grebennikov pa design fundamentals lecture 3

43
1 3.1. Main characteristics (two-port networks, gain, 3.1. Main characteristics (two-port networks, gain, delivered power ) delivered power ) LECTURE 3. POWER AMPLIFIER DESIGN FUNDAMENTALS LECTURE 3. POWER AMPLIFIER DESIGN FUNDAMENTALS 3.2. Gain and stability 3.2. Gain and stability 3.3. Stabilization circuit technique 3.3. Stabilization circuit technique 3.5. Linearity 3.5. Linearity 3.6. DC biasing 3.6. DC biasing 3.7. Push-pull amplifiers 3.7. Push-pull amplifiers 3.8. Practical aspect of RF and microwave 3.8. Practical aspect of RF and microwave power amplifiers power amplifiers 3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

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Power Ampliifers Design Fundamentals

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Page 1: Grebennikov PA Design Fundamentals Lecture 3

1

3.1. Main characteristics (two-port networks, gain, 3.1. Main characteristics (two-port networks, gain, delivered power )delivered power )

LECTURE 3. POWER AMPLIFIER DESIGN FUNDAMENTALSLECTURE 3. POWER AMPLIFIER DESIGN FUNDAMENTALS

3.2. Gain and stability3.2. Gain and stability

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

3.5. Linearity3.5. Linearity

3.6. DC biasing3.6. DC biasing

3.7. Push-pull amplifiers3.7. Push-pull amplifiers

3.8. Practical aspect of RF and microwave 3.8. Practical aspect of RF and microwave power amplifierspower amplifiers

3.4. Class-A,-B,-C operation modes3.4. Class-A,-B,-C operation modes

Page 2: Grebennikov PA Design Fundamentals Lecture 3

2

3.1. Main characteristics3.1. Main characteristics

1

[W] Output

matching circuit

Input matching

circuit

Load WL

I1 I2

V1 V2

2 4

3

Source WS

Generalized single-stage power amplifier circuitGeneralized single-stage power amplifier circuit

1

[Y] YL

I1 I2

V1 V2

2 4

3

YS IS

1

[Z] ZL

I1 I2

V1 V2

2 4

3 ZS

VS

2221212

2121111

VYVYI

VYVYI

Two-port active device is characterized by immitance W-parameters which means system of impedance Z-parameters or admittance Y-parameters

Matching circuits are necessary to transform source WS and load WL immitances into definite values between points 1-2 and 3-4, respectively

If source of input signal is presented by current source with internal admittance YS

device is characterized by Z-parameters

2221212

2121111

IZIZV

IZIZV

device is characterized by Y-parameters

If source of input signal is presented by voltage source with internal impedance ZS

Page 3: Grebennikov PA Design Fundamentals Lecture 3

3

3.1. Main characteristics3.1. Main characteristics

Power amplifier gainPower amplifier gain(in terms of Y-parameters)(in terms of Y-parameters)

• Operating power gain GP = PL /Pin - ratio of power dissipated in active load GL to power delivered to input port of active device with admittance Yin : this gain is independent of GS but is strongly

dependent on GL

• Available power gain GA = Pout /PS - ratio of power available at output port of active device with admittance Yout to power available from

source GS : this gain depends on GS but is independent of GL

• Transducer power gain GT = PL /PS - ratio of power dissipated in active load GL to power available from source GS : this gain

strongly depends on both GS and GL

• Maximum available gain MAG - theoretical power gain of active device when its reverse transfer function Y12 is set equal to zero : represents theoretical gain limit that can be achieved with given

device under assumption of conjugate input and output impedance matching

Page 4: Grebennikov PA Design Fundamentals Lecture 3

4

3.1. Main characteristics3.1. Main characteristics

Operating power gainOperating power gain

• operating power gain to characterize device amplifying capability and multistage power amplifier

in2

1in Re 5.0 YVP

2L2 VYI

L22

21 1211

1

1in

YY

YYY

V

IY

L2

2L Re 5.0 YVP

in

2

L22

L

2

21

in

LP

Re

Re

YYY

YY

P

PG

Two types of power gain are widely used: operating power gain GP and transducer power gain GT

• transducer power gain to evaluate input matching and stability

Power flowing from input port

From

2221212

2121111

VYVYI

VYVYI in view of

input admittance

Output power dissipated in load

operating power gain

1

[Y] YL

I1 I2

V1 V2

2 4

3

YS IS

Page 5: Grebennikov PA Design Fundamentals Lecture 3

5

3.1. Main characteristics3.1. Main characteristics

Transducer power gainTransducer power gain

S

2

S Re8

Y

IP S

11SS IVYI

1

L22

2112L22S11S

V

YY

YYYYYYI

2

2112L22S11

LS

2

21

S

LT

Re Re 4

YYYYYY

YYY

P

PG

2211

2

21

ReRe 4

YY

YMAG

Transducer power gain GT includes assumption of conjugate matching

both load and source

Power flowing from input port

From

2221212

2121111

VYVYI

VYVYI in view of

1

[Y] YL

I1 I2

V1 V2

2 4

3

YS IS

source current

Output power dissipated in load L2

2L Re 5.0 YVP

transducer power gain

Maximum available gain (Y12 = 0, YS = Y11

*, YL = Y22*)

Page 6: Grebennikov PA Design Fundamentals Lecture 3

6

3.1. Main characteristics3.1. Main characteristics

Small-signal FET power amplifierSmall-signal FET power amplifier

Equivalent circuit with Cgd = 0

RS

VS RL Cds Yin

Lin

Lout

g

Rds

Rgs

s

Yout

s

d

Cgs gmV V

gsgsgs11 1/ CRjCjY

012 Y

gsgsm21 1/ CRjgY

dsds22 /1 CjRY

gs2

in /1 CL

gsS RR

gs

ds

2

T gdT 4

0R

R

f

fMAGCG

gsmT 2/ Cgf

gs

dsT max 2 R

Rff

2

TTTT

f

ffGfG

Input and output conjugate matching

ds2

out /1 CL dsL RR

- transition frequency

- maximum frequency where MAG = 1

- gain estimation at any frequency vs gain at transition

frequency

Page 7: Grebennikov PA Design Fundamentals Lecture 3

7

3.2. Gain and stability3.2. Gain and stability

0 Im

0 Re

inS

inS

WW

WW

0 Im

0 Re

outL

outL

WW

WW

0 Re S W

0 Re out W

Principle of power amplifier design - to provide maximum power gain and efficiency for given output power with predictable degree of stability

Main reasons of instability:• positive feedback from output to input through intrinsic feedback capacitance

or inductance of common-grounded terminal• oscillation conditions due to external elements forming positive feedback loop

In terms of immitance approach, circuit will be unconditionally stable if for both hypothetical conditions of open-circuited input and output ports:

In case of opposite signs, active two-port network can be treated as unstable or potentially unstable (having negative input or output immitance)

Requirements of power amplifier stability can be simplified to

0 Re L WWhen

0 Re in W

Page 8: Grebennikov PA Design Fundamentals Lecture 3

8

Device stability

S11

21 1222out

WW

WWWW

0 Reminout W

0Im /Re out SWW

S11

21 1221 1222out Re2

Re Re Re

WW

WWWWWW

11

21 1221 1222out Re2

Re Re Re

W

WWWWWW

0 Re Re Re2 21 1221 122211 WWWWWW

21 12

21 122211

Re Re Re 2

WW

WWWWK

- device stability factor

3.2. Gain and stability3.2. Gain and stability

In common case, value of ReWout depends on WS within definite values of WS, ReWout < 0 and two-port network will

be potentially unstable

To provide unconditional stability

Minimum positive value when ReWS = 0 :

Unconditional stability: K > 1

Potential instability: -1 < K < 1

Page 9: Grebennikov PA Design Fundamentals Lecture 3

9

- maximum gain (maximum achievable value at K = 1)

1

Re Re Re 2

21 12

21 12L22S11T

WW

WWWWWWK

0 Re

L

P

W

G

0 Im

L

P

W

G

in

2

L22

L

2

21

in

LP

Re

Re

WWW

WW

P

PG

1 Re2

Re 2

11

21 12oL K

W

WWW

22

11

21 12oL Im

Re2

Im Im W

W

WWW

1 / 2

12

21Pmax KK

W

WG

3.2. Gain and stability3.2. Gain and stability

When active device is potentially unstable, power amplifier stability can be improved with proper choice of source and load immitances, WS and WL:

Circuit stability

Maximum gain with unconditionally stable device

When K > 1, it is necessary to choose load immitance WL to maximize finite

value of operating power gain GP :

Page 10: Grebennikov PA Design Fundamentals Lecture 3

10

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Stability factor through Z-parameters:

21 12

21 122211

Re 2

ZZ

ZZRRK

C

Zin XL

b rb

e e

c

C

gmV

V

T m12

T mb11

1/1

1/1

jg

Z

jg

rZ

2

m

T

m

mb

1

1

2

Cg

Cg

grK

C

ggrK

T

mmb 12

Frequency domains of BJT potential instability

BJT equivalent circuit Z-parameters:

T T m22

T m21

1/

1

1

1/

1

1

jCg

Z

jCjg

Z

BJT stability factor

Maximum value at higher frequencies:

Page 11: Grebennikov PA Design Fundamentals Lecture 3

11

where

1 12/ 2

2

T

m2mb

mp2

C

ggr

C

gf

Crf

bp2 4

1

C

Zin XL

b rb

e

c

C

gmV

V

Le

2 bT

2

bT

bT

bT

bT Tp3,4

1

8

4 1

8

41

CrCr

Cr

Cr

Crff

beT / rL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of BJT potential instability

Only one unstable frequency domain with low fp1 and high

fp2 boundary frequencies

For K = 1 or

At low frequencies if to take into account dynamic base-emitter resistance r and Early

collector-emitter resistance r0 K > 1

In common case, at higher frequencies with parasitic emitter lead inductance Le :

Expression for low fp3 and high fp4 boundary frequencies of second

domain of BJT potential instability

Page 12: Grebennikov PA Design Fundamentals Lecture 3

12

LmLT

m

m

T

mbin

1

1

1

1

11

XjgXCC

g

Cg

jgrZ

CrL

L

bT S

L 1

LS

LL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of BJT potential instability

Appearance of second frequency domain of BJT potential instability is result of simultaneous effect of feedback capacitance C and emitter lead inductance Le

• first case for Le = 0 and reactive load XL:one frequency domain of potential instability

Hartley oscillator

Boundary condition of first potential instability domain:

to prevent oscillations reduce value of collector choke inductance and

increase value of base choke inductance

Page 13: Grebennikov PA Design Fundamentals Lecture 3

13

LS

LL

Le

CS

Le

LL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of BJT potential instability

• second case for Le 0 and reactive load XL: two frequency domains of potential instability

- parasitic oscillator with

inductive source and

load reactances - parasitic oscillator with

capacitive source and inductive load reactances

first frequency domain

second frequency domain

Appearance of second frequency domain of BJT potential instability is result of simultaneous effect of feedback capacitance C and emitter lead inductance Le

Page 14: Grebennikov PA Design Fundamentals Lecture 3

14

21 12

21 122211

Re 2

YY

GGGGK

gdgsgs

gs11

1

Cj

CRj

CjY

Cds Yin XL

g

Rds

Rgs

s s

d

Cgs gmV V

Cgd

2gsgs

gsgs

gd

gs

dsm 1

1

2 1

CR

CR

C

C

RgK

gd

gs

dsm

12

1 C

C

RgK

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of MOSFET potential instability

Stability factor through Y-parameters:

MOSFET equivalent circuit Y-parameters:

gddsds

22

gdgsgs

m21

1

1

CCjR

Y

CjCRj

gY

MOSFET stability factor:

Maximum value at higher frequencies:

gd12 CjY

Page 15: Grebennikov PA Design Fundamentals Lecture 3

15

dsmgd

gs

gd

gs

dsm

gsp2

1

1

1 4

1

RgC

C

C

C

Rg

CRf

gs

gsCRf

gsp2 4

1

Cds

Yin YL

g

Rds

Rgs

s

d

Cgs gmV V

Cgd

Ls

Rd

K

0.5 1.0 RgsCgs

0.5

1.0

0

= 0

3

6

4 gssT / RL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of MOSFET potential instability

Only one unstable frequency domain with low fp1 and high

fp2 boundary frequencies

For K = 1or

At low frequencies if to take into account gate leakage resistance K > 1

In common case, parasitic emitter lead inductance Le creates second frequency domain of potential instability at higher frequencies

When = 3.5 second frequency domain disappears

Page 16: Grebennikov PA Design Fundamentals Lecture 3

16

ds

L

ds

gddsds

gsgsT

dsmgsgs

gsin

1 1

1 1

1 1

C

B

C

CCRj

CRjj

RgCRj

CjY

LS

LL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of MOSFET potential instability

Appearance of second frequency domain of MOSFET potential instability is result of simultaneous effect of feedback

capacitance Cgd and source lead inductance Ls

Hartley oscillator

• first case for LS = 0 and reactive load XL:one frequency domain of potential instability

Page 17: Grebennikov PA Design Fundamentals Lecture 3

17

LS

LL

Ls

CS Ls

LL

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Frequency domains of MOSFET potential instability

• second case for LS 0 and reactive load XL: two frequency domain of potential instability

- parasitic oscillator with

inductive source and

load reactances

- parasitic oscillator with capacitive source and

inductive load reactances

first frequency domain

second frequency domain

Appearance of second frequency domain of MOSFET potential instability is result of simultaneous effect of feedback

capacitance Cgd and source lead inductance Ls

Page 18: Grebennikov PA Design Fundamentals Lecture 3

18

• use active device with stability factor K > 1

• if it is impossible to choose active device with K > 1, provide circuit stability factor KT > 1 on operating frequency by appropriate choice

of real parts of source and load immitances

• choose such reactive parameters of matching circuits adjacent to input and output of active device which are necessary to avoid

self-oscillation conditions

• disrupt equivalent circuit of possible parasitic oscillators

In common case, it is difficult to propose unified approach to provide stable operation of different power amplifiers

especially for multistage power amplifier

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

General requirements to provide stable operation of power amplifier:

Page 19: Grebennikov PA Design Fundamentals Lecture 3

19

• at lower frequencies when frequency of parasitic oscillations fp is significantly smaller operating frequency f0 (fp << f0)

Stability analysis must be done in different frequencies ranges:

R1

L1

C1

Vcc C2

L2

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

R1 L1

C1

Vcc

- using stabilizing resistor R1 in

parallel to RF choke

R1

L1

C1

Vcc

L2

- using stabilizing resistor R1 in parallel to additional RF choke to

avoid degradation of RF performance

R1

L1

C1

Vcc C2

- using stabilizing resistor R1 with series bypass

capacitance C2 in parallel to power

supply

- using additional RF choke if impedance of series R1C2 circuit is too high

Page 20: Grebennikov PA Design Fundamentals Lecture 3

20

L2 C1

Vcc Vb

C2 C3

C4

C5

L1

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

- inductive impedance at device input

Stability analysis must be done in different frequencies ranges:

• at higher frequencies when frequency of parasitic oscillations fp is significantly higher operating frequency f0 (fp >> f0)

- reduce value of collector choke inductance- increase value of base

choke inductance

- capacitive impedance at device output

Page 21: Grebennikov PA Design Fundamentals Lecture 3

21

R1

L1 C1

L2

C2 C3

Yout Ystab

R1

L1 C1 L2

C2 C3

Zout Zstab

3.3. Stabilization circuit technique3.3. Stabilization circuit technique

Stability analysis must be done in different frequencies ranges:

series L1C1 circuit is tuned on operating frequency series connection of

stabilizing RLC circuit connected in series

between active device and output matching

circuit

parallel connection of stabilizing RLC circuit between active device and output matching

circuit

• near operating frequency frequency when frequency of parasitic oscillations fp is close to operating frequency f0 (fp f0)

Page 22: Grebennikov PA Design Fundamentals Lecture 3

22

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

Vcc

0

2Vcc

0 2

t

i v

t

I

Iq

V

R

Vcc

0

i

vin

vin

Vin

Vb

t

i

2

Vp

Vcc

v

Class AClass A

- input cosinusoidal voltage

tVVv cos inbin

tIIi cos q

tVVv cos cc

ccq0 VIP

VIP 0.5

2

1

2

1

qccq0 I

I

V

V

I

I

P

P

cc/ VV

1 / q II

.50

- output cosinusoidal current

- output cosinusoidal current

- DC output power

- fundamental output power

Transfer characteristic

Input voltage

Output current

Output voltage

- collector efficiency

- voltage peak factor

For ideal condition of zero saturation voltage when 1

- maximum collector efficiency in Class A

Page 23: Grebennikov PA Design Fundamentals Lecture 3

23

Vcc

2 0

2Vcc

t

i v

t

V R

Vcc

0

i

vin

vin

Vin

t

0 2

I

i

i1

= 90

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

2 , 0

, cos q

t

ttIIi

cos 0 q IIi

I

Iq cos

cos cos tIi

cos 1 max IIi

-output currentconduction angle 2

indicates its duty cycle

- input cosinusoidal voltage

tVVv cos inbin

For moment with zero current

For moment with maximum current

Class BClass B

Transfer characteristic

Output voltage

Output current

Input voltage

Page 24: Grebennikov PA Design Fundamentals Lecture 3

24

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

- quiescent current as function of half-conduction angle

where

cos q II

• when > 90 cos < 0 Iq > 0 - Class AB operation mode

• when = 90 cos = 0 Iq = 0 - Class B operation mode

• when < 90 cos > 0 Iq < 0 - Class C operation mode

3 cos 2 cos cos 3210 tItItIIi

0 0 cos cos 2

1

ItdtII

1 1 cos cos cos 1

ItdttII

,cos sin1

0

cos sin 1

1

2

1

2

1

0

1

0

1

0

1 I

I

P

P

1 When = 90 and .7850 4

- Fourier series

where - DC component

- fundamental component

- collector efficiency

- maximum collector

efficiency in Class B

- current coefficients

Page 25: Grebennikov PA Design Fundamentals Lecture 3

25

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

- dynamic characteristic of power amplifier or load line function within

- slope of load line

R

v

R

VIi

11

ccq

t

t 0

i

v

t

Imax

i

= 90

Vcc 2Vcc Vsat

V

M N M' M'' N' N''

K

0 Iq

L

P

Vcos

I

RV

I

1

1

cos 1 tan

Output current

Input voltage

Transfer characteristic

Page 26: Grebennikov PA Design Fundamentals Lecture 3

26

t 0

i

v

t

I

i

= 90

K

0

L

M P

Vcc 2Vcc

I

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

For increased input voltage amplitude:

Output current

Input voltage

Transfer characteristic

Class BClass B

MP – pinch-off region

• operation in saturation, active and pinch-off regions

KM – active region

KL- saturation region (depression in collector current waveform)

• load line represents broken line with three sections:

Page 27: Grebennikov PA Design Fundamentals Lecture 3

27

3.4. Class-A,-B,-C operation modes 3.4. Class-A,-B,-C operation modes

• collector current becomes asymmetrical for complex

load impedance

0

i

v

a).

0

i

v

b).

t0

t1

t2

t2

t1

t0

asymmetrical load line

• for inductive load impedance, depression in collector current waveform is shifted to the left (a)

• for capacitive load impedance, depression in collector current waveform is shifted to the right (b)

Reason: different phase conditions for higher-order harmonics

Page 28: Grebennikov PA Design Fundamentals Lecture 3

28

To evaluate nonlinear properties of power amplifier,consider transfer function of active device in common form of i = f(v)

where i - output current, v - input voltage

3.5. Linearity3.5. Linearity

1

n 0n

n

0 1

o

n Vv

Vvv

vf

n!Vfvf

where V0 - DC bias voltage

Usual method to determine nonlinear properties is to to apply two-tone excitation test signal

v

t

2V

T/2

tVtVv 2 21 1 cos cos

For two signals with equal amplitudes V1 = V2 = V :

ttV coscos2

2/ 2 1

2/ 2 1

Peak envelope power PEP corresponds to maximum amplitude of 2V:

RVP 2/2 2PEP

Total power due to each tone:

RVPPP / 22 1total

PPP 4 2 out PEP

2 1 PPP where

where

Page 29: Grebennikov PA Design Fundamentals Lecture 3

29

3.5. Linearity3.5. Linearity

For two-tone excitation test signal tVtVVv 2 21 10 cos cos

22

212

2

0

o4

1 VV

v

vfVfvfi

Vv

tVVV

v

vfVf

Vv

1 12

22

13

3

0 cos 2

1

4

1

o

tVVV

v

vfVf

Vv

2 22

22

13

3

0 cos 2

1

4

1

o

cos2 cos2 4

1 2

221

212

2

o

tVtVv

vf

Vv

cos3 cos3 24

1 2

321

313

3

o

tVtVv

vf

Vv

cos 2

1 2 1 212

2

o

tVVv

vf

Vv

2 cos 2 cos 8

1 2 1

2212 1 2

213

3

o

tVVtVVv

vf

Vv

Taylor’s expansion of output current for first three derivatives results in

Page 30: Grebennikov PA Design Fundamentals Lecture 3

30

3.5. Linearity3.5. Linearity

• variation of DC bias point is directly proportional to second derivative (in common case - even derivatives) of transfer function

• device transfer function will be linear only if third derivative (in common case - odd derivatives) is equal to zero

• first-order mixing products (total and differential) depend on even derivatives of transfer function

• even harmonic components are result of even derivatives of transfer function; odd harmonic components are result of odd

derivatives of transfer function

Main conclusions:Main conclusions:

• mixing products of third and higher order are mainly determined by odd derivatives of transfer function

Distortions which are determined by second derivatives of device transfer function are called second-order intermodulation distortions;distortion which are determined by third-order derivatives are called

third-order intermodulation distortions

Page 31: Grebennikov PA Design Fundamentals Lecture 3

31

3.5. Linearity3.5. Linearity

Output current amplitude of fundamental, second and third harmonic or intermodulation

components depends on first, second and third degree of input

voltage, respectively Pout, dBm

Pin, dBm

IP2

P1dB

IP3

P1

P21 P212

dBm 1 nIM 1nIPnnPP

dBm 2 22 11IPPP

dBm 2 3 32 121IPPP

dBm 9 31dB IPP

Consequently, output powers of linear, second- or third-order component show

straight-line behavior and vary by 1 dB, 2 dB and 3 dB,

respectively, with 1-dB variation of input power

These straight lines intersect at some points which are called intercept points IPn

- 1-dB gain compression point

Third-order intermodulation component

Second harmonic component

Page 32: Grebennikov PA Design Fundamentals Lecture 3

32

3.5. Linearity3.5. Linearity For MOSFET device, there is optimum bias point with drain quiescent

current Idg in limits of 0.1…0.15 Idss when IM3 can be minimized providing high-power and high-efficiency operation because of

quadratic transfer function in this region

21 2

V1

V9

V5

V7

V3

2

1 2

2 1 31 2

2 32 2

1

V2

IM3

Pout 0

Idq3

Idq2 Idq1 Idq1 > Idq2 > Idq3

dBc / log 10 2121 22103 PPPPIM

dBc / log 10 2121 2323105 PPPPIM

21 PPP

Output spectrum containing n-order intermodulation components

- third-order intermodulation product

- fifth-order intermodulation product

where

Page 33: Grebennikov PA Design Fundamentals Lecture 3

33

3.6. DC biasing3.6. DC biasing DC biasing of active device provides required operation condition

which should be stable over input power, temperature or technology process variations

R1 L1

VT1

R3

R2

Vdd

R1 L1

VT1

VD1

R2

Vdd

VD2

For MOSFETs as voltage controlled devices, at normal conditions it is enough to use resistive divider to set gate bias

voltage

However, in wide temperature range when device threshold

voltage varies with temperature (2 mV/C), to reduce quiescent current

variation, it is possible to use silicon diode in series to

variable resistor

When device threshold

voltage is too high, it is best

to connect several silicon

diodes in series

R1 L1

VT1

VD1

R2

Vdd

Such simple bias circuit configurations for MOSFETs become possible in view of

extremely small gate DC current equal to its leakage

current only

Page 34: Grebennikov PA Design Fundamentals Lecture 3

34

3.6. DC biasing3.6. DC biasing

For bipolar transistor as current-controlled device, to stabilize quiescent current it is best to use current-mirror type of bias circuits where reference diode is formed

using same diode-connected transistor with substantially smaller area

Current mirror bias circuits

RFin

Vref

RFout

Vcc

Q1

Q0

R1

R0

R2

RFin

Vref

RFout

Vcc

Q1

Q3

Q0

Q2 R0

To minimize quiescent current variations over temperature, ratio of ballast resistors R1/R0 must be equal to device area ratio Q0 /Q1

However,to fix current flowing from reference source through resistor R2, its value should be much higher than base

current of RF device Q0

To reduce current from reference source and to increase current

driving capability for high power RF device, driving transistor Q3 is used

to feed DC base current for RF device Q0

Page 35: Grebennikov PA Design Fundamentals Lecture 3

35

3.6. DC biasing3.6. DC biasing

Current mirror bias circuits

RFin

Vref

RFout

Vcc

Q1

Q2

Q0

R1

R0

R2

Pin, dBm

Vbe0, V

-10 -5 0 5 10 15

1.0

1.1

1.2

1.3

1.4

1

2

RFin

Vref

RFout

Vcc

Q1

Q2

Q0

R1

R0

R2

It is very important to provide ratio of ballast resistors R1/R0 equal to ratio of device areas Q0/Q1 which minimizes

variations over temperature as well as stabilizes DC bias point over input power

Popular configuration of temperature compensated bias circuit contains one

reference transistor and one driving device

1 - required value of ballast

resistor R1

2 - R1 = 0

To minimize current from reference voltage source, emitter

follower configuration can be used where this current is equal to

extremely small base current of emitter follower device Q2

Page 36: Grebennikov PA Design Fundamentals Lecture 3

36

3.7. Push-pull amplifiers3.7. Push-pull amplifiers

Push-pull operation helps to increase values of input and output impedances and to additionally suppress even harmonics

2 , 0

0, sin cc1

Ii

2 , sin

0, 0

cc2 I

i

first transistor collector current

second transistor collector current

RL

T1 T2

Vb Vcc

ic1

ic2

iL

icc

n2

n1

n1

Ic

2

Ic

2

Ic

2

Ic

2

Ic0

ic1

ic2

icL icc

For 50% duty cycle of each device (ideal Class B) with driving sinusoidal voltage:

Being transformed through output transformer T2, total collector current:

sin cc2c1L Iiii

Current flowing in center tap of primary winding of transformer T2:

sin cc2c1cc Iiii

Page 37: Grebennikov PA Design Fundamentals Lecture 3

37

3.7. Push-pull amplifiers3.7. Push-pull amplifiers

sin sin L L cL VRIv

c

2

0

ccco 2

2

1 IdiI

ccc0

2VIP

cccout 2

1VIP

%5.78 4

0

out

P

P

Ideally, even-order harmonics are canceled as they are in-phase and combined in center tap of primary winding of output transformer

RL

T1 T2

Vb Vcc

ic1

ic2

iL

icc

n2

n1

n1 To eliminate losses, it is necessary to connect bypass capacitance to this

center point

As for 50% duty cycle, third- and higher-order odd harmonics do not exist, ideally

sinusoidal signal will appear in load

Total DC collector current

For zero saturation resistance when collector voltage amplitude Vc = Vcc and equal turns of winding when VL = Vc, DC

and fundamental output powers

Maximum theoretical collector efficiency that can be achieved in

Class B operation

Page 38: Grebennikov PA Design Fundamentals Lecture 3

38

3.7. Push-pull amplifiers3.7. Push-pull amplifiers

In balanced circuit, identical sides carry 180° out-of phase signals of equal amplitude

ground virtual

If perfect balance is maintained, there are midpoints where signal amplitudes are zero

Such a condition is called virtual grounding

Being inside device package with two balanced transistors, virtual ground reduces common-

mode inductance and simplify matching circuit

Matching conditions for single-ended transistor

Simplification for balanced transistors where matching parallel capacitances

are combined and DC blocking capacitances are not required

Page 39: Grebennikov PA Design Fundamentals Lecture 3

39

3.7. Push-pull amplifiers3.7. Push-pull amplifiers

Pin Pout

Pin Pout C1

C2

C3 C4 C5

C6

C7

l2

l1

l3

l4

l5

l6

l8

l7

T1

T2

T8

T7

For push-pull operation, unbalance-to-balance transformation is required

• most suitable approach is to use 1:1 coaxial transformer

• to minimize transformer size and provide broadband

operation with minimum return loss, coaxial

transformers are mounted and soldered

along shortened microstrip lines and additional shortened stubs are added for

symmetry

• for 50-ohm source and load, its characteristic impedance = 50 Ohm

and each balanced part sees 25 Ohm

• as shortened stubs produce inductive impedances, series capacitors C1 and C2 are used forming high-pass

matching sections

Page 40: Grebennikov PA Design Fundamentals Lecture 3

40

3.8. Practical aspect of RF and microwave power amplifiers3.8. Practical aspect of RF and microwave power amplifiers

• matching circuits in form of L-transformers:parallel microstrip open stubs represent capacitive reactances,

series microstrip lines represent inductive reactances

Input

Vbias

Output

l1

l2

l3

l4

C2

Vsupply

C1

• bias circuits contain quarterwave loaded and opened microstrip lines for RF signal isolation

Typical microwave power amplifier topology

Page 41: Grebennikov PA Design Fundamentals Lecture 3

41

3.8. Practical aspect of RF and microwave power amplifiers3.8. Practical aspect of RF and microwave power amplifiers

50

10 V

Pin 50

25

82

330 1 k 3.3 k 7 V

50

25

82

0.68 F

29 50

100 pF

50 10 pF 30 pF

1-5 pF 1-5 pF

Pout 50

29

• drain bias circuit contains additional RC-circuit to prevent high-frequency oscillations and large capacitance to prevent low-frequency oscillations

Microwave 2.5-2.7 GHz 5 W GaAs MESFET power amplifier topology

• matching circuits are combinations of L-transformers (parallel capacitors and series microstrip lines) and quarterwave lines with

different characteristic impedances

Page 42: Grebennikov PA Design Fundamentals Lecture 3

42

3.8. Practical aspect of RF and microwave power amplifiers3.8. Practical aspect of RF and microwave power amplifiers

/4

Pout

50

/4

PA1

PA2

50 /4

/4

Pin

Vg

lin

Z2

Vdd

Vg Vdd

0.25

50

0.25

50

0.25 0.25

1 pF

1 pF

1 pF

1 pF Pout 50

Pin 50

lin

lout

lout

RFC RFC

RFC RFC

Z2

Z2

Z1

Z2

Z3 Z1 Z3

in1 ZZ 2

outin 2

ZZZ out3 ZZ

• to combine output powers from two or more transistors at

microwaves, 90-degree branch-line hybrids are widely used where active devices are isolated from

each other

Microwave balanced power amplifier

• at equal reflection coefficients from loads connected to output terminals,

reflection wave is absent at input terminal and flowing to 50-ohm

ballast resistor

• branch-line hybrid also can work as

impedance transformer with characteristic impedances of its

microstrip branches as

Page 43: Grebennikov PA Design Fundamentals Lecture 3

43

3.8. Practical aspect of RF and microwave power amplifiers3.8. Practical aspect of RF and microwave power amplifiers

Vg

10 V Vg

40 , 33

5 pF

5 pF

50 Ohm

Pin 3.8 pF

3.8 pF

5 pF

5 pF

50 , 62

40 , 33

20 pF

20 pF

49 , 14

49 , 14

40 , 89

40 , 89

5 pF

5 pF

87 , 5

87 , 5

2 k

2 k

50 , 62

10 V

Pout

50 Ohm

• for monolithic microwave applications, when output resistance of transistor is

slightly less or higher than 50-ohm, it is convenient to realize

parallel connection of active devices (easy to provide circuit

symmetry for packaged devices)

Microwave 5.5 GHz 2.5 W GaAs MESFET power amplifier topology

• to combine power from two transistors, it is necessary

simply to transform impedance from each device to 100 Ohm and then parallel

connection results in required 50-ohm load

• input matching circuits represent quarterwave microstrip line transformer and L-transformer with series microstrip line and parallel capacitance each