half-bridge drivers a transformer or an all-silicon drive?

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Half-Bridge Drivers A Transformer or an All-Silicon Drive?

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Half-Bridge DriversA Transformer or an All-Silicon Drive?

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

Topology Trend for High Efficiency• Soft Switching

– LLC-HB resonant– Active clamp forward– Active clamp flyback– Asymmetrical half-bridge– Full bridge with phase shift

• Hard Switching– Flyback– Forward– 2-sw flyback– 2-sw forward– Full bridge

LLC-HB

Active clamp Forward

Active clamp Flyback

AHB

FB Phase-shift

The High-Side Switch

• To achieve high efficiency, the topologies with ZVS (Zero-Voltage Switching) behavior are preferred.

• All the soft switching topologies implement the power switch with floating reference pin, e.g. the source pin of MOSFET.

• Why are MOSFETs used in soft switching applications?– High frequency operation– Body diode (current loop for ZVS)

How to drive the high side MOSFET?

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

D

G

S

Turn-on Procedure for Hard-switching

• Stages 2 and 3 dominate the switching losses of MOSFET and driver.• DRV’s source capability as VGS is around VGS,Miller is important.

CDS

CGD

CGS

RG,IRGATERHI

VDRV

IDVTH

VGS

IG

VDS

ID

VGS,Miller

S1 S2 S3 S4

IG

The Miller plateau

The miller plateau is caused by CGD

D

G

S

Turn-off Procedure for Hard-switching

• Stages 2 and 3 dominate the switching losses of MOSFET and driver.• DRV’s sink capability as VGS is around VGS,Miller is important.

CDS

CGD

CGS

RG,IRGATERLO

VDRV

IDVTH

VGS

IG

VDS

ID

VGS,Miller

S1 S2 S3 S4

IG

The Miller plateau

The miller plateau is caused by CGD

17

Vin250

18

D11N4148

16

Resr100m

C2440uF

Rload2.5

Vout2

1

5

Ll0.1uH

Lp1.75mH

Rp300m

Ip

RATIO_POW = -0.0667RATIO_AUX = -0.0667

7

Aux

21C510uF

22

R113.9k

C647pF

Isnub

R9300m

Iout

3

Rg15

13

Rsense1

14R131kC1

470pF

23

Vgs

Vsense

12

Verr

11

Rupper4.851k

Rlower0.97k

9

R1720k

C43.97nF

C7470pF 6 Vdrain

X1MBRS340t3 Out

Out

Vramp

CMP

FB

OSCSENS

OUT

GND

X2PWMCM

10

D3MUR160

Iclipp

Aux

R5470

Rclamp88k

Cclamp1.4nF

ΔVclipp

Vdrv

V1Ipri

D21N4148

X3IRF840

Simulation Circuit of Flyback

• Simulate the VGS, VDS, and IDS on Flyback.

IDS

0

4.00

8.00

12.0

16.0

vgs

in v

olts

plot

1

1

-100

100

300

500

700

vdra

in in

vol

tspl

ot3

2

1.01995m 1.02005m 1.02015m 1.02025m 1.02035mtime in seconds

-400m

0

400m

800m

1.20

ipri

in a

mpe

res

plot

2 3

VGS

VDS

IDS

Turn-on Simulation of Flyback

• VGS rises with Miller effect.

50 ns / div

200 mA / div

50 ns / div

200 V / div

50 ns / div

2 V / div

0

4.00

8.00

12.0

16.0

vgs

in v

olts

plot

1

1

-100

100

300

500

700

vdra

in in

vol

tspl

ot3

2

1.0244m 1.0246m 1.0248m 1.0250m 1.0252mtime in seconds

-400m

0

400m

800m

1.20

ipri

in a

mpe

res

plot

2

3

VGS

VDS

IDS

Turn-off Simulation of Flyback

• Turn off with Miller effect.

100 ns / div

200 mA / div

100 ns / div

200 V / div

100 ns / div

2 V / div

Turn-on Procedure for Soft-switching• Because of ZVS, there is no Miller

effect as turning on.

• The switching losses are dominated by– The dead time (to reduce S1), and– Source capability to charge CGS to

reduce S2

• Less driver capability requirement.

VTH

VGS

IG

VDS

ID

S1 S2 S3 ID depends on topology

-Vf

Turn-off Procedure for Soft-switching

• Similar as hard-switching: The Miller plateau exists as turning off.

• The difference is that IDS also reduces at this duration since IDS will go through the opposite MOSFET as VDS changes.

• To avoid overlap between 2 MOSFETs, minimize the duration of S1 ~ S4.

• Strong DRV’s sink capability is needed.

VTHVGS

IG

VDS

IDS

VGS,Miller

S1 S2 S3 S4

The Miller plateau

10 12Ls{Ls}

2

Lmag{Lmag}

Cs{Cs}

1

4X3XFMR-TAPRATIO = 1/N

ILmag

ICs

Vcs

ΔVLmag

26

V3{Vbulk}

23

B1Voltage

V(G2) < 2.5 ?0 :15

24

B2Voltage?

19

Mlower

Vbridge

Cs

Δ22

Mupper

* WV3

R105m

R1115

R1415

11

V4

IML

M2IRF840

5

M1IRF840

X12MBR2045

X13MBR2045

Δ

YM1

V10IM1D2

1N4148

D31N4148

Simulation Circuit of LLC-HB

• Simulate the VGS_MU, VDS_MU, and IMU on LLC-HB• To ease the reading of current, the direction of IMU and IML is referred to ICS.

IMU

ICS

IML

Turn-on Simulation of LLC-HB

• VGS_ML off, ICS reduces VDS_MU for ZVS.• VDS_MU is 0 V BEFORE VGS_MU, so VGS_MU rises smoothly.

-2.00

2.00

6.00

10.0

14.0

mlo

wer

, mup

per

in v

olts

plot

1

1

2

0

100

200

300

400

ym1

in v

olts

plot

2

3

10.1922m 10.1926m 10.1930m 10.1934m 10.1938mtime in seconds

-2.00

-1.00

0

1.00

2.00

im1,

iml i

n am

pere

spl

ot3

4

5

VGS_MUVGS_ML

VDS_MU

I_ML I_MU

Not overlap; it is the current through CDS

200 ns / div

500 mA / div

200 ns / div

200 V / div

200 ns / div

2 V / div

Turn-off Simulation of LLC-HB

• Strong turn off capability is required.

-2.00

2.00

6.00

10.0

14.0

mlo

wer

, mup

per

in v

olts

Plo

t1

2

1

0

100

200

300

400

ym1

in v

olts

Plo

t2

3

10.1976m 10.1978m 10.1980m 10.1982m 10.1984mtime in seconds

-2.00

-1.00

0

1.00

2.00

iml,

im1

in a

mpe

res

Plo

t3

45

VGS_MLVGS_MU

VDS_MU

I_MU VGS_ML100 ns / div

500 mA / div

100 ns / div

200 V / div

100 ns / div

2 V / div

Driver Comparison between Hard-Switching and Soft-Switching

AccurateAccurateDead time accuracy requirement

HighHighSink capability requirement

LowMediumSource capability requirement

Soft-switchingHard-switching

The Solutions for High-Side Driver

• Transformer-based solution

– Single DRV input

– Dual DRV inputs

• Silicon integrated circuit driver: dual outputs

– Single DRV input

– Dual DRV inputs

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

Consideration as Designing Driver Transformer

• Ground-referenced floating drive – keep 500 V isolation if a 400 V pre-regulated PFC exists.

• Minimize the leakage inductance - the delay between output and input windings may kill the power MOSFETs.

• Follow Faraday’s law – keep V*T constant, otherwise, saturate.

• Keep enough margin from saturation – the worst case happens with transient load at high line.

• High permeability ferrite – minimize the IM.

• Keep high sink current capability

Single DRV Input

• An ac coupling capacitor (CC) is needed to reset the driver transformer flux.• The amplitude of VGS is dependent on duty. • With (-VC) to turn off at steady state, but the sink capability is limited at start-up. • Need a fast time constant (LM//RGS * CC) to avoid flux walking due to the fast transient.• Watch out the ringing between CC and drive transformer at skip mode or UVLO, a diode is

needed to damp the ringing.

DRV

CCRC

+ -VC

Dead time generatorDriver

C

M

C

MC C

LCL

QR 21

=≥

DRVC DVV =VDRV - VC

- VC

RGS

CC to reset the driver transformer and RC to damp the L-C resonance.

5.01=>

C

M

C CL

RQ

Single DRV Input with DC Restore

• VGS amplitude is independent on duty ratio at steady state.

• Limited sink capability.

DRV

CC1RC

+ -VC

Dead time generatorDriver

C

MC C

LR 2≥

DRVC DVV =

VDRV - Vf

- Vf

RGS

CC2

+-VC-Vf

Single DRV Input with PNP Turn-Off

• A pnp transistor + diode help to improve the switching off.

DRV

Dead time generator Driver

Don’t Forget the AND Gate

• Add the totem-pole drivers if output capability of AND gate is limited.• Is the design finished?

No, not yet. Pay attention to the ringing among CC1, CC2 and driver transformer when skip or UVLO. A diode and resistor to damp the ringing.

DRV

Dead time generator High-side Driver

CC1 CC2

Dual Polarity Symmetrical DRV Inputs

• DRVA and DRVB are opposite-polarity and symmetrical no ac coupling capacitor.• This is suitable for push-pull type circuit, e.g. LLC-HB, but NOT for asymmetrical type, e.g.

AHB or active clamp. • Pay attention to the flux of driver transformer at line/load transient.• The strong turn off capability is still needed. • Pay attention to the delay caused by the leakage inductance. minimize the leakage

inductance and use dual output windings instead of single output winding.• Extra losses caused by voltage drop on Roff.

DRVB

DriverVDRV

- VDRV

DRVA

VDRV

- Vf

Roff

Roff

The Driver Transformer• Pros

– A transformer is more robust than a die!– Less sensitivity to spurious noise and high dV/dt pulses– Cheap?

• Cons– Complicated circuits– Pay attention on extreme line/line condition & off mode ……– Pay attention on the leakage inductance and isolation– Is the sink capability strong enough?

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

IN Dead Time

Vcc

Gnd

in out

Vcc

Gnd

in out

M1

M2

VBoot

Vcc

Vbulk

DRV_HI

DRV_LO

GND

GND_HI

Silicon Half Bridge Driver PrincipleIntegrated HB driver LLC converter

IN_HIVcc

Gnd

in out

Vcc

Gnd

in out

M1

M2

VBoot

Vcc

Vbulk

DRV_HI

DRV_LO

C1GND

GND_HI

IN_LO

• Principle– Single or dual inputs– High & low side driver

Single Input

Dual Inputs

Integrated HB driver

Silicon Solution, What are its Limits?

• High-side isolation – 600 V is reached within the silicon.

• Matched propagation delay between high and low side

drive – Prevents any unbalanced transformer usage.

• High side driver supply – Bootstrap supply is requested.

• Noise immunity – Negative voltage robustness of the high side driver.

Silicon Solution, High Voltage Isolation

IN_HIVcc

Gnd

in out

Vcc

Gnd

in out

M1

M2

VBoot

Vcc

Vbulk

DRV_HI

DRV_LO

GND

GND_HI

SR

QLevel Shifter

PulseTrigger

IN_LO

Floating area

• Pulse trigger: generates pulse on each edge from IN_HI input.

• Level shifter: shifts pulses from GND reference to GND_HI reference.

• SR flip flop: latches pulses information from the level shifter.

Level shifter sustains up to

600 V

IN_HIVcc

Gnd

in out

Vcc

Gnd

in out

M1

M2

VBoot

Vcc

Vbulk

DRV_HI

DRV_LO

GND

GND_HI

SR

QLevel Shifter

PulseTrigger

IN_LO Delay

Silicon Solution, Matched Propagation Delay

Delay compensation

• Delay is inserted on the fastest path: Low side driver pathto compensate: Pulse trigger + level shifter and SR flip-flop delays.

Vcc

Gnd

in out

Vcc

Gnd

in out

M1

M2

Vbulk

DRV_HI

DRV_LO

GND

Bridge

Vboot

Cboot

DbootRbootVcc

VccVcc

CVcc

Silicon Solution, High Side Driver Supply

• Bootstrap technique is used for supplying the high side driver

Bootstrap connected to VccBootstrap Step:• Step 1: M2 is closed Cboot is

grounded: Cboot is refueled via Vcc.

• Step 2: M1 & M2 are opened Bridge pin is floating, Dboot is blocked & Cboot supplies floating area.

• Step 3: M1 is closed bridge pin moved to bulk level, Dboot is still blocked & Cboot supplies floating area.

Root of High Side Driver Negative Voltage? • Let’s focus on the half-bridge branch:

– the load connected to a half-bridge branch is inductive:– like an LLC-HB– Or with the most simple case in a synchronous buck (where body

diodes of the mosfet are represented).

LLC-HB

M1

M2

Vbulk

Dbody1

Dbody2

Vbulk

Theory: Buck Converter Operation • 1st step of the buck converter:

Step 1:M1 ONM2 OFF

VBridgeTime

Time

VBridge

Step: 1

VBulk

M1 ON

M2 OFF

IL

IL

Vbulk

Theory: Buck Converter Operation• 2nd step of the buck converter:

Step 2:M1 OFFM2 OFF

VBridgeTime

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 OFF

IL

IL

Vbulk

Theory: Buck Converter Operation• 3rd step of the buck converter:

Step 3:M1 OFFM2 ON

VBridgeTime

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 ON

3

IL

IL

Vbulk

Theory: Buck Converter Operation• 4th step of the buck converter:

Step 4:M1 OFFM2 OFF

VBridgeTime

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 OFF

3 4 1

IL

IL

Bench: Buck Converter Operation• Anywhere but in a ppt file there are parasitic elements:

– True buck converter:

M1

M2

Vbulk

Dbody1

Dbody2

Parasiticinductances

ParasiticCapacitors

Vbulk

Bench: Buck Converter Operation• 1st step of the buck converter:

Step 1:M1 ONM2 OFF

VBridgeTime

Time

VBridge

Step: 1

VBulk

M1 ON

M2 OFF

IL

IL

Vbulk

Bench: Buck Converter Operation• 2nd step of the buck converter:

Step 2:M1 OFFM2 OFF

IL

VBridge

IL

Time

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 OFF

Time

1.453000ms 1.453200ms 1.453400ms1.452846msV(BRIDGE)

0V

20.0V

-10.0V

31.8V

Bench: Buck Converter Operation• 3rd step of the buck converter:

Step 3:M1 OFFM2 ON

VBridgeTime

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 ON

3

IL

IL

Vbulk

Vbulk

Bench: Buck Converter Operation• 4th step of the buck converter:

Step 4:M1 OFFM2 OFF

VBridgeTime

Time

VBridge

Step: 1

VBulk

-Vf

2

M1 OFF

M2 OFF

3 4 1

IL

IL

Bench: Buck Converter Operation• Negative voltage on bridge pin will create negative current

injection inside the IC driver.

IN_HI

Vcc

Gnd

in out

M1

M2

VBoot

Vcc

Vbulk

DRV_HI

DRV_LO

GND

Bridge

SR

QLevel Shifter

PulseTrigger

IN_LO Delay

Vcc

Gnd

in out VBridge

Floating area

Leaky path when VBridge < 0VThis leakage path could create some trouble inside the driver IC.

How to Characterize the Negative Voltage?

Time

VBridge

VBulk

-Vf

Time

VBridge

Width

Principle:

Negative pulse is added on bridge pin:

With adjustable Negative voltage

And adjustable Width

Vneg

At each pulse width the neg. voltage is increased until the driver IC fails.

How the Negative Voltage has Been Created?

L1

100uHIN_LO

IN_HI

C710uF25V

C19100nF

C3220uF50V

D13D1N4148

Rload10R

0Pulse gen.

0

VCC

D14D1N4148

TX1

BZX84C18D5

BZX84C18D6

C13

100n

Q4FDP3682

Q5FDP3682

Q6FDP3682

VCC

Vout

BZX84C18D7R10

47k

0

C4330uF100V

C12100nF

Rload110R

VDC_IN20V

D11D1N4148

U1NCP5106A

VCC1

IN_HI2

IN_LO3

GND4

DRV_LO5

BRIDGE6

DRV_HI7

VBOOT8

0

0R11R

R2

10RQ1Q2N2907

R3

10R

Q2Q2N2907

Vneg

0Vdc to 50V

D4

MBR1100

R4

10R C11100n

U5MC33152

1 2

Sync

R847k

R947k

Synchronous Buck

Converter

Negative pulse generation

IC Driver

Adj. VNeg

Adj. pulse width

Example of Negative Voltage MeasurementVG_LO

(10 V/div)

VG_HI

(10 V/div)

Vbridge pin

(20 V/div)

Time

(80 ns/div)Width = 150 ns

Vneg = -18 V

When the bridge pin is released, it generates some noise on the hi-

side driver.

Note: Negative voltage pulse is applied when the bridge pin voltage is reaching zero.

Negative Voltage versus Neg. pulse duration @ +25°C

-35

-30

-25

-20

-15

-10

-5

00 100 200 300 400 500 600

Negative pulse duration (ns)

Nega

tive

puls

e vo

ltage

(V

)

Negative Voltage Characterization

If the negative pulse is inside this area, the driver will not work properly or can be damaged.

If the negative pulse is inside this area, the driver will work properly.

Negative Voltage Characterization in Temperature

Negative Voltage versus Neg. pulse duration @ different Temp

-35

-30-25

-20

-15

-10-5

00 100 200 300 400 500 600

Negative pulse duration (ns)

Nega

tive

puls

e vo

ltage

(V

)

-40°C25°C125°C

• Note: These characterizations will be available in each IC driver datasheet

Driver IC Remarks• ON Semiconductor defines electrical parameters on overall

temperature range (here -40℃ < Tj < +125 ℃). See electrical table & characterization curves.

• Competitors define the electrical parameters only at Tamb = +25℃. Temp characterization is not always available

what about min & max over extended temperature range?

• The competitors values extracted from the curves probably do not take into account the lot to lot process variations

the range variation is probably wider.

ON Semiconductor IC Driver Cross Reference

•3.3 V CMOS/TTL input•Internal fixed dead time 650 ns•One pin for creepage

IR2111 –IRS2111, NA30 ns / 60 ns

750 ns / 100 ns

85 ns /35 ns

NCP5111

•3.3 V CMOS/TTL input•Internal fixed dead time 520 nsIR2104 –

IRS2104NA10 ns /45 ns620 ns /100 ns

85 ns /35 ns

NCP5104

•3.3 V CMOS/TTL inputs•Internal fixed dead time 100 ns

IR2304 -IRS2304, L6388/84FAN7380

20 ns / 35 ns100 ns / 100 ns

85 ns /35 ns

NCP5304

•3.3 V CMOS/TTL inputs•Internal fixed dead time 100 ns

IR2106 –IRS2106,FAN7382

20 ns / 35 ns100 ns / 100 ns

85 ns /35 ns

NCP5106B

•3.3 V CMOS/TTL inputsIR2106 –IRS2106,FAN7382

-20 ns / 35 ns100 ns / 100 ns

85 ns /35 ns

NCP5106A

•3.3 V CMOS/TTL inputsIR2181 –IRS2181-20 ns / 35 ns

100 ns / 100 ns

40 ns / 20 ns

NCP5181

RemarksPin-Out

Compati-bility

Cross Conduction Protection

Matching Delay

Typ / Max

Propag.Delay typ.tON / tOFF

Drive trise / tfall typ.

(CL=1 nF)

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

3 26

L1

5

4

8

T1XFMR

C1

C3a1mF

7

C8100p

R1410k

15R15

D41N4148

17

28

M1IRFB11N50A

24

M2IRFB11N50A

40

16U2TL431

13

R610k

out

R786k

R810k

C5470p

L34.7uH

C2680uFPart number = EEUFC1V681

int out

int

10

R122k

C410n

R222k

18

C6470p

R322k

C7 C10

+400 V

0 V

R547k

R947k

45

11

2

30 12

42 14

41

19

23

1

2

3

4

5

8

6

7

9

10

11

12

13

14

15

1629

37

38

39

6

1

31

NCP1395A

timer

BO

analog ground

C15100n

C1822u

R16

R24 250k

75k

R11 160k

C19 10u

R12 150k

C20 10u

R19 5.2k

10nC14

C13

U5ASFH615-A

C1110n

R224.7k

R251.8Meg

100n

540

R2310k

U5BSFH615-A

Vcc

InA

InB

Gnd

OutA

OutB

VB

Gnd

C3b1mF

C3c1mFPart number = EEUFC1V102

Irms=5 A24 V / 10 AP = 4W

22nFPart number = PHE450MB5220JR06

C1

0.47uFPart number = PHE450MF6470JR06L2C7

100uFPart number = 2222-05737101C10Snap-in BC Comp. 450 V

EVOX RIFA 630 V

EVOX RIFA 630 V

D3mbr1645

D6mbr1645

D11mbr1645

D12mbr1645

Heatsink 18°C/WKL112-25

L1PCV-0-274-04220u

1 kV

PCV-0-472-20L

ETD44ET4415A

KL195/25,4SW

KL195/25,4SW

R3233k

R335.6k

FF

FF

20

21

25

22

T2Q3903-A

D151n5818

D171n5818

..

Vcc

D51n5818

D71n5818

R171k

R181k

27

D101N4148

R2010

32R211k

33

R41k

34

D81N4148 R10

10

.

Vcc

C1610u

C170.1u

R30

47k

R2947k

1

6

2

5

3

4

Q12N2222

Q52N2907

Q22N2222

Q62N2907

Q102N2907

Q112N2907

LLC-HB Schematic with Driver Transformer

• LLC-HB with 24 V @ 10 A• NCP1395, the LLC controller with dual DRV outputs.• Transformer drivers the MOSFETs of LLC converter.

Driver Transformer

LLC controller

NCP1395

3 26

L1

5

4

8

T1XFMR

C1

C3a1mF

7

C8100p

R1410k

15R15

D41N4148

17

28

M1IRFB11N50A

24

M2IRFB11N50A

40

16U2TL431

13

R610k

out

R786k

R810k

C5470p

L34.7uH

C2680uFPart number = EEUFC1V681

int out

int

10

R122k

C410n

R222k

18

C6470p

R322k

C7 C10

+400 V

0 V

R547k

R947k

45

11

2

30 12

42 14

41 35

23

1

2

3

4

5

8

6

7

9

10

11

12

13

14

15

1629

37

38

39

6

1

31

NCP1395A

timer

BO

analog ground

C15100n

C1822u

R16

R24 250k

75k

R11 160k

C19 10u

R12 150k

C20 10u

R19 5.2k

10nC14

C13

U5ASFH615-A

C1110n

R224.7k

R251.8Meg

100n

540

R2310k

U5BSFH615-A

Vcc

InA

InB

Gnd

OutA

OutB

VB

Gnd

C3b1mF

C3c1mFPart number = EEUFC1V102

Irms=5 A24 V / 10 AP = 4W

22nFPart number = PHE450MB5220JR06

C1

0.47uFPart number = PHE450MF6470JR06L2C7

100uFPart number = 2222-05737101C10Snap-in BC Comp. 450 V

EVOX RIFA 630 V

EVOX RIFA 630 V

D3mbr1645

D6mbr1645

D11mbr1645

D12mbr1645

Heatsink 18°C/WKL112-25

L1PCV-0-274-04220u

1 kV

PCV-0-472-20L

ETD44ET4415A

KL195/25,4SW

KL195/25,4SW

R3233k

R335.6k

FF

FF

1

2

3

4 5

8

6

7

51

44

36

U1NCP5181

25

D11N4937

R1310

C9100nF

R2610

R2710

C12100n

D21N4148

D91N4148

R2847k

R3147k

LLC-HB Schematic with Driver IC

• LLC-HB with 24 V @ 10 A• NCP1395, the LLC controller with dual DRV outputs.• NCP5181, driver IC drives the MOSFETs of LLC converter.

LLC controller

NCP1395

Driver IC

NCP5181

VGS Waveform

• The waveforms seem similar.

Driver transformer Driver IC (NCP5181)

VGS_ML

(5 V/div)

VGS_MU

(5 V/div)IMU(2 A/div)

VDS_ML

(100 V/div)

2 µs / div

High Side MOSFET Turns Off

• The driver IC turns off the MOSFETs more vigorously.• IC turn-off is 70 ns faster, lowering the switching losses

Turn-off comparison

80 ns / div

Driver transformer Driver IC (NCP5181)

VGS_ML

(5 V/div)

VGS_MU

(5 V/div)IMU(2 A/div)

VDS_ML

(100 V/div)

High side MOSFET Turns On

• The driver IC keeps safe and enough dead time between high and low side MOSFETs.

200 ns / divTurn-on

comparison

Driver transformer Driver IC (NCP5181)

VGS_ML

(5 V/div)

VGS_MU

(5 V/div)IMU(2 A/div)

VDS_ML

(100 V/div)

The Efficiency Comparison

• There is no efficiency difference between the IC driver and transformer solutions.

Input power (W)

Output power (W)

Vout(V)

Iout(A) η

128.33 119.72 23.96 5.00 93.29%257.2 235.46 23.57 9.99 91.55%

128.34 119.72 23.96 5.00 93.29%258.5 236.46 23.67 9.99 91.48%

Driver Transformer

Driver IC

Agenda• Topologies using a half-bridge configuration

• The difference between soft and hard-switching

• The gate-drive transformer

• The all-silicon-solution

• Comparison

• Conclusions

Conclusion: Transformer or IC?• Both solutions work if well-trimmed.

• We recommend the IC solution because:

– We don’t sell the transformer.

– Manual insertion for the transformer.

– Ease the layout

– Ease the design

– Free of transformer problems, e.g.:• isolation is destroyed,• flux walking away,• unexpected ringing after turn off,• Height of the transformer in low profile PSU

For More Information

• View the extensive portfolio of power management products from ON Semiconductor at www.onsemi.com

• View reference designs, design notes, and other material supporting the design of highly efficient power supplies at www.onsemi.com/powersupplies