grid.pdf grid.pdf november 2010 · 2010-10-29 · november 2010 visit us at page 2 your networking...

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GRID.pdf GRID.pdf

November 2010

CHAPTER MEETINGS IEEE-USA - 11/2 | What's Gender Got to Do with It? Gender-Inclusive Engineering Education - Webinar: case studies ... [more]

SCV-Phot - 11/2 | SOFIA: NASA's Stratospheric Observatory for Infrared Astronomy - 100-inch telescope, 747SP aircraft ... [more]

SF-ComSoc - 11/2 | Dynamic Spectrum Access in Wireless Ad Hoc Networks: Issues and Possible Solutions - primary users ... [more]

SCV+OEB-ComSoc - 11/3 | Dynamic Spectrum Access and Cognitive Radio - bandwidth, white space sensing, allocatio, security ... [more]

SCV-SSC+Phot+EMB - 11/4 | Progress in Hard-Field Industrial Tomography - imaging, water, hydrocarbons, example case ... [more]

OEB-NPSS+ComSoc+CS - 11/5 | Tomographic Sensing and Imaging for Industry - see where you cannot reach: signal processing ... [more]

SCV-SPS - 11/8 | Making 3D Printing Ideas Real: A Demo and Talk - rapid prototyping, open source, enthusiasts, hobbyists ... [more]

IEEE-USA - 11/9 | Patentability and Infringement: A Practical Guide for Understanding the Basics - no-cost one-hour webinar ... [more]

SCV-CS+PES - 11/9 | Smart Computing for the Smart Grid - bulk power distribution, renewable sources, bidirectional flows ... [more]

SCV-EMS - 11/9 | War Stories from the EMC Society's Founders - riveting stories of the early years of the profession ... [more]

SCV-CPMT - 11/10 | Embedded Passives: Packaging Paradigm of the Future? - materials, benefits, when to implement, examples ... [more]

SCV-GOLD - 11/11 | Bowling Outing and Social - includes bowling shoes, food, drinks; friends welcome ... [more]

SCV-MTT - 11/11 | Filter and Multiplexer Technology for Satellite Applications - design techniques, future payload requirements ... [more]

ARRL-SARA - 11/13 | Amateur Radio License Class and Exam - Technician class, study materials, FCC exam at end ... [more]

SCV-CAS - 11/15 | Low Power Design for OWA Baseband Processor supporting Various Wireless Standards - SIMD cores ... [more]

SCV-Section - 11/15 | IEEE Senior Member Grade Elevation Night - quick and easy upgrade from Member to Senior Member ... [more]

SF-PES - 11/15 | Integration of Renewable Resources - Challenges & Solutions - generation, innovation, storage, smart grid ... [more]

SCV-CNSV - 11/16 | How Many Consultants Does it Take to Create a Medical Device? - concept to regulatory approval, right talents ... [more]

SF-IAS - 11/16 | Grounding Considerations for Distributed Generation Interconnection to Electric Power System ... [more]

SCV-EDS - 11/16 | Resistive RAM: Technology and Market Opportunities - memristors, mechanism, optimizing switching ... [more]

OEB-Life - 11/16 | An Iconoclast Revisits Climate Change: Some Pleasant Truths - wasted resources, data, recent developments ... [more]

SCV-Nano - 11/16 | Nanoelectronics – Innovation and Implementation - foundry services, future directions ... [more]

Continued on next page ====>

Conference Calendar

Nov 8-9: Silicon Valley Test Conference & Expo (SVTest) - Wyndham Hotel, San Jose [more]

Nov 9-11: AdvancedTCA/MicroTCA Summit - Santa Clara Convention Center [more]

Nov 9-11: ARM Technology Conference and Exhibition - Santa Clara Convention Center [more]

Nov 14-18: 36th Int'l Symposium for Testing and Failure Analysis - InterContinental Hotel, Dallas [more]

Nov 30 - Dec 3: IEEE Real-Time Systems Symposium (RTSS) - Hyatt Mission Bay, San Diego [more]

Nov 30-Dec 3: Printed Electronics/Photovoltaics USA Conference - Santa Clara Convention Center [more]

Dec 8-10: 3D Architectures for Semiconductor Integration and Packaging - Hyatt, Burlingame [more]

Dec 1: Server Design Summit 2010 [more] - Santa Clara Convention Center

CALL FOR PAPERS: IEEE Int'l Technology Management Conference (ITMC 2011) - June 27-30, 2011 [more] - Hilton Hotel, San Jose - Papers due by December 1, 2010

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MARKETPLACE – Services page 3

Career Development

Professional Skills Courses [more] - 5 Habits of Intentional Leadership - Virtual Teams - Managing Time - Presentation Skills - and more

Santa Clara University Grad School of Engineering 3-Part Solar Technology Series [more] - Introduction to Photovoltaics - Function & Design of Solar Cells - Advanced Photovoltaics

Computer History Museum Come celebrate and partner with the Computer History Museum – special offer for IEEE Members to become CHM members [more]

http://k6sa.net/forms/hamclass.php

November 2010 V is i t us a t w w w . e - G R I D . n e t

Your Networking Partner ®

November 2010 • Volume 57 • Number 11

IEEE-SFBAC ©2010

IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.

IEEE GRID is published as the GRID Online Edition residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 24,000 Bay Area members and other professionals.

Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net

NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information: www.e-GRID.net

DIRECTORS

Santa Clara Valley

Ram Sivaraman

Allen Earman

(Alt: Fred Jones)

Oakland East Bay

Victor Stepanians

Bill DeHope

San Francisco

Michael Butler

Dan Sparks

OFFICERS Chair: Allen Earman

Secretary: Bill DeHope Treasurer: Dan Sparks

IEEE-SFBAC PO Box 2110

Cupertino, CA 95015-2110

IEEE GRIDCHAPTER MEETINGS

(continued from Page 1) SCV-ES - 11/17 | Overview of Multimedia eLearning Theory with a View Towards Efficient Creation and Dissemination ... [more]

SCV-EMBS - 11/17 | MEMS Technology for Medical Applications - size scale, compatible materials, devices and implants ... [more]

Monterey - 11/17 | How Organic Semiconductors Work - fundamental processes, consequences of crystallinity ... [more]

OEB-IAS - 11/18 | Adjustable Speed Drives - hydrodynamic vs electrical, power transmission, comparisons ... [more]

SCV-CSS - 11/18 | Robot Control for Medical Applications and Hair Transplants - force control, stereo servoing, control ... [more]

OEB-PES - 11/18 | Sunpower Technology: Benefits of High Efficiency and Vertical Integration - 3rd Presentation ... [more]

SCV-CNSV - 11/19 | Copyright and Trademark Basics for Consultants - law, creative ideas, legal issues, contract ... [more]

SCV-AP - 11/22 | Antenna Measurements from Basic Concepts to Automated Systems ... [more]

SCV-CPMT - 12/8 | Photoprinting Assembly Technology for Ultrathin Electronic Components - flexible, micron-scale .. [more]

SCV-CSS - 12/9 | Autonomy: From Outer to Inner Space - Deep Ocean Exploration using NASA Technology ... [more]

SCV-CNSV - 12/14 | Mass Storage: What the Future Holds - non-volatile, rapid data access, hierarchy, cost ... [more]

SCV-EMC - 12/14 | EMC/EMI Issues in Biomedical Research - safety considerations, implantable devices, antennas ... [more]

SCV-CSS - 1/20 | Adaptive Inverse Control - feed forward, variable parameters, filtering, stable and unstable plants ... [more]


Patent Agent Jay Chesavage, PE

MSEE Stanford 3833 Middlefield Road, Palo Alto 94303

[email protected]

www.File-EE-Patents.com

TEL: 650-619-5270 FAX: 650-494-3835

Do you provide a service? Would you like more inquiries?

Access 25,000 engineers and managers IEEE Members across the Bay Area Monthly and Annual Rates available

Visit our Marketplace (page 3)

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GRID.pdf

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MET Laboratories

EMC – Product Safety

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IEEE Professional Skills Courses

Transitioning from Individual Contributor to Manager

– Date/Time: Tuesday, Nov 2, 8:30AM-4:30PM – Instructor: Linda Price – Location: Cypress Semiconductor, San Jose – Fee: $400 for IEEE Members; $500 non-members

"Excellent! The instructor's experiences have clearly demonstrated direction and path I would like to experiment. This class was very clear and concise"

Communication & Conflict Management using Myers-Briggs (MBTI) Date/Time: Thursday, Nov 4, 8:30 AM – 4:30 PM Instructor Linda Price Location: Cypress Semiconductor, San Jose

The Myers-Briggs Type Inventory (MBTI) is the most widely used instrument in the world to gain a deeper understanding of self, others and interpersonal relationships. It provides insights on the four basic “people patterns” that hold the key to leadership styles, effective communication, conflict, team building and productivity.

Upgrade your skill set – prepare for future challenges

Today the focus on 3-D integration and packaging has shifted from trying to understand the technology opportunity to one of understanding the practical challenges of technology adoption and commercialization, including who is getting there first, how, and at what cost. There is a natural degree of uncertainty as companies scramble to secure market share, obtain new process and design tools, and of course, new customers and new applications. This conference continues to give a broad, yet thorough perspective on the techno-market opportunity and challenge offered by building devices and systems in the vertical dimension. Industry leaders from around the world are invited to speak on topics important to the emerging and on-going 3-D related efforts. The format of the conference and its presentations enables speakers to present the most up-to-date and forthright perspectives as possible. This conference provides a unique forum where one can gain the latest insights to bring clarity in the direction of their own efforts.

SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies

Managing Time & Multiple Priorities – Date/Time: Wednesday, Nov 10, 8:30AM-12:30PM – Instructor: Janet Bailey – Location: Brocade Communications, San Jose – Fee: $300 for IEEE Members; $350 non-members

"I enjoyed this class very much. I thought it was very informative and useful. It really made me more aware of how I can organize my time."

Presentation Skills for Engineers – Date/Time: Wed, Nov 17, 9:00 AM - 5:00 PM – Instructor: Peter Rosselli – Location: Brocade Communications, San Jose – Fee: $500 for IEEE Members; $550 non-members

" This class is top notch! Peter is very experienced and provided me with lots of good tips I can use on all my presentations. Definitely worth while.” -TIBCO Software

For complete course information, schedule, and registration form, see our website:

www.EffectiveTraining.com

Wednesday Pre-Conference Symposium:

“Key Topics in Going 3-D” - The Evolving 3-D IC Infrastructure - Test in the Third Dimension - Thermal Management of 3-D Architectures and Chip Stacks - Taiwan R&D for 3-D ICs

Sessions: - Meeting the 3-D Opportunity - Toward the Frontline of Manufacturing - 3-D Interposers: Where, When, and Why? - Facilitating Design of 3-D Interposers and Dle - 3-D IC Advancements and the Systems Approach - Handling, Bonding, and TSV Manufacturing Capabilities - New Routes to Logic - Critical Perspectives on 3-D IC Standards Earlybird Rates through November 24th (save $100). Corporate multi-attendee discount. Full details:

techventure.rti.org/Winter2010

http://www.effectivetraining.com/calendar.php?loc=local

http://techventure.rti.org/Winter2010


CALL FOR PAPERS

We invite contributions from researchers, educators, managers and students. Contributions may be conceptual, theoretical, or empirical. They should document research activity, case studies or best practices, shedding light on the theory or practice of engineering, technology, or innovation management, and address the strategic objective of technological change. Major topic areas include:

Globalization and its Implications - Outsourcing and Off-shoring - Globalization of Research & Development - Role of Silicon Valley & Other Technology Centers - Adapting Business Practices to the New Era

Adapting to Change for Employees - Employee’s View of Management - Education in Technology Management - Employee Innovation in the Wake of Recession

Sponsored by the IEEE Technology Management Council and its 14 member Societies

This three-part series gives an overview of the field, from introduction to topics of current research. The first class introduces applications, terminology, the processes for making various types of PV panels, systems and installation. The second derives how solar cells work, designing & using PC-based models, how performance is measured, and a more-detailed overview of manufacturing processes. The third class reviews topics of current research interest in silicon, thin-film, concentrator and advanced PV. Instructor: Dr. Peter Borden, Santa Clara University

Email Rosie Chow with inquiries: [email protected]

Entrepreneurship - Opportunity Recognition in a challenging environment - Innovative Business models

Management of Innovation - R&D during the Economic Downturn - New Measures of Innovation - Management of Innovation Processes - Open Innovation & Collaboration in Technology Management

Supply Chain Management - Sourcing Management - Strategic Issues in Supply Chains - Sustainable Supply Chains

Sustainability - Green Product and Process Development - Safety and Health Management - Project Management for Sustainable Solutions

Papers due by December 1, 2010

Download the full Call for Papers:

www.ieee-itmc.org

Prepare for that next project or assignment! Nov 2: Introduction to Photovoltaics Nov 10: Function & Design of Solar Cells Nov 16: Advanced Photovoltaics

Registration now open

Regular admission: $195

Use code “IEEE” to save $50 (only $145) Full details, and to register:

www.scu.edu/ete

Located in the heart of Silicon Valley, with easy parking

August 11-13, 2009 Santa Clara

Convention CenterIEEE Int’l Technology Management Conference

ITMC 2011 June 27-30, 2011 Hilton Hotel San Jose

"Managing Technology in Challenging Times"

Santa Clara University School of Engineering Graduate Programs

3-Part Solar Technology Series: Photovoltaics

http://www.ieee-itmc.org/

http://www.scu.edu/ete/



Immerse yourself in Best-in-Class design strategies for leading embedded architecture - ARM

This year's ARM Techcon doubles your value

with two events in one. Whether you are a hardware or software engineer, ARM Techcon 2010 offers classes, hands-on tutorials and training at all levels of expertise. Invest your in future today with a solid core of strategies, tools and methodologies for successfully incorporating ARM IP in your design. Choose to attend November 9th where the focus is on designing ICs using ARM cores, or November 10-11, where the focus will be on designing systems and developing software around ARM-based hardware. If your responsibilities span across both areas- we offer an all access pass to attend the entire conference, the best value. The exhibition floor is unique based on which days you attend.

Get the Solutions for your ARM-Powered Designs

Keynote Talks Keynote Address: Realizing the Future Today, Tudor Brown, Chief Operating Officer, ARM; plus keynotes and addresses from Jensen Tjeng, Director of Engineering, Marvell Semiconductor; Dr. Sehat Sutardja, Chairman, President and CEO, Marvell Semiconductor; Dr. Gary Patton, Vice President, Semiconductor R&D Center, Common Platform

ABOUT ARM ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Exhibit at ARMTechCon4! Don’t miss this opportunity to showcase your ARM-based products or technology solutions. Increase ROI, launch new products, influence target customers, expand your visibility. Contact Seam Raman, Sales Director, [email protected], 415-947-6622.

CHIP DESIGN CONFERENCE:

A one-day intensive conference for chip design teams working with ARM silicon IP and tools.

Sessions on: - SoC Architecture & Analysis - SoC IP - SoC Design & Verification - SoC Design for Reliability and Yield - SoC Verification of Challenging Structures Sponsors:

SYSTEM AND SOFTWARE DESIGN CONFERENCE Two days of courses and exhibits for system developers employing the ARM architectures.

Sessions on: - Software Debugging Tools and Techniques - Microprocessors/Microcontrollers/DSPs - Designing with Open-Source Software - Operating System Selections - Safety and Security - Low-power design with ARM - Multicore and Virtualization - Designing with Open-Source Software - Buses and Communication Channels Sponsors:

Half-Day Tutorial: “Networking and Connectivity,” Christian Legare, Vice President, Micrium

Register today:

vault.eetimes.com/armconference

Save $100 by using the promo code “GRID”!

A free Exhibition-Only pass includes access to the exhibits, keynotes, industry addresses, sponsored technical sessions, teardowns, and opening-night reception..

November 9 – 11, 2010 Santa Clara Convention Center

- Chip Design Conference - System & Software Design Conference

http://vault.eetimes.com/armconference



The only conference on Semiconductor testing in San Jose

SVTest focuses on all the aspects associated with wafer and packaged die characterization, debug, final test and failure analysis.

CONFERENCE FOCUS: - Test and Design for Manufacturability - Yield Analysis and Optimization - Low Cost Test - High Speed I/O and RF Test - Probe-Card Design and Innovation - Interface Hardware and Simulation - Design Verification & Validation - PDN implications for Testing & Validation - Adaptive Test - Defect based Testing - Hi Resolution A/D - D/A testing - Iddq and current test - Load Board and Socketing Issues - Multi-Site Test - SiP and KGD Test - Analog & Mixed Signal Test SPONSORS:

Designing Next-Generation Servers

This one-day event will bring you the latest in designing for next-generation virtualized servers in the cloud computing era! From simple blades to powerful high-end systems, servers are the key to managing networked computing. At Server Design Summit you can talk with industry leaders about key issues, see the latest products, meet with potential partners and solution providers, and identify major market trends.

Three timely workshops: Energy-Efficient Servers and Datacenters Increasing Server Performance Servers for Cloud Computing

“The focus on the data center is going to be about simplification. Virtualization and blades are important

components of that.” – Bill Zeitler, Sr VP/Group Executive, IBM Systems Technology Group

FIRST TRACK: Improved use of Test Techniques & Methods to improve the accuracy and reduce the time to bring a product to volume production. This includes RF, Analog & Mixed Signal products along with Digital devices.

SECOND TRACK: Hardware and interface of the DUT to the Test Stimulus and Measurement systems. Includes Probe Cards, ATE boards, calibration methods, test sockets and more.

Plus, on the second afternoon, 4 hours of Tutorials on subjects guaranteed to improve your understanding of a few important topics. Full Conference: Only $174

More information: www.svtest.com

Keynote Speakers “Watt Matters in Energy Efficiency,” Dileep Bhandarkar, Chief Architect, Global Foundation Services, Microsoft “Raising the Green 'Flag' with Cloud Computing,” Richard McCormack, Sr VP Server Business, Fujitsu America “Why an OS for the Cloud?,” Kuyper Hoffman, Systems Engineering and Client Liassion, Nebula

Sessions and Panels: - Server Strategies - Data Center Strategies - Energy Efficiency - Hardware Methods - Software - Virtual Servers - Infrastructure - Storage - Servers for Cloud Computing - Virtual Machines - I/O Virtualization

Save $200 through November 19th.

For more information:

www.serverdesignsummit.com

http://www.svtest.com/

http://www.serverdesignsummit.com/


Sponsored by the Santa Clara Valley Section of IEEE

IEEE Senior Member Grade Elevation Night Date: Monday, November 15, 2010

Time: 6:15 – 8:00 PM (drop in at any time between 6:15 PM and 7:30 PM)

Location: Cogswell Polytechnical College, Executive Board Room 1175 Bordeaux Drive, Sunnyvale, CA 94089

Refreshments will be provided

The IEEE Santa Clara Valley Section, in conjunction with PACE, is sponsoring a Senior Member Grade Elevation night for all IEEE members who meet the requirements for grade elevation to Senior Member. The requirements are posted at:

www.ieee.org/web/membership/senior-members Summary:

* be an engineer, scientist, educator, or technical executive in IEEE-designated fields; * have been in professional practice for:

7 years if you hold a baccalaureate degree in an IEEE-designated field; 6 years if you hold a baccalaureate and a masters degree; 5 years if you hold a doctorate

* show professional maturity and "significant performance" over a period of at least five of those years in professional practice.

IEEE members who meet these requirements are encouraged to attend. Potential Senior Members will have an opportunity to meet with Senior/Fellow Members and possibly obtain the references that are required for the application, as well as to get a formal Nomination from the Section. Please draft your background/ answers on the Application Form (www.ieee.org/web/membership/senior-members/application.html) and bring 4 copies, but do NOT begin the application process on the IEEE website (this is done AFTER our meeting). Also, members are asked to write a few sentences on Page 2 of the Application, or else in a file on the flash memory device, explaining how they have significantly performed their professional duties for at least five years. To help our volunteer Senior/Fellow members evaluate your application, particularly the sections on Professional Experience and Significant Performance, please prepare a Curriculum Vitae (CV) / resume that contains details that don’t “fit” into the application; the CV also contains details that explain possible questions that arise in the minds of the reviewers. Bring 4 copies of this resume. Please remember that this collaborative exploratory process does not guarantee that you will receive all of the requisite references. For any questions, please send email to John Berg [email protected]

Become a Senior Member -- See you there!

http://www.ieee.org/web/membership/senior-members/

http://www.ieee.org/web/membership/senior-members/application.html



IEEE MEMBERS ONLY….

SPECIAL DISCOUNTED MEMBERSHIP OFFER!

COMPUTER HISTORY MUSEUM MEMBERSHIP:

TWO YEARS FOR THE PRICE OF ONE

Experience The Exciting New Exhibition, “Revolution: The First 2000 Years Of Computing”.

Come celebrate with the Computer History Museum as it prepares to open its 30,000 sq. ft. new world-class exhibition, Revolution: The First 2000 Years of Computing. Join NOW to receive a special Museum membership package. Current IEEE CHM members may also renew their membership under this special discounted membership.

Join NOW to receive one-time-only pre-opening benefits this fall, prior to the

official opening of “Revolution” in January 2011!

TWO YEARS’ MEMBERSHIP FOR THE PRICE OF ONE Individuals (includes one guest per visit)

A two year membership for $60 (a $150 value)

Seniors 65+ (includes one guest per visit) A two year membership for $45 (a $120 value)

Families (includes you and every member of your immediate family) A two year membership for $105 (a $300 value)

Benefits For All Levels of Membership - Unlimited free admission to the Museum ($15/person value)

- Exclusive pre-opening “sneak preview” of the Exhibition - Admission to Museum Member-Only receptions before “CHM Presents” events (10-15 events per year)

- 10% discount at the new Museum Store and Cafe - Discounted tickets to special Museum events

-Free subscription to CORE Magazine, the Museum’s signature annual publication

Additional Family Membership Benefits -Exclusive Family Day “sneak preview” of the Exhibition in fall 2010

-Free admission to all Family Days

To become a CHM IEEE member or renew your membership under this special offer,

sign up NOW at www.CHMdeal.com

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November 9-11, 2010 Santa Clara Convention Center

The AdvancedTCA-MicroTCA Summit is the only conference dedicated entirely to the modular open standard AdvancedTCA and MicroTCA platforms for telecommunications and other embedded applications. Join the brightest minds in the industry as they look to the future of LTE, deep packet inspection, multicores, network acceleration, cloud computing, enterprise systems, and unified architectures. The Summit features tutorials, workshops, paper and panel sessions, keynotes, and exhibits. Subjects include hardware, software, infrastructure, design methods, applications, standards, interfaces, and market research. Who Should Attend?

• Embedded systems developers • Hardware and software design engineers • Network equipment manufacturers • Telecom engineers • Military/defense equipment contractors

“For the first time, we have a complete ecosystem of customers and vendors working together to specify, implement, and apply the new technologies.”

— Lars Johan Larsson, MODT AB Sponsorship and Exhibiting Information Kat Pate, 505-238-3208

[email protected]

Summit Topics • AdvancedTCA / AdvancedMC / MicroTCA • One-stop shop for evaluating products or designs • 60 AdvTCA/MicroTCA Design Tips in 60 Minutes • Embedded Linux, embedded virtualization, security • Next-Generation COTS Solutions (10 Gbps and up) • Future of Mil/Aero Mobile Command and Control

Summit Tutorials • New Directions in xTCA • How to Win the Economic Case for xTCA: Getting

More Customers Today • 40G and 100G Ethernet in AdvancedTCA • Deploying 4G/LTE Networks: Technology, Trends,

and Services • Developing Wireless Applications • 40G/100G Applications • Special Open Tutorial: Developing Next-Generation

COTS Solutions (10 Gbps and Above)

Keynote Speakers • Brigadier General (Ret.) Pete Palmer, General

Dynamics C4 Systems • Frank Soqui, Intel • Stephen Dow, Emerson Network Power • Ray Larsen, SLAC National Accelerator Laboratory,

“xTCA for Physics” • Jaymie Durnan, Deputy Director Strategic

Assessments, DoD

Awards Ceremony Wednesday evening reception recognizes BEST

hardware, software, infrastructure products

Understand and Learn Understand MicroTCA-based design Learn about AdvancedTCA-based system

development Learn how to develop shelf management software

and evaluate alternative middleware.

Reduced Fees through November 3rd

Use Code ”IEEE” to save $100. Full information:

www.AdvancedTCAsummit.com

http://www.AdvancedTCAsummit.com/



Enrich your career and further the industry at the 36th International Symposium for Testing and Failure Analysis (ISTFA), November 14-18 in Dallas, Texas.

ISTFA™ is the best venue for learning new failure analysis techniques, solutions and enterprise for success.

Acquire the latest knowledge from the field's leading professionals with six days of tutorials, short courses, technical presentations, panels, and user groups. Research leading-edge instruments and solutions at the industry's largest dedicated equipment exposition. Meet and network with hundreds of your peers from around the world. All this makes ISTFA your best opportunity to learn, network and advance your career.

20 TECHNICAL SESSIONS • Packaging- and Assembly-Level FA • Defect Characterization and Metrology • FA Process/Case Histories • Sample Preparation • Alternative Energy • Photon-Based Techniques • Board and System Level FA • EMS, Discretes and Optoelectronic Device FA • Counterfeit Electronics • Test and Diagnostic/Debug • Nanoprobing and Nano-Scale Characterization • Circuit Edit • Posters

9 TUTORIALS Continuously updated tutorial sessions with new and cutting-edge topics related to failure analysis. Two New Sessions This Year!

• Fault Localization • Technology-Specific Failure Analysis • The Periphery of Failure Analysis • FIB • Fault Localization • Microscopy • Die and Defect Access • FA Lab Management • Counterfeit Electronics

EDUCATION SHORT COURSES Three New Courses!

• Counterfeit Electronics • Polycrystalline Thin Film Solar Cell Durability • Curve Tracing Techniques for IC Failure Analysis • Fault Isolation • Differentiating Between EOS and ESD • Financial Management of Failure Analysis

2010 Keynote Address Counterfeiters’ Techniques: Constantly Improving to Avoid Detection – National Security Depends on Us to Keep Up Thomas Sharpe, Vice President, SMT Corporation A riveting presentation supported by first-hand experiences – A MUST ATTEND!

TECHNOLOGY-SPECIFIC USER GROUPS Meet, share ideas, and discuss relevant issues in a noncommercial environment. Planned topics are:

• Optical SEM • Sample Preparation • Nanoprobing

EXPOSITION The ISTFA exposition is North America’s largest tradeshow of FA-related equipment and services. This promises to be an exciting year on the show floor where you will see the latest industry advances and network with vendors for problem-solving advice. Bring your questions, needs and concerns. Get solutions to your FA problems! The ISTFA exposition is your once-a-year opportunity to access the innovators, influencers, and decision makers – all in one location! To exhibit, sponsor or advertise, contact Kelly Thomas at [email protected] or 440.338.1733.

Discounted fees for EDFAS and ASM Members. Non-members of EDFAS receive a full year’s membership with their registration.

Additional information is on the ISTFA web site. Plan and register at:

www.ISTFA.org

EDFAS GENERAL MEMBERSHIP MEETING Wednesday, November 17

The Electronic Device Failure Analysis Society (EDFAS) annual General Membership Meeting and Luncheon is open to all current and interested prospective members.

http://www.ISTFA.org/



Nov. 30 – Dec. 2, 2010 Santa Clara Convention Center

The seventh annual Printed Electronics USA conference and exhibition covers all the applications, technologies and opportunities. This is the World's largest event on the topic.

Printed Electronics USA gives the big picture, not least by inviting leading speakers from around the world from a range of industry verticals including healthcare, consumer packaged goods, advertising/media, textiles, military and others. Commercialization and the full range of technologies are the emphasis, from interactive packaging and promotional posters to sensing fabrics and ultra low cost wireless identification tags.

Photovoltaics USA covers the solar cell sector. All the latest developments in thin film, organic, printed photovoltaics as well as emerging technologies growing alongside the more established ones, such as luminescent concentrators and infrared harvesting.

Technical Sessions A prestigious program with over 70 technical presentatiions – see the Advance Program.

RTSS is the premier conference in the area of real-time computing, presenting innovations in the field with respect to theory and practice -- design, analysis, implementation, evaluation, and experience.

Also Hosted:

The Workshop on Data Artifacts, Experimentation, & Collaboration to Support Software Systems Research (DAEC)

Analytic Virtual Integration of Cyber-Physical Systems Workshop (AVICPS)

Workshop on Compositional Theory and Technology for Real-Time Embedded Systems (CRTS)

The world’s largest event on printed and flexible electronics

Master Classes – interactive consultancy sessions: • Introduction to Printed Electronics • Materials • Thin Film Photovoltaics • Printing Technologies • Logic, Memory & Circuitry Design • Investment Summit • Displays and Lighting • Creating New Products with Printed Electronics • Flexible Substrates, Transparent Conductors and Barriers • RFID and its Progress Towards Being Printed • Energy Harvesting & Storage for Small Electronic Devices

Tradeshow Over 100 leading companies will be showcasing innovative technologies and commercial applications in the field of printed electronics and photovoltaics. This is the world’s biggest tradeshow on the topic and an ideal place to meet your customers and partners in one place. New this year is Demonstration Street, featuring examples of printed electronics in action.

Use code “IEEE25” for additional 25% discount thru Dec.1. Exhibit-only option available.

www.IDTechEx.com/peUSA

Sessions: • Multiprocessors • Blocking, Locking, and Versioning • Cyber-Physical Systems • WSN Algorithms and

Improvements • Uniprocessor Scheduling • WSN Systems Issues and Techniques • Data Flows, Networks, and Distributed Systems • Design and Verification

Work-In-Process session – may include • compiler support • embedded systems • energy management • model-based development • performance modeling • sensor/actuator networks • adaptive systems theory and practice • programming languages • systems middleware • QoS support • multicore real-time support

Visit the website:

www.rtss.org

Sponsor: IEEE Technical Committee on Real-Time Systems

IEEE Real-Time Systems Symposium

November 30 - December 3, 2010

San Diego, CA

http://www.IDTechEx.com/peUSA/

http://www.rtss.org/


What's Gender Got to Do with It? Gender-Inclusive

Engineering Education Speakers: Julie Mills, Civil Engineering, University of

South Australia; Mary Ayre, University of Glamorgan; and Judy Gill, School of Education, University of South Australia

Time: Webinar from 6:00 - 7:00 AM (PDT) Cost: none Place: on the Web RSVP: From the website Web: www.ieeeusa.org/careers/webinars

Julie Mills is an Associate Professor in Civil Engineering at the University of South Australia. She worked for fifteen years as a structural engineer in private industry before returning to academia and completing her PhD in engineering education. Julie was Chair of the Australian Women in Engineering Committee from 2004-6 and has received several university and national teaching grants and awards.

Mary Ayre has worked in universities in the UK and Australia teaching mathematics and academic literacy, and has coordinated several projects to widen participation or improve teaching and learning in engineering and science. She has recently retired from a senior lectureship at the University of Glamorgan, Wales, UK.

Judith Gill is Associate Professor in the School of Education at the University of South Australia. Besides her many publications in the area of gender equity and social justice she has recently published a book based on research with Australian schoolchildren tracing their ideas about belonging , citizenship and the meaning of being Australian.

Despite numerous initiatives over the past 30

years, women continue to be a small minority in engineering education and employment in much of the world. In a recent Australian report Addressing the supply and quality of Engineering graduates for the new century by Emeritus Professor Robin King it was recommended that engineering education must become more female-friendly, and specifically that a more inclusive curriculum must be defined and implemented. The selection of the knowledge and skills to be included in any curriculum is the responsibility of the faculty members, in conjunction with accreditation bodies, and the choices made will therefore shape student perceptions of the current priorities, attitudes and practices in the profession.

The presenters of this webinar are co-authors of the recently published book Gender Inclusive Engineering Education (Routledge, 2010) which demonstrates the ways in which traditional engineering education has not attracted, supported or retained female students and identifies the issues needing to be addressed in changing engineering education to become more gender inclusive. This innovative and much-needed work also addresses how faculty can incorporate inclusive curriculum within their courses and programs, and provides a range of exemplars of good practice in gender inclusive engineering education that will be immediately useful to faculty who teach engineering students.

This webinar will discuss some of these findings and particularly focus on assisting faculty members in engineering to develop inclusive curriculum in their courses by exploring the following:

What does gender have to do with the engineering curriculum?

Case studies of inclusive practice in engineering How can I make my courses more inclusive?

TUESDAY November 2, 2010

IEEE-USA, with Women in Engineering (WIE)


SOFIA: NASA's Stratospheric Observatory for

Infrared Astronomy Speaker: Dr. Dana Backman, SETI Institute Time: Networking/Light Dinner at 6:00 PM;

Presentation at 7:00 PM Cost: none Place: National Semiconductor Building E

Auditorium, 2900 Semiconductor Drive, Santa Clara

RSVP: From the website Web: ewh.ieee.org/r6/scv/leos

Dr. Dana Backman, native of Hartford, Connecticut, obtained his Bachelor's degree in physics from MIT, and a Ph.D. in astrophysics from the University of Hawai'i. He was infrared astronomy post-doctoral researcher at Kitt Peak National Observatory in Tucson, Arizona, and at NASA-Ames, Moffett Field. He was professor of physics and astronomy for 12 years at Franklin & Marshall College in Lancaster, Pennsylvania. Since 2003, he has been employed by the SETI Institute as director of education and public outreach for NASA's Stratospheric Observatory for Infrared Astronomy (SOFIA) mission at NASA-Ames. He teaches introductory astronomy courses in Stanford University's Continuing Studies Program. He is co-author with Michael Seeds of three college introductory astronomy textbooks, "Horizons", "Foundations", and "Astro".

SOFIA, a 2.5-meter (100-inch) telescope mounted

in a 747SP aircraft, is nearing the end of its development and testing phase and is ready to start regular scientific observations by the end of 2010. You'll hear the story of why and how this amazing feat of engineering has been accomplished, and what kinds of scientific returns we can expect from this international research facility.


SCV Photonics


Dynamic Spectrum Access in Wireless Ad Hoc Networks: Issues and Possible Solutions

Speaker: Dr. Zhensheng Zhang, Argon ST Time: Presentation at 6:30 PM Cost: none Place: California Public Utilities Commission,

505 Van Ness Ave, San Francisco RSVP: by email to Tim Ryan, [email protected] Web: www.ieee.org/sfcomsoc

Dr. Zhensheng Zhang received his Ph.D. in electrical engineering from the University of California, Los Angeles in 1989. Dr. Zhang has over twenty years experience in design and analysis of network architecture, protocols and control algorithms, with very strong backgrounds in performance analysis, modeling and simulation of the communication networks. He is currently with Argon ST (formerly SDRC), Principal Scientist, Networking Research, serving as Principal Investigator for many Department of Defense (DOD) projects. He worked at Bell Laboratories, Lucent Technologies, and Columbia University, focusing on research and development in wireless networks. Dr. Zhang severed as Editor of IEEE Transaction on Wireless Communications from 2002 to 2006 and as Guest Editor for the IEEE JSAC special issue on Overlay Networks, 2003 and the Journal of Wireless Networks issue on multimedia wireless networks, 1996. He is an IEEE COMSOC distinguished lecturer (2010-2011) and will serve as IEEE Globecom 2012 Conference Technical Program Committee (TPC) Chair. He has given many invited talks and tutorials on wireless ad hoc networks at various conferences. His research interests include wireless ad hoc networks, wireless sensor networks.

In this talk, we present a brief overview on the

recent development of the dynamical spectrum access (DSA) techniques, focusing on the following areas: characteristics of the available bandwidth of the primary users, sensing technologies and sensing intervals to detect white spaces, spectrum allocation and management, reliability of the secondary user, tradeoff between spectrum/performance gain versus additional overhead used in implementing DSA, and cross layer optimization in spectrum sharing. Some of tradeoff studies are presented in terms of price of anarchy, which is defined as the price that a decentralized system should pay for not being coordinated. In the second part of the talk, we present a brief overview of the security issues associated with DSA networks, including communications, jamming and anti-jamming, and describe a secured multi-functional framework which can support DSA, cognitive jamming and anti-jamming. The proposed multi-function framework uses prediction algorithms for resource allocation. A cognitive/predictive jamming algorithm can leverage machine learning and prediction methods.


SF Communications


Dynamic Spectrum Access and Cognitive Radio

Speaker: Dr. Zhensheng Zhang, Argon ST Time: Pizza and networking at 6:30 PM;

Presentation at 7:00 PM Cost: none Place: DeVry University, Fremont Campus, 6600

Dumbarton Cr., Fremont RSVP: by email to Bill Kaminsky,

[email protected] Web: www.ewh.ieee.org/r6/scv/comsoc

Dr. Zhensheng Zhang is currently Principal Scientist, Networking Research, with Argon ST (formerly SDRC), serving as Principal Investigator for many Department of Defense (DOD) projects. Dr. Zhang has over twenty years experience in design and analysis of network architecture, protocols and control algorithms. He received his Ph.D. in electrical engineering from the University of California, Los Angeles (UCLA). He worked at Bell Laboratories, Lucent Technologies, and Columbia University, focusing on research and development in high speed networks and wireless networks. He has served as editor of IEEE Transaction on Wireless Communications, Guest Editor for the IEEE JSAC special issue on Overlay Networks and others.

This talk will address: • Bandwidth Characteristics • White Space Sensing Technologies • Spectrum Allocation Schemes • Performance Gain vs. Overhead • Security Issues • Standards Activities

WEDNESDAY November 3, 2010 SCV and OEB Communications

MET Laboratories

EMC – Product Safety

US & Canada

• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (DASH7 & EPCglobal Test Lab)

Facilities in Union City and Santa Clara

www.metlabs.com [email protected] 510-489-6300


Progress in Hard-Field Industrial Tomography

Speaker: Dr. Krikor Ozanyan, The University of

Manchester, UK Time: Pizza and networking at 6:15 PM;

Presentation at 7:15 PM Cost: none Place: David Packard Building (Room 101), Serra

Mall, EE Department, Stanford University, Stanford

RSVP: From website Web: ewh.ieee.org/mu/scv-sscs/upcoming-events

Krikor B. Ozanyan, MSc PhD SMIEEE FInstP FIET FHEA(rp) Head of Sensors, Imaging and Signal Processing School of Electrical and Electronic Engineering The University of Manchester, UK

Degrees: MSc in Engineering Physics (Semiconductors) PhD in Solid-State Physics

Imaging: • Spectroscopic Optical Tomography with scanning

sources (NIR-MIR) • Guided-Path Tomography (DC/AC low frequency,

optical) • Temperature Tomography for industrial

applications (EPSRC, Rolls-Royce; NIR toTHz) • Optically Excited Fluorescence Auto-Projection

Tomography (UV-VIS) • Multi-channel THz tomography with portable

sources • Image reconstruction from a limited number of

views

This presentation will give an introduction into the methodology and systems for fast tomography imaging, which are compact and do not involve mechanical movement. The classical background of X-ray Computed Tomography will be examined first, highlighting the concepts of tomography measurements and algorithms for mathematical reconstruction, as well as their interaction to produce a complete system. Particular emphasis will be given to imaging in the "fingerprint region", examining two cases of chemically specific indirect imaging: utilizing water molecules and the C-H bond in hydrocarbon molecules. Examples of major applications across the electromagnetic spectrum will be illustrated, together with new kinds of Tomography, developed at Manchester. An example case will be discussed suitable for a healthcare application, such as the monitoring of obese patients.

Further, wider variations of hard-field Tomography, expanding into lower-energy optical and THz modalities, will be discussed in the light of motivation for species-selective imaging and the cost implications of pushing the operating range to longer wavelengths. The requirements for flexible signal processing set by the measurement complexity will be considered, together with the practicality of building such systems. Some example problems to be addressed include: spectroscopic tomography; imaging with path integrals on curved surfaces; re-configurable signal processing; imaging from a severely under-sampled Radon transform. Examples of solutions of these problems, studied at Manchester, will be presented and discussed.

THURSDAY November 4, 2010

SCV Solid State Circuits


Tomographic Sensing and Imaging for Industry: Seeing

Where You Cannot Reach Speaker: Dr. Krikor Ozanyan, The University of

Manchester, UK Time: Pizza and drinks at 12:45 PM; Presentation

at 1:00 PM - 2:30 PM Cost: none Place: Pleasanton Library, 400 Old Bernal

Avenue, Pleasanton RSVP: From website Web: www.mindspring.com/~banchero1/ieee Krikor B. Ozanyan, MSc PhD

SMIEEE FInstP FIET FHEA(rp) Head of Sensors, Imaging and Signal Processing School of Electrical and Electronic Engineering The University of Manchester, UK

Degrees: MSc in Engineering Physics (Semiconductors) PhD in Solid-State Physics

Imaging: • Spectroscopic Optical Tomography with scanning

sources (NIR-MIR) • Guided-Path Tomography (DC/AC low frequency,

optical) • Temperature Tomography for industrial

applications (EPSRC, Rolls-Royce; NIR toTHz) • Optically Excited Fluorescence Auto-Projection

Tomography (UV-VIS) • Multi-channel THz tomography with portable

sources • Image reconstruction from a limited number of

views

An introduction to sensors for imaging and Hard-Field Tomography and the challenges set by the requirement for applications in industry. Particular emphasis is given to original work on fully digital fast multiprocessor tomography systems for signal and data processing, novel algorithms for imaging by inversion of limited data, new measurement modalities for imaging of temperature and strain fields, etc. Chemically specific imaging is examined in applications such as fuel imaging for internal combustion engine research and other applications.

FRIDAY November 5, 2010

OEB Nuclear and Plasma Sciences, with Communications and Computer

• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise

www.esw.com [email protected] (408) 328-9240


Making 3D Printing Ideas Real: A Demo and Talk

Speaker: J.R. Warmkessel, founder, Bay Area

MakeBot Users Group Time: Refreshments at 6:30 PM; Presentation at 7:00

PM Cost: none Place: National Semiconductor, Building E, Kifer Rd,

Santa Clara RSVP: From website Web: www.ewh.ieee.org/r6/scv/sps

J.R. Warmkessel, founder of the Bay Area MakeBot users group, is a self-taught Jack-of-all hobbies. He has not only been building kits for over 15 years (eg K2 radio, EggBot, MakerBot), but designing his own and other projects using the Arduino Platform, ShopBot, and the Epilog Laser Engraver. Other hobbies include Flight Instruction, Aircraft Repair, and Ham Radio Operator. Professionally, he started his first software corporation in 2009.

The 3D printer was first designed for rapid

prototyping in the commercial arena. With the advances in technology, and the significant drop in price, this technology is now available to enthusiasts and hobbyists. The RepRap project is an open source 3D Printer, designed for at home use. A RepRap 3D printer heats ABS or PLA plastics and extrudes it in thin layers to build the final product.

There are multiple implementations of the RepRap project, with the best-known version being the MakerBot CupCake printer. The CupCake printer is a complete kit that includes everything that a user needs to build and use the printer at home.

The 3D printers use standard CNC (Computer Numeric Control) phases to design and print the products. CNC has three phases: CAD, CAM, and Cut. CAD, or Computer Aided Design, is the process by which parts and assemblies are designed. The final product of this phase is a software file, often STL (Stereo Lithography). Common CAD software includes SolidWorks, Rhino, and Google Sketchup.

CAM, or Computer Aided Machining, is the process of converting the STL file into a set of sequential commands that serve as instructions for the printer (called G-code). The MakerBot uses Skeinforge CAM software.

Cut is the process by which the machine (in this case, the 3D printer) creates the final product through execution of the G-code. The MakerBot uses ReplicatorG Cut software.

Discussion will include the benefits of 3D printing, and of using the RepRap project for 3D printing, the pitfalls, problems, and limits of 3D printing, and finally, the future of 3D printing and the RepRap project.

MONDAY November 8, 2010

SCV Signal Processing


Patentability and Infringement: A Practical Guide for

Understanding the Basics

Speaker: Karen Dana Oster, IEEE-USA's Intellectual Property Committee

Time: Webinar from 11:00 AM - Noon Cost: none Place: on the Web RSVP: From the website Web: www.ieeeusa.org/careers/webinars

Karen Oster has been assisting businesses and individuals turn their ideas into patents for almost 20 years. She has written and/or prosecuted patents in almost every technological category.

Oster has a bachelor of arts degree in English from the University of California at Santa Barbara; a juris doctorate from Loyola Law School, and a bachelor of science in computer engineering from California State University in Long Beach. Her computer engineering degree was directed to a combination of software, digital electronics and analog electronics. For six years, Oster wrote bi-annual updates for the Federal Circuit Patent Case Digests published by West Group. Karen also wrote the "Patents and E-Commerce" chapter of the Oregon State Bar Computer and Internet Law Section e-Commerce Deskbook.

For more than 15 years, Karen has served on the executive committee of the Oregon State Bar Intellectual Property Section, the Oregon State Bar Computer and Internet Law Section, and/or the Oregon Patent Law Association, and often served as an officer for these committees. Oster is a longtime IEEE member and currently serves on IEEE-USA's Intellectual Property Committee.

Despite their similarities, patentability (can you get a patent for your invention?) and infringement (will there be a liability if you practice your invention?) are very different issues and must be considered separately: An invention may not infringe a patent, and be

patentable over the patent. An invention may infringe a patent, and still be

patentable over the patent. An invention may infringe a patent, and not be

patentable over the patent. An invention may not infringe a patent, and still

not be patentable over the patent. If you have an idea for a product or service, you

need to understand at least the basics of this confusing topic. This presentation will include practical tips that you can do yourself without consulting an attorney. It will also direct your attention to situations in which an attorney should be consulted.

TUESDAY November 9, 2010IEEE-USA

Patent Agent Jay Chesavage, PE

MSEE Stanford 3833 Middlefield Road, Palo Alto 94303

[email protected]

www.File-EE-Patents.com

TEL: 650-619-5270 FAX: 650-494-3835


Smart Computing for the Smart Grid

Speaker: Rick Geiger, Executive Director, Cisco Time: Networking with food and beverage at 6:30

PM; Presentation at 7:00 PM Cost: $2 donation for food Place: Microsoft Research (use rear/North door),

1288 Pear Ave., Mountain View RSVP: required - from the website Web: smartergrid.eventbrite.com

Rick Geiger has been with Cisco for 5 years, formerly as Director of Engineering in Cisco’s Physical Security Business Unit. Prior to joining Cisco, Mr. Geiger was VP Engineering for GE Security in Physical Security, video surveillance and access control. Rick has in-depth experience in the global utility market with more than 10 years as VP Engineering and Chief Technical Officer for Itron. Presently Executive Director for Utilities and Smart Grid, on Cisco’s Business Transformation Team, Rick and the Smart Grid Vertical Team serve the US and Canada utility markets with secure, resilient and scalable network solutions for smart grid, advanced metering, distribution automation and utility telemetry. Rick is an IEEE Senior Member and Member of the Power and Energy Society

Computing content for the Smart Grid is highly varied. Smart Grid has many aspects. From a compute standpoint, the most challenging is in modeling and managing the change from a bulk power distribution system to one that must accommodate bidirectional flows from many sources with the introduction of solar panels and wind turbines in everything from small residential installations to huge wind and solar farms. Making this even more challenging is the inherently variable nature of these renewable sources of energy. This presentation will address the variability of renewable sources of power, the challenge of integrating multiple sources of power at all levels of the transmission and distribution grid, and the distributed computing challenge this presents for situational visibility and control.

TUESDAY November 9, 2010SCV Computer, with Power & Energy


Embedded Passives: Packaging Paradigm of the Future?

Speaker: Jason Ferguson, Crane Naval Surface

Warfare Center Time: Optional dinner at 6:00 PM; Presentation at

6:45 PM Cost: IEEE members $40; Non-members $50;

Students & unemployed members $20 (Optional box lunch add $10)

Place: Engineering Building Auditorium, ENG 189, San Jose State University, One Washington Square, San Jose

RSVP: required - from the website Web: www.cpmt.org/scv

Jason Ferguson holds a Bachelor of Science degree from Rose-Hulman Institute of Technology. In 1995, he began a four year tour of duty as a commissioned officer in the U.S. Army. After his service, he went to work for the Naval Surface Warfare Center at Crane, IN. For the past ten years, he has served as a systems engineer on an air defense program called Cooperative Engagement Capability and as a process engineer for the printed circuit board (PCB) fabrication shop. For the past six years, he has been fabricating and testing embedded passive technology in PCB's. This has led to a project with the Jet Propulsion Lab at Cal Tech to embed resistors and capacitors into a current motor controller design to demonstrate electrical and reliability performance.

Embedded Passive (EP) Technology is of interest

to many OEMs and designers, but the technology remains a mystery for how and when to implement this technology into designs.

Embedded passives will be the next pivotal technology for PCBs. Simply stated, embedded passives are the incorporation (embedding or burying) of passive components, particularly resistors and capacitors, in a substrate. Around in some form for years, EPs are now seen as a key enabling technology in the National Electronics Manufacturing Initiative (iNEMI) Roadmap. The EP revolution is soon to come."

This presentation will reveal what EP materials are out on the market, what the benefits are for using the technology, and give examples of when implementation is viable to a design.

WEDNESDAY November 10, 2010

SCV Components, Packaging and Manufacturing Technology

Channel Partner

Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability

Ozen Engineering (408) 732-4665

[email protected] www.ozeninc.com


Bowling Outing and Social

Speaker: Jason Ferguson, Crane Naval Surface Warfare Center

Time: 7:00 PM – 9:00 PM Cost: $3 for members, $5 for non-members

(includes shoes, food and drinks) Place: AMF Milpitas, 1287 South Park Victoria,

Milpitas RSVP: From the website Web: www.ieee-scv-gold.org

Join IEEE SCV GOLD on a fun-filled evening as we head to the bowling alleys at AMF Milpitas. We'll take care of the bowling shoes, food and drinks, so all you have to do is get there! Non-IEEE members, friends, coworkers, general public all very welcome – in fact go ahead and invite someone you know. It will be fun, we promise! But make sure you RSVP as soon as possible as these events do fill up fairly quickly. Please RSVP via EventBrite (from the website) no later then November 8th. We need to get a head count for food and lane reservations.


SCV Grads of the Last Decade (GOLD)


War Stories from the EMC Society's Founders

Speakers: Jerry Ramie, proctoring his video of Tony

Zimballati, Dr. Ralph Showers, Jim McNaul, Vince Mancino, Milton Kant and Sam Burrauno

Time: Networking/light dinner at 5:30 PM; Presentation at 6:30 PM

Cost: Small fee for dinner; Coffee, tea, and snacks are free

Place: Applied Materials Bowers Cafeteria, 3090 Bowers Ave., Santa Clara

RSVP: From the website Web: ewh.ieee.org/r6/scv/emc

Six of the original founders of the EMC Society were invited to the 50th Anniversary celebration of the formation of the EMC Society in Honolulu in July of 2007. Tony Zimballati, Dr. Ralph Showers, Jim McNaul, Vince Mancino, Milton Kant and Sam Burrauno spoke in the EMC History theatre and told riveting stories of the early years of the EMC profession. The host is Dan Hoolihan, our EMC Society historian.

The video of this event, which Jerry Ramie created, is posted at the IEEE global history network. It lets six of the founding members of the EMC Society tell the "war stories" that they thought were important in their careers. It's funny, serious, touching and always true to life, including many photos of the people, places and things that are discussed. 72 minutes. (produced by Jerry Ramie)

THURSDAY November 11, 2010 SCV Electromagnetic Compatibility


Filter and Multiplexer Technology for Satellite Applications

Speaker: Stephen Berry, Space Systems/Loral Time: Refreshments and Social 6:00 PM;

Presentation at 6:30 PM Cost: none Place: Agilent Technologies, Main Building,

Aristotle Room, 5301 Stevens Creek Blvd, Santa Clara

RSVP: not required Web: www.mtt-scv.org

Stephen Berry received his BS degree from UC Santa Barbara in 1991. He has worked at Space Systems/Loral for 17 years as a design engineer for filters, multiplexers, passive components and is currently the Design Section Manager for the Multiplexer Products group at SS/L. His group is responsible for flight qualified multiplexer design, as well as research and development of novel filters for satellite applications.

This talk will discuss the use of filters, multiplexers, and passive components for satellite payloads including current design techniques and future payload requirements.


SCV Microwave Theory and Techniques


Integration of Renewable Resources - Challenges &

Solutions

Speakers: Barney Speckman, Nexant; Robert Shainker, EPRI; Dan Pearson, PG&E; Darren Brady, Enernoc; Dr. Merwin Brown, CIEE

Time: 8:30 AM to 4:30 PM Cost: $100 for IEEE member; $150 for non-

member Place: State of California Building, San Diego

Room, 455 Golden Gate Avenue, San Francisco

RSVP: by email to Anupama Pandey, [email protected], 415-369-1096

Web: www.e-grid.net/docs/1011-sf-pes.pdf

California is pioneering its way towards a greener and cleaner energy future, with a progressive goal of at least 33% of its electricity generated by renewable resources. The implementation of higher amounts of renewable generation offers many opportunities to the industry and fosters innovation in the areas of renewable technologies, storage technologies, and smart grid technologies. However, there are significant barriers that must be overcome before the power system can be operated in a reliable and economic manner.

To help understand issues related to renewable integration and the role different technologies and smart grid applications will play, the San Francisco Power & Energy Society is sponsoring a one-day workshop to provide a forum for discussion and increased understanding. We have assembled a group of experts with extensive knowledge and experience in their respective field of expertise.

Topics and Speakers Integration of Renewable Resources –

Introduction, Mr. Barney Speckman, Vice President, Nexant

Energy Storage technologies & their Role in Renewable Integration, Dr. Robert Shainker, Senior Technical Executive, EPRI

Renewable Generation & the role Plug-in Electric Vehicles will Play, Mr. Dan Pearson, PG&E, Manager Strategy and Regulation

Potential of Demand Response for Renewable Integration, Mr. Darren Brady, Senior Vice President and COO, Enernoc

Existing, Advanced & Smart Grid Technologies for Renewable Integration, Dr. Merwin Brown, Director Electric Grid Research, CIEE

Panel Discussion (Moderator – Mr. Jon Eric Thalman) Mr. Barney Speckman, Mr. Dan Pearson, Mr. Darren Brady, Dr. Merwin Brown, & Dr. Robert Schainker


SF Power & Energy


Low Power Design for Open Wireless Architecture (OWA)

Baseband Processor supporting Various Wireless Standards

Speaker: Prof. Willie W. Lu, CEO, China 4G Labs Time: Networking/light dinner at 6:30 PM;

Presentation at 7:00 PM Cost: $2 donation accepted for food Place: QualComm Santa Clara, Building B, 3165

Kifer Road, Santa Clara RSVP: not required Web: www.ewh.ieee.org/r6/scv/cas

Willie Lu is a former professor at Stanford University, Chinese University of Hong Kong and an active professor of Zhejiang University of China with expertise in advanced wireless and mobile communications. He is well-known worldwide for his invented Open Wireless Architecture (OWA) core technology which is being widely used in mobile handheld devices and portable devices by Fortune 500 companies both in the Valley and globally. He founded many world-class technology events including World Wireless Congress, Mobile World Congress, Global Mobile Congress, 4G Mobile Forum and 4G Summit with over 100,000 global wireless professionals involved in his events. Willie is currently heading the China 4G R&D teams in the Shanghai area with over $5B investment from the governments, private sectors and global investors, focusing on 4G global IPRs & Innovations.

The OWA family of programmable and open

baseband processors is designed for hosting multiple wireless standards of mobile communication, wireless connectivity, and reception of broadcast services in one common platform. The OWA Processors obtain the necessary flexibility and intelligence from a set of programmable SIMD processor cores, which exchange data through shared on-chip memories. The processors are supported by several dedicated reconfigurable accelerators including Open Computing Machines (OCM) accelerators and Open Kernels accelerators. This OWA architecture has been widely used in the next-generation mobile phone development as well as in baseband processor development.


SCV Circuits and Systems

John Swan Available now for hire in SoC/FPGA/EDA:

• Product Marketing • Business Development • SoC/ESL Methodology • Strategic Partnerships

www.linkedin.com/in/SwanOnChips www.SwanOnChips.com

2010 Chair, IEEE Computer Society of Silicon Valley

Swan On Chips


How Many Consultants Does it Take to Create a Medical Device?

Speaker: Dr. Kendall Waters, IP and Technology

Development, Silicon Valley Medical Instruments, Inc.

Time: Presentation at 7:00 PM Cost: none Place: KeyPoint Credit Union, 2805 Bowers Ave.,

Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org

CNSV member Dr. Kendall Waters is Manager of IP and Technology Development at the start-up Silicon Valley Medical Instruments, Inc., and is an IEEE Senior Member. He is an expert in ultrasound, with particular experience in the interaction of ultrasound and tissue for diagnostic and therapeutic applications.

Kendall has previously worked at the Advanced Technology Laboratory of Volcano Corp., the National Institute of Standards and Technology and the Centre National de la Recherche Scientifique in France. He received his Ph.D. in Physics from Washington Univ. in St. Louis, MO.

Successfully taking a medical device product from

concept to regulatory approval requires a broad range of expertise. Effective strategy execution requires having the right talents available at the right time. Consultants play a key role in supplementing the core competency of a company.

This talk will examine the many and varied roles of consultants at one medical device start-up commercializing a minimally invasive imaging system and catheter. The types of consultants employed have a variety of engineering backgrounds, including hardware, software, mechanical, process, and quality.

A critical factor in making the match between the consultant and the company is the professional network.


SCV Consultants' Network of Silicon Valley


Resistive RAM: Technology and Market Opportunities

Speaker: Deepak Sekar, NuPGA Corporation Time: Pizza at 6:00 PM; Presentation at 6:15 PM Cost: none Place: National Semiconductor, Building E1,

Conference Center, 2900 Semiconductor Drive, Santa Clara

RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds

Deepak Sekar received a B. Tech degree from the Indian Institute of Technology, Madras in 2003 and a PhD degree from the Georgia Institute of Technology in 2008. He worked at SanDisk Corporation as a researcher developing 3D resistance-based memories and NAND flash memories between 2006 and 2010. He is now a Principal Engineer at NuPGA Corporation. Honors he has received include Best Student Paper Award at the Int’l. Interconnect Technology Conference IITC (2008), an Intel PhD Fellowship (2006-2008), two Inventor Recognition Awards from the Semiconductor Research Corporation (2006, 2009), Best Paper Award from the IETE Technical Review (2009), among others. He is an author or co-author of a book, an invited book chapter, 15 publications, 18 issued patents and 20 pending patents. He serves as a Program Committee Member and a Short Course Co-Chair at the Int’l. Interconnect Technology Conference.

Over the past few years, Resistive RAM (RRAM)

devices, also known as memristors, have garnered significant attention in the popular press. They have, in fact, been called “One of the Best Inventions of 2008” by Time Magazine and “The Greatest Electronics Invention in the Past 25 Years” by IEEE Spectrum. In this presentation, this exciting new technology will be discussed in detail. Topics to be covered include switching mechanism, techniques to optimize RRAM switching at the material, process, device and circuit levels as well as array architectures and opportunities for commercialization.

TUESDAY November 16, 2010SCV Electron Devices


Grounding Considerations for Distributed Generation

Interconnection to Electric Power System

Speaker: Stuart Gibbon, Director of Business

Development, Post Glover Time: Social at 5:30 PM; Presentation at 6:00

PM; Dinner at 7:00 PM Cost: $30 ($10 for full-time students) Place: Sinbad’s Restaurant, Pier 2 The

Embarcadero, San Francisco RSVP: by email to Frank Sylvester,

[email protected], 415.554.1578 Web: www.e-grid.net/docs/1011-sf-ias.pdf

Stuart Gibbon Director of Business Development at Post Glover, is a Graduate of McGill University, with a degree in Electrical Energy. Mr. Gibbon began his career as a Project Engineer in broadcast communications systems. He worked with ABB in North America and Europe in MV Power Compensation Systems. Most recently, he has enjoyed the past ten years working in the application of power resistors, including his present position with responsibility for product advancement. Mr. Gibbon is active in IEEE PCIC and ESW.

Whether installed by a utility to provide capacity or by an end user for reliability peak-shaving, more generators are being installed and operated in parallel with the standard utility system. Choosing the proper ground fault protection for distributed generators can be challenging, especially when it must be coordinated with other sources. This presentation will discuss various generator grounding possibilities at both LV and MV for unit connected and parallel operated generators, and consider relevant issues such as residual current devices, transfer switches and overall power quality.


SF Industry Applications


An Iconoclast Revisits Climate Change: Some Pleasant Truths

Speaker: Albert G. Engelhardt, President and CEO,

Enfitek, Inc Time: Buffet Dinner, Networking at 6:00 PM;

Presentation at 7:00 PM Cost: $10 (includes dinner) Place: Willow Tree Restaurant, 6513 Regional St,

Dublin RSVP: by November 14 on the Website Web: www.ieee4life.org

Albert G. Engelhardt is President and CEO of Enfitek, Inc. His 51-year professional career covers a broad spectrum as a university professor, a research engineer and physicist, a Los Alamos National Laboratory Staff Member, and corporate executive. Dr Engelhardt holds a PhD in Electrical Engineering from the University of Illinois. He has been active in IEEE activities locally, nationally and internationally since 1957. He is presently the IEEE Region 6 Life Member Coordinator.

A considerable share of the limited resources of the country, and of scientists and engineers, is being wasted on the speculation about global warming and the role of CO2. Data obtained by scientists about the temperature cycles for many thousands of years in the past have shown significant temperature cycles without the effect of large human populations. There are solid data out there conclusively proving man-made global warming to be at best insignificant. A summary of the Climate Change Debate within the context of recent developments will be given.

Comment from the Organizers:

The organizers of this meeting recognize that the subject is controversial. The organizers want to present all sides of controversial topics. If you want to suggest a speaker with an opposing view, please send your recommendation to the Chair at [email protected].

TUESDAY November 16, 2010OEB Life Members


Nanoelectronics – Innovation and Implementation

Speakers: Di Ma, TSMC; Bill Liu, Global Foundries;

Anna Hunter, Samsung Semiconductor; and others

Time: Noon - 5:00 PM Cost: Members $25, Students $25, Non-

Members $30. At Door Registration add $5 Place: National Semiconductor Bldg E-1 CMA

Room, 2900 Semiconductor Drive, Santa Clara

RSVP: from website Web: www.ieee.org/nano

Presentations on the current state of available foundry services and directions for the future. Panel discussion on Challenges and breakthroughs for sub 17nm technology.


SCV Nanotechnology


Overview of Multimedia eLearning Theory with a View

Towards Efficient Creation and Dissemination

Speaker: Allen Partridge, Adobe Time: Refreshments at 6:30; Presentation at

7:00 PM Cost: none Place: Silicon Valley Technical Institute, 1762

Technology Drive, Suite 227, San Jose RSVP: not required Web: www.ewh.ieee.org/r6/scv/es

Dr. Allen Partridge is the eLearning Evangelist for Adobe. In addition to his work for Adobe Systems, he continues to serve on the doctoral faculty in the Communications Media and Instructional Technology program at Indiana University of Pennsylvania. Allen has written several books and a host of articles on topics ranging from 3D game development to Instructional Design for new technologies. He is active in explorations of Immersive Learning as well as traditional multimedia enhanced eLearning and rapid eLearning. Allen works closely with the eLearning Suite and Captivate teams at Adobe, providing a channel to customer needs and concerns and helping facilitate communication among team members.

See website for full details.


SCV Education


MEMS Technology for Medical Applications

Speaker: Alissa M. Fitzgerald, Ph.D., A.M. Fitzgerald

& Associates Time: Optional dinner at Stanford Hospital

Cafeteria, 6:15 PM; Presentation at Med School at 7:30 PM

Cost: none Place: Presentation at Room M-114, Medical

School, Stanford University RSVP: not required Web: www.ewh.ieee.org/r6/scv/embs

Dr. Alissa Fitzgerald has over 15 years of hands-on engineering experience in MEMS design, fabrication and product development. She has developed over a dozen distinct MEMS devices, such as piezoresistive cantilevers, ultrasound transducers, and infrared imagers. She advises clients on the entire technology development cycle, from business and IP strategy, to initial design and prototyping, all the way through to foundry transfer. She is a recognized expert on reliability of brittle materials and is active in the development of a proprietary MEMS fracture prediction tool.

She has previously been employed by the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation (acquired by Siemens). Dr. Fitzgerald received her bachelor and master degrees from the Massachusetts Institute of Technology and her doctorate from Stanford University, all in the discipline of Aeronautics and Astronautics.

Dr. Fitzgerald has numerous journal publications, holds two patents, and is a frequent lecturer at UC Berkeley, Stanford University and local professional group meetings. Dr. Fitzgerald serves on the Governing Council of the MEMS Industry Group.

MEMS technology offers great potential for

medical applications, since it enables manufacturing of sophisticated components and sensors at biologically-relevant size scales (microns to millimeters) and uses bio-compatible materials (noble metals, polymers, glass). This presentation will provide an overview of the wide range of MEMS devices being developed for medical applications, in markets such as biotech and drug discovery, point of care, external medical devices and implants. Many MEMS devices are already in use, some are in FDA trials and others will be starting trials soon.

WEDNESDAY November 17, 2010 SCV Engineering in Medicine and Biology


How Organic Semiconductors Work

Speaker: Dr. Arthur P. Ramirez, University of California Santa Cruz

Time: Refreshments, Food at 6:30 PM; Presentation at 7:00 PM

Cost: none Place: Room 180, Engineering Bldg 2, University

of California at Santa Cruz RSVP: by email to Marcelo Siero, [email protected] Web: www.ee.com/organic

Art Ramirez received both B.S. and Ph.D. degrees in physics from Yale University. His doctoral thesis dealt with the thermodynamic signature of solitons in a quasi-one-dimensional ferromagnet. Art then did a postdoc at Bell Labs and studied the interplay of superconductivity and magnetism in heavy fermion materials. Between 1986 and 2000 he was Member of Technical Staff at Bell and worked on a variety of different topics in Condensed Matter and Materials Physics, including superconductivity in high-Tc cuprates and buckyballs, colossal magnetoresistance in magnanites, and geometrical frustration in magnetic and structural systems. Art went to Los Alamos in 2001 where he led the Condensed Matter and Thermal Physics group. In 2003 he returned to Lucent Technologies Bell Labs as director of Condensed Matter Physics Research and then in 2005 became director of Device Physics Research. In 2008, he joined LGS, a wholly owned subsidiary of Alcatel-Lucent. In 2009 he moved to the University of California Santa Cruz where he is Dean of the Baskin School of Engineering. At UCSC, Art is also setting up a materials characterization lab to do research in devices from novel materials and the development of novel multifunctional systems.

Electronics made largely from carbon have already been incorporated into commercial products. To realize the full promise of such organic semiconductors, however, a good understanding of fundamental processes is needed. We ask simple questions such as "how does an organic semiconductor become doped?" and "what is the ultimate speed of organic devices?" in the context of field effect transistors and photovoltaic devices made from crystals of small molecules (rubrene, C60, HBC). I will discuss experiments that demonstrate, for the first time, controlled doping in organic semiconductors. I will also discuss the consequences of crystallinity for organic photovoltaics.


Monterey Bay Subsection


Adjustable Speed Drives Speaker: Reinaldo Bermudez, Voith Turbo Time: Social at 5:30 PM; Presentation at 6:15

PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM

Cost: $20 for IEEE members; $25 for non-members

Place: Marie Callender's Restaurant - The Garden Room, 2090 Diamond Blvd, Concord

RSVP: By email to Gregg Boltz, [email protected], (925) 210-2571

Web: www.e-grid.net/docs/1011-oeb-ias.pdf

Reinaldo Bermudez is a Regional Sales Manager for Voith Turbo covering the Oil and Gas industry in the United States. He has over 12 years of experience in the field of turbomachinery both in the process refrigeration industry and in power transmission equipment. At Voith Turbo he is currently responsible for sales and the implementation of hydrodynamic variable speed technology in a variety of oil and gas applications with special focus in the downstream market. Mr. Bermudez has a B.S. degree in Industrial Engineering from the University of Houston. He is an active member of ASME. Mr. Bermudez has contributed as an author and instructor for the Texas A&M Pump Users Symposium. He currently serves in the advisory board of the Apollo Subsection of the ASME South Texas section and the Multiphase Pump Users round table.

This presentation will provide a general overview

of hydrodynamic variable speed drives and their application to various types of rotating machinery as a viable and reliable alternative to the more commonly used electrical variable frequency drives. The hydrodynamic principle of power transmission and its application to different kind of fluid drives will be explained and compared to other available adjustable speed technology.

Adjustable speed drives are commonly applied to various types of rotating machinery such as pumps, fans, compressors and wind turbines. The presentation will discuss, with the aid of animations and graphics, the fundamental principle of hydrodynamic power transmission, possible drive configurations, reliability and efficiency figures, motor starting, and comparison to other adjustable speed drive technologies.


OEB Industry Applications


Robot Control for Medical Applications and Hair Transplants

Speaker: Dr. John Tenney, Restoration Robotics, Inc. Time: Networking/refreshments at 6:30 PM;

Presentation at 7:00 PM Cost: none Place: Cogswell Polytechnical College, Board

Room, 1175 Bordeaux Drive, Sunnyvale RSVP: not required Web: ewh.ieee.org/r6/scv/css

John Tenney is Director of Research at Restoration Robotics, Inc., a medical device startup that is designing a hair transplantation robotic system. Between 2004 and 2007, he served as Chief Software Architect at Adept Technology, where he led design and implementation of a new generation of their control system. In 1996, he co-founded Commotion Technology, which developed a VxWorks and PC-based robot control package. He became Director of Motion Control at PRI-Brooks Automation when Commotion was acquired in 2000. Dr. Tenney earned his PhD in Mechanical Engineering from Berkeley in 1996, his MS from Stanford in 1986, and his BS from MIT in 1982.

Medical device applications have proven to be

fertile ground for innovative robotic control solutions. In this talk, Dr. John Tenney of Restoration Robotics, Inc., describes the wide range of medical device robotic applications. He will then discuss the application of both force control and 3-D stereo visual servoing as part of the real-time control system created by his company, Restoration Robotics.


SCV Control Systems


Sunpower Technology: Benefits of High Efficiency

and Vertical Integration

Speaker: Jonathan Botkin, SunPower Corp. Time: Networking/refreshments at 6:00 PM;

Buffet Dinner at 7:00 PM; Presentation at 7:45 PM

Cost: $30 for Members; $35 for Non-members; $20 for Student members

Place: Pyramid Brewery, 901 Gilman Street, Berkeley

RSVP: from website Web: www.ieee.org/go/oebpes

Jonathan Botkin is a Mechanical Engineer, and

Director of Systems R&D for SunPower Corporation He leads the development of SunPower products for utility, commercial, and residential applications. An Engineering group of about 20 people. Jonathan has worked in solar energy for nearly 12 years and wind energy for about 7 years. He got his BSME at UC Berkeley in 1989, and is a California-licensed PE.

3rd Presentation in our Large Scale Solar Power

series.

THURSDAY November 18, 2010 OEB Power & Energy


Seminar: Copyright and Trademark Basics for Consultants Speaker: Jonathan Sweet, Esq., CNSV member Time: 9:00 AM - 12:30 PM Cost: $35 for Members; $45 for Non-members Place: Cogswell Polytechnical College, Board

Room, 1175 Bordeaux Drive, Sunnyvale, and on the Web

RSVP: from website Web: ieeecnsv111910.eventbee.com/track/cnsvmtg

Being a successful technical consultant requires a

basic understanding of the law pertaining to copyright and trademark. Copyright protects creative ideas stored in a fixed medium, and trademark protects use of a name used in commerce. You can lose important legal rights by not addressing these legal issues in your contract language with clients.

CNSV member, Jonathan Sweet, Esq. will present this seminar as a follow-up to his talk on "Collections and Insurance" at our CPP seminar a few months ago.

Who Should Attend: All consultants who design software or hardware

for clients. In other words, just about all consultants. A few examples of what you will learn:

Copyright: Matters Protected Originality Requirement Protection of Expression Rather than Ideas Elements for Infringement Digital Millenium Copyright Act

Trademark: Basis for trademark protection Federal trademark infringement Abandonment of a trademark Fair-Use defense

FRIDAY November 19, 2010


• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts

Ph: 408-288-7588 www.StevensLawGroup.com

Email: [email protected]

1754 Technology Dr, #226 San Jose


Antenna Measurements from Basic Concepts

to Automated Systems

Speaker: Mike Hillbun, President, Diamond

Engineering Time: Networking/refreshments at 6:00 PM;


Room, 1175 Bordeaux Drive, Sunnyvale RSVP: not required Web: www.ewh.ieee.org/r6/scv/aps

Mike Hillbun, President of Diamond Engineering, holds a Masters degree in Physics from the University of California, Berkeley. He has 30 years’ experience in semiconductor and antenna design. Mr. Hillbun producted the first wireless 10MB packet radio which won first prize at Interop in 1994. Currently Diamond Engineering manufactures antenna test systems.


SCV Antennas and Propagation


Photoprinting Assembly Technology for Ultrathin Electronic Components

Speaker: Dr. Jayna Sheats, Terepac Corporation Time: Networking and buffet dinner at 6:00 PM;

Presentation at 6:45 PM Cost: $20; $10 for fulltime students and currently

unemployed; $5 more at door Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy

101 at Montague Expressway), Santa Clara RSVP: from website, by Dec. 6 Web: www.cpmt.org/scv

Dr. Jayna Sheats is a co-founder of Terepac Corporation and has been its full-time CTO since 2008. From 2004 until 2008 she served as Vice President of Manufacturing Technology and subsequently Associate CTO at Nanosolar, Inc. Before that, she spent two years in consulting and entrepreneurial development in thin film electronics, particularly involving roll-to-roll processing techniques, and was a co-founder of two companies and advisor to several (including Nanosys, Nanosolar, Appleton Paper, and others). Prior to this, she spent 20 years at HP Labs, working on a wide variety of projects in thin film electronics, including microlithography, superconductivity, and electro-luminescence. She also initiated and supported a program to introduce Internet technology in the developing world. Palo Alto based and a fellow of the American Association for the Advancement of Science, she holds a Ph.D. in physical chemistry from Stanford University, has published 55 journal articles and filed more than 34 patents, with 20 presently issued.

Packaging continues to push toward smaller and thinner assemblies to accommodate the demands of mobile consumer products. 3D integration provides another driver for the use of ultrathin components. The wireless sensors market, envisioned by many to be in the trillions, requires microprocessors with tens of thousands of transistors and memory in the kilobyte range. These devices need to be very inexpensive and typically, flexible and small.

We have developed an assembly and packaging technology which can effectively handle electronic components of almost any useful size, down to the micron scale in both thickness and lateral size. Interconnections are printed from soluble precursors, allowing for much smaller I/O pad periods than solder bumping or wirebonding. Flexibility is achieved without any compromise in electrical performance compared to conventional packaging.

The ability to package ultrathin components rests on a process in which parts are transferred from diced wafer directly to a “printing plate”, and then released by the action of light and heat on a photoactive polymer. Thus the complex mechanical action of the pick and place process is replaced by photoprinting, requiring much simpler mechanics with increased throughput. While our emphasis has been on low part count products such as smart cards and simple wireless sensors, the technique can also handle larger (cm-scale) dice, and could provide an alternative for stacking bare die in wafer level packages.

WEDNESDAY December 8, 2010 SCV Components, Packaging and Manufacturing Technology


Autonomy: From Outer to Inner Space - Deep Ocean Exploration

using NASA Technology

Speaker: Dr. Kanna Rajan, Monterey Bay Aquarium Research Institute (MBARI)

Time: Networking/refreshments at 6:30 PM; Presentation at 7:00 PM

Cost: none Place: Cogswell Polytechnical College, Board


Kanna Rajan is the Principal Researcher in Autonomy at the Monterey Bay Aquarium Research Institute, a privately funded non-profit Oceanographic institute which he joined in October 2005. Prior to that he was a Senior Research Scientist for the Autonomous Systems and Robotics Area at NASA Ames Research Center Moffett Field. At Ames, he balanced programmatic and technical responsibilities. He was the Principal Investigator of the MAPGEN Mixed-Initiative Planning effort to command and control the Spirit and Opportunity rovers on the surface of the Red Planet. MAPGEN continues to be used to this day, twice daily in the mission-critical uplink process at the Jet Propulsion Laboratory in Pasadena. Kanna was one of the six principals of the Remote Agent Experiment (RAX) team, which designed, built, tested and flew the first closed-loop AI-based control system on a spacecraft. The RA was the cowinner of NASA's 1999 Software of the Year, the agency's highest technical award.

His interests are in automated planning/scheduling, modeling and representation for real world planners and agent architectures for distributed control applications. Prior to joining NASA Ames, he was in the doctoral program at the Courant Institute of Math Sciences at New York University. Prior to that he was at the Knowledge Systems group at American Airlines, helping build a Maintenance Routing scheduler (MOCA), which continues to be used by the airline 365 days of the year.

Kanna is the recipient of the 2002 NASA Public Service Medal and the First NASA Ames Information Directorate Infusion Award also in 2002. In Oct 2004, JPL awarded him the NASA Exceptional Service Medal for his role on the Mars Exploration Rovers misson. He was Co-chair of the 2005 International Conference on Automated Planning and Scheduling (ICAPS) in Monterey and till recently the chair of the Executive Board of the International Workshop on Planning and Scheduling for Space. He continues to serve on review panels for NASA, the Italian Space Agency and European Space Agency.

Ocean Sciences the world over is at a cusp, with a move from the Expeditionary to the Observatory mode of doing science. Recent policy decisions in the United States, are pushing the technology for persistent observation and sampling which hitherto had been either economically unrealistic or unrealizable due to technical constraints. With the advent of ocean observatories, a number of key technologies have proven to be promising for sustained ocean presence. In this context robots will need to be contextually aware and respond rapidly to evolving phenomenon, especially in coastal waters due to the diversity of atmospheric, oceanographic and land-sea interactions not to mention the societal impact they have on coastal communities. They will need to respond by exhibiting scientific opportunism while being aware of their own limitations in the harsh oceanic environment. Current robotic platforms however have inherent limitations; pre-defined sequences of commands are used to determine what actions the robot will perform and when, irrespective of the context. As a consequence not only can the robot not recover from unforeseen failure conditions, but they're unable to significantly leverage their substantial onboard assets to enable scientific discovery.

To mitigate such shortcomings, we are developing deliberative techniques to dynamically command Autonomous Underwater Vehicles (AUV). Our effort is aimed to use a blend of generative and deliberative Artificial Intelligence Planning and Execution techniques to shed goals, introspectively analyze onboard resources and recover from failures. In addition we are working on Machine Learning techniques to adaptively trigger science instruments that will contextually sample the seas driven by scientific intent. The end goal is towards unstructured exploration of the subsea environments that are a rich trove of problems for autonomous systems. Our approach spans domains and not unduly specific to the ocean domain; the developed system is being used for a terrestrial personal robot at a Silicon Valley startup and will soon be on a Planetary rover testbed in Europe. Our work is a continuum of efforts from research at NASA to command deep space probes and Mars rovers, the lessons of which we have factored into the oceanic domain. In this talk I will articulate the challenges of working in this hostile underwater domain, lay out the differences and motivate our architecture for goal-driven autonomy on AUV's.

THURSDAY December 9, 2010

SCV Control Systems


Mass Storage: What the Future Holds /

CNSV Annual Meeting Speaker: Tom Coughlin, Coughlin Associates Time: 7:00 PM Cost: none Place: KeyPoint Credit Union, 2805 Bowers Ave.,

Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org`

Tom Coughlin is a widely

respected storage analyst and consultant with over 30 years of experience in the data storage industry. His company Coughlin Associates provides market and technology analysis - including a newsletter and reports on several digital storage technologies and applications - as well as Data Storage Technical Consulting services.

Dr. Coughlin has many publications and six patents to his credit. His 2008 book Digital Storage in Consumer Electronics: The Essential Guide was the subject of a previous CNSV talk that he gave.

Tom is active with SMPTE, SNIA, IDEMA, the IEEE Magnetics Society, IEEE CE Society and other professional organizations. He is the founder and organizer of the annual Storage Visions conference (a partner to the International Consumer Electronics Show), as well as the Creative Storage Conference. He is also a Leader in the Gerson Lehrman Group Councils of Advisors, a CNSV member and an IEEE Senior Member.

This year's iNEMI Mass Storage Roadmap committee was chaired by CNSV members Roger F. Hoyt and Tom Coughlin.

Mass data storage for digital electronic systems plays a vital role in contemporary life, providing non-volatile and rapid data access for business, government, academic, military, and consumer applications. The properties of these technologies may be illustrated in a Tiered Storage Hierarchy pyramid, with the lower capacity, highest performance and most costly technologies at the top, down to the highest capacity, lowest performing, and least costly at the base.

This presentation will provide highlights from the latest bi-annual iNEMI Mass Storage Roadmap on technology developments in solid state memory, hard disk drives, magnetic tape and optical storage. The current roadmap of this report, like previous roadmaps beginning in 1996, includes participation and input from a broad spectrum of participants in the mass data storage industry, government, and academic organizations.

This talk will give perspective on the current status and outlook for all key mass storage technologies: Solid State, Magnetic and Optical Storage, as well as integrated storage systems.

TUESDAY December 14, 2010



EMC/EMI Issues in Biomedical Research

Speaker: Prof. Ji Chen, ECE Dept., University of

Houston Time: Networking/light dinner at 5:30 PM;

Presentation at 6:30 PM Cost: none (includes catered holiday dinner) Place: Applied Materials Bowers Cafeteria, 3090

Bowers Ave., Santa Clara RSVP: not required Web: ewh.ieee.org/r6/scv/emc

Dr. Ji Chen received the Bachelor’s degree from Huazhong University of Science and Technology, Wuhan, Hubei, China, the Master’s degree from McMaster University, Hamilton, ON, Canada, in 1994, and the Ph.D. degree from the University of Illinois at Urbana-Champaign in 1998, all in electrical engineering. He is currently an Associate Professor with the Department of Electrical and Computer Engineering, University of Houston. Prior to joining the University of Houston, from 1998 to 2001, he was a Staff Engineer with Motorola Personal Communication Research Laboratories, Chicago, IL. Dr. Chen has received the outstanding teaching award and outstanding junior faculty research award from the College of Engineering at University of Houston. He is also the recipient of ORISE fellowship in 2007. His research group also received the best student paper award at IEEE EMC Symposium in 2005 and the best paper award from IEEE APMC conference in 2008.

The interactions between electromagnetic signals

and biomedical systems lead to safety considerations for medical devices and patients. In this talk, we will present some recent investigations of EMC/EMI issues related to these scenarios. In particular, we will discuss 1) safety evaluation for pregnant woman under a walk-through metal detector, 2) thermal and temperature evaluation of pregnant woman models under an MRI RF coil, 3) effects of implantable devices within human subject models under MRI coils, and 4) the interactions between vehicular-mounted antenna and bystanders with implantable medical devices.

TUESDAY December 14, 2010

SCV Electromagnetic Compatibility


Adaptive Inverse Control

Speaker: Prof. Bernard Widrow, Stanford University Time: Networking/refreshments at 6:30 PM;



Bernard Widrow received the S.B., S.M., and Sc.D. degrees in Electrical Engineering from the Massachusetts Institute of Technology in 1951, 1953, and 1956, respectively. He joined the MIT faculty and taught there from 1956 to 1959. In 1959, he joined the faculty of Stanford University, where he is Professor of Electrical Engineering.

He began research on adaptive filters, learning processes, and artificial neural models in 1957. Together with M.E. Hoff, Jr., his first doctoral student at Stanford, he invented the LMS algorithm in the autumn of 1959. Today, this is the most widely used learning algorithm, used in every MODEM in the world. He has continued working on adaptive signal processing, adaptive controls, and neural networks since that time.

Dr. Widrow is a Life Fellow of the IEEE and a Fellow of AAAS. He received the IEEE Centennial Medal in 1984, the IEEE Alexander Graham Bell Medal in 1986, the IEEE Signal Processing Society Medal in 1986, the IEEE Neural Networks Pioneer Medal in 1991, the IEEE Millennium Medal in 2000, and the Benjamin Franklin Medal for Engineering from the Franklin Institute of Philadelphia in 2001. He was inducted into the National Academy of Engineering in 1995 and into the Silicon Valley Engineering Council Hall of Fame in 1999.

Dr. Widrow is a past president and member of the Governing Board of the International Neural Network Society. He is associate editor of several journals and is the author of over 125 technical papers and 21 patents. He is co-author of Adaptive Signal Processing and Adaptive Inverse Control, both Prentice-Hall books. A new book, Quantization Noise, was published by Cambridge University Press in June 2008.

Adaptive inverse control, a novel method of self-correcting system dynamics, uses feed-forward control to optimize plant performance. Unlike conventional control methods, adaptive inverse control uses feedback to control the variable parameters of the controller itself, offering enhanced flexibility and precision in the control of unknown variable systems.

Adaptive filtering techniques have been used successfully in a variety of signal processing problems, including antenna systems, channel equalization, echo cancellation, and spectral estimation. This presentation will discuss how these techniques are being used in control systems. Adaptive inverse control is suited to both stable and unstable plants, minimum phase and nonminimum phase plants, and linear and nonlinear sy stems. Multiple-input multiple-output (MIMO) plants are supported as well as single-input single-output (SISO) plants. Control of plant dynamics is treated separately, without compromise, from optimal control of plant disturbance.

Prof. Widrow will be available for book signing after the presentation.

THURSDAY January 20, 2011SCV Control Systems

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