_USB_microJ400 micro B 1 ZX62R-B-5P H11574CT-ND HiroseReceptacle, SMD, RA _ZX62R-B-5PATFM-110-02-SM-D- Contact SamtecRF1, RF2 2×10 SMD 2 Header, SMD, 1.27 mm, 2×10 HDR2X10 N/A SamtecA-K directly
Alternative: Anysimilar JP13 and(JP13+JP14), J401 2×2 2 Header, TH, 2.54 mm, 2×2 HDR2X2 67997-104HLF 609-3225-ND FCIJP14 share samecomponent
J402, J601PORT_1_4, Alternative: AnyPORT_2_3, 2×4 6 Header, TH, 2.54 mm, 2×4 HDR2X4 67997-108HLF 609-3226-ND FCIsimilarPORT_6_8,PORT_J
Shrouded Header, TH, 2.54 mm, SBH11-PBPC-D08- Sullins ConnectorESI 2×8 RA 1 HDR2X8 S9179-ND2×8, Right Angled RA-BK Solutions
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Table 3. BOM: Main Board (continued)MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPN
Alternative: Any Sullins Connector(Jumpers) 1×2 12 2-pin Jumper, 2.54 mm N/A QPC02SXGN-RC S9337-ND similar SolutionsMISCELLANEOUS
4-Way Navigation Switch withBUT TPA511GLFS 1 TPA511GLFS TPA511GLFS 401-1130-1-ND C&KselectBUT (Accessory) Y43109100OP 1 Cap for TPA511GLFS N/A Y43109100OP 401-1997-ND C&KMCU_RESET, B3U-1000P 3 Push Button B3U-1000P B3U-1000P SW1020CT-ND OmronS201, S202
ADKOM ElektronikLCD FH-1152P 1 Custom 160-segment LCD FH-1152P FH-1152P N/A Provided by TI GmbHAlternative: AnyM3 Hex Standoff M3/13 mm 4 M3 13 mm Female, female N/A Harwin Inc 952-1488-ND R30-1011302similar
M3 ScrewPhilips Pan Head Alternative: AnyM3 Screw M3/6 mm 4 RM3X8MM 2701 335-1149-ND APM HexsealHead Diameter 5 to 6 mm similar M3 ScrewsThread Length 6 mm
Table 4. BOM: Sensor Board (Two-LC Configuration)
MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPNCAPACITORS
Alternatives:GRM1555C1H221C1 C2 220 pF (NP0/C0G) 2 Chip Capacitor, C0G, 50 V, ±5% C0402 490-1293-1-ND NP0/C0G, 10 V, MurataJA01D ±5% or betterAlternatives: X5R,Chip Capacitor, X5R, 10 V, GRM155R61A474C5 470 nF 1 C0402 490-3264-1-ND 10 V, ±10% or Murata±10% KE15D better
INDUCTORSL1 L2 470 µH 2 Radial 11R474C 811-2034-ND MurataCONNECTORS
8×2 2.54-mm SFH11-PBPC- Sullins ConnectorESI 8×2 1 S9196-NDFemale Socket D08-ST-BK Solution
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Table 5. BOM: Motor Board
MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPNRESISTORS
RC0402JR- Alternatives: ±5%R4, R8, R9 100 R 3 Chip Resistor R0402 311-100JRCT-ND Yageo07100RL or betterRC0402JR- Alternatives: ±5%R2, R6 470 R 2 Chip Resistor R0402 311-470JRCT-ND Yageo07470RL or better
Alternatives: ±5%R3 1 K 1 Chip Resistor R0402 RC0402JR-071KL 311-1.0KJRCT-ND Yageoor betterAlternatives: ±5%R5 2 K 1 Chip Resistor R0402 RC0402JR-072KL 311-2.0KJRCT-ND Yageoor better
RC0402JR- Alternatives: ±5%R1 10 K 1 Chip Resistor R0402 311-10KJRCT-ND Yageo0710KL or betterRC0402JR- Alternatives: ±5%R7 47 K 1 Chip Resistor R0402 311-47KJRCT-ND Yageo0747KL or better
Alternatives: Sametype, valueVR1 10 K 1 10-K POT 3352P-1-103LF 3352P-103LF-ND Bourns Inc.between 10 to 100K
CAPACITORSAlternatives: X5R,Chip Capacitor, X7R, 100 V, GRM155R72A222C4 2200 pF 1 C0402 490-6367-1-ND 10 V, ±10% or Murata±10% KA01D betterAlternatives: X5R,C3, C5, C7, C8, Chip Capacitor, X7R, 16 V, GRM155R71C104100 nF 5 C0402 490-3261-1-ND 10 V, ±10% or MurataC10 ±10% KA88D betterAlternatives: X5R,Chip Capacitor, X5R, 10 V, GRM155R61A474C6 470 nF 1 C0402 490-3264-1-ND 10 V, ±10% or Murata±10% KE15D betterAlternatives: X5R,GRM31CR61C226C1, C9 22 µF 2 Chip Capicitor, X5R, 16 V, ±20% C1206 490-4739-1-ND 10 V, ±10% or MurataME15L better
DIODES, LEDsLED1 Red 1 LED, Red, SMD 603 LTST-C190CKT 160-1181-1-ND Lite-On IncLED_PWR Green 1 LED, Green, SMD 603 LTST-C190GKT 160-1183-1-ND Lite-On IncD1 MBR0520L 1 0.5-A Schottky Diode, SMD SOD123 MBR0520L MBR0520LCT-ND FairchildICs, TRANSISTORS
20 TSSOP PW(R- MSP430G2553IPU1 MSP430G2553 1 MCU: MSP430G2553 296-28430-1-ND Texas InstrumentsPDSO-G20) W20DSG(S-PWSON-U3 DRV8837DSG 1 Low-Voltage H-Bridge Driver DRV8837DSGR 296-34786-1-ND Texas InstrumentsN8)
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Table 5. BOM: Motor Board (continued)MANUFACTURERDESIGNATOR VALUE QTY DESCRIPTION PACKAGE DIGIKEY PN REMARK MANUFACTURERPN
U4 QRD1113 1 Reflective Optical Sensor Custom 4L QRD1113 QRD1113-ND FairchildBC817-T1 BC817-40L 1 NPN Transistor SOT23 BC817-40L On Semi40LT3GOSCT-ND
JUMPERS, CONNECTORS, SWITCHESBUT1, BUT2 2 SMD push button 6×6 mm B3SL-1002P SW1064CT-ND OmronPOWER 2P2T 1 SMD 2P2T Switch JS202011SCQN 401-2002-1-ND C&K ComponentsPWR_SEL, I2C, 3×1 3 3×1 2.54-mm Pin header 68001-103HLF 609-3468-ND FCIUARTEXT_PWR, SBW 2×1 2 2×1 2.54-mm Pin header 68001-102HLF 609-3506-ND FCI
Sullins Connector(Jumpers) 1×2 1 2-pin Jumper, 2.54 mm N/A QPC02SXGN-RC S9337-ND SolutionsMISCELLANEOUS
NMB TechnologiesMotor 1 Motor PPN7PA12C1 P14355-ND CorporationBAT 2xAAA 1 2xAAA Battery holder 2468 2468K-ND Keystone ElectronicsMotor Mount 1 Custom made motor mount N/A N/A N/A
M2 ScrewPhilips Pan HeadHead Diameter 3 mmM2 Screws M2/3 mm 2 N/AHead Height 1 mmThread Length 3 mmTotal length 4 mmM2 Spring B&F FastenerM2 Spring M2/4-mm dia 2 Diameter around 4 mm MLWZ 002 H771-ND SupplyThickness <1 mmM3 ScrewPhilips Pan HeadM3 Screw M3/6 mm 5 RM3X8MM 2701 335-1149-ND APM HexsealHead Diameter 5 to 6 mmThread Length 6 mmM3 1-inch StandoffM3 Hex Standoff M3/2.54 cm 4 R6397-02 952-2177-ND Harwin IncFemale, femaleM3 NutWidth around 5 mmM3 Nuts M3 1 N/AThickness around 2 mm(for Mounting Battery Holder)
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8.3 PCB LayoutsTo download the layer plots, see the design files at TIDM-LC-WATERMTR.
8.3.1 Main Board
Figure 12. Main Board 1 Figure 13. Main Board 2
Figure 14. Main Board 3 Figure 15. Main Board 4
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Figure 16. Main Board 5 Figure 17. Main Board 6
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8.3.2 Sensor Board
Figure 18. All Layers Figure 19. Top Silkscreen
Figure 20. Component Side Figure 21. Solder Side
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8.3.3 Motor Board
Figure 22. Motor Board 1 Figure 23. Motor Board 2
Figure 24. Motor Board 3 Figure 25. Motor Board 4
Figure 26. Motor Board 5
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8.4 Altium ProjectTo download the Altium project files, see the design files at TIDM-LC-WATERMTR.
8.5 Gerber FilesTo download the Gerber files, see the design files at TIDM-LC-WATERMTR.
8.6 Software FilesTo download the software files, see the design files at TIDM-LC-WATERMTR.
9 About the AuthorTHOMAS KOT is a system and solutions architect in the Smart Grid and Energy group at TexasInstruments, where he primarily works on the flow meter reference design development and customersupport. Thomas received his bachelor of engineering in electronic engineering and his master of sciencein electronic and information engineering from Hong Kong Polytechnic University in 1995 and 2005,respectively. He received the master of business administration from City University of Hong Kong in2007.
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