generation of nanoscale anticounterfeiting patterns on ... · b. user-designed pattern on silicon...
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Generation of nanoscale anticounterfeiting patterns on silicon by optical trap assistednanopatterningT.-H. ChenY.-C. TsaiR. Fardel and C. B. Arnold
Citation: J. Laser Appl. 29, 012006 (2017); doi: 10.2351/1.4966590View online: http://dx.doi.org/10.2351/1.4966590View Table of Contents: http://lia.scitation.org/toc/jla/29/1Published by the Laser Institute of America
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Generation of nanoscale anticounterfeiting patterns on silicon by optical trapassisted nanopatterning
T.-H. ChenDepartment of Mechanical and Aerospace Engineering, Princeton Institute for Science and Technology ofMaterials, Princeton University, Princeton, New Jersey 08544
Y.-C. Tsaia)
Fischell Department of Bioengineering, University of Maryland, College Park, Maryland 20742
R. Fardel and C. B. Arnoldb)
Department of Mechanical and Aerospace Engineering, Princeton Institute for Science and Technology ofMaterials, Princeton University, Princeton, New Jersey 08544
(Received 13 July 2016; accepted for publication 14 October 2016; published 8 November 2016)
Among the different strategies aimed at protecting products from counterfeiting, hidden security
patterns are used by manufacturers to mark their products in a unique way. However, most
anticounterfeiting patterns bear the risk of being reproduced by an unauthorized party who has
gained knowledge of the exact technique and process parameters. In this paper, we use optical trap
assisted nanopatterning to create unique security markings by taking advantage of statistical
fluctuations when generating nanoscale features within the pattern. We image the patterns by
optical microscopy, scanning electron microscopy, and atomic force microscopy and propose a
three-level examination process that allows for an efficient yet highly secure authentication.VC 2016 Laser Institute of America. [http://dx.doi.org/10.2351/1.4966590]
Key words: OTAN, nanopatterning, solid-immersion lens
I. INTRODUCTION
Brand protection and product authentication rely on the
ability to apply a distinctive marking on original products.1
Among these markings, covert security features are used by
manufacturers to identify their products as authentic and rely
on the creation of a hidden security pattern on the product to
protect. Several techniques have been developed to generate
covert security patterns such as invisible printing, laser coding,
and digital watermarking.2–7 These techniques require special-
ized equipment for fabricating and authenticating security fea-
tures, and therefore, present a barrier to counterfeiting.
However, in all these techniques, the exact parameters to cre-
ate the features must be kept confidential, because knowledge
of the fabrication conditions is sufficient to reproduce them.
One way to mitigate this issue is to take advantage of statisti-
cal fluctuations that are intrinsic to the fabrication method. An
ideal technique would introduce statistical fluctuations that
make each pattern unique no matter how well the fabrication
conditions are reproduced, yet create features that cannot be
easily made by other methods. One technique that fulfills these
requirement is optical trap assisted nanopatterning (OTAN),
which uses a Bessel-beam optical trap to position a micro-
sphere to be used as a near-field optical element.8–12 Besides
introducing statistical fluctuation, the Bessel beam optical trap
has the advantage of self-positioning the bead at the optimal
distance from the substrate, which eliminates the complicated
step of precise vertical focusing in the alignment process.
Upon illumination with an appropriate pulsed laser, a micro-
sphere focuses the laser light to a subwavelength-sized spot
and creates surface features as small as 100 nm. The feature
creation is dependent on the exact position of the microsphere
relative to the laser and to the substrate, and small fluctuations
in position lead to small fluctuations in shape and size of the
features. In this case, the Bessel-beam nature of the optical
trap means that the statistical fluctuations associated with
Brownian motion of the bead are significantly greater along
the optical axis than orthogonal to the optical axis.13 Most
OTAN literature has dealt with the fundamental principle and
the development of the OTAN technique. In this paper, for the
first time, we demonstrate nanopatterns on silicon and present
an application for OTAN that specifically takes advantages of
the technique’s unique features. More precisely, we exploit
fluctuations along the optical axis of an optically trapped
microsphere to create unique patterns that are virtually impos-
sible to reproduce even when using the identical processing
conditions. We utilize OTAN to create anticounterfeiting pat-
terns on silicon, a technologically important material, and a
substrate for high added-value devices. This approach takes
advantage of the multiscale nature of the patterns by enabling
a three-level authentication process with increasing levels of
spatial resolution based on optical microscopy, scanning elec-
tron microscopy (SEM), and atomic force microscopy (AFM).
II. EXPERIMENTS’ DETAILS
A. Sample preparation
The sample on which patterns are created is a silicon
substrate cleaned in a Piranha solution and hydrogen
a)Present address: ASML Brion, 339 W. Trimble Road, San Jose, California
95131.b)Electronic mail: [email protected]
1938-1387/2017/29(1)/012006/5/$28.00 VC 2016 Laser Institute of America012006-1
JOURNAL OF LASER APPLICATIONS VOLUME 29, NUMBER 1 FEBRUARY 2017
terminated in a hydrofluoric acid solution according to stan-
dard practices.14 OTAN requires the sample to be immersed
in a liquid in which microspheres are optically trapped. To
that end, the substrate is assembled into a wet cell: a hollow
square of double-sided tape is applied to the substrate, creat-
ing a cavity in which we pipette a suspension containing
4000 particles/ll of 2 lm diameter polystyrene micro-
spheres. The wet cell is sealed by placing a glass cover slip
on the top. Finally, the sample is placed upside-down on a
MATLAB-controlled piezostage.
B. Nanopatterning by OTAN
The experimental setup for OTAN system is shown in
Fig. 1. Two lasers are used: a continuous wave laser (Spectra
Physics, Model VHP80-106Q) with a wavelength of
1064 nm for trapping particles and a pulsed nanosecond laser
(Spectra Physics, Model VSL-337ND-S) with a wavelength
of 337 nm for material processing. The pulse duration is 4 ns.
The stage speed is constant (5 lm/s), and the repetition rate
varies with the distance between pulses (0.4–10 Hz). The
trapping laser is sent through an axicon lens with a micro-
scope objective and imaged to the focal plane of the objec-
tive to create a Bessel beam optical trap. Then, the
processing laser is focused by the objective to a spot of
1.45 lm in diameter on the substrate and aligned with the
trapping beam. To make a nanofeature, we trap a bead with
the trapping laser and bring it to the selected location on the
substrate. We then illuminate the bead with a processing
laser pulse, which induces material modification underneath
the bead. A pattern made of many individual features is real-
ized by moving the piezostage, and repeating the operation
until the desired pattern is completed. At the end of the
experiment, the substrate is separated from the cover slip and
tape and rinsed with deionized water to eliminate any resi-
due. The features and patterns are imaged with an optical
microscope, a Quanta 200 FEG Environmental Scanning
Election Microscope (ESEM) and a Digital Dimension
Atomic Force Microscope (AFM).
III. RESULTS AND DISCUSSION
A. Nanofeatures on silicon
At first, we investigate the creation of individual nano-
scale features on silicon. We find that two different types of
features are created: nanocones and nanoholes, depending on
the laser fluence. SEM images (Fig. 2(a)) show the differences
between a nanocone (left) and nanohole (right), but the
detailed height and width of the features cannot be obtained.
Rather, AFM characterization is needed to determine the pre-
cise depth or height of the feature (Fig. 2(b)). In order to quan-
titatively compare the features, we fit the cones and holes to a
two-dimensional (2D) Gaussian function, from which we
extract the height and full-width-at-half-maximum (FWHM).
In the case of Fig. 2(b), the nanocone has a height of 22 nm
and the nanohole is 27 nm deep. The average height and
FWHM from 60 data points at each fluence is shown in Fig.
3. The plot of height versus fluence reveals three zones (Fig.
3(a)). At low fluences, no modification of the silicon occurs
and the height is zero. When the fluence increases, there is a
range where the height is positive and cones are formed.
Finally, in the highest fluence range, the height becomes nega-
tive as nanoholes are created on the silicon surface. The
boundaries between the three regions are not clearly defined,
because the fluence resolution of our experimental setup is not
sufficient to observe sharp transitions. However, we believe
this transition occurs with continuous change from one regime
to another based on the mechanism proposed below. The crea-
tion of nanocones and nanoholes on silicon has been described
previously in the literature, but only separately, and two dif-
ferent mechanisms have been proposed. The nanocone fea-
tures might be created by the difference in density between
the liquid and solid silicon during phase transformation.15–19
Upon irradiation with a laser pulse, silicon is locally melted.
The liquid pool of silicon cools down laterally faster than
FIG. 1. Experimental setup and the sample.
FIG. 2. AFM images and cross sections of (a) a nanocone created by a laser
fluence of 8.7 mJ/cm2 and (b) a nanohole made at 10.3 mJ/cm2.
012006-2 J. Laser Appl., Vol. 29, No. 1, February 2017 Chen et al.
depthwise. Solid silicon has a lower density than liquid sili-
con, therefore, silicon expands upon resolidification and
pushes the molten liquid silicon to the center and forms a
hump. Although this mechanism is still not fully verified,
most researchers accept this hypothesis based on the experi-
mental results and available simulation.19 This explanation is
valid for silicon thin films. The case in bulk silicon has not
been investigated, but we believe that the result would be sim-
ilar to the thin film case. In the case of the nanohole, the
Marangoni effect dominates.20,21 The surface tension of liquid
silicon has a negative temperature dependency. Therefore,
after the laser pulse, the surface tension at the edge is higher
than at the center, which drives the liquid silicon to the edge
and forms a volcano crater. The surface tension effect
becomes significant only when a higher laser fluence is
applied to the substrate because the gradient of the laser inten-
sity increases with the laser fluence. These two effects are pre-
sent simultaneously but compete with each other, so that at
low fluence the resolidification dominates, therefore creating
nanocones, whereas at high fluences, the surface tension effect
is more important and craters are formed.
B. User-designed pattern on silicon
In order to serve as a security pattern, multiple distin-
guishable features encoded in the pattern are needed. The
OTAN system is a direct-write technique, so one can design
the spacing and pattern shape as needed without resorting to
multiple layers of photomasks with different spacing and
patterns. We outline a Princeton shield with nanocones on
silicon for demonstrating the direct-write ability, as shown in
Fig. 4. Since the pattern is composed of several nanofeatures,
the distance between each nanofeature has to be defined. It is
important to take the resolution of the nanopattern into con-
sideration when we design and generate security markings.
Therefore, we investigate different spacings between indi-
vidual pulses. The smallest spacing that one can choose
before an individual nanocone begins to overlap with its
neighbor is the diameter at base, about 500 nm according to
the 2D Gaussian fit in our case. Figure 5 shows the average
height and FWHM of the nanocones in a 10 � 10 array
determined by fitting a 2D Gaussian to each feature. When
the feature separation is between 500 and 1000 nm, the aver-
age height of nanocones is around 10–20 nm, but when the
separation increases to 1500–2000 nm the average height of
the nanocones increases to around 30–40 nm. The FWHM
appears to be less sensitive to the feature separation.
The phenomenon of feature spacing dependency has not
been fully studied, but we propose that the decrease in height
at smaller spacings is due to the fact that the heat affected
zone of subsequent laser pulses overlaps with existing nano-
cones. We propose that the existing nanocones are remelted
and reform a new structure after the succeeding laser pulse
illuminates the nearby area. In order to verify the hypothesis,
we used a 3D Maxwell solver from Lumerical Computational
Solution, Inc. The simulation domain contains a 2 lm polysty-
rene bead in water and a silicon substrate. The bead-substrate
spacing is set to be 50 nm, which based on our former
research, is the typical separation distance of the OTAN sys-
tem.8 The refractive indices for the polystyrene bead, water,
and silicon substrate are 1.62, 1.34, and 5.64, respectively.
We assume absorbing boundary conditions at the left, right,
and bottom boundaries. At the top boundary, a linearly polar-
ized beam with a plane wave front and a wavelength of
337 nm propagates normally to the silicon surface, which has
a silicon nanocone 500 nm away from the center of the beam
to simulate the situation when the subsequent laser pulse cre-
ates the next silicon nanocone. The intensity enhancement
factor is calculated based on the time-averaged Poynting vec-
tor at the last interaction cycle. We slice the simulation
domain and show the intensity result on the top of silicon sub-
strate in Fig. 6, which indicates the area where one sees signif-
icant intensity enhancement is in the center of the beam,
within 500 nm in radius. This enhancement profile suggests
FIG. 3. The average height and FWHM extracted from fitting a 2D Gaussian
function to the nanofeatures, in function of the laser fluence.
FIG. 4. AFM image of the Princeton shield created by OTAN.
J. Laser Appl., Vol. 29, No. 1, February 2017 Chen et al. 012006-3
that the succeeding processing laser pulse will illuminate an
existing silicon nanocone and remelt it to form a modified
structure smaller in height.
C. Anticounterfeit pattern
An ideal anticounterfeiting strategy should prevent the
exact reproduction of a security marking even when using
the same parameters and the same technique. As we have
discussed, we are able to generate a user-designed anticoun-
terfeit pattern with feature size smaller than the diffraction
limit by OTAN. The Brownian motion associated with the
trapped bead varies the z-position of the bead while the
nature of the Bessel beam trap retains a high resolution in
the x-y plane.18 Thus, the morphology of each feature is
slightly free to vary from spot to spot. In addition, the
remelting mechanism for closely spaced features adds uncer-
tainty as demonstrated in Fig. 5. These size and shape varia-
tions ensure that the nanofeatures on the genuine item are
truly unique.
Pattern authentication by examining nanoscale features
accurately can be time consuming and expensive. In order to
reduce the effort, we propose that the OTAN-created pattern is
suitable for a multilevel authentication procedure such that
each succeeding level brings an additional layer of security
while being more time and cost intensive than the previous
one. In practice, after the pattern is produced on the genuine
item, an optical, an SEM, and an AFM image of the pattern
are recorded and stored as reference. When authentication of
the item is needed, one can compare the measured images with
the reference images. In Fig. 7, we repeat the creation of a pat-
tern in multiple locations on the silicon wafer where each fea-
ture in the pattern is created using the identical conditions. In
this case, we can compare the two patterns directly. In the first
level, the optical image provides the outline of the pattern, as
seen in the top box of Fig. 7. The laser pulse causes a change
in reflectivity in the heat-affected zone,22 which is significantly
larger than the actual nanofeature and is therefore able to be
resolved in the optical image. The size of the individual fea-
tures making up the pattern is smaller than the diffraction limit,
FIG. 5. Average height and FWHM of the Gaussian fitting for the nanocone
in function of the separation distance between pulses.
FIG. 6. Finite-Difference Time-Domain (FDTD) simulation result of the
intensity enhancement of the pulsed laser induced by the microsphere on the
silicon surface.
FIG. 7. Optical microscope image, SEM image, and AFM image of the anti-
counterfeiting pattern created by OTAN. Each feature is produced using the
identical conditions of fluence¼ 7.3 mJ/cm2 and spacing¼ 1250 nm. The
inset shows a line scan along the red line in the figure.
012006-4 J. Laser Appl., Vol. 29, No. 1, February 2017 Chen et al.
thus microscope cannot resolve this information. However, the
general shape and location of the pattern can be obtained
through optical methods. Based on this image, one would infer
that the two patterns and all features within are identical within
the uncertainty of this verification protocol. In the second level
examination involves the use of SEM to obtain a high resolu-
tion image of the features. SEM is able to elucidate the shape
(nanohole versus nanocone) and location of each nanofeature
but not able to obtain the detailed height information. Figure 7
demonstrates that all the features in both patterns are nano-
cones. However, the difference between the two patterns is
slight and difficult to quantify. For instance, differences
between the two features in the circled region cannot easily be
distinguished in this method. At the final level of examination,
we use AFM to obtain the height information of the features.
This type of investigation can be expensive and time consum-
ing but is necessary only for ultimate verification if desired.
Here, one can easily see the differences between the individual
nanocones. In particular, a line scan through the two similar
nanocones from the SEM reveals that in fact, their heights dif-
fer by a factor of 3. This multilevel verification process ensures
that a pattern is genuine and not reproducible even if the exact
same system parameters are used. However, this particular
example was perhaps the worst case scenario in that we used
the same system to create the features. In general, if one were
to reproduce our setup and acquire similar microbeads to pro-
duce patterns, it would be likely that the first two screening
techniques would reveal variation in the patterns.
IV. CONCLUSION
In this paper, we investigated the use of OTAN to create
unique covert security features on silicon for the protection of
high added-value products. We exploit the statistical fluctua-
tion intrinsic to OTAN to create truly unique patterns on sili-
con that cannot be reproduced even with the identical
conditions. One can produce either nanocones or nanoholes by
simply changing the laser fluence, and combined with the
direct-write nature of the OTAN process, a multilevel encod-
ing system can record binary information in the pattern. The
patterns themselves can be imaged by optical microscopy,
SEM, and AFM to provide a three-level authentication process
where each level increases the resolution and provides addi-
tional information about the pattern. Thus rapid, inexpensive
screening or more expensive high resolution characterization
can be selected based on the user needs for authentication.
ACKNOWLEDGMENTS
The authors gratefully acknowledge the financial
support from NSF (Grant No. CMMI-1235291) and AFOSR
(Grant No. FA9550-11-0208). Also, the authors
acknowledge the usage of PRISM Imaging and Analysis
Center, which is supported in part by the NSF MRSEC
program through the Princeton Center for Complex
Materials (Grant No. DMR-0819860). The authors sincerely
thank Joshua A. Spechler for help with acquiring SEM
images. In addition, T.-H. Chen thanks Elizabeth Davison
for helpful discussions.
1C. J. Shultz and B. Saporito, “Protecting intellectual property: Strategies
and recommendations to deter counterfeiting and brand piracy in global
markets,” Columbia J. World Business 31(1), 18–28 (1996).2G. J. Walters, “Security hologram with covert messaging,” U.S. patent
application 5/742/411 A (23 April 1998).3R. W. Phillips and A. F. Bleikolm, “Optical coatings for document
security,” Appl. Opt. 35(28), 5529–5534 (1996).4W. J. Coyle and J. C. Smith, “Methods and ink compositions for invisibly
printed security images having multiple authentication features,” U.S. pat-
ent application US7/821/675 B2 (26 October 2010).5K. Kulper and A. Koops, “Laser labels and their use,” U.S. patent applica-
tion US6/241/289 B1 (5 June 2001).6B. Dusser, Z. Sagan, D. Bruneel, M. Jourlin, and E. Audouard, “Laser
deep marking of metals and polymers: Potential interest for information
coding,” J. Phys.: Conf. Ser. 77(1), 012002 (2007).7N. S. Tanaka, S. Nishiyama, and M. Koyama, “Method for making an anti
counterfeit latent image formation object for bills, credit cards, etc.,” U.S.
patent application US5/582/103 A (10 December 1996).8E. McLeod and C. B. Arnold, “Subwavelength direct-write nanopatterning
using optically trapped microspheres,” Nat. Nanotechnol. 3(7), 413–417
(2008).9Y.-C. Tsai, R. Fardel, and C. B. Arnold, “Nanopatterning on rough surfaces
using optically trapped microspheres,” Appl. Phys. Lett. 98(23), 233110
(2011).10E. McLeod and C. B. Arnold, “Array-based optical nanolithography using
optically trapped microlenses,” Opt. Express 17(5), 3640–3650 (2009).11K. H. Leitz, U. Quentin, I. Alexeev, and M. Schmidt, “Process investiga-
tions of optical trap assisted direct-write microsphere near-field nano-
structuring,” CIRP Ann. – Manuf. Technol. 61(1), 207–210 (2012).12K. H. Leitz, U. Quentin, B. Hornung, A. Otto, I. Alexeev, and M. Schmidt,
“Microsphere near-field nanostructuring using picosecond pulses,” Phys.
Procedia 5(1), 237–244 (2010).13R. Fardel, Y. C. Tsai, and C. B. Arnold, “Microbead dynamics in optical
trap assisted nanopatterning,” Appl. Phys. A: Mater. Sci. Process. 112(1),
23–28 (2013).14B. F. Phillips, D. C. Burkman, W. R. Schmidt, and C. A. Peterson, “The
impact of surface analysis technology on the development of semiconduc-
tor wafer cleaning processes,” J. Vac. Sci. Technol. A 1(2), 646–649
(1983).15C. P. Grigoropoulos, R. H. Buckholz, and G. A. Domoto, “A heat transfer
algorithm for the laser-induced melting and recrystallization of thin silicon
layers,” J. Appl. Phys. 60(7), 2304–2309 (1986).16G. Wysocki, R. Denk, K. Piglmayer, N. Arnold, and D. B€auerle, “Single-
step fabrication of silicon-cone arrays,” Appl. Phys. Lett. 82(5), 692–693
(2003).17T. Chiba, R. Komura, and A. Mori, “Formation of micropeak array on a
silicon wafer,” Jpn. J. Appl. Phys. 39(8), 4803–4810 (2000).18J. Eizenkop, I. Avrutsky, G. Auner, D. G. Georgiev, and V. Chaudhary,
“Single pulse excimer laser nanostructuring of thin silicon films:
Nanosharp cones formation and a heat transfer problem,” J. Appl. Phys.
101(9), 094301 (2007).19J. Eizenkop, I. Avrutsky, D. G. Georgiev, and V. Chaudchary, “Single-
pulse excimer laser nanostructuring of silicon: A heat transfer problem and
surface morphology,” J. Appl. Phys. 103(9), 094311 (2008).20T. Schwarz-Selinger, D. Cahill, S.-C. Chen, S.-J. Moon, and C.
Grigoropoulos, “Micron-scale modifications of Si surface morphology by
pulsed-laser texturing,” Phys. Rev. B 64(15), 155323 (2001).21S. R. Vatsya and S. K. Nikumb, “Modeling of fluid dynamical processes
during pulsed-laser texturing of material surfaces,” Phys. Rev. B 68,
035410 (2003).22C. Grigoropoulos, H. Park, and X. Xu, “Modeling of pulsed laser irradia-
tion of thin silicon layers,” Int. J. Heat Mass Transfer 36(4), 919–924
(1993).
J. Laser Appl., Vol. 29, No. 1, February 2017 Chen et al. 012006-5