grid february 2014 grid · february 2014 visit us at page 2 your networking partner ® february...
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February 2014 V is i t us a t www .e-gr id .net Page 1
GRID.pdf
February 2014
CHAPTER MEETINGS
SCV-PACE - 1/30 | Networking Dinner & Brainstorming for 2014 Professional Activities - careers, previous events, shape events ... [more]
SCV-BAMMF - 2/4 | Bay Area Multimedia Forum - 4 talks: sentiment, emotion, StreetView, TV news ... (PARC, 1PM) [more]
SCV-CNSV - 2/4 | Your Professional Network: The Secrets to a Successful Consultancy - LinkedIn, features, personal brand ... [more]
SCV-TMC - 2/6 | Value Innovation: The Mindset of an Agile Engineer - value drivers, less is best, practical tools ... [more]
SCV-WiE - 2/6 | How to Grow Stronger through Rapid Changes in Technology - leadership, connections, performance, coaching ... [more]
SCV-CS - 2/11 | OpenZFS: The Future of Open Source ZFS Develop-ment - file system, capacities, data compression, enhancements ... [more]
SCV-ComSoc - 2/12 | Broadband Access Over Copper at Speeds Greater than 100 Mbps - 2 talks: chips, algorithms, advances ... [more]
SCV-PV - 2/12 | Flexible, Thin Film CIGS and Applications in Premium Markets - flexible substrate, premium pricing ... [more]
SCV-APS - 2/13 | Dielectric Resonator Antennas, Transparent Antennas, and Spherical 3D Antennas - design, substrates ... [more]
SCV-MTT - 2/13 | Measuring Dielectric Constant with a Microstrip Ring Resonator - solder mask, loss, technique ... [more]
SCV-Nano - 2/18 | Nano-Justified: Why Nano Matters for Silicon Thermoelectrics - silicon-based nanowires, cooling system ... [more]
SCV-Rel+PSES - 2/18 | Fuses for Supplementary Protection: Safety Versus Reliability - working when they fail, failure modes ... [more]
SCV-Mag - 2/18 | History of the Magnetics and Control of Actuators in Disk Drives - velocity feedback, torque factor, inertia ... [more]
SCV-EDS - 2/18 | Product-Level Reliability Challenges Originating from TDDB, BTI and Variability - scaling, correlation ... [more]
OEB-IAS - 2/20 | Switchboard and Panelboard Basics: A Tour of the Eaton Hayward Facility - construction, functions, features ... [more]
SCV-YP - 2/24 | Trampoline Dodgeball - recent grads, networking, foam pit ... [more]
SF-IAS - 2/25 | Codes, Standards and Listings - Who Requires What, and Why - installation, testing, efficiency, certifications ... [more]
SCV-CPMT - 2/27 | Probing Interfacial Contact via MEMS-based Microinstrumentation - surfaces, mesoscopic scale, insights ... [more]
SF-IAS - 2/28 | The Electrical Code of the Future - 1-day seminar: lighting, controls, commissioning, testing ... [more]
SCV-CNSV - 3/3 | Innovation in Japan and in Silicon Valley - differences, culture, METI, technology sectors, employers ... [more]
SCV-CS - 3/11 | Cleanroom Robots for Semiconductor Manufac-turing - requirements, design guidelines, atmospheric, vacuum ... [more]
SCV-EDS - 3/11 | 2014 International Technology Roadmap for Semiconductors (ITRS) Update - overview, highlights ... [more]
... more March, April events ===>
GRID.pdf
Santa Clara University Grad School of Engineering Spring Open University [more]- Early-morning, evening, Saturday classes
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MARKETPLACE – Services page 3
Career Development RF Design Courses for Engineers [more]- Core Concepts - Appplied Techniques - Digital Signal Processing - MMICs - EMC and Signal Integrity more
Professional Skills Courses [more]- Management Essentials - Getting Things Done Across Organizational Borders - Managing Time and Multiple Priorities more
CONFERENCE CALENDAR
Feb 9-13: International Solid-State Circuits Conf (ISSCC) - San Francisco Marriott Marquis Hotel [more]
Mar 3: Interdisciplinary Engineering Design Education Conference (IEDEC) - Santa Clara Conv’n Ctr [more]
Mar 3-5: Int’l Symposium on Quality Electronic Design (ISQED) - Santa Clara Conv’n Ctr [more]
Mar 5-7: Wearables Development Conference (WearablesDevCon) - Hyatt Regency Burlingame [more]
Mar 9-13: Optical Network & Communication Conf. (OFC'14) - Moscone Conv’n Center, SF [more]
Mar 24-28: International Wireless Communications Expo (IWCE) - Las Vegas Convention Center [more]
Mar 31-Apr 3: EE Live! Conference & Embedded Systems Conference - San Jose Convention Center [more] CALLS FOR PAPERS: IEEE Symp on Product Compliance Engineering - May 5-7, San Jose - Submit papers by February 3rd [more]
2nd IEEE Int'l Conference on Big Data Science and Computing (BigDataScience) May 27-31, Stanford - Submit papers by March 1st [more]
Volunteers Needed for Middle, High School Science Fair Judges [more]- Santa Cruz, San Mateo, Santa Clara Counties
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 2
Your Networking Partner ®
February 2014 • Volume 61 • Number 2
IEEE-SFBAC ©2014
IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.
IEEE GRID is published as the GRID Online Edition
residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 30,000 Bay Area members and other professionals.
Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net
Scouting out the Job Market
Most recruiters today use social media as part of their candidate selection, and you should have a presence -- even if you're not job-seeking. Use Twitter and LinkedIn to improve your visibility: use your name as your handle, post a bio and complimentary photo of yourself, contribute tweets, and participate in discussions. You can also re-tweet posts from influential people, to get their attention -- they may re-tweet your posts to their broader networks. You might want to attend this month's CNSV meeting on this topic (see page 12 ).
If you have something to say, or design hints or insights that would prove useful to others, spend a few minutes every day to develop your own followers!
Best regards,
Paul Wesling, Editor
Select a Chapter event to learn about new developments and to network with fellow professionals -- choose a course
or conference to master new skills.
Stay ahead of changing professional demands;
sharpen your competitive edge with up-to-date technical skills and through your networking activities. Technology to your INBOX, twice a month.
NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information.
DIRECTORS
Santa Clara Valley
Ed Aoki
John Swan
Oakland East Bay
Catherine Jenkins
Bill DeHope
San Francisco
Michael Butler
Jonathan Burrows
OFFICERS Chair: Kate Jenkins
Secretary: Jonathan Burrows Treasurer: Ed Aoki
IEEE-SFBAC PO Box 2110
Cupertino, CA 95015-2110
IEEE CHAPTER MEETINGS
SCV-ComSoc - 3/12 | Human Interface Technologies for Mobile Devices: Today & the Future - 2 talks: sensing, development [more]
OEB-Life - 3/19 | Fuel Cell Vehicles: What's Up? - mass market, proton exchange membrane, refueling ... [more]
OEB-IAS - 3/20 | Applications and Advantages of Continuously Welded Corrugated Cable - hazardous locations, code ... [more]
SCV-Life - 3/24 | The History of Robots - non-technical review, assembly, medical, entertainment, science fiction ... [more]
SF-IAS - 3/25 | Maximizing Battery Reliability and Life in Standby Power Backup Applications - variables, alternate systems ... [more]
OEB-IAS - 4/17 | Extending Product Life, Safeguarding Data Integ-rity with Low-Voltage Surge Protection - surges, failures ... [more]
SF-IAS - 4/22 | DC Arc Flash Calculations and Studies - need, resistance, energy, open air, enclosures ... [more]
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 3
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
Do you provide a service? Would you like more inquiries?
Access 25,000 engineers and managers IEEE Members across the Bay Area Monthly and Annual Rates available
Visit our Marketplace (page 3)
Download Rates and Services information: www.e-grid.net/docs/marketplace-f lyer.pdf
GRID.pdf
e-GRID
Professional Services Marketplace – [email protected] for information
Say you found them in our GRID MARKETPLACE
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (DASH7 & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
IEEE-CNSV Consultants' Network
of Silicon Valley
• Become a member • Find a Consultant • Submit a Project
CaliforniaConsultants.org
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 4
** NEW THIS YEAR Evening Panels on TUESDAY - FREE FOR ALL IEEE MEMBERS
(No fee for IEEE members if attending only EP2 or EP3 evening panels. Please bring membership proof.)
ISSCC is the foremost global forum for the presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers engineers a unique opportunity to network with leading experts in the field.
SUNDAY ALL-DAY
TWO ALL-DAY FORUMS: ● Digital-Assisted Analog and Analog-Assisted Digital CMOS Techniques ● 3D for Imagers and Memory
10 TUTORIALS: ● 3D Power & Contactless Coupling ● Transceiver Filtering ● Power-Optimized Processors ● Vmin Constraints & Optimization ● ADC Perpheral Circuits ● Charge-Pump Converters ... plus 5 more.
2 EVENING EVENTS: ● Graduate Student Research in Progress ● Data Centers for the Cloud
THURSDAY ALL-DAY 4 FORUMS: ● Adaptive Design for Energy Efficiency ● Low-Power Sensor Radio ● mm-Waves in Safety and Communication ● Future Energy Efficient I/O SHORT-COURSE: ● Biomed and Sensor Circuits
Wearable computing devices are the next Big Wave in technology. Take advantage of these new technologies EARLY and build the red-hot apps. Learn how to develop for the coolest gadgets and next generation of computing devices like Google Glass, FitBit, Pebble, the SmartWatch 2, Jawbone, and the Galaxy Gear SmartWatch.
Especially for practitioners, including • Software engineers • iOS and Android developers • Design engineers • Project managers • Hardware designers • UI designers • Embedded developers • Design architects • Software architects • System architects
Classes: • Battery Tips for Wearable Apps • API and GDK Design for Google Glass • Google Glass Live Cards • Details of Wireless Communications • Wearable Home Automation Control • Wireless Connectivity and Wearables ... and 17 more.
MONDAY THROUGH WEDNESDAY Plenary Talks on MONDAY ● Mark Horowitz, Stanford, “Computing's Energy Problem” ● Ming-Kai, Tsai, MediaTek, “Cloud 2.0 Clients and Connectivity” ● Erik H.M. Heijne, CERN, “How Chips Pave the Road to the Higgs Particle and the Attoworld Beyond” ● Susie Wee, Cisco, "The Next Generation of Networked Experiences”
Special-topic session on "Wearable Wellness Devices." Five parallel Technical Sessions on: RF Techniques, Analog, Data Converters, Energy-Efficient and High Performance Digital, Technology Directions ... and more
Plenary evening panel on MONDAY (EP1)
CEO/VC evening panel on TUESDAY (EP2) **
Pantheon-of-Experts evening panel on TUESDAY (EP3) **
Save on registration, through January 10th
Visit www.isscc.org
Wearable Medical Devices Security for Wearables
Design for Google Glass APIs and Hardware
Making Wearables Relevant Sport Wearables Design
Tutorials: • Building Wearable Technology Applications for Behavior Modification • Developing for Wearable Devices with Android • How to Develop Your Wearable Electronics • Transitioning from Android to Google Glass • Prototyping New Wearable Experiences with Soft Electronics ... and more.
Plus Keynotes, Lightning Talks, Fireside Chats, Sponsored Classes, Exhibits.
Save $300 through January 24th. Save additional $200 with Priority Code "IEEE".
www.WearablesDevCon.com
Exhibit at WearablesDevCon -- contact Adam Teichholz, [email protected], 631-421-4158 x114
International Solid-State Circuits Conference
February 9-13, 2014 San Francisco
Theme: “Silicon Systems Bridging the Cloud”
NEW!
March 5-7 - Burlingame
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 5
Have you ever wanted to continue your education in engineering while you continued working? Santa Clara University’s School of Engineering offers graduate degree and non-degree programs to both full-time students and working professionals. Simplified registration for the Winter Open University. Graduate-level instruction. Up to 16 units may be transferred to a graduate-degree program.
Early-morning classes: - Probability - Database Systems - Linear Control Systems - Analog ICs - Energy Transmission and Distribution - Active Microwave Devices (and more)
Evening classes: - Linear Algebra - Intro to Nano-Bioengineering - VLSI Design - Computer Architecture - Network Management - Logic Design using HDL - Robotics (and more)
Saturday classes: - Secure Coding in C and C++ - Project Risk Management - Gender and Engineering (and more)
Email LeAnn Marchewka with inquiries: [email protected]
Managing Time & Multiple Priorities – Date/Time: Thursday, February 20, 9 AM – 1 PM – Location: – TIBCO Software, Palo Alto
Fee: $325 for IEEE Members; $375 non-members
"Such a valuable subject. My team would likely double in productivity if the ideas in this class were put in to practice. Cupertino-based Technology Company, UX Designer
Management Essentials – Date/Time: Thurs-Fri, March 13-14, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $650 for IEEE Members; $725 non-members
"Thank you!! I wish I could have had this knowledge along time ago when I first became a supervisor." -Sales Operations Supervisor, @Road
Getting Things Done Across Organizational Borders
– Date/Time: Thursday, March 20, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $420 for IEEE Members; $525 non-members
Upgrade your skill set – prepare for future challenges
Prepare for that next
project or assignment!
To remain competitive in Silicon Valley's changing environment, engineers need to update their knowledge base. The School of Engineering offers professional Certificates and Open University programs, as well as graduate degrees, for those who are driven to become leaders in their fields.
Spring Registration opens Feb. 1st Classes begin March 31, 2014
Located in the heart of Silicon Valley, with easy parking
Review winter quarter Open University courses:
www.scu.edu/engineering/graduate
SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies
Managing Time & Multiple Priorities – Self-Paced – Fee: $250 A 2-hour on-line alternative to the instructor-led course that participants complete at their own pace. The program concludes with a quiz to demonstrate comprehension and completion
For complete course information, schedule, and registration form, see our website:
www.EffectiveTraining.com*
Specializing in Training for Engineers, Managers, Project Teams
Santa Clara University School of Engineering Graduate Programs
SCU Spring Open University
IEEE Professional Skills Courses
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 6
IWCE’s five days of workshops, sessions and
networking opportunities provides you with the tools you need to become more efficient, work faster and more profitably and to stay ahead of the competition – the ability to learn about all aspects of convergent communications.
College of Technology: 25 courses: - Practical Wireless Communications Engineering - New Technology Review for the RF Professional - Project 25 Foundations and System Technology - Cybersecurity for Critical Networks & Systems - Power Options for Networks and Devices - Next-Generation Wireless Networks: 4G, LTE and Broadband - In-Building Wireless and DAS Fundamentals - Software Applications for Communications Systems - Layering LTE Technology on Existing Systems - Intro to Microcells, Picocells and Small Cells - Cloud-Based Managed Services 101 ... and more!
76 Short Courses: Tracks include - FirstNet - Next-Generation Networks and Systems - System Management and Infrastructure - Interoperability and Collaboration - Software and Applications - Spectrum and Signal Optimization - Case Studies and Best Practices - Industry Sessions: Public Safety, Critical Infrastructure ... more
Four days of sessions, tutorials, boot camps, summits and post-mortem discussions on a comprehensive selection of engineering design topics taught by leading industry experts. Exclusive 2-day Boot Camps and Tutorials taught from a highly practical perspective to allow engineers to create more effective and efficient designs and systems. ESC (The Embedded Systems Conference) will return and is built around the essential tool kit of the embedded designer.
Seven Programs -- Multiple Tracks: ● ESC – Embedded Systems Conference (Mon-Thurs)
● Android Engineering Certificate Program (Mon-Tues)
● Super C++ Tutorial (Mon-Tues)
● FPGA Engineering Boot Camp (Mon-Tues)
● Black Hat Engineering Summit (Wed-Thurs)
● Hardware Startup Engineering Summit (Tues-Wed)
● IoT Engineering Summit (Wed-Thurs)
Additional Tracks: ● Debugging and Test ● Embedded Android ● Embedded Systems Engineering ● Hardware: Design, I/O, and Interfacing ● Linux Kernel and Operating Systems ● Real-Time Operating Systems ... more.
Opening Keynote Address: Daniel Burrus, Technology Futurist/Forecaster
Lunch & Learn: “Voice over LTE: When, Where, How?”
General Sessions: “Who Will Manage Your Communications Network in the Future?” and "Choosing Your Next Generation Communications"
EXPO: 350 exhibitors - Utilities - Public Safety/ Government - Transportation - Enterprises
From land mobile radio, to wireless mobility … voice, video, data and
everything in between … communications technology is evolving … and so is IWCE.
Save, through February 27. Use code H27 to receive 25% off the Premium Package & Free Exhibit Hall Admission. For full program details and registration, visit:
www.iwceexpo.com
Tutorials: ● Architectural Design Of Device I/O Drivers ● Fundamentals of Real-Time Kernels ● Managing Embedded Projects ● Design Of High Availability Embedded Systems ● Embedding TCP/IP ● Modeling Behavior with UML: Interactions and Statecharts
A revolutionary new experience, with more learning options, and more value for your money and time spent.
Registration Packages • All-Access Pass • Embedded Systems Conference Pass • Engineering Summits Pass • Free Expo Pass (with Keynotes, sponsored sessions, more) • Choose exactly what suits your needs and schedule • Group rates available – bring your team!
Save, through March 23rd. Use code GRID for 20% off the ESC or any Summit package. For more information:
www.eeliveshow.com/sanjose*
International Wireless Communications Expo
Classes: Mar 24-28 Expo: Mar 26-27
LasVegas Convention Center
EE Live! Conference March 31 - April 3, 2014
San Jose Convention Center 250+ Exhibitors
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 7
San Jose/Mountain View Classes
March, 2014
RF Design: Core Concepts Mar 17-Mar 21 Web classroom, WebEx
RF Design: Applied Techniques Mar 31-Apr 4
April, 2014 DSP - Understanding Digital Signal Processing Apr 1-Apr 3
RF Measurements:Principles & Demonstration Apr 7-Apr 11
Monolithic Microwave Integrated Circuit (MMIC) Design Apr 28-Apr 30
EMI/EMC and Signal Integrity Boot Camp Apr 28-May 2
For these and other classes, or
customized/private courses at your facility, visit the website
Science Fair season is coming up.
Traditionally, the IEEE has provided both prizes and judges for local fairs and we need your help once again.
These fairs provide an opportunity for students
from middle schools and high schools to show their projects and hear comments from professionals like you. As a judge you will interact with students and help them understand what they did right and how they could do better next time.
This year we will be supporting three science
fairs: San Mateo (Tuesday, February 25th), Santa Clara (Wednesday, March 12th) and Santa Cruz (Saturday, March 8th).
Upcoming Courses for
Engineering Professionals
Headquartered in Mountain View since 1985, we have delivered theory with hands-on practical training to professionals working with analog, RF, wireless, digital, and networking technologies -- to over 45,000 people in these industries. Besser Associates instructors are top luminaries in their field. Their work experience provides insights that help you avoid pitfalls on the job.
Use thise QR code to download our schedule:
www.besserassociates.com/Schedule.pdf
www.besserassociates.com
Generally, the judging starts about 10:00 AM and lasts until about 4:00 PM (however, the San Mateo Fair is judged in the evening). Even if you can only stay a few hours, your help will still be greatly appreciated by the students. No previous experience is necessary -- only patience and common sense.
If you are interested in helping out at one of these fairs, or can sponsor a prize, please call
Charlie Neuhauser at (408) 245-0085 (W)
or E-mail him at [email protected].
You can find out more about the fairs at the following sites:
Santa Clara - www.science-fair.org
Santa Cruz - www.science.santacruz.k12.ca.us
Volunteers Needed for Middle, High School Science Fair Judges
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 8
55 Training Courses include: - High-Speed Semiconductor Lasers - WDM in Long-Haul Transmission Systems - Modulation Formats and Receiver Concepts - Passive Optical Networks (PONs) Technologies - Microwave Photonics - Metro Network: The Transition to Ethernet - 100 Gb/s and Beyond Transmission Systems, Design and Trade-offs - Optical Network Design and Planning - Short-Reach Optical Interconnects - Data Center Cabling: Transitioning from Copper to Fiber - Cloud Computing and Dynamic Networks - Fundamentals of Super Computing - Wireless Backhaul - Intro to Forward Error Correction - Software Defined Networking and OpenFlow - Space Division Multiplexing ... (and many more)
Technical Conference March 9-13
Exposition March 11-13
Moscone Convention Center
San Francisco
Register by February 10 and Save!
For more information:
www.ofcconference.org
The World’s Leading Optical Network and Communication Conference and Exhibit
Sponsored by: ®
Two ways to register: Attend the 3-day Exposition for Free with Exhibit Pass Plus Registration 550+ Exhibitors – One stop for all of your business needs
See New Products Meet with Vendors Attend 14 educational sessions on the show floor
For complete information visit www.ofcconference.org/exhibitpass
Or Register for the Full Technical Conference featuring the latest advances in the research and development of new technologies in optical communications
High-quality technical program covers recent progress in research and technology Covers the latest near-term and long-term research Two Special Symposia: Advance Electro-optic Packaging Technologies and Enabling the Cloud Over 100 invited presentations by experts in the field 750+ peer-reviewed technical presentations presented in a variety of formats
1 hour in-depth tutorials Interactive workshops Panel discussions Half-day short courses (separate fee required) In-depth symposia on hot topics
For complete technical conference information visit
www.ofcconference.org/home/conference-program
R i t b d SAVE!
Security in a Connected World
KEYNOTE SPEAKERS
TECHNICAL SESSIONSISQED Technical sessions start on Tuesday March 4, and continue until the afternoon of Wednesday, March 5. Beside the above plenary sessions, and workshops, the program consists of 22 technical sessions featuring over 100 papers on various challenging topics. A partial list of topics is shown below. Detail program would be available on the web at www.isqed.org.
REGISTRATIONPlease refer to ISQED web site at www.isqed.org for information regarding the tutorials, conference, and hotel registration. Direct all conference inquiries to [email protected]. Early registration is recommended to take advantage of the discounted registration fee.
Jacqueline Woods - Global Vice President of Growth Solutions, STG IBM CorporationSridhar Iyengar - Director of security research, Intel LabsScot Morrison - General Manager of Embedded Runtime SolutionsMentor Graphics Subhasish Mitra - Professor and Director of Robust Systems GroupStanford UniversityStacy Cannady - Chief Security Scientist, Trusted Computing GroupAmit Sinha - EVP Engineering and Operations, CTO, Zscaler
Past, Present and Future of High Performance Logic TransistorsProf. Suman Datta - Pennsylvania State UniversityIntegrated Techniques for Variation-Tolerant, Energy-Efficient CircuitsDr. Carlos Tokunaga - Intel CorporationNew Rules: Managing Processor Physics to Sustain Performance ScalingProf. Sudhakar Yalamanchili - Georgia Institute of TechnologySystem and architectures for low-power signal processingDr. Manish Goel - Texas Instruments Emerging Materials for Energy Efficient DevicesProf. Sayeef Salahuddin - University of California at Berkeley
TUTORIALS/WORKSHOPS
VENDOR EXHIBITIONISQED2014 Exhibition floor will be open on Tuesday March 4 from 12 noon, and includes technical poster presentations in afternoon. Exhibition floor attendance is free but needs advance on-line registration (see registration information on the web)
ISQED 2014, 15th International Symposium & Exhibits on
QUALITY ELECTRONIC DESIGN
www.isqed.org
March 3-5, 2014Santa Clara Convention Center, Santa Clara, CA, USA
ISQED2014 corporate sponsors are IBM, Synopsys, InnovoTek and Silicon Valley Polytechnic Institute
ISQED AwardsISQED Award ceremony will be held during Tuesday March 4 luncheon. Best papers will be also announced during the same session.
Symposium 2014
4th Interdisciplinary Engineering Design Education Conference - IEDEC2014
March 3, 2014. Santa Clara, CA, USAEducation Society
The Interdisciplinary Engineering Design Education Conference is a premier event committed to further the education in engineering design with the ultimate goal of improving the quality of engineering designers worldwide. The conference is intended for educators, mentors, engineers, managers, researchers, students, as well as industry companies and consortiums that desire excellence in interdisciplinary engineering education and have created or need to create interdisciplinary programs and products. IEDEC strives to promote the engineering design profession and to highlight the important role of engineering in all aspects of human life. The conference provides a forum for sharing ideas; learning about developments in engineering design education; and interacting with professionals, experts, and colleagues in the field.
Conference Registration & InformationVisit conference website at www.IEDEC.org for information about the program, registration, and hotel reservation. IEDEC2014 is held in technical spon-sorship of IEEE Education Society.
March 6, 2014Convention Center
Santa Clara, CA, USASensorsCon
2014
www.SensorsCon.orgMarch 6, 2014
Santa Clara Convention Center
www.IEDEC.org
The conference on Sensors - Technology, Design, Applications and Business (SensorsCon) is a forum to present, highlight and discuss the latest research, development, application, and business opportunities in sensors technology and applications in various fields.The market for sensors and related technolo-gies is expanding at a phenomenal rate. The conference brings together researchers, developers, and practitioners from diverse fields including scientists and engineers, research institutes, and industry. List of participating companies include Texas Instruments, ST Microelectronics, Broadcom, Farchild Semiconductors, and more. Seating is limited so ensure your place by registering today.
*** 3 Exciting Events in One Location, Santa Clara Convention Center, Santa Clara, CA, March 3-6 ***Enjoy Huge Discount when Your Register for All 3 Events
1
2
3
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 10
Networking Dinner & Brainstorming for 2014
Time: 6:00 PM to 8:30 PM Cost: $15 for buffet dinner Place: Sneha Restaurant, 1214 Apollo Way
#404B, Sunnyvale RSVP: from website Web: pace-networking-2014.eventbrite.com
Come join the IEEE SCV PACE team for a 2-part event to meet other engineers from the Bay Area and discover what PACE does locally and how you can help shape the events planned for 2014.
During the first part of the evening, you can enjoy a casual buffet dinner and meet with other engineers, managers and technologists from the Bay Area. This is a great opportunity to expand your network and meet people in similar fields or backgrounds in a casual setting. We hope to provide an opportunity to network, discuss and exchange career opportunities with like-minded folks.
The second half of the event will anchor the discussion around what PACE has done, currently plans to do for 2014 and what you would like to see more from PACE in the future. The PACE team will first present last year's and previous years' events and will give you a hint of what to expect in 2014. Once the presentation is finished, the floor will be opened for questions, comments and brainstorming.
The registration cost covers the food and venue. Indian buffet with Vegetarian as well as non-Vegetarian options are offered.
THURSDAY January 30, 2014SCV Professional Activities Committee for Engineers (PACE)
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 11
Quarterly Forum: Bay Area Multimedia Technology
Speakers: Shih-Fu Chang, Columbia Univ; Mei Han,
Google; Wenwu Zhu, Tsinghua Univ; Peter Vajda, Stanford Univ
Time: Networking/registration at 1:00 PM; Presentations from 1:30 PM - 5:00 PM
Cost: none Place: Pake Auditorium, PARC, 3333 Coyote Hill
Rd, Palo Alto RSVP: from website Web: www.bammf.org
This Forum presents four speakers on a diverse set of multi-media topics. Keynote Speaker "Images Shared in Social Media: A Window into User Sentiment and Emotion", Shih-Fu Chang, Columbia University. "Google StreetView Image Segmentation and Beyond", Mei Han, Google Inc. Keynote Speaker "Social-sensed Multimedia Computing", Wenwu Zhu, Tsinghua University "Personalized Television News", Peter Vajda, Stanford University
TUESDAY February 4, 2014
SCV Bay Area Multimedia Forum
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 12
Your Professional Network: The Secrets to a Successful
Consultancy
Speaker: Tim Worboys, LinkedIn Time: 7:00 PM (plus BigDataSIG, 6-7 pm) Cost: none Place: Agilent Technologies, 5301 Stevens Creek
Blvd., Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org
Tim Worboys started working at LinkedIn immediately after receiving his Bachelor of Applied Science degree in Computer Engineering in 2007. He is now a Senior Software Engineer in the Distributed Graph team where he works on building the next generation in-memory distributed query processing system.
Tim is active in the IEEE as the Chair of the local Young Professionals (formerly GOLD) Affinity Group, and he also volunteers with the global Young Professionals. Tim enjoys mentoring and teaching others, and helping them enhance their career. He satisfies this passion by giving talks throughout Canada and the US, and acting as a mentor for numerous students. In his spare time he enjoys kayaking, snorkeling and hiking in the mountains.
LinkedIn can keep track of your consulting
network, create your personal brand, and sell your services to potential customers. While you may be a regular user of this popular website, you may not be taking full advantage of its wealth of capabilities.
This live interactive tutorial will cover how best to use LinkedIn's features to build your personal brand and sell your consulting services. Come with plenty of questions and learn how to find new consulting leads and better your consulting career.
CNSV Pre-Meeting: BigDataSIG (6-7 pm)
Big Lies and Small Truths: Tales from the Accidental Big Data Scientist
Speaker: John Feland, Ph.D., Argus Insights We have reached a stage in the evolution of Big
Data where collecting and accessing tremendous amounts of data has moved from challenging to mundane. The next challenge will be in turning these storehouses into analytical work horses for businesses in a variety of marketplaces.
In this talk, Dr. John Feland will describe the lessons he learned from deployments of predictive analytics in Digital Marketing and the Internet of
Things. John will also share how he accidentally founded a Big Data company, what he has learned along the way to separate the hype from the useful, and where he postulates that Big Data could take us.
TUESDAY February 4, 2014SCV Consultants' Network of Silicon Valley
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Value Innovation: The Mindset of an Agile Engineer
Speaker: Pat Reed, Agile Consultant and Adjunct
Professor, iHoriz and UC Berkeley Time: 6:00 PM Cost: IEEE Member $11; non-Member $14 Place: Ramada, 1217 Wildwood Ave, Sunnyvale RSVP: from website Web: www.ieee-scv-tmc.org
Pat Reed has been solving technology problems, designing and delivering cutting edge solutions, developing leaders and driving transformational change for over 35 years. Throughout her career leading Business Technology Solutions, Pat has leveraged Lean Agile Project Management and Software Development principles and practices in the Mental Health, Criminal Justice, Criminal Intelligence, Entertainment & Retail Industries. For the past 8 years, before co-founding iHoriz, she led IT Strategic Planning, Global PMO, Portfolio Management, Risk and Vendor Management and IT Finance at Gap and her accomplishments include developing an Agile Portfolio Management capability, an Agile Accounting model and world class value management and adaptive career management frameworks.
Pat serves as a Director on the Agile Alliance Board and co-chaired the 2011 Agile Executive Forum with Jim Highsmith. She serves on the Executive Council on the Agile Leadership Network and is a frequent keynote speaker. She has earned an MBA & BS in Psychology (from the University of Illinois) and is active in PMI and the Bay Area Project Leaders Network, teaching at UC Berkeley Extension and consulting as principal agile management consultant with iHoriz.
As the pace of organizational change and
complexity accelerates, it’s critical that we find a way to move out of the “Do More with Less” mindset and build our competitive edge at truly doing less to create more time and space for innovation and sustainable value creation. It’s equally important to understand our unique value proposition and the critical mindset changes that are vital to mastery as an Agile Engineer. This session will introduce a framework to shatter several paradigms:
From: “more is better” To: “less is best” “do more with less” “do less and achieve more”.
”increased output” “decreased output and increased outcomes”
This 2-hour highly interactive workshop will introduce some practical tools to create a culture of Value. We introduce concepts of value drivers which is a technique to clarifying enterprise priorities and provide a clear-line-of-sight to enable everyone in the organization to understand how they create value. . Next we will interactively facilitate a deeper understanding of how to apply these concepts to your organization, develop an Enterprise Value Model and drill down to one or two of the value drivers and develop value stories and a Value Strategy Map.
This workshop will provide foundational concepts and practical tools to apply immediately in your enterprise to measure and manage an optimum flow of value and make value informed portfolio, program and project level decisions. We’ll wrap the session by exploring how to understand and leverage your unique value proposition.
What can you expect to learn? Understand how moving from a fixed to an agile
mindset amplifies the value that Engineers create for an organization
Understand the business case and benefits of creating a culture that’s razor focused on optimizing customer value
Learn key building blocks and management practices that are critical to aligning the organization around a shared focus on value
Practical techniques for alignment and clear line of sight on how everyone in the organization and deliver optimal value
Understand and explore ways to introduce value modeling, value engineering and value management in your organization
THURSDAY February 6, 2014
SCV Technology Management
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How to Grow Stronger through Rapid Changes in Technology
Speakers: Roxsana Hadjizadeh, Co-founder of IEEE-
WIE-SCV, and New Product Program Manager, Cisco Systems; and Ingrid Gavshon, Executive Leadership Coach
Time: 6:00 PM Cost: none Place: Stanford Univ (room TBD) RSVP: from website, or by email to Susan
Delafuente, [email protected] Web: www.ieee-wie-scv.org
Roxsana Hadjizadeh is an IEEE Sr. Member, IEEE SCV WIE co-founder, 2006-2012 SCV WIE Chair, and the 2013/2014 SCV WIE Sr. Advisor. In 2009, she served as IEEE SCV Section Chair and previously as Secretary, Treasurer and Vice Chair. She is an IEEE Spectrum Media Group advisor and has included Tesla Motors and Cisco Systems in a number of events from 2007 thru 2011. Roxsana holds a BSEE/MSEE and is currently a ITBU New Product Program Manager focusing on new Hardware and Software security products at Cisco Systems. Her past professional experience includes: Senior Staff Engineer, Manager and Director at various Silicon Valley companies including GENUS Inc., PRIAM, Network Computing Devices, WinCom Systems, Quantum 3D and Tesla Motors. Roxsana is a member of Cisco’s iWise (Inspiring Women through Information Sharing and Experiences), WISE (Women in Science and Engineering), and Connected Women, and Women in Technology. Roxsana loves giving back to society and is an active member in many charity events such as 2nd Harvest Food Bank, Habitat for Humanity, RAFT (Resource Area for Teaching), March of Dimes for babies and also Leading the team of university students for SVIJ (Silicon Valley Innovation Jam) events at Cisco.
In order for women to become authentic leaders
in the rapidly changing world of technology today, they need the ability to communicate effectively, to make meaningful connections and to identify a course of action to maximize their performance. This is where working with an Executive Coach can help empower women to achieve their fullest potential.
You are invited to attend the IEEE Women in Engineering Executive Fireside Chat to (1) Broaden awareness of IEEE Women in Engineering and encourage membership, leadership and active participation; and (2) Learn how to improve your soft skills through WIE and a leadership coach.
This is an opportunity to meet and ask questions of our Executive Sponsor and our special guest(s):
Ingrid Gavshon works with
clients in the United States, the Middle East, Mongolia, Russia and South Africa and believes coaching allows clients to create a shared thinking environment to effectively achieve their personal and professional goals, by identifying their strengths, recognizing obstacles to success, and as a team helps the coachee fulfil their potential. Ingrid is an Executive Coach and a member of the Berkeley Executive Coaching Institute Leadership and Communications team. Ingrid is an award-winning documentary filmmaker who has made a number of documentary films including 13 films about Nelson Mandela. Ingrid is a co-facilitator of the Peterson Caterpillar Brand Ambassador Program and is a guest faculty member at the Haas School of Business at UC Berkeley EWMBA and UCLA, UCB CEE. Ingrid’s clients include: Adobe USA, Cisco Systems, Cypress Semiconductors, Lawrence Berkeley Laboratory, Qualcomm, Advanced Technology Investment Company (ATIC) Abu Dhabi, Peterson Caterpillar, the RL Consulting Group in the USA and KC Alternative Health Services in the United Kingdom.
THURSDAY February 6, 2014SCV Women in Engineering
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OpenZFS: The Future of Open Source ZFS Development
Speaker: Matt Ahrens, Software Engineer, Delphix Time: Networking/Refreshments at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: Cadence / Bldg 10, 2655 Seely Ave, San
Jose RSVP: from website Web: sites.ieee.org/scv-cs
Matt Ahrens co-founded the ZFS project at Sun Microsystems in 2001, designed and implemented major components of ZFS including snapshots and remote replication, and helped lead Sun’s ZFS team for 9 years. Matt is now a software engineer at Delphix, where he works on ZFS for Delphix’s database virtualization appliance. He continues to improve ZFS, most recently working on i/o performance, as well as coordinating open-source ZFS development across companies and platforms. Matt founded the OpenZFS community, a collaboration among FreeBSD, Linux, Mac OS X, and illumos ZFS developers. Matt has a degree in Computer Science from Brown University.
ZFS is a combined file system and logical volume
manager originally designed by Sun Microsystems (now a part of Oracle). The features of ZFS include protection against data corruption, support for high storage capacities, data compression, snapshots and copy-on-write clones, continuous integrity checking and automatic repair, RAID Z (RAID 5) and native NFSv4 ACLs. The OpenZFS project provides a common development hub for all platforms working with open source ZFS code. This talk will discuss how OpenZFS enables ZFS code and ideas to flow easily between the illumos, FreeBSD, and Linux communities. It will cover how companies and organizations are integrating ZFS into their products, including purpose-built storage appliances and general-purpose distributions. In addition, it will highlight several important features and performance enhancements that were developed for OpenZFS, and also discuss forthcoming enhancements that are in the planning phase.
TUESDAY February 11, 2014SCV Computer
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Broadband Access Over Copper at Speeds Greater than 100 Mbps
Speakers: Kevin Fisher, VP of Advanced DSL
Technology, Ikanos; and Mehdi Mohseni, Director of Systems Engineering, ASSIA
Time: Networking and refreshments at 6:30 PM; Presentations at 7:00 PM
Cost: none Place: Texas Instruments Building E Conference
Center, 2900 Semiconductor Dr. Santa Clara
RSVP: not required Web: www.comsocscv.org
Kevin Fisher, VP of Advanced DSL Technology, Ikanos, has more than 27 years experience in developing and managing the development of firmware, software and complex silicon devices. At Ikanos, Fisher is responsible for accelerating the development and introduction of new DSL technologies. Prior to joining Ikanos, Fisher was CEO of Vector Silicon, Inc. Before VSI, he held several senior level engineering positions, including Vice President of IC and DSP engineering at 2Wire and department manager of advanced recording channels at Quantum Corp. He earned Ph.D. E.E. and M.S.E.E degrees from Stanford University after obtaining a B.S. degree in Computer Engineering at the University of Illinois.
Mehdi Mohseni is Director of Systems Engineering at ASSIA, Inc, where he is responsible for research and development of management algorithms for broadband access systems. He has previously held engineering management and architect positions at ASSIA. Mohseni was a lead contributor to the development of the ITU-T G.vector recommendation. He earned M.S. and Ph.D. degrees in electrical engineering from Stanford University, and a B.S. degree in electrical engineering from Sharif University of Technology, Tehran.
Silicon solutions for next-generation
broadband access over copper. The first talk will refer to advances in chipset design that enable broadband speeds of over 100 Mbps. It will be shown that Vectoring technology enables removal of crosstalk induced among twisted pairs, and achieves transmission speeds that were previously considered impossible. New emerging technologies will be described that promise speeds of almost 1 Gbps over copper twisted pairs.
Delivering copper-based broadband access services at 100 Mbps. The second talk will describe practical aspects of delivering broadband access services using vectored VDSL technologies. The importance of dynamic management systems for continuous optimization and automated fault identification/intervention will be explained. Management algorithm fundamentals will be presented, and results will be shown from real networks. The concept of Software-Defined Access Networking will be presenting as a means to promote service provider competition.
WEDNESDAY February 12, 2014
SCV Communications
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Flexible, Thin Film CIGS and Applications in Premium Markets
Speaker: Amit Kumar, Chairman, Ascent Solar
Technologies Time: Networking and refreshments at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: Palo Alto Research Center, Pake
Auditorium, 3333 Coyote Hill Road, Palo Alto
RSVP: not required Web: www.ewh.ieee.org/r6/scv/pv
Dr. Amit Kumar is currently President and CEO of GFF, a privately held biotechnology and energy company. He is also Chairman of the Board of Ascent Solar Technologies (ASTI:NASDAQ). He also sits on the Boards of two additional publicly traded companies. Previously, he was President and CEO of CombiMatrix Corporation (CBMX:NASDAQ) from 2000-2010, which he took public in 2002. He remained on the Board of CBMX until 2012. Before, CombiMatrix, he was Vice President at Acacia Research Corporation (ACTG:NASDAQ), a publicly traded venture capital firm. Previous to that he was the founding CEO of Signature BioSciences, a VC-funded drug discovery company. Prior to Signature, Dr. Kumar was engaged as an Entrepreneur-in-Residence for Oak Investment Partners, a venture capital firm. Previous to Oak, Dr. Kumar was Senior Manager for Futures Technology and General Manager for IDEXX (NASDAQ:IDXX) Laboratories’ west coast R&D operations. Prior to IDEXX, Dr. Kumar was Program Manager for New Technology at Idetek Corporation, which was acquired by IDEXX.
He holds an AB with honors in Chemistry from Occidental College. Following post-graduate studies at Stanford University and the California Institute of Technology, he received his Ph.D. in chemistry from the California Institute of Technology under the direction of Professor Nathan S. Lewis. He also completed a post-doctoral fellowship at Harvard University under the direction Professor George M. Whitesides, where he was the inventor of a technology known as “soft lithography”. Dr. Kumar’s Ph.D. research focused on fundamental studies of photovoltaic cells using silicon (amorphous, poly-crystalline, and crystalline), III-V materials, II-VI materials, and oxide semiconductors. He also performed research on water-splitting.
While most agree that solar markets will continue
to grow as technology and costs improve, the capital intensive nature of this business and competition from fossil fuels and other factors have created stresses in this industry. Numerous private and publicly traded solar module manufacturers have failed and many others are under tremendous pressure. Specifically in the CIGS space, many companies have failed even after investing hundreds of millions or billions of dollars. As a result investor interest has waned and companies need to develop newer business models. Ascent Solar (ASTI) which went public in 2007 has transitioned to a model where it is able to sell products at a price that can be 100 times higher than conventional prices. ASTI’s thin film CIGS cells, built on a flexible substrate, enable applications in multiple markets, where such premium pricing can be achieved. Many module manufacturers have discussed entering these premium markets, however there are many considerations that affect executing such a strategy. Ascent has pivoted to access these premium opportunities, while maintaining the ability to address conventional markets. This talk will discuss many of the challenges in pivoting, and how ASTI has addressed them. The talk will present insights on how such a strategy can change the way investors view and monitor the success of the company, how the capital needs are reduced, and how investment focus changes- for example efficiency may not be as important as before.
WEDNESDAY February 12, 2014
SCV Photovoltaics
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Dielectric Resonator Antennas, Transparent Antennas, and
Spherical 3D Antennas
Speaker: Dr. Kwok Wa (Ben) Leung, City College of Hong Kong, an IEEE Distinguished Lecturer
Time: Networking and refreshments at 6:30 PM; Presentation at 7:00 PM
Cost: none Place: Cogswell College, 1175 Bordeaux Drive,
Sunnyvale RSVP: rom website Web: sites.ieee.org/scv-aps
Kwok Wa Leung was born in Hong Kong. He received the B.Sc. degree in Electronics and Ph.D. degree in electronic engineering from the Chinese University of Hong Kong, in 1990 and 1993, respectively. From 1990 to 1993, he was a Graduate Assistant with the Department of Electronic Engineering, the Chinese University of Hong Kong. In 1994, he joined the Department of Electronic Engineering at City University of Hong Kong (CityU) and is currently a Professor and an Assistant Head of the Department. He is also the founding Director of the Innovation Centre of the Department. From Jan. to June, 2006, he was a Visiting Professor in the Department of Electrical Engineering, The Pennsylvania State University.
Professor Leung was the Chairman of the IEEE AP/MTT Hong Kong Joint Chapter for the years of 2006 and 2007. He was the Chairman of the Technical Program Committee, 2008 Asia-Pacific Microwave Conference, Hong Kong, the Co-Chair of the Technical Program Committee, 2006 IEEE TENCON, Hong Kong, and the Finance Chair of PIERS 1997, Hong Kong. His research interests include RFID tag antennas, dielectric resonator antennas, microstrip antennas, wire antennas, guided wave theory, computational electromagnetics, and mobile communications. He was an Editor for HKIE Transactions, a Guest Editor of IET Microwaves, Antennas and Propagation, and an Associate Editor for IEEE Antennas and Wireless Propagation Letters. He was also an Associate Editor for IEEE Transactions on Antennas and Propagation and received Transactions Commendation Certificates twice in 2009 and 2010 for his exceptional performance. Currently, he is the Editor-in-Chief of IEEE Transactions on Antennas and Propagation. He is a Distinguished Lecturer of the IEEE Antennas and Propagation Society. (Continued ...)
The fundamentals and development of dielectric
resonator antenna will be discussed in this talk. For many years, dielectric resonators (DRs) have only been used as high-Q elements in microwave circuits until S. A. Long and his collaborators showed that they can also be used as efficient radiators. As compared to the microstrip antenna, the DRA has a much wider impedance bandwidth (~ 10% for dielectric constant ~ 10). This is because the microstrip antenna radiates only through two narrow radiation slots, whereas the DRA radiates through the whole DRA surface except the grounded part. Avoidance of surface waves is another attractive advantage of the DRA over the microstrip antenna. Although the DRA received attention originally for millimeter-wave applications, it is also widely investigated at microwave or even RF frequencies. It is because the DRA is a volume device that offers designers more degrees of freedom than 2D-type antennas (e.g., microstrip antennas) or 1D-type antennas (e.g., monopole antennas). Other advantages of the DRA include its light weight, low cost, low loss, and ease of excitation.
Transparent antennas are very attractive. They can be integrated with clear substrates such as window glass, or with solar cells to save surface areas of satellites. Transparent antennas are normally realized using (2D) planar structures based on the theory of patch antenna. For a long time, transparent antennas have been of planar (2D) structures. Very recently, 3D transparent antennas have also been developed. This is a new topic. The principle of 3D transparent antenna is based on the theory of dielectric resonator antenna; the resonance is caused by the whole 3D structure rather than a confined cavity as found in the patch-antenna case. Recently, a dielectric constant of ~7 was measured for glass at 2 GHz and this value is sufficient for obtaining a good radiator. Since crystals are basically glass, they can also be used for antenna designs. In this talk, the characteristics of glass DRAs will be shown. In addition, the idea of using a 3D glass antenna as a light cover will be presented. It has been experimentally found that the lighting and antenna parts do not affect each other because they are operating in totally different frequency regions. Finally, it will be shown that 3D transparent antennas can be designed as aesthetic glass (or crystal) wares or artworks. This idea is especially useful when invisible antennas are needed due to psychological reasons.
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THURSDAY February 13, 2014 SCV Antennas and Propagation
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Professor Leung received the International Union of Radio Science (USRI) Young Scientists Awards in 1993 and 1995, awarded in Kyoto, Japan and St. Petersburg, Russia, respectively. He received CityU Research Excellence Award 2013 and Departmental Outstanding Teacher Awards in 2005, 2010, and 2011. He is a Fellow of IEEE and of Hong Kong Institute of Engineers (HKIE).
The spherical antenna is an interesting and useful topic. For example, a spherical helical antenna can radiate circularly polarized fields over a wide beamwidth. An antenna array with its elements distributed over a spherical surface is able to determine the direction-of-arrival and polarization of an incoming wave. Further, a spherical antenna array can be used to avoid the scanning problem of a planar array at low elevation. The spherical antenna is also important from the theoretical point of view. Since a spherical structure does not have any edge-shaped boundaries as found in cylindrical and rectangular structures, its closed-form Green’s function is obtainable. As a result, an exact solution of a spherical problem can exist, and the solution can be used as a reference for checking the accuracy of numerical or approximation techniques. Excellent agreement between theory and experiment is observed and the results will be presented in the talk. Finally, it will be shown that a spherical solution can be used to solve a planar annular problem.
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Measuring Dielectric Constant with a Microstrip Ring Resonator
Speaker: Jeff Philips, TCI Time: Networking and refreshments at 6:00 PM;
Presentation at 6:30 PM Cost: none Place: Agilent Technologies, 5301 Stevens Creek
Blvd, Santa Clara RSVP: not required Web: meetings.vtools.ieee.org/
meeting_view/list_meeting/23265
Jeff Philips graduated from San Jose State University in 1996 with an undergraduate degree in electrical engineering with a minor in mathematics. He also joined his current employer TCI in 1996 as an RF Engineer. He has been involved in the design of three generations of receivers and antenna switches. One of his career passions is making his modeling results agree with his network analyzer measurements.
There’s no point in modeling RF and microwave
circuitry without an accurate microstrip substrate definition and specifically without an accurate dielectric constant. Historically, there’s been some confusion about the dielectric constant of Rogers’ 4003 material. Solder mask is often cleared over critical portions of microstrip circuitry on RF and microwave PCBs to perfectly mimic the microstrip definition. Instead of covering the copper with solder mask, it is often covered with the popular ENIG PCB finish. Does the nickel in the ENIG PCB finish create unacceptable loss? If it does, could critical circuitry instead be covered with solder masks like the popular Taiyo PSR-4000 BN Series? Does solder mask change the effective dielectric constant? These questions will be discussed. Also, a microstrip ring resonator technique to measure dielectric constant will be introduced. Measurements of dielectric constant with 0-, 1-, and 2-mil solder mask thicknesses on the Rogers 4003 material will be presented. The discussion focuses on PCB design, but the concepts and techniques might be applicable to IC design as well.
THURSDAY February 13, 2014
SCV Microwave Theory and Techniques
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Nano-Justified: Why Nano Matters for Silicon Thermoelectrics
Speaker: Dr. Akram Boukai, CEO and Co-Founder,
Silicium Energy Time: Registration & light lunch at 11:30 AM;
Presentation at 12:00 PM Cost: IEEE Members: $5, Non-members:$10 Place: Texas Instruments (TI) Auditorium, 2900
Semiconductor Dr, Santa Clara RSVP: from website Web: sites.ieee.org/sfbanano
Akram Boukai obtained his PhD from the California Institute of Technology in 2008. His research focused on the thermoelectric properties of nanostructured silicon where he produced and measured high efficiency thermoelectrics. He then went on to become an Assistant Professor at the University of Michigan in the Materials Science and Engineering Department. There his group made a breakthrough in the manufacture of nanostructured silicon thermoelectrics, which resulted in the formation of a Khosla Ventures funded startup, Silicium Energy. Akram now serves full-time as the co-founder and CEO of Silicium Energy and is continuing his dream of taking his laboratory discovery on silicon thermoelectrics to market.
Nano has been an overhyped buzzword for more than a decade and yet it's difficult to point to a product that benefits from the nanoscale. The field of thermoelectrics, however, benefits tremendously from nanostructuring due to dissimilar length scales between heat and electron transport. Silicon in particular has very different length scales for heat and electron transport. Recently, silicon based thermoelectric devices that utilize a finely tuned nanostructure have delivered high performance in the lab. This discovery culminated in the formation of Silicium Energy in 2011 with funding from Khosla Ventures. Silicium Energy is developing next-generation thermoelectric devices with unprecedented performance designed to revolutionize markets for waste heat recovery and refrigeration. Silicium's platform has the potential to achieve high ZT across a wide range of temperatures at low cost. Silicium leverages technology created at Caltech and the University of Michigan, which utilizes a "fab-less" approach for high performance thermoelectrics using off the shelf silicon wafers.
TUESDAY February 18, 2014
SCV Nanotechnology
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Fuses for Supplementary Protection:
Safety Versus Reliability
Speakers: John McBain and Jim Krepelka, Agilent Technologies
Time: Networking and snacks at 6:30 PM; Presentations at 7:00 PM
Cost: none Place: Aristotle Room, Agilent Technologies, 5301
Stevens Creek Blvd, Santa Clara RSVP: not required Web: ewh.ieee.org/r6/scv/rl
John McBain, Product Safety Engineering Society, Agilent Technologies, started having fun with product safety at Underwriters Labs, working on products ranging from office and data processing equipment to electrical conduit and snap switches. After 4 years at UL, John moved to Qume and then Hewlett Packard. During the 1990’s John helped grow the Product Safety Technical Committee (now the PSES) and circulation of the Product Safety Newsletter, as well as earning degrees at San Jose State University (MS Engineering and MBA) to augment his B.Sc. in physics/math from the University of Alberta in Edmonton.
In the last decade John has looked at product safety in semiconductor equipment (KLA-Tencor), military vehicles (BAE Systems) and test and measurement equipment (Agilent Technologies). He is a senior member of the IEEE.
Jim Krepelka of Agilent Technologies, for the last
15 years, has coordinated both reliability test and environmental test activities for diverse products such as mass spectrometers, genetic array scanners, and laboratory robotics. Prior to his Reliability Engineering role, he spent 6 years in R&D for mass spectroscopy at the Chemical Analysis Solutions Division of Hewlett Packard. Before that, he spent 5 years in Manufacturing Engineering for spectrophotometry and bio-reagent products at the Scientific Instruments Division of Hewlett Packard. He received his BSEE degree from San Jose State University and a BS in Aviation Management from the University of Southern Illinois. He is a senior member of the ASQ and is an ASQ Certified Reliability Engineer (CRE).
Fuses for Supplementary Protection: Safety
Versus Reliability is a topic that should not exist! After all, we want both safety and reliability, not one or the other. Product safety and reliability both focus on how and why items fail, perhaps more than on how they work, but fuses have the paradoxical characteristic that they are working when they fail. Unfortunately, fuses may occasionally fail to work as expected.
This case study explores the relationship that exists between some fuses and fuseholders with an emphasis on failure mechanisms that are not always obvious from reading specifications.
TUESDAY February 18, 2014SCV Reliability, with Product Safety Engineering
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History of the Magnetics and Control of Actuators
in Disk Drives
Speaker: Dr. Art Wagner, consultant Time: Networking and pizza at 6:45 PM;
Presentations at 7:30 PM Cost: none Place: Western Digital, 1710 Automation Parkway,
San Jose RSVP: not required Web: ewh.ieee.org/r6/scv/mag
Dr. Art Wagner has designed in the areas of the magnetics and control of the actuator and the spindle motor for a multitude of disk drive companies, including Seagate, Maxtor, Maxoptics, Quantum, Conner Peripherals, IBM, ISS, Priam, Iota, StorCard, and Swan.
Art taught full time at SJSU for 13 years, attaining full professorship with tenure, then he went into the disk drive industry. He designed in the areas of the magnetics and control of the actuator and the spindle motor for a multitude of disk drive companies, including Seagate, Maxtor, Maxoptics, Quantum, Conner Peripherals, IBM, ISS, Priam, Iota, StorCard, and Swan. Along the way, Art taught a series of short courses on the moving coil actuator, the disk drive spindle motor, and perpendicular magnetic recording. He also taught classes part-time at Santa Clara University on mechatronics. Presently, he is teaching a class at SJSU. Art received a bachelor’s degree from Santa Clara University, master’s degree from the University of Arizona, and a Ph.D. from Oregon State University. He is a member of the SCV Magnetics Society and a regular attendee at our meetings.
In computer systems, an important data storage
medium, beginning in the 1950s until today, is the Hard Disk Drive (HDD). Using magnetic heads, the HDD reads and writes data on magnetic surfaces of spinning disks. A disk drive actuator positions the magnetic heads on data using a combination of position and velocity feedback control. An engineer configures an actuator from magnets, steel, a coil, bearings, and head arms. The presentation centers on the progression of actuator configurations. The talk pays attention to parameters important for control, such as the force factor or torque factor, mass or inertia, and coil resistance. In this presentation, we discuss configuration evolution from typical early actuators to configurations prevalent in today’s actuators and control. We answer the question: what has changed, what is the same?
TUESDAY February 18, 2014
SCV Magnetics
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Product-Level Reliability Challenges Originating from
TDDB, BTI and Variability
Speaker: Dr. Tanya Nigam, GlobalFoundries Time: Networking and pizza at 6:00 PM;
Presentation at 6:15 PM Cost: none Place: Texas Instruments Building E Conference
Center, 2900 Semiconductor Dr., Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds
Dr. Tanya Nigam obtained Ph.D from Katholieke Universiteit Leuvenin (1999), in the area of ultra-thin gate oxides from the work done at IMEC, Belgium. From 1999 until 2001, Tanya was a Member of Technical Staff at Bell Labs. During this period she worked on novel device geometries to overcome sub-50nm device challenges. From 2001 until 2005, she was with Agere Systems, formerly the Microelectronics Division of Lucent Technology. At Agere, she worked on reliability issues for power LDMOS devices, and HCI/NBTI reliability concerns for CMOS. From October 2005 till 2007 Tanya worked as a Senior Staff at Cypress Semiconductor involved in the optimization of 65nm CMOS. Since Jan 2008 she is working at AMD as SMTS, correlating device level degradation to product level degradation. Since 2009 she has been working at GLOBALFOUNDRIES. She is currently a Distinguished Member of Technical staff working in the area of Front End of Line reliability for sub 20 nm technologies. She has co-authored 60 papers in Journals and Conferences.
As we continue scaling towards 10 nm, reliability
is becoming an integral part of the complete technology offering. Building in reliability is critical to the success of future scaling. For sub-100 nm technologies, material changes have been necessary to meet the power, performance and reliability requirements. In the sub-45 nm regime, SiOx based dielectrics have been replaced by HK MG leading to new degradation mechanisms such as PBTI and also changed the understanding of existing mechanisms such as TDDB. As we scale further we need to comprehend interaction between device-level variability pre- and post-stress and circuit functionality. In this talk I will address some of the challenges and correlation of device level reliability learning to simple circuits such ring oscillator and SRAM cells. Also I will outline the efforts being made to extend these to product level solutions.
TUESDAY February 18, 2014SCV Electron Devices
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Switchboard and Panelboard Basics: A Tour of the Eaton
Hayward Facility Speakers: Joseph Burnett, Jason Maffioli, Kendyl
Brown, and Bob Salter, Eaton Time: Light Dinner at 5:30 PM; Short Presentation
at 6:00PM; Tours at 6:30 PM Cost: none Place: Eaton Corp., 20923 Cabot Blvd., Hayward RSVP: to Michael Nakamura,
[email protected], (925) 330-6595 (limited to first 35)
Web: www.e-grid.net/docs/1402-oeb-ias.pdf
Joe Burnett is currently the Business Operations and Plant Manager at Eaton’s Hayward Customer Service Center in Hayward. Joe has held various positions at Eaton including Field Sales and Applications, and Production Manager. Joe holds a BS in Computer Science from University of Illinois at Urbana-Champaign, and an AS in Electrical and Electronics Engineering from College of DuPage.
Jason Maffioli is a Senior Product Engineer at
Eaton and has held positions of Manufacturing Engineer, Division Test Engineer and Production Supervisor. Jason earned his Bachelor of Engineering in Industrial Engineering at West Virginia University.
Kendyl Brown is a Product Engineer at Eaton and
holds a BSME from Chico State. Kendyl has extensive experience in both Panelboard and Switchboard construction.
Bob Salter is a Field Specialist at Eaton. Bob is a
Registered PE (EE) since 1994, holds a BSEE from Worcester Polytechnic Institute, and MBA (Finance) from SF State. Bob is a Senior Member of IEEE.
We will discuss Basics of switchboard
construction, functions and features, some of the basic “dos and don’ts” related to Switchboard specification, differences between Switchboards and Panelboards, some of the differences and similarities between switchboards and switchgear, and application limitations. The short presentation will be followed by a tour where attendees can see first-hand the basic building blocks, and how panelboards and switchboards are built.
THURSDAY February 20, 2014
OEB Industry Applications
February 2014 V is i t us a t w w w . e - G R I D . n e t Page 26
Trampoline Dodgeball Time: 7:00 PM - 8:30 PM Cost: $10 members, $12 non-members Place: Sky High Sports, 2880 Mead Avenue,
Santa Clara RSVP: from website Web: scv-yp-skyhigh.eventbrite.com
Come out and join the IEEE SCV Young
Professionals for our first networking event of the year at Sky High Sports. We will have free reign to play on the trampolines, play trampoline dodgeball and jump in the foam pit! It's a super exciting and fun sport, to find out more visit http://sjc.jumpskyhigh.com/
Prior to arriving on February 24, please download and sign the following liability waiver: http://bit.ly/1chjAPz
What is Young Professionals? For those of you that don’t know we're the Young
Professionals affinity group of the IEEE in Santa Clara Valley. We primarily focus on helping recent graduates be productive in their jobs and to achieve success through networking (social), technical and professional development events.
Why Young Professionals? Young Professionals is a great opportunity and
place for you to get involved and meet like-minded people in silicon valley while building your career at the same time. We are a great way to expand your professional network, or if you are new to the area you can meet new people. Not all of our events are technical in nature, we also run quite a few social events which make for a good way to relax after a hard day’s work and also meet your fellow engineers.
Why Get Involved on the Committee? Being a committee member is a great way for you
to have your opinions heard and to shape the future of the IEEE and specifically the Young Professionals affinity group. You can plan events to help fellow Engineers build their career, and in doing so build your own career as well. Your involvement in IEEE looks great on a resume, and is also a great way to network with other respected engineers in your field who can help you fulfull your career goals. Young Professionals is a well sought after affinity group which tries to work with other societies and affinity groups which even allows you to make connections with more senior Engineers in industry. Furthermore, leadership positions available on the Young Professionals committee can give you great leadership experience which will provide you with transferrable leadership and management skills.
MONDAY February 24, 2014
SCV Young Professionals (was GOLD)
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Codes, Standards and Listings - Who Requires What, and Why
Speaker: John Taecker, Underwriters Laboratories Time: Networking and social at 5:30 PM;
Presentation at 6:00 PM; Dinner at 7:00 PM Cost: $25 ($10 for Student Members) Place: Sinbad's Restaurant, Pier 2 The
Embarcadero, San Francisco RSVP: from website Web: meetings.vtools.ieee.org/
meeting_view/list_meeting/23039
John Taecker, P.E. has worked for Underwriters Laboratories Inc. for 29 years. He has a BS in Mechanical Engineering from Cal Poly, San Luis Obispo, and is a California Registered Professional Engineer in Safety Engineering. He has served on various building, mechanical, and plumbing code development committees, and actively participates in all levels of the code development process for ICC and IAPMO. He is a nationally recognized speaker on electrical, building, mechanical, and plumbing products and installations.
There are many installation codes and product
testing standards that apply to products. How can you determine what codes and standards effect your product? What reliable resources are available? Does the installation code influence the testing standard, or does the standard influence the code? How are codes and standards developed, and are there any opportunities to provide input? What products are required to be Listed? Why are the products required to be Listed? Learn who requires products to be certified by a third-party agency, what requirements are used, how a product is certified, and where information about certifications can be found. Discussion will include both the safety requirements, but also the new requirements under development for sustainable ("green") buildings and energy efficiency.
TUESDAY February 25, 2014SF Industry Applications
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Probing Interfacial Contact via MEMS-based
Microinstrumentation Speaker: Roya Maboudian, Department of Chemical
& Biomolecular Engineering, UC-Berkeley Time: Networking and lunch at 11:30 AM;
Presentation at 12:00 PM Noon Cost: $15; $5 for full-time students and
unemployed ($5 more at door) Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa
Clara RSVP: from website Web: www.cpmt.org/scv/meetings/cpmt1402l.html
Roya Maboudian is professor of chemical and biomolecular engineering, associate director of the Center of Integrated Nanomechanical Systems (COINS), and faculty affiliate of the Berkeley Sensor & Actuator Center (BSAC) at the University of California, Berkeley. She received her B.S. degree in Electrical Engineering from the Catholic University of America, Washington, D.C., and her M.S. and Ph.D. degrees in Applied Physics from the California Institute of Technology in Pasadena. Prof. Maboudian's research interest is in the surface and materials science and engineering of micro/nanosystems. The main research activities in her group currently include investigation of the tribological issues in micro/nanoelectromechanical systems (M/NEMS) and surface interactions in microfluidic environments; silicon carbide-based sensors for harsh environment applications; nanowire- and graphene-based sensors and energy technologies; development of electrochemical processes for low-cost thin-film photovoltaics; and biologically inspired materials design. Prof. Maboudian is the recipient of several awards, including the Presidential Early Career Award for Scientists and Engineers (PECASE) from the White House, NSF Young Investigator award, and the Beckman Young Investigator award. She is currently serving as editor to the IEEE Journal of Microelectromechanical Systems (JMEMS), as associate editor to IEEE/SPIE Journal on Micro/Nanolithography, MEMS and MOEMS (JM3), and as advisory board member to ACS Applied Materials and Interfaces (AMI).
Understanding the mechanisms underlying the interactions that occur when two surfaces are brought together, separated, or rubbed against each other is fundamentally important to many basic and applied problems. In this presentation, I will discuss the impact of these interactions in the burgeoning field of micro- and nano-electromechanical systems. I will also present the unique opportunities provided by the MEMS processing techniques to interrogate surfaces on a length scale not easily accessible by other techniques, namely in the mesoscopic length scale. With this view, I will introduce a number of MEMS-based microinstruments that we have developed to study these interactions, and some of the insights we have gained using them about the nature of surface interactions involved in M/NEMS.
THURSDAY February 27, 2014
SCV Components, Packaging and Manufacturing Technology
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1-day Seminar : The Electrical Code of the Future
Speakers: Eric Leber, Cree Lighting; Ron France,
Leviton; Halley Fitzpatrick, Arup; and Rick Miller, RNM Engineering
Time: Regisration & Continental breakfast at 7:30 AM; Presentations 8:30 AM - 4:40 PM
Cost: $250 Place: Hilton, 7050 Johnson Dr., Pleasanton RSVP: from website Web: www.e-grid.net/docs/1402-sf-ias.pdf
For biographies of speakers, download flyer.
Lighting Controls Acceptance Testing Technician and the four Certificates of Acceptance that are required to be completed. If everyone has done everything right then all that the Building Inspector is required to do is to verify that all the Certificates are completed with a passing grade. Code Update: Engineering Design to comply with the NEC and CEC (John Taecker, P.E., Underwriters Laboratories; Mike Stone, NEMA)
John and Mike will present an overview of the significant changes to the 2011 National Electrical Code (NEC), which is the basis for the 2013 California Electrical Code (CEC). Changes include service definitions, labeling requirements for available fault currents, fine stranded conductor terminations, grounding electrode requirements, reorganization of Article 310, health care facilities, and three new NEC articles.
Session 3: Q & A with Your Favorite Electrical Equipment Supplier Reps.
For the previous two IEEE Seminars, the four “Fixtures” from GE, Eaton, IEM, and Schneider Electric have reviewed power distribution equipment basics, and discussed specifications. This year, the GE and Eaton Representatives will stand before the seminar attendees with open minds to answer your questions. So, bring some hard questions pertaining to electrical distribution equipment, products and applications, codes and standards, and they will do their best to address your industry issues and concerns.
Speakers: Chris Lovin, Eaton; Gary Fox, PE, General Electric
LED Lighting (Eric Leber, Cree Lighting) Why is LED lighting important today? Subjects
Covered: LED considerations for power efficiency, heat dissipation, optics, and systems integration. Current market trends and opportunities. How to identify quality LED lighting and understanding LED ratings. Last portion of the lecture will focus on LED applications and case studies showing the impact of LED. Lighting Controls, Metering and power segregation (Ron France, Leviton)
Overview of the new Title 24 code, summarizing changes and the impact and concerns on the design of commercial buildings, parking garages, and site lighting. Design impacts on dimming systems, daylight harvesting systems, overall lighting controls, sub-metering, plug load control, and demand response will be discussed. Lighting Design (Halley Fitzpatrick, Arup)
The new version of Title 24 code is light on LPD changes but comes with major changes to minimum lighting control requirements. These changes will affect lighting control systems and zoning, the light fixture specified, and lighting layouts. This presentation is a brief – but detailed – look at how these changes will affect lighting system design for several project and space types.
Commissioning and Testing: New Final Building Acceptance Protocol (Rick Miller, RNM Engineering)
“Paperwork” – The Bane of the New Title 24 - So you think you know what Title 24 is all about? You know about the allowable watts for lighting and about the required controls for lighting, now learn about the required paperwork! Yes, Title 24 requires paperwork and lots of it. “Passing grades” are required by the designer, commissioning agent, manufacturers and vendors, installing contractor, and acceptance testing technician. Rick Miller will share how to survive the Title 24 paperwork tide. A quick review of the thirteen Certificates of Compliance that the design engineer needs to complete and place in the drawings in order to submit for a building permit will be followed by an explanation of the Commissioning process and its five Certificates of Commissioning Review to be completed by the commissioning agent. Learn about the eleven Certificates of Installation that are required to be completed by the installing contractor or the construction foreman. Rick will finish his session by explaining the job of the newly created Certified (continued, at left)
FRIDAY February 28, 2014
SF Industry Applications
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Innovation in Japan and in Silicon Valley
Speaker: Takahide Inoue, Global Outreach Director,
CITRIS (the Center for Information Technology Research in the Interest of Society), UC Berkeley
Time: 7:00 PM Cost: none Place: Agilent Technologies, 5301 Stevens Creek
Blvd., Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org
Takahide Inoue is the Global Outreach Director of CITRIS (the Center for Information Technology Research in the Interest of Society) at UC Berkeley, and he was a Special Advisor to CITRIS from its founding in 2001 to 2010. He is also a Founder and Principal of BA Consulting Group Company, and has been Senior Consultant for the Japanese Semiconductor Technology Research Corporation (STARC) since 1998.
Takahide-san was at Sony Corp. from 1965-98, including serving as Sr. VP of Sony Engineering and Manufacturing of America in San Jose from 1991-98. His BS in EE is from Keio-Gijyuku Univ., and his MBA is from Northeastern Univ.
This event will be a discussion about differences
between Japanese and American culture from the perspective of electrical engineers. It will be led by a panel of three CNSV members who have a proven track record in innovation and entrepreneurship, and three Japanese engineers who are familiar with working in the technology sectors in both Japan and in Silicon Valley.
The following topics will be discussed: the findings of a select committee of the
Japanese Ministry for Economy, Trade, and Industry (METI), which is co-chaired by panel organizer Takahide Inoue, and which has been trying many different and fairly drastic changes in an attempt to revive the Japanese semiconductor industry
the differences in the awareness and common sense of engineers in Silicon Valley and Japan
how the relationship between employers and workers differs between the two environments
the interest of Japanese engineers in the role of IEEE's local chapters, especially in Silicon Valley
the role of personal networks, how these networks are created, and the benefits of their strengths
MONDAY March 3, 2014
SCV Consultants' Network of Silicon Valley
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Cleanroom Robots for Semiconductor Manufacturing
Speaker: Dr. Karl Mathia, President, Zidecs
Automation Time: Networking/Refreshments at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: Cadence / Bldg 10, 2655 Seely Ave, San
Jose RSVP: from website Web: sites.ieee.org/scv-cs
Dr. Karl Mathia is an experienced engineer in the areas of motion control, robotics, and cleanroom automation. He is the owner and president of Zidecs Automation, Inc., a technology firm that provides engineering services and automation solutions to equipment makers. Karl previously worked for automation providers, including Brooks Automation and Newport Corporation. He holds an M.S. in Electrical Engineering from the Technical University in Munich, Germany, and a Ph.D. in Electrical and Computer Engineering from Portland State University in Oregon. He authored of over 30 technical articles and the book “Robotics for Electronics Manufacturing – Principles and Applications in Cleanroom Automation”, published by Cambridge University Press in 2010. Karl is a Senior Member of the IEEE and Chair of the Control Systems Society in Silicon Valley.
This talk emphasizes the technical challenges with
the automation of ultra-clean semiconductor factories, and discusses cleanroom robotics as an example. Topics include cleanliness requirements, design guidelines for cleanroom robots, kinematics and dynamics, as well as the installation and test of cleanroom robotic systems. Beginning with early substrate-handling robots, the speaker outlines how current cleanroom automation evolved over time to accommodate -- and enabled -- the transition to 200 mm and 300 mm wafer sizes. Real-world examples illustrate the design of robots for atmospheric and vacuum environments.
TUESDAY March 11, 2014
SCV Computer
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International Technology Roadmap for Semiconductors
(ITRS) Update - Overview, Highlights
Speaker: Alan K. Allan, Intel Corporation Time: Networking and pizza at 6:00 PM;
Presentation at 6:15 PM Cost: none Place: Texas Instruments Building E Conference
Center, 2900 Semiconductor Dr., Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds
Alan K. Allan, Staff Engineer, Intel Corp.: BSEE, 1971, University of Colorado Boulder; 7 years Motorola Semiconductor; 35 years Intel Corp.; past responsibilities: Design Engineer, Process Engineer, Applications Engineer, Product Market Engineer, Product Market Manager, Division Sales Training Manager, Corporate Market Research Council Member, SEMATECH Assignee, International SEMATECH/I300I Assignee. Alan is presently assigned as a Staff Engineer for Intel Technology Manufacturing Group (TMG) External Programs to support: the International Technology Roadmap for Semiconductors (ITRS); the International National Electronics Manufacturing Initiative (iNEMI) Roadmap; the SRC FORCe University Research Programs; and various SEMATECH Member and SEMI Supplier Industry Economic and Productivity Model Projects.
Highlights from the latest version of the
International Technology Roadmap for Semiconductors (ITRS).
TUESDAY March 11, 2014
SCV Electron Devices
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Human Interface Technologies for Mobile Devices: Today
and the Future
Speakers: Adam Schwartz, VP of System Architecture, and Patrick Worfolk, VP of Corporate Research and Technology, Synaptics
Time: Networking and refreshments at 6:30 PM; Presentations at 7:00 PM
Cost: $5 donation for refreshments Place: Texas Instruments Conf Center, 2900
Semiconductor Dr. Santa Clara RSVP: from website Web: www.comsocscv.org
Adam Schwartz is the Vice President of System Architecture at Synaptics. The Architecture group is responsible for areas such as sensing schemes, ASIC architecture, firmware algorithms, sensor design and optimization and investigation of methods to provide new or enhanced capabilities. Prior to joining Synaptics, Adam was the Director of RF Architecture at a startup company developing ultra-wideband wireless HDMI and, before that, Chief Technology Officer at another startup company developing cellular infrastructure for in-building coverage. Both startup companies were acquired. Adam holds a PhD in electrical engineering from the University of California at Berkeley and MSEE and BSEE degrees from MIT.
Patrick Worfolk is the Vice President of Corporate
Research and Technology at Synaptics. His team is responsible for developing and exploring new technologies to advance human computer interfaces, with core competencies including materials and manufacturing, mechanical and electrical engineering, and modeling and simulation. Prior to joining Synaptics, Patrick was the Director of Architecture at a startup designing low-power wireless technology for the retail industry. He has also been responsible for designing protocols for PAN, LAN and WAN wireless technologies. Patrick holds PhD and MSc degrees in Applied Mathematics from Cornell University and a BSc degree in Mathematics from MIT.
In the competitive business of mobile devices, one primary area of differentiation is the user experience. Human-computer interface technology plays a significant role in the user experience. This session will cover the interface technologies present in today's devices, including a survey of the major challenges for capacitive sensing, followed by a discussion of a range of interface technologies which are likely to appear in the future. Two talks:
Capacitive Sensing: Looking under the Hood
Interfaces for consumer electronics are dominated by capacitive touch. Although largely unnoticed when working properly, the touch interface is a primary factor in the user experience of devices such as smartphones, tablets and laptops. Consequently, innovation in the touch interface is an active area of differentiation in a world of otherwise homogenous products. This talk explores touch innovation in the recent years and explains some of the non-obvious issues that make designing touch systems so challenging.
Human Computer Interfaces: Looking down the Road
This talk starts out by reviewing the current state-of-the-art in interface technology in mobile consumer devices. It then surveys a range of interface technologies currently under development. This includes examples from action detection, biometrics, and state of mind recognition and all are competing for slots in future generations of mobile devices.
WEDNESDAY March 12, 2014SCV Communications
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Fuel Cell Vehicles: What's Up?
Speaker: Dr. Robert M. Moore, Director of Fuel Cell Research (retired)
Time: Networking/social at 6:00 PM; Buffet dinner at 6:30 PM; Presentation at 7:00 PM
Cost: $15 Place: Willow Tree Restaurant, 6513 Regional St,
Dublin RSVP: from website by noon Tuesday, March 18 Web: www.ieee4life.org
Dr. Robert Moore's 50 years of professional experience include consulting, university teaching and research, industrial research management, and new process and new product development and testing. He is a Life Member of the Institute of Electrical and Electronics Engineers, author or co-author of more than 100 technical publications and papers, and holds or shares seven US Patents. In 1999 he was elected a ByFellow of Churchill College, University of Cambridge.
He is the retired Director of Fuel Cell Research for the Hawaii Natural Energy Institute of the University of Hawaii. Prior to joining the faculty at UH, he was the Director of the Fuel Cell Vehicle & Fuels Modeling Project, and Co-Director of the FCV Center-of-Excellence, at the Institute of Transportation Studies of the University of California (’97-’04). The FCV & Fuels Modeling Project was a seven year project funded by an international consortium of 25 leading companies from the automotive and fuels industry. The (DoE) FCV Center-of-Excellence was established under the US DoE Graduate Automotive Technology Excellence program to educate and develop future technical and policy leaders in the automotive industry. Dr. Moore also lectured on the fundamentals of Fuel Cells and related system and application topics at UC and continued to do so at UH.
Prior to joining the University of California, Dr. Moore held a variety of senior positions at Chevron Research Company (’80-’97), including 5 years as Director of Corporate Research and 5+ years as Assistant to the President. Before joining Chevron he was a Member of the Technical Staff and technical manager at the Sarnoff Research Center of RCA Corporation (’66-‘79), where he received two Outstanding Achievement Awards for his research (’69 and ’73). He earned his DSc in Engineering as a NASA Pre-Doctoral Fellow at the George Washington University, and his undergraduate honors include Outstanding BSE Graduate and membership in both the Engineering and Physics Honor Societies.
Fuel Cell Vehicles (FCVs) are attracting
increasing public attention -- especially after the announcement by Toyota of their plan to introduce a mass market FCV in 2015. This presentation will provide an overview of FCVs -- focusing especially on hydrogen fueled FCVs. This is the introductory talk for a three-part series on hydrogen-fueled FCVs and Hydrogen Refueling facilities. The questions that will be addressed include:
What is a Fuel Cell Vehicle? Why the current interest in Fuel Cell Vehicles? Why do FCVs use PEM Fuel Cells? What are possible FCV/Fuel options? What are possible FCV “Futures”? PEM => Polymer Electrolyte Membrane aka
Proton Exchange Membrane.
WEDNESDAY March 19, 2014OEB Life Members
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Applications and Advantages of Continuously Welded
Corrugated Cable
Speaker: George R. Matto, The Okonite Company Time: Networking/social at 5:30 PM; Presentation
at 6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: $25 for IEEE members, $30 for non-members, $15 for student and retired members
Place: Zio Fraedos, 611 Gregory Lane, Pleasant Hill
RSVP: by March 17 by contacting Michael Nakamura, [email protected] or telephone (925) 330-6595
Web: www.e-grid.net/docs/1403-oeb-ias.pdf
George R. Matto, (M1974-SM2005-LSM2009) was born in Oakland. He started his college career in San Francisco while working part time and attended San Francisco City College, graduating in Electrical Engineering Technology and then San Francisco State University, BA Industrial Arts, and Marketing 1967. His career in industrial sales and application engineering began during college working for Norton Co. High Vacuum Systems. George was responsible for or was part of the system sales team selling high vacuum process systems and equipment to Silicon Valley start-ups: Intel, Fairchild, AMD and others. These same names turned up again when, in the employment of The Okonite Company, George’s sales and application skills were productive in providing these same companies with primary and process wire and cable. For 39 years with The Okonite Co. primarily in Portland, Oregon, George expanded the company’s presence in the Northwest. On his arrival, Okonite Portland consisted of a 2-person office; today, the Okonite Portland footprint consists of staff of eight and a 50,000 sq. ft. distribution center. George authored “The History of the Okonite Company” that appeared in the Industry Applications Magazine as have papers he co-authored on wire and cable topics. In addition to consulting for the Okonite Company, George is an Adjunct Professor in the School of Engineering at Gonzaga University, Spokane, WA, and repairs and restores spring wound and weight driven antique clocks.
Continuously Welded and Corrugated Armored
Cable classified by UL as metal-clad MC hazardous locations (HL) are being specified and used in all types of industrial, commercial and utility installations. MC cable is used to supply plant electrical power and distribute power to motors, pumps, fans and other equipment. A large percentage of these cables are extensively used in petrochemical industry, and there are many applications in the water/wastewater industry. Their use has become so widespread that the National Electrical Code has permitted their use in a variety of code articles. In this paper we will review the various advantages and uses, the code articles, and the proper installation methods for CWC armored cables.
THURSDAY March 20, 2014OEB Industry Applications
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The History of Robots Speaker: Dave Grossman, IEEE Fellow, IBM (retired) Time: Networking/social at 6:00 PM; Dinner at
6:30 PM; Presentation at 7:00 PM Cost: IEEE Member $25; Non-Member $27 Place: Michael's at Shoreline, Mountain View RSVP: from website Web: lmagmar2014.eventbrite.com
Dave Grossman is an IEEE Fellow for his work in robotics. After a PhD in Physics from Harvard, he taught at Princeton for a few years. He spent 25 years at IBM in Yorktown Heights NY, in research and management in AI and robotics. A co-inventor of using software to calibrate robots, he pioneered robotic assembly of electronic cards, 2-arm robots with collision avoidance and 3D solid modeling. He also worked on RoboDoc hip surgery and laparoscopic robotics. After IBM, he worked at USC and then co-founded an internet company in Silicon Balley. Subsequently he worked on Stanford projects in the mechanical engineering department and in the medical school. He was also a tour guide at SLAC for a few years. He is currently semi-retired … which means working harder than ever but not getting paid.
Two highly unusual accomplishments: he patented a corrugated cardboard snowplow, and he built a huge cosmic ray exhibit in his garage that will eventually be installed in a science museum
An irreverent non-technical review of the history of
surprisingly animate machines from ancient Egypt to current times. Areas include teleoperators for hazardous environments, assembly systems, medical applications, entertainment and science fiction. The talk has over 100 slides covering such varied topics as Memnon son of Dawn, Droz’s automata, Vaucanson’s duck, cathedral clocks, Von Kempelen’s chess player, household robots, Asimov’s laws, Disneyland, dinosaurs, movie droids and cyborgs.
MONDAY March 24, 2014
SCV Life Members
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Maximizing Battery Reliability and Life in Standby Power
Backup Applications
Speaker: John Kim, EnerSys Time: Networking and social at 5:30 PM;
Presentation at 6:00 PM; Dinner at 7:00 PM Cost: $25 ($10 for Student Members) Place: Sinbad's Restaurant, Pier 2 The
Embarcadero, San Francisco RSVP: from website Web: meetings.vtools.ieee.org/
meeting_view/list_meeting/22793
John Kim has been in the standby battery industry for over 25 years. Currently, John is a Director of Technical Marketing at EnerSys. He has written numerous papers and presented at many industry related conferences including Battcon, Doble, Eurobat, Intelec, Infobatt, and IEEE chapter meetings. His battery background includes R&D, manufacturing, product management, and technical support. He is also knowledgeable in battery selection, specification, maintenance, and troubleshooting. John received both BS in Materials Engineering and MS in Engineering Management from Drexel University.
The reliability of battery backup systems is critical
in maintaining the robustness of infrastructure. Telecommunications, UPS (Uninterruptable Power Supply), and Utility sectors all rely on battery power backup systems to communicate, control, and power mission critical equipment. This presentation will identify and understand the variables that can affect the lead acid battery’s reliability and life. It will also examine the pros and cons of alternate battery systems.
TUESDAY March 25, 2014SF Industry Applications
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Extending Product Life, Safeguarding Data Integrity and Reducing Downtime with Low-
Voltage Surge Protection
Speaker: Rob Fuentes, Schneider Electric Time: Networking/social at 5:30 PM; Presentation
at 6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: $25 for IEEE members, $30 for non-members, $15 for student and retired members
Place: Zio Fraedos, 611 Gregory Lane, Pleasant Hill
RSVP: by April 14 to Michael Nakamura, [email protected] (925) 330-6595
Web: www.e-grid.net/docs/1404-oeb-ias.pdf
Rob Fuentes is a Consulting Engineering Specialist with Schneider Electric. His primary responsibility is to assist consulting engineers and select end users in Northern California and Western Nevada with design and application of electrical systems. With knowledge of Six Sigma, lean manufacturing and other quality methods, Rob previously managed national product and process development and improvement projects. In addition to professional training, he has also taught courses at his local community college. He is an active participant in IEEE, IAEI and NEMA. Rob received his M.B.A. from San Jose State University and B.S. from UC Davis.
Expanded use of electronics has placed
microchips in everything from coffee makers to industrial systems. While usage continues to broaden, the basic characteristics of electronics remain unchanged as does the fundamental threat: transient surges. The consequences are premature product failure, loss or corruption of data, and time-consuming troubleshooting. In a study by Lawrence Berkeley National Laboratory, the cumulative cost exceeds $80 billion per year nationally.
A misconception is that most surges come from outside the facility. In fact, most originate from within your location. Your surge protective device at the service entrance switchboard will not protect your equipment from internal surges. The solution is not complex or expensive: a cascaded approach with appropriately sized and located surge protective devices.
THURSDAY April 17, 2014OEB Industry Applications
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DC Arc Flash Calculations and Studies
Speaker: Jim Phillips, PE Time: Networking and social at 5:30 PM;
Presentation at 6:00 PM; Dinner at 7:00 PM Cost: $25 ($10 for Student Members) Place: Sinbad's Restaurant, Pier 2 The
Embarcadero, San Francisco RSVP: from website Web: meetings.vtools.ieee.org/
meeting_view/list_meeting/22795
: With a career spanning over 30 years, Jim Phillips has taught tens of thousands of people from around the world understand electrical power system design, analysis and safety. He is the founder of www.Brainfiller.com and www.ArcFlashForum.com.
Jim literally “wrote the book” about arc flash studies with “Complete Guide to Arc Flash Calculation Studies.” Jim is Secretary of IEEE 1584 and is the Liaison Officer of the IEC working group 13 based in Europe. He is a regular contributor to Electrical Contractor Magazine.
Jim continues to travel the globe, typically flying over 150,000 miles a year to work with various U.S. and international standards organizations and speak at many conferences and training events.
Rectifiers, Photovoltaics, Battery Systems, and
DC power are everywhere. And with it, the possibility of a DC arc flash. When IEEE 1584 Guide for Arc Flash Hazard Calculations was first published in 2002, it did not consider DC arc flash. Subsequent to the 2002 Edition, several technical papers have been developed regarding DC arc flash and calculation methods.
Join us as Jim Phillips, P.E. founder of brainfiller.com, ArcFlashForum.com and Secretary of the IEEE 1584 working group, takes you from the history of DC arc flash up though the calculation methods. By using a series of examples, Jim will walk you through the DC arc flash calculation process.
Agenda • History of DC arc flash technical papers • Need for DC arc flash calculations • DC arc resistance calculations • DC arc power and energy • DC incident energy calculations • DC arc flash calculations – open air • DC arc flash calculations – enclosures
TUESDAY April 22, 2014SF Industry Applications