greeting from chapter chair - eps...

IEEEElectronicsPackagingSociety(EPS)MalaysiaChapterNewsletterH2-2018

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GreetingfromChapterChair:Greetings to all EPS M’sia members for Y2018! How time flies, we areapproachingtheendofY2018.

As updated in the 1H of the Y2018 newsletter, we are very glad that ourprestigious and regionally recognized conference, International ElectronicsManufacturingTechnology(IEMT2018)conference,washeldverysuccessfullyat the Historical City of Malacca back in September 2018. Volunteers fromthree sectors: localmultinational semiconductor companies suchas InfineonTechnologies, Intel, ON Semiconductor, Carsem, Atotech, Lumileds, NXP,STMicroelectronics and Tactilis; local universities: UM, UKM, UTM and USMalong with the semi-governmental body CREST, formed the organizingcommittee thatwouldbring theconference to fruition.ThisyearconferencealsoachievedthehighestnumberofparticipantsinthehistoryofIEMTwithatotal of 490participants. Setting this as thenewbenchmark, I amexpectingtheIEMT2020plannedtobeheldinKualaLumpurtomeetorexceedthat.

ShawFongWONGIEEEEPSM’sia

ChapterChair2018IntelTechnology

Moreover,theteamhadaccomplishedsomeothermajormilestoneswiththeirtirelessvolunteeringtoserveourtechnicalcommunity.Someoftheselandmarkachievementsareregional innature,exemplifiedbyourefforttotableameetingwith3localVietnameseUniversitiesinMarch2018withtheobjectivetohelpseedandinitiateaVietnamIEEEEPSchapterinHoChiMinhCity.WehadthebackingoftheSantaClaraEPS,IntelVietnamandOn SemiconductorVietnamas it helps to raise regional technical expertise.We sharedwiththem about global IEEE EPS society structure, our objectives and examples of benefits/activities of EPSMalaysia as an example.We are committed to support Vietnam team to achieve that goal, providingguidanceandassistanceinto2019.Onthelocalfront,inMalaysia,wecarriedonorganizingandfundingthe“BestEngineeringStudentAward”(BESA)programwithcertainidentifiedlocaluniversities.Thisprogramaimstorecognizeandrewardourfinalyearengineeringstudent’sprojectwithaprestigiousaward,thusencouragingthenextgenerationengineersto pursue technical excellence. Another landmark achievement is the initiation and roll out of our longawaitedmembershiprewardprogramtoallourlongtermengagedloyalmembers,whichwasexecuted.Thisaimstoretainmemberswhilstgrowingthesocietymembership.Wealsoextendedour involvementtoourregional EPS chaptersby conducting some invitedpaper speaker sessionsatChina, Taiwan, SingaporeandHongKongtoexchangeknowledgeandideas. Inadditiontoallthese,werevampedourchapter’swebsite,aiming forbetter informationdissemination, sharing, referenceandalsoarchiving.Please refer to this link(https://ieee-epsmalaysia.org) formoredetail of our newly set upwebsite! There aremanymoreexcitingprogramsthatarebeingworkedoutbyourcommitteeandtheseareexpectedtoproduceresults in2019.Staytuneforthat!Lastly,Iwishtotakethisopportunitytosincerelythankourchapter’sExComemberswhoalwaysdisplayaverygreatvolunteeringspiritfornumerousyears.IalsowanttowishyouallagreatHappyNewYear2019!WeareintherightpathtocontinuerepositioningelectronicpackagingasasignificantvaluecreatorandIPdifferentiatorforvariousdomainsinthisvibrantsemiconductorindustry,whichincludes5Gcommunication;autonomousdrivingandvirtual realitydevices.Theheterogeneouspackaging forbigdata,whichpresentsmany challenges in this fast paced world, also provides great opportunities for our respective industrygroups to collaborate towards greater innovations. Looking forward to your participation and continuedsupportinourexciting2019events!


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IEEEEPSVietnamChapterSeedingandInitiation (CompiledbyCHChew)

Lookingback,MalaysiaIEEEEPSchapterandIEMTconferencewouldnothavebeensuccessfulwithoutDr.BillChen and our sister chapter, Santa Clara EPS chapter’s great support 12 years back. Currently, withmoreinvestments intoVietnam(Intel,ONSemiconductor,Foxconnamongstothers), therewillbegreaterneedtocontinuetobringuptheknowledgeandcompetency levelof the local industriesanduniversitiesassociatedwithSemiconductorPackagingandManufacturingTechnologywithinVietnam.Inspired by Santa Clara EPS example of supporting the setup of a sister chapter in a new region, IEEE EPSMalaysia(SFWongandCHChew)initiatedafacetofacemeetingwith3localVietnamUniversitiestodiscussandadvocatethesettingupofaEPSchapterinVietnam(VN).TheyhadthesupportofIntelVietnamandONSemiconductor Vietnam, as well as Santa Clara EPS. SF and CH shared with the VN team about IEEE EPSobjectivesandexamplesofbenefits/activitiesofEPSMYtoenhancingknowledgeanddevelopingthecountry’shumanresourcesinthefaceoftechnicalchallenges.2sponsoredticketstoIEMT2018werepresentedtotwooftheHoChiMinhUniversityheadsofdepartmenttoexperiencefirsthandthetechnicalknowledgesharingavailableandwhatEPSVNcouldlooklikeinyearstocome.TheinvitedparticipantscameandwereimpressedbyhowwellEPSMalaysiaorganizedthehighlyreputableIEMTconferencesuccessfullyfornumerousyears.DrBillChen/ProfSungYi/ProfKyungW.Paik/DrKimShyong/DrCheongalsothankedtheUniversityheadsofdepartmentandVietnamEngineersfortakingthefirststepbyattendingEPSconferences.Furthermore,theymotivatedthedelegatestocontinueparticipatingintheregionalEPSactivitiesandstronglyencouragedthemtosetupthesisterchapterinVietnam.WhiletherearemanychallengestosettinguptheEPSchapterinVietnamandimprovingthecompetenciesofthelocaltalents,theobjectiveisachievablewiththesupportofregionalchapters.EPSMalaysiaiscommittedtosupportVietnamteamtoachievethatgoalwiththeguidanceandassistancefromEPSheadquarters.

Figure1:SFWong,CKChewandtheVNteam

Figure2:SFWong,CKChewandtheVNteam


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EPSEngagementinCREST2018Semiconductor&OptoelectronicsBootcamp

EPS Malaysia chapter was invited to engage in the Collaborative Research in Engineering, Science &Technology(CREST)Semiconductor&OptoelectronicsClusterBootcampfrom2ndto5thofAugust2018.IntheeveningofAugust3rd,5youngengineersfromIntelTechnology,representingIEEE/EPSchapterparticipatedintheYoungEngineers&Researchers@WorkdialoguesessionrepresentingEPSMalaysia.Brokenintosmallergroups,bootcampparticipantshadthechancetopersonallygettoknowtheyoungengineers.

The session startedwith the young engineers sharing on their journey from how they start their academicjourney, to how they reach where they are today through good times and difficult times, to serve as amotivationandinspirationfortheparticipants.2-wayinteractionswerehighlyemphasizedduringthesession,with the participants interactively voicing out their concerns and questions to be discussedwith the youngengineers.

Despitetheparticipantsbeingexhausted,asitwasthelastprogramforthelongday,thedialoguesessionwaswell received.Thesessionwashighlyengaging,withparticipants still approaching theyoungengineerswithmorequestionsaftertheeventended.Manyalsocometopersonallythanktheyoungengineersfortheirtimeandpraisingthesharingasmotivational.

Figure3:Participantsengagedwiththesharing(left),andgroupphototoendthefruitfulsession(right)


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Summaryof38thIEMTConference2018,CityofMelaka (CompiledbyDr.KimShyongSiow,Ms.VaithilingamParamesvari,Mr.Jit-

ShenSim,photosbyMr.CheeYangNg)

Itwas poetically fitting that the IEMTConferenceof 2018 was held in the Historic City of Melaka,having successfully made its presence felt in theotherHistoricCityofGeorgetownin2016.Havinghosted the event in 2010, Melaka embraced itsProdigal Conference’s return with open arms,welcomingdelegatesfromaroundtheworldonceagaininwhathasbecometheflagshipconferenceofIEEESantaClara.

Volunteers fromthreesectors: localmultinationalsemiconductor companies such as InfineonTechnologies, Intel, ON Semiconductor, Carsem,Atotech, Lumileds, NXP, STMicroelectronics andTactilis, local universities Universiti KebangsaanMalaysia (UKM), Universiti Teknologi Malaysia(UTM) and Universiti SainsMalaysia (USM) alongwith the semi-governmental body CREST(Collaborative Research in Engineering, Science&Technology), formed the organizing committeethat would bring the conference to fruition. 15months of hard-work, enabled by multi-partyconferencing, sprinkledwithagamutofemotionsranging from anticipation to angst anddisappointment to delight, overtly fueled by thedesire tobring thebestconference to thesociety(covertlydrivenbythefearoffailure),culminatedin the 3-day Conference held from 4th to 6thSeptember2018attheRamadaPlazaHotelintheheartofMelakacity.

Figure4:TheIEMT2018OrganizingCommittee

Theconferencekickedoffwithabangonthe4thofSeptember with 7 short-courses covering thediversetopicsof§ Failure Analysis of Engineering Materials for

ApplicationinIoT(Prof.Dr.KuanYewCheong–USM),

§ Electromigration- The hurdle forMiniaturization of High Power Devices (Dr.Ning-ChengLee–Indium)

§ PDC – Packaging forMEMS and Sensors (Dr.TheussHorst–Infineon)

§ Cu Wire Bonding for Automotive GradeSemiconductorProductsPackaging (Mr.MarkLukeFarrugia–NXP)

§ Chip to Package Interactions: Trends,DevelopmentsandIntegrationChallenges(Dr.SrinivasaYeduru–Infineon)

§ Wire Bond Advancement: Smart EquipmentforSmartManufacturing(Mr.NelsonWong–Kulicke&Soffa)

§ Breakthrough in Semiconductor PackagingProblemSolvingThroughQualityFunctionandStatistical Methodologies (Mr. LF Chan – LFTraining)

The short-course topics were well-received,garnering138participantswhowereimpressedbythedepthofknowledgeaswellas thebreadthofcoverageoftheshort-courses.

Figure 5: Dr. YY Tan (Left) andMr. SFWong (2nd fromRight)withtheShort-CourseSpeakersThe second day of the conference saw a GrandBallroom packed with participants hungering forknowledge and information to be shared by theimpressiveline-upofspeakers.Afterthewelcomespeechesby the IEMT2018GeneralChair,Dr.Yik-YeeTanandthe IEEEEPSMalaysiaChapterChair,Mr.ShawFongWong,theevergreenDr.BillChentook to the stage with an engaging speech thatbrought us back throughmemory lane,way backto before 2017, when the EPS – ElectronicsPackaging Societywas still known by the tongue-


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numbing acronym of CPMT – Components,PackagingandManufacturingTechnologies.

Figure6:PackedGrandBallroomfortheOpeningon2ndDayEmceesDr.YewHoongWong,BernardLimandJit-Shen Sim moderated the events in the mainballroom.Theconferencehadthegoodfortuneofwitnessing7keynotespeeches,eachpresentedbyrenowned experts in their respective areas. ThefirsttwokeynoteaddressesweredeliveredbyMr.Qin Deng (IBM) The AI Driven ManufacturingTransformation is Imminent and Ms. ClaireTroadec (Yole Developpement) AutomotiveIndustryTransformation:EV/HEVimpactonPowerModules, Design Changes and Packaginginnovations! Both keynote addresses showed keytrends, challenges and opportunities for thesemiconductor industry, keeping the audienceengaged throughout the presentations. In theafternoon session, the3rd KeynoteaddressbyDr.BillChen(ASE)HeterogeneousIntegrationthroughSiP from Design to Manufacturing kept theaudience equally engaged and this was nomeanfeat, considering that the keynote was given at3pm,when bellies were full from the sumptuouslunchprovidedby thehosthotel. Thenext threekeynote addresses were presented in quicksuccession on the 3rdmorning of the conference:Dr. NorAzmi Alias (CREST) Opportunities andChallenges for Semiconductor and OptoelectronicPackagesintheEmergingMarketsof4thIndustrialRevolution (4IR) focused on Digital Healthcaretrends, Dr. Gaurang Choksi (Intel) EnablingHeterogeneous Packaging: A Perspective onChallenges & Opportunities focused on themultiple challenges in Heterogeneous Integrationand Dr. QianWang (Tsinghua University)GrowthofChina’sSemiconductorAdvancedPackaging–AWin-WininaWorld-WideContextopenedoureyestowards the packaging industry in China.Rounding off the keynote addresses, the finalkeynote was presented in the evening by Mr.

Alexander Mueller (Infineon) Packaging forAutomotive: Challenges and Solutions, giving us aglimpse of the challenges facing the automotivepackagingworld.

Figure7:KeynoteSpeakerDr.BillChenAdding more spice to the program, a paneldiscussionwasintroducedinthisConference,rightafterlunchonthesecondday.ModeratedbyMr.Jit-Shen Sim (Infineon), the panelists Ms. ClaireTroadec(YoleDeveloppment),Mr.LaurentHerard(STMicroelectronics) and Mr. Alexander Mueller(Infineon) shared their perspectives on themegatrends of New Mobility Services,Electrification, Digitization and AutonomousDriving in the automotive industry. Packagingparadigm shifts, challenges and related strategieswerealsoputonthetablefordiscussions.Overall,the one-hour was well spent in a balance oftechnicalfacts,opinionsandsharingofknowledgeeven from the audience. On top of the alreadyexcellent program line-up, kudos to the Programteam of Swee Har, Eng Hoo and Bernard for thisadditionalgem.

Figure8:PanelDiscussionontheAutomotiveIndustry(ModeratorJit-ShenSim,ConferenceAdvisorCheeHiongChew,Mr.AlexanderMueller,Ms.ClaireTroadec,Mr.LaurentHerard)


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For thosehankering for some statistics about theconference, here are some numbers to sate yourappetite:§ 490totalparticipants§ 138Short-Courseattendees§ 62OralPapers§ 22tableexhibits§ 17invitedPapers§ 17posterpapers§ 17 International Advisory Board (IAB)

members§ 7Shortcourses§ 7KeynoteaddressesThe conference accomplished several record-breaking feats, accumulating the highestsponsorship with 22 display booths –congratulations to the Sponsor&Exhibition teamof Chan Wah Chai, Lily Khor and Eng-Lim. Theformer achievement surely brought a smile ofrelief to the treasurers, Shutesh and Kai Chat.IEMT2018 also achieved the highest number ofparticipantsat490.Thisfeatwouldnothavebeenpossible without the tireless efforts by thePublicity and Publication teamof Chee Yang, KimShyong and Yew Hoong, aided of course by theInternational Advisory Board consisting of 17membersfromacrosstheglobe.Coupledwiththetimely selectionof the 7 short-courseworkshops,thiswasalsoa jobwelldoneby the InternationalLiaisonteamofPohLeng,MunLeongandJit-Shen.The Technical team of Prof. Nasir, Prof. Cheong,Choong Kooi, Hoo Kooi and Zal should also belauded for wading through >100 abstractsubmissions to arrive at a final 62oral paper and17 poster paper presentations. These werepresentedàlaquad-coreduringtheconference:infour separate break-out rooms while the posterswerepresentedalongthemainwalkway,visibletoallconferenceparticipants.

Throughout the conference, the secretariat team,led by Param, did a fantastic job of maintainingorder, accommodating changes and last-minuteregistrations. They did such a good job that webarely noticed them because no news is goodnews. KudostoMadamSecretaryParamandherteam!!!

Butwhatisaconferenceinamuch-toutedhistoriccity if therewas no chance to soak in the sights,sounds and smell of the host city? With thisrhetorical question in mind, the Logistics and

Social Tour team of Nor Azman, Kenneth andMdNasirMislantreatedconferenceparticipantstoa pre-Gala Dinner excursion through the city ofMelaka in an idyllic boat-ride, coasting along theSungaiMelaka,riverbreezegentlycaressingfacesand billowing hair as we welcomed dusk in thishistoric city. After disembarking from the boats,participantshadtheopportunitytohitcharide incolorfultrishawsasthesunsetfurther,castinganethereal glow as we made our way back to thehotelfortheGalaDinner.

Figure9:CruiseontheMelakaRiverandBeca(Trishaw)RideTheGalaDinnergotoff toanexplosivestartwithdelectable dances that showcased the variety ofraces inMalaysia. Mr. CheeHong Lee, Presidentand Managing Director of Infineon Malaysia, setthe ball rolling with his Opening Address,cementing his commitment to the conference(Infineon had sent about 100 participants to theconference). The scrumptious servings of localcuisine, the cheerful conversations among tablematesandthemelodiousmusicfromthelivebandallconspiredtocreatetheperfectambienceforagala dinner, and not even a technical talk duringthe banquet could ruin the atmosphere. In fact,Dr.RickyLee’sSMARTTalkwassoinspiringitgotarapturous round of applause from the still soberaudience. Of course it helped that Dr. Leeconcluded his talk with the assertion that “thelouderyouclap,thesmarteryouare”.Throughoutthe dinner, the lovely emcee, Poh Leng, kept theaudienceinformedandinspired.


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Figure10:Mr.CheeHongLee(PresidentandManagingDirectorofInfineonMelaka)Engineers are nurtured to take pride in sharingknowledge but it is human nature to competeamong ourselves. No conference would becomplete without some friendly competition.JudgedbyProf.Nasir, Prof.Cheong,Dr. Poh-LengEu, Dr. Shutesh Krishnan and Mr. Hoo Kooi Lim(now you know who to thank/blame), the BestPoster was awarded to Dr. Lai Chun Yung(Infineon) for his paper entitled Investigation ofthe Solder Void FormationMechanism After HighTemperatureStressProcessby3DCTScanandEDXAnalysis. The Best Student Paper went to Yan-Cheng Liu, Hsien-Chie Cheng and Zong-DaWu ofFeng Chia University, Taiwan with the paperentitledEvaluationofOut-of-planeDeformationofFan-out Wafer-level Packaging while the BestIndustry Paper was awarded to Yung Hsiang Lee,WeiKeatLohand IanChinof IntelwithElectronicPackagingMoistureInteractionStudy.

Figure11:WinnersforPosterandIndustrialPaper

All good things have an end (except the sausagewhichhastwo)andso itwasthattheConferenceendedafterallluckydrawprizesweredistributed.Not even the World Cup witnessed so manyheartaches in this final session as many of luckydraw winners turned up unlucky, having left theconference early (you know who you are) thusdisqualifyingthemselvesfromtheprizes. Afterallthe laughterandclaps, itwas timetobringdownthe curtains on IEMT2018, dubbed the bestconference in Melaka, JB and some say Batam.Alas, the bitter-sweet moment of friends andacquaintances having to part ways after asuccessful conference came to pass but thenagain, there is always thenext conference in twoyears’ time. See you in Putrajaya, Malaysia in2020!

Figure12:ParticipantsatPostersdisplayed

Figure13:GroupandindividualphotosatIEMT2018


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ScientificWriting&PublishingSession–UniversityofNottinghamMalaysia (CompiledbyDr.KimShyongSiow)TheInstituteofMechanicalEngineersStudentChapterofUniversityofNottinghamMalaysiaCampusandIEEEElectronic Packaging Society (EPS) Malaysia jointly organized a session to educate students on technicalpublicationof their researchworkon the6th ofDec2018whereDr. KimS Siow (UKM) spokeon “ScientificWritingandPublishing”inatwo-hourtalk.Morethan30studentsattendedthe2-hoursession,mostlyfromthefourthyearMechanicalEngineeringembarkingontheirupcomingresearchprojects.Dr.KimShyongSiowtouchedonvariouselementsofscientificpublications-themotivationforpublishing,aspectsofamanuscript(i.e. abstracts, introduction, experimental procedures, results and discussions, and conclusions), differentformsofpublications,ethicsandauthorship.DrKimSiowalsomadehisrecentKindlebookonthesametopicavailableforfreeofchargefortheparticipants.Theparticipantsleftthetalkfeelingmotivatedandequippedwith the right skills and attitude to writing their next manuscript for publication. Kudos to Dr. Siow forencouragingmorepublications!

Figure14:Dr.KSSiowsharingthemethodology Figure15:Dr.Siowsharingaphotomomentwithastudent

IEEEDay&UniMAPStudentBranchAdoptionProgram–IndustrialLecture (CompiledbyDr.Shutesh,Dr.BanuandEncikHafiz)UniMAPorganizedanIndustrialLectureprograminconjunctionwiththeIEEEDay2018attheirPauhCampus,Perlis.Atotalof96participantsconsistingofstaff,postgraduateandundergraduatestudentsfromtheSchoolofMicroelectronicEngineeringattendedthisevent.

The organizer had a mini exhibition for students to get to know IEEE and its activities. Pamphlets andbrochureswithinformationrelatedtoIEEEsocietiesandmembershipbenefitswereavailableattheexhibition.IEEEDay2018AmbassadorforMalaysiaSection,(MohdHafizIsmail)deliveredtheopeningspeechandbriefedonthehistoryandinformationofIEEE,IEEEMalaysiaSectionandIEEEUniMAPStudentBranch.Attheendofthe event Dr Shutesh from EPS Malaysia delivered a lecture titled “Towards Nano-dimensional ElectronicPackaging”.

Figure16:Dr.Shuteshdeliveringhislecture.Figure17:GroupphotoatUniMAPforIEEEDay


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IndustrialOpenDay–UniversityofMalaya (Write-upbyDr.YewHoongWong)On28thNovember2018,IndustrialOpenDaywasheldinBlockY,DepartmentofElectricalEngineering,Facultyof Engineering, University of Malaya. Industrial Open Day was organized by Malaya Electrical StudentsAssociation (MESA) in collaborationwith the following societies - IEEE Electronics Packaging Society (EPS),IEEE Electron Devices Society, IEEE Computational Intelligence Society and IEEE Dielectrics and ElectricalInsulation Society. Over 200 students, lecturers and representatives from 14 companies participated in theevent. Out of the 14 companies, 10 were invited to each conduct an industrial talk for the event. Thecompanies were KVC, Li-Zainal, ABB Malaysia, Micron Malaysia, Telekom Malaysia, SilTerra, PESTECHTechnology,Infineon,WesternDigitalandHuawei.

TheeventfirststartedwithanopeningceremonyinAuditorium2,BlockY.At2pm,theHeadofDepartmentofElectricalEngineering,AssociateProfessorDrSuhanaBintiMohdSaidkickstarted theeventbydeliveringanopeningspeech.Thenat2.05pm,theDeputyDeanofPostgraduateStudies,ProfessorIr.Dr.HazlieBinMokhliswas invited on stage to deliver his welcoming speech. The event continued with a mock cheque givingceremony. Prof. Hazlie were asked to remain on stage. The representative from KVC, Ms. Samantha OoifollowedbytherepresentativefromLi-Zainal,Ir.LeeTzeLinwereinvitedonstagetopassthemockchequestoProf.Hazliesubsequently.KVCwasnamedthePlatinumSponsoroftheeventwhereasLi-ZainalwasnamedtheLong-termPartnerofMESA.Agroupphotowastakenafterwards.

At 2.30pm, a forum titled “Entrepreneur Success Story – Inspiring Journey of Tech Startup”moderated byAssociateProfessorDr.NarendraKumarwasconducted.The fourpanellists–Mr JoeMcGuire, theFounderandCEOofMyMyPaymentsMalaysia,MsSharmilaSharma,theHeadofStrategyandMergers&AcquisitionswithCenergi SEA,Mr Thomas Yip, the Founder andCEOofRadica Software, andMrNoorMohdHelmiBinNong Hadzmi, the Founder and CEO of IX Telecom were invited on stage to share their stories ofentrepreneurship.ThesharingfollowedbyaQ&Asessiontookabout30minutes.StudentsthenmovedtothelobbyofBlockYtovisitboothsfromsomeoftheindustrialcompaniessetupthere.

Thenextagendaof theeventwas the threesessionsofparallel industrial talksconducted inDK7,DK8,DK9andHuaweiLabinBlockY.Thefirstsessionstartedat3.30pmandendedat4.00pm.Huawei,ABB,MicronandTMeachconductedanindustrialtalkinHuaweiLab,DK7,DK8andDK9respectively.Studentswereallowedtojoinanytalksthattheywereinterestedin.Thenextsessionstartedat4.10pmandendedat4.40pm.SilTerra,PESTECHTechnology andKVC each conducted an industrial talk inDK7,DK8 andDK9 respectively. The lastsession of parallel industrial talks started at 4.50pm and ended at 5.20pm. Infineon, Li-Zainal andWesternDigitaleachconductedanindustrialtalkinDK7,DK8andDK9respectively.Studentsandrepresentativesfromthecompanywereaskedtofillinfeedbackformsaftereachtalk.

The last agenda of the event, which started at 5.30pm, was the interview session for internship or jobplacement. Prior to the event, resumes from students were collected online and sent to the companiesparticipating in the event. Only Huawei and PESTECH Technology conducted the interview sessions. Therepresentatives from Huawei interviewed the students inMeeting Room 1, Student Clinic and Huawei Labwhereas PESTECH Technology conducted the interview inMeeting Room 2 of Block Y. The event officiallyendedat7.30pm.

Aluckydrawwasconductedthenextday.StudentswhoattendedtheIndustrialOpenDaywereeachgivenanattendancecard. Stickersweregiven to stickon thecardasproofsof visiting theboothsandattending theindustrial talks. Toqualify for the luckydraw, a studentmust visit threebooths and attend three industrialtalks.PrizesincludedwerefourStarbucksgiftcardsworthRM50,10SanDiskUltraDualDrive16GBsponsoredbyWesternDigitalandawirelessmouse.WinnerswereannouncedliveonMESA’sofficialFacebook.


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Figure18:GroupphotooftheparticipantsFigure19:EntrepreneurSuccessStorysessionpanelists

Figure20:IndustryBoothdisplayFigure21:RegistrationandInformationDesk

Figure22:StudentsinoneoftheparallelsessiontalksFigure23:Inspiringstudentstochangetheworld


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EPSBESAandElectronicPackagingTrackAwards2018 (CompiledbyDr.KimShyongSiow)

BestEngineeringStudentAwards(BESA)for2018UndergraduateWinners

EPSMalaysiahasaregular“BestEngineeringStudentAwards(BESA)”forUndergraduates.Thisisthe2ndyearofitsrolloutandtheaimistorewardandencouragetechnicalexcellenceinMalaysia’snextgenerationofengineers.CongratulationstothewinnerswhoreceivecashprizeofRM3,000andacertificatefromIEEEEPS!Student Supervisor FinalYearPaperTitle UniversityTongTeongYen Dr.YapSoonPoh InvestigationonPlaneFailure

MechanismsofStructuralBamboounderDifferentLoadings

UniversityofMalaya

JacquelineLease AssocProfDrAhmadAzminMohamad

ElectrochemicalCharacterizationofLithiumVanadiumOxideAnodewithAgarBinderinAqueousRechargeableLithiumIonBatteries

UniversityofSainsMalaysia

MohdSoufianKamarudin

Dr.MuhammadNoorAfiqWitriMuhammadYazid

AluminaThermalPasteforEnhancingCoolingPerformanceofCPU

UniversitiTecknologiMalaysia

LaiChunNeng DrT.NandhaKumar

FPGA-basedAccelerometer UniversityofNottingham(MalaysiaCampus)

Figure23:JacquelineLeasereceivingcertificatefromFigure24:TongTeongYenreceivingthecertificatefromProfDr.Ir.CheongKuanYewIr.Dr.WongYewHoong

Figure25:MohdSoufinreceivingthecertificatefromFigure26:LaiChunNengreceivinghisEPScertificatefromAssoc.Prof.Dr.HaslindaMohamedKamarDr.Siowathisgraduationceremony


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IEEEMalaysiaSection’sBestFYPAward2018-Track6:ElectronicsPackaging

The awards for this track, were sponsored by, Electronics Packaging Society (EPS) for the Final Year Paper(FYP). Congratulations to the winners! The winners won cash prizes of RM 300, RM 200 and RM 100respectivelyforBestFYP,1strunnerup,and2ndrunnerup.

Award Student Supervisor FYPTitle University

BestFYP Thinesa/lRavendran

Dr.ImaduddinHelmiBinWanNordin

EffectofLaserPulseEnergyonTemperatureDistributiononLaserIrradiationofMonocrystallineSilicon

UniversitiMalaysiaPerlis

1strunnerup

LaiKengMay Dr.YeoKwokShien

SECS/GEMProtocolIntegrationandDataProcessingforReal-TimeSMTEquipmentMonitoring

TunkuAbdulRahmanUniversitiCollege

2ndrunnerup

ShriKumarana/lNadaraja

Dr.YapBoonKar LeadFrameTapeAssessment UniversitiTenagaNasional

Figure27:ElectronicsPackagingTrackGroupPhoto

Figure28:TheAwardwinners,theirsupervisorsandthejudges


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REGIONALEVENTS:

20thInternationalConferenceonElectronicMaterialsandPackagingEMAP) (CompiledbyDr.YewHoongWong)Dr. Wong YH represented Malaysia EPS chapter to join the 20th International Conference on ElectronicsMaterials andPackaging (EMAP2018) on the 17 – 20Dec 2018. This conferencewas held inHongKong, agateway in between the East andWest. The purpose of the conference is to promote awareness of newadvances in materials, design and simulations, fabrication, reliability, and thermal management ofmicrosystem/MEMSpackages.ThisconferenceusesHongKongUniversityofScienceandTechnology(HKUST)as themeeting venue.With a rich, successful history of previous EMAP conferences held in Japan, Korea,Malaysia,Singapore,andTaiwan,thisannualeventoffersagreatopportunitytounitepeoplefromacademia,research institutions and industries to share their innovative thoughts, state-of-the-art technologies andrecent developments. The program included invited and keynote presentations from world-renownedspeakers, interactivesharingsessions,andtechnicalshortcourses.Anexcursionwasalsoarrangedafter thetechnicalsessionstoshowcasethenaturalpartofHongKong.Thisconferencehad2shortcourses,8keynotespeakers,14invitedpaper,60oralpresentationpapersandmultipleposterpapers,whichattractedmorethan150participantsfromaroundtheglobe.

Figure29:Dr.WongwithDr.JeffreyCCLoFigure30:EMAPSteeringCommitteeatlunch 20thElectronicsPackagingTechnologyConference(EPTC)andIEEEElectronicPackagingSocietyBoardofGovernorsMeeting(BoGM) (CompiledbyDr.ShuteshKrishnan)EPSsocietyhelditsBoGMmeetinginSingaporethisyear.ThisisthefirsttimeBoGMisheldoutsidetheUnitedStates.DrShuteshrepresentedEPSMalaysiainthismeeting.Theconferencewasheldfrom4-7thDecatResortWorld,SentosafollowingEPTC2018,Singapore.DelegatesfromEPSchaptersaroundtheworldattendedthismeeting.Themeetingwasscheduled for twodays.On the firstday,7thDec, themeetingwasstatedwithareception dinner for the delegates. This provided opportunity for the delegates to meet and greet theircounterpartsfromvariouscountries.DrShuteshpresentedEPSMalaysia’saccomplishmentstothedelegateslaterintheevening.HealsopromotedtheupcomingIEMT2020eventinMalaysia.Ontheseconddayof themeeting,8thDec, thesocietyPresidentAvramBarCohen,presentedhisreportonEPS’saccomplishmentsfortheyear.This isfollowedbyreportpresentationfromTechnology,EducationandConference functional teams.Thenominationchairpresentedthenamesof thenewmembersat large.TheVicepresidentofpublicationpresentedtherecommendationonopenaccessforEPSjournal/transactions.TheEPS President elect was also nominated during themeeting. Chapter chairs from regions 8, 10 and Youngprofessionalsalsopresentedtheirrespectiveactivitiesfortheyear.ThemeetingwasendedwithdecisiontoconveneagainforthenextBoGMin2019following69thECTCinLasVegas,NV,USA


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19thInternationalConferenceonElectronicPackagingTechnology(ICEPT) (CompiledbyShawFongWong)SFWongrepresentedMalaysiaEPS inthe ICEPT2018andwas invitedtopresentakeynote“WhyPackagingStillMatters”there.Itwasagoodopportunitytoexplorepossibilitiesforpotentialcollaborationandalsoforbenchmarking. ICEPT had about 450 delegates from >20 countries with > 350 papers covering 7 parallelsessionsandmultiplepostersessions.TheconferencewashostedbyIMCESandorganizedbyFudanUniversity(Shanghai) at the beautifulCrowne Plaza Hotel of Shanghai Harbour City. Both IEEE EPS and EMPT are thetechnical sponsors for this regional conference. The event was opened by EPS President, Prof. Avram Bar-Cohenand somekeynotesweredeliveredbyDistinguishSpeakers likeProfRaoTumalla,ProfCPWong,Dr.RolfAschenbrennerandProfDavidWeiZhang.TheMalaysianteamreceivedverywarmhospitalityfromtheFudanUniversityandalsotheChinaElectronicPackagingteamandtheyinturnextendedaninvitationtotheChinateamtoattend IEMT2018 inMalaysiaasdistinguishedspeakers.GoodengagementwithChinaEPS&packagingteamtoinitiategreaterfuturecollaborationsbetweenChinaandMalaysiateams.EPSMYwishestothankProfCaifromBeijingTsingHuaUniversityfortheirkindinvitationforMalaysiaEPStoparticipateinthis!!

Figure31:Agreatgettogethersessionswithrespectiveorganizers(FudanUniversity&EPSChina)aswellastheinternationaldelegates

2018InternationalMicrosystems,Packaging,Assembly&CircuitsTechnology(IMPACT) (CompiledbyDr.YikYeeTan)Thisyear,InternationalMicrosystems,Packaging,AssemblyandCircuitsTechnology(IMPACT)conferencewasorganizedbyEPS,iMAPSTaiwan,ITRIandTPCAinthebeautifulcityTaipei,Taiwan.Thethemewas“IMPACTon Artificial Intelligence –Our Future”. It attractedmore than 600 delegateswith > 200 papers covering 4parallelsessionsandmultiplepostersessions.Onanotherfloor,therewasaTaiwanPrintedCircuitAssociation(TPCA) show focusing on Assembly, Green Technology, Printed Circuit Board (PCB) and Thermal exhibition.Therewerearound250exhibitorswhocamewithnewmachinesorproductsdemo,mainlyfromTaiwanandChina.Dr.TanYYrepresentedMalaysiaEPSchapterandpresentedatechnicalpaperentitled“investigationonCu-Al IntermetallicCompound”.MalaysiaEPSreceivedverywarmhospitality fromtheorganizingcommitteeand had great opportunities to interact with local industrial and academia for technical sharing, potentialcollaborationandbenchmarking.MalaysiaEPSteamalsoextendedourInvitationtotheIMPACTparticipantsandotherrenownedspeakerstoparticipateintheIEMT2020conference,wheretheywereinvitedtodeliverkeynotesasDistinguish speakers. This showedagoodcontinuityandgoodengagementwithTaiwanEPS&packagingteamtosparkmorefuturecollaborations.

Figure32:Dr.YikYeeTanatIMPACT2018


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UpComingEPSConferences&Meetings:Networking and constant knowledge advancement opportunities are always an important part of anyconference.EPSchaptershave linedupanoutstandingprogramwithtoptierspeakersandtimelytopics for2018.Belowisasampleofwhat’sinstoreforus.Markthedates!!EPSCONFERENCESIN2019:https://ieee-epsmalaysia.org/events-activities/upcoming-events/

SomeImportantReferences:• OfficialIEEEwebsite:http://www.ieee.org• OfficialIEEE/EPSwebsite(HQ)https://eps.ieee.org/• IEEEEPSMalaysiawebsite:https://ieee-epsmalaysia.org/

greeting from chapter chair - eps...

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