handling and soldering recommendation gps-ms1e receiver application note (gps g1-x-01021)

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u-blox agZuercherstrasse68 CH-8800ThalwilSwitzerlandPhone+4117227444 Fax+4117227447www.u-blox.com HANDLING AND SOLDERING RECOMMENDATION GPS-MS1E Receiver APPLICATION NOTE Abstract Thisapplicationnotedescribestherecommendationsfortheprocessingandhandlingofthe GPS-MS1Ereceiver.Readersareadvisedthattheresponsibilityovertheactualmanufacturing processandprocessqualitycontrolliesattheircontractedelectronicmanufacturer.

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Page 1: HANDLING AND SOLDERING RECOMMENDATION GPS-MS1E Receiver APPLICATION NOTE (GPS G1-X-01021)

��

u-blox ag�•�Zuercherstrasse�68�• CH-8800�Thalwil�• Switzerland�•�Phone�+41�1�722�74�44 •�Fax�+41�1�722�74�47�•�www.u-blox.com�

HANDLING AND SOLDERING

RECOMMENDATION

GPS-MS1E Receiver

APPLICATION NOTE

Abstract

This�application�note�describes�the�recommendations�for�the�processing�and�handling�of�the�GPS-MS1E�receiver.�Readers�are�advised�that�the�responsibility�over�the�actual�manufacturing�process�and�process�quality�control�lies�at�their�contracted�electronic�manufacturer.�

Page 2: HANDLING AND SOLDERING RECOMMENDATION GPS-MS1E Receiver APPLICATION NOTE (GPS G1-X-01021)

Handling�Recommendation�for�GPS-MS1E�Receiver�-�Application�Note� u-blox�ag�

GPS.G1-X-01021� � Page�2�

Title Handling Recommendation for GPS-MS1E Receiver

Doc Type APPLICATION�NOTE� �

Doc Id GPS.G1-X-01021�

Author : Guido�Hollenstein�

Date : 19/11/2001�

For�most�recent�documents,�please�visit�www.u-blox.com�

We�reserve�all�rights�in�this�document�and�in�the�information�contained�therein.�Reproduction,�use�or�disclosure�to�third�parties�without�express�authority�is�strictly�forbidden.�

�������������������������������������

All�trademarks�mentioned�in�this�document�are�property�of�their�respective�owners.�

Copyright�©�2001,�u-blox�ag�

��THIS�DOCUMENT�CONTAINS�INFORMATION�ON�U-blox�PRODUCTS�IN�THE�SAMPLING�AND�INITIAL�PRODUCTION�PHASES�OF�DEVELOPMENT.�THE�SPECIFICATIONS�IN�THIS�DOCUMENT�ARE�SUBJECT�TO�CHANGE�AT�u-blox'�DISCRETION.�u-blox�ASSUMES�NO�RESPONSIBILITY�FOR�ANY�CLAIMS�OR�DAMAGES�ARISING�OUT�OF�THE�USE�OF�

THIS�DOCUMENT,�OR�FROM�THE�USE�OF�MODULES�BASED�ON�THIS�DOCUMENT,�INCLUDING�BUT�NOT�LIMITED�TO�CLAIMS�OR�DAMAGES�BASED�ON�INFRINGEMENT�OF�

PATENTS,� COPYRIGHTS� OR� OTHER� INTELLECTUAL� PROPERTY� RIGHTS.� u-blox� MAKES� NO� WARRANTIES,� EITHER� EXPRESSED� OR� IMPLIED� WITH� RESPECT� TO� THE�

INFORMATION�AND�SPECIFICATIONS�CONTAINED�IN�THIS�DOCUMENT.�PERFORMANCE�CHARACTERISTICS�LISTED�IN�THIS�DOCUMENT�ARE�ESTIMATES�ONLY�AND�DO�NOT�

CONSTITUTE�A�WARRANTY�OR�GUARANTEE�OF�PRODUCT�PERFORMANCE.�

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GPS.G1-X-01021� � Page�3�

Contents�

1 General information.....................................................................................................4

1.1 SSMT�Connector ............................................................................................................................. 4

1.2 RF-Input�Handling ........................................................................................................................... 4

1.3 Grounding�Metal�Covers ................................................................................................................. 4

1.4 Module�Removal ............................................................................................................................. 4

2 Processing .....................................................................................................................5

2.1 Reflow�profile ................................................................................................................................. 5

2.2 Solder�paste�&�sensor�positions ........................................................................................................ 5

2.3 Reflow�Soldering............................................................................................................................. 5

2.4 Overheating.................................................................................................................................... 6

2.5 Module�Cleaning ............................................................................................................................ 6

2.6 Repeated�Reflow�Soldering .............................................................................................................. 6

2.7 Hand�Soldering ............................................................................................................................... 6

3 MSD Handling Instructions..........................................................................................7

3.1 Standard�Handling .......................................................................................................................... 7

3.2 Manual�Tempering�Guideline ........................................................................................................... 8

A Recommended Reflow Profile.....................................................................................9

B Hand Soldering Of Modules ......................................................................................10

C Examples Of Pictures Indicating Defects ..................................................................11

D Contact .......................................................................................................................13

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GPS.G1-X-01021� � Page�4�

1 GENERAL INFORMATION

The�GPS-MS1E�receiver�is�designed�and�packaged�to�be�processed�in�an�automatic�assembly�line.�However�due�to�the�fact�that�the�GPS-MS1E�is�a�specially�packaged�subsystem,�there�are�some�requirements�that�differ�from�the�handling�of�single�packaged�parts.�

This�document�describes�a�recommendation�regarding�the�soldering�and�handling�process�in�the�startup�phase�of�a�project�with�GPS-MS1E.�Of�course�also�special�conditions�and�equipment�at�the�customers�site�should�be�considered.�u-blox�and�Tyco�is�able�to�support�customers�who�have�problems�regarding�reflow�and�soldering�process,�which�we�are�willing�to�do.�

1.1 SSMT Connector

The�antenna�plug�may�be�put�in�only�with�the�prescribed�strength�

(Typ. 5.5lbs ⇒ 2.4Kg ⇒ 24.5N).�Where�possible�we�recommend�the�use�of�the�designated�engagement/disengagement�tool�of�Tyco.�

See�article�no.�0-1221286-1�on�the�web�page:�

http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15535&P=&M=PROP&N=1&LG=1&I=13&G=G�

The�datasheet�for�the�SSMT�connector�is�available�at:�

http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15475&F=0&M=CINF&N=3&LG=1&I=13��

1.2 RF-Input Handling

If�a�short-circuit�on�the�RF-connector�to�GND�occurs�then�it�will�damage�the�receiver�permanently.�Our�module�is�not�protected�against�such�a�short-circuit�between�the�interior�conductor�and�GND�(see�data�sheet).�Therefore�we�recommend�that�the�handling�process�be�such�that�this�possibility�does�not�occur.�

1.3 Grounding Metal Covers

Reworking�the�module,�also�making�soldered�connections�on�the�metal�covers,�J-Leads�or�own�repair�attempts�should�not�be�attempted.�Serious�mechanical�loads�can�occur,�which�can�lead�to�the�destruction�of�the�modules.�Also�soldering�on�the�antenna�connector�must�be�omitted�to�alleviate�any�mechanical�load�on�the�connector.�

1.4 Module Removal

The�removal�of�GPS�modules�by�the�customer�should�be�avoided,�so�that�more�reliable�predictions�of�the�effective�fault�can�be�made.�Due�to�this,�the�customer�should�return�the�whole�unit�to�u-blox�and�should�not�remove�the�GPS�module.�If�this�is�not�possible�we�recommend�using�our�solder�off�process�documentation�to�remove�a�module.�

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GPS.G1-X-01021� � Page�5�

2 PROCESSING

2.1 Reflow profile

According�to�Tyco�the�reflow�profile�is�extremely�important�to�use�at�set-up�time.�Of�course�it�depends�on�the�customer’s�board�and�the�reflow�oven�how�closely�the�recommended�profile�matches�the�actual�achieved�profile.��Here�the�danger�exists�that�due�to�the�resultant�mechanical�stress,�the�Micro-VIA’s,�IC�bonds�or�GlobTop�can�be�damaged.�The�temperature�gradient�for�preheating�when�soldering�the�GPS�modules�must not be higher than 2°C/sec.�Also�IR�supporting�ovens�should�not�be�used,�we�recommend�a�pure�reflow�convection�oven.��⇒ See appendix A Recommended Reflow Profile

2.2 Solder paste & sensor positions

The�recommendation�is�to�use�‘no�clean’�solder�paste�during�the�assembly�of�the�modules:�Ecorel 802;�This�‘no�clean’�solder�paste�has�been�used�with�the�qualification�samples.�To�check�the�reflow�profile�the�following�measurement�points�must�be�used�on�the�module:�

� �Link�to�the�recommended�‘no�clean’�solder�paste:�

http://www.promosol.com/english/cremes01a.html�

2.3 Reflow Soldering

As�far�as�possible�any�hand�soldering�process�should�be�avoided�since�this�process�is�not�controlled�or�reproducible�and�can�result�in�damage�to�the�modules�delicate�internal�circuitry.�If�necessary�warm�air�supporting�tools�must�be�used,�in�order�to�achieve�reproducibility.�

A convection type soldering oven is strongly recommended�over�the�infrared�type�radiation�oven.��Convection�heated�ovens�allow�precise�control�of�the�temperature�and�all�parts�will�heated�up�evenly,�regardless�of�material�properties,�thickness�of�components�and�surface�color.�

Preheat�Phase:�

Initial�heating�of�component�leads�and�balls.��Residual�humidity�will�be�dried�out.��Please�note�that�this�preheat�phase�will�not�replace�prior�baking�procedures.�

� Temperature�rise�time:�1�-�2°C/s�

� Reach�90�-�110°C�

Activation�Phase:�

The�solder�paste�dries�out�and�the�flux�activates.��The�activation�phase�is�normally�dependent�on�your�chosen�soldering�paste�and�is�therefore�subject�to�variations.�

� Ramp�up�from�90-110°C�range�up�to�150-175°C�range�

� Limit�to�110�seconds�(known�as�wetting�time)�

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Reflow�Phase:�

The�temperature�rises�above�the�liquidus�temperature�of�180°C.�

� Limit�time�above�180°C�liquidus�temperature:�35�-�50s�

� Peak�reflow�temperature:�max.�220°C�(±�10°C)�

Cooling�Phase:�

A�controlled�cooling�avoids�negative�metallurgical�effects�(solder�becomes�more�brittle)�of�the�solder�and�possible�mechanical�tensions�in�the�products.��Controlled�cooling�helps�to�achieve�bright�solder�fillets�with�a�good�shape�and�low�contact�angle.�

� Temperature�fall�time:�max�4°C�/�s��

Caution:

To�avoid�falling�off,�the�GPS-MS1E�receiver�shall�be�placed�on�the�topside�of�the�motherboard�during�soldering.�

The�final�soldering�temperature�chosen�at�the�factory�depends�on�additional�external�factors�like�choice�of�soldering�paste,�size,�thickness�and�properties�of�the�base�board,�etc.��Exceeding�the�maximum�soldering�temperature�in�the�recommended�soldering�profile�may�permanently�damage�the�macro-component.�

2.4 Overheating

Care�should�be�used�to�ensure�that�no�overheating�of�the�module�can�occur. �That�means�an�overheating�of�the�modules�and�also�a�too�fast�rise�time�when�soldering�should�not�occur.�Our�recommended�reflow�profile�should�be�used�for�set-up�a�solder�process.�

2.5 Module Cleaning

Any�cleaning�of�modules�with�the�Ultrasonic�bath�or�solvents�is�prohibited.�Use�of�Ultrasonic�bath�cleaning�will�damage�the�32�kHz�RTC�quartz.�Also�the�handling�of�modules�does�not�allow�dipping�into�varnish�etc.�under�these�circumstances�the�warranty�would�be�void.�

2.6 Repeated Reflow Soldering

Only�a�single�reflow�soldering�process�is�encouraged�for�boards�with�a�GPS-MS1E�module�on�it.�

2.7 Hand Soldering

A�hand�soldering�process�in�any�form�is�not�recommended�for�our�modules.�Nevertheless,�if�it’s�necessary�to�hand�solder,�then�our�appropriate�documentation�should�be�taken�for�assistance.�

⇒ See appendix B Hand Soldering Of Module

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GPS.G1-X-01021� � Page�7�

3 MSD HANDLING INSTRUCTIONS

The�GPS-MS1E�receiver�is�a�moisture�sensitive�device�(MSD)�and�must�be�handled�by�the�following�handling�instructions.�

3.1 Standard Handling

For�standard�shipping,�the�modules�will�be�delivered�in�a�moisture�sensitive�package.�The�bags�will�have�a�shipping�slip�as�follows:�

CAUTION

This�bag�contains�

MOISTURE-SENSITIVE�DEVICES�

1.� Calculated�shelf�life�in�sealed�bag:�12�months�at�<40°C�and�<90%�relative�humidity�(RH).�

2.� Peak�package�body�temperature:�_____�°C�[If�blank�(220°C)�]�

3.� After�bag�is�opened,�devices�that�will�be�subjected�to�reflow�solder,�or�other�high�temperature�process�must�be:�a)�Mounted�within�_____�hours�of�factory�conditions�<30°C�/�60%RH,�or�b)�Stored�at�10%RH.�

4.� Devices�require�baking,�before�mounting,�if:�

a)�Humidity�indicator�card�is�>10%�when�read�at�23°C�±5°C,�or�b)�3a�or�3b�is�not�met.�

5.� If�baking�is�required,�devices�may�be�baked�for�48�hours�at�125°C�±5°C�

Note:�If�device�containers�cannot�be�subjected�to�high�temperature�or�shorter�bake�times�are�desired:�Reference�IPC/JEDEC�J-STD-033�for�bake�procedure�

Bag�seal�date:�______________________�Sign:�_________________________�

Note:�LEVEL�and�body�temperature�defined�by�IPC/JEDEC�J-STD-020�

5

LEVEL

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GPS.G1-X-01021� � Page�8�

3.2 Manual Tempering Guideline

Since�the�receiver(s)�in�this�package�could�not�be�packed�into�one�of�our�standard�package�types,�we�strongly�recommend�you�to�observe�the�recommendations,�based�on�IPC/JEDEC�J-STD-033�Level�5�below:�

1. If the receiver is exposed to a reflow or vapor phase soldering process, the receiver should be pre-baked at 125°C +5°C /-0°C for at least 48 hours prior to soldering. In order to prevent thermal shock, the receiver should be inserted into a cold oven (<80°C). After pre-baking for 48 hours, the oven needs to be shut down but the receivers should not be taken out before the temperature has dropped to approx. 40°C. Attention: Do not bake the modules in the tray as the tray will melt. Place the modules on a big PCB base board in upright position before baking them. See photographs below:

2. For hand soldering, no humidity treatment like pre-baking is necessary.

Please note: The recommendations above do not apply to GPS-MS1E receivers shipped in one of our standard package types.

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GPS.G1-X-01021� � Page�9�

A RECOMMENDED REFLOW PROFILE

Reflow Profile

Solderpaste L-Sn62Pb36Ag2 Liquidustemperature 180°C Type: Ecorel 802

0

50

100

150

200

250

0 50 100 150 200 250 300 350 400

Time in Sec

Te

mp

era

ture

in

°C

Preheat�Phase� Activation�Phase� Reflow�Phase� Cooling�Phase�

Liquidus�Temperature�180°�

Peak�Temperature�210-230°�

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GPS.G1-X-01021� � Page�10�

B HAND SOLDERING OF MODULES

Hot�bar,�thickness�max.1mm�� Solder�Iron:�50W� Adcola�Soldering�Station���

GPS-MS1E�in�housing��

�Desoldering

The�temperature�of�the�soldering�iron�(hot�bar)�has�to�be�set�to�a,�value,�which�allows�the�desoldering�to�be�finished�within�10�seconds.�If�feasible,�the�procedure�can�be�supported�with�hot�air�(max.�70°C)�from�the�underside�of�the�motherboard.��

1.� The�solder�iron�(hot�bar)�is�gently�pressed�against�the�J-leads�and�the�motherboard.�The�receiver�must�not�be�removed�before�all�J-leads�are�loose.�

2.� The�solder�iron�should�be�withdrawn.�At�the�same�time,�the�receiver�needs�to�be�carefully�lifted�until�the�tin�is�solidified.�

3.� Step�2�and�3�need�to�be�repeated�on�the�other�side�of�the�GPS-MS1E�

This�procedure�(even�when�applied�to�both�sides�simultaneously)�limits�the�thermal�stress�for�the�GPS-MS1E�and�the�motherboard�as�much�as�possible.�

Please note, the procedure described above is only a recommendation. It needs to be qualified by the

each manufacturer for its equipment.

Thermal Flow

Soldering�

The�temperature�of�the�soldering�iron�(hot�bar)�has�to�be�set�to�a�value,�which�allows�the�soldering�of�a�J-lead�to�be�finished�within�3�to�6�seconds.��

Tin:�L-Sn60Pb,���F-SW32,��1.5�DIN,��d=1.5mm�

1.� The�pads�need�to�be�cleaned.�

2.� The�GPS-MS1E�is�placed�and�fixed�by�soldering�two�J-leads�(i.e.�pins�1�&�22�or�21�&�42)�

3.� The�remaining�J-leads�are�soldered�one�by�one.�

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GPS.G1-X-01021� � Page�11�

C EXAMPLES OF PICTURES INDICATING DEFECTS

Short-circuit�at�the�antenna�plug�

Component�resoldered�

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GPS.G1-X-01021� � Page�12�

Components�shifted�

Pin�broken�off�

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GPS.G1-X-01021� � Page�13�

D CONTACT

For�further�info,�please�contact�us:�

Headquarters Subsidiaries

u-blox ag�Zuercherstrasse�68�CH-8800�Thalwil�Switzerland�

Phone:� +41�1�722�74�44�Fax:� +41�1�722�74�47�E-mail:� [email protected]�www.u-blox.com�

u-blox Deutschland Gmbh�Berliner�Ring�89�D-64625�Bensheim�Germany�

Phone:� +49�(0)�6251�17566-0�Fax:� +49�(0)�6251�17566-11E-mail:� [email protected]�www.u-blox.de�

Tech. Support:

Phone:�+41�1�722�74�74�[email protected]

u-blox Asia Pacific Ltd.�22/F.,�City�Landmark�I��68�Chung�On�Street�Tsuen�Wan,�Hong�Kong�

Phone:� +852-2941-8877�Fax:� +852-2615-2285��������E-mail:� [email protected]�www.u-blox.com�

Tech. Support:

Phone:�+41�1�722�74�74�[email protected]

� u-blox Europe Ltd.�Barham�Court�Maidstone,�Kent�ME18�5BZ�United�Kingdom�

Phone:� +44�1622�618628�Fax:� +44�1622�618629�E-mail:� [email protected]�www.u-blox.co.uk�

Tech. Support:

Phone:�+44�1622�618628�[email protected]

u-blox America, Inc.�13800�Coppermine�Road�Herndon,�VA�20171�USA�

Phone:� +1�(703)�234�5290�Fax:� +1�(703)�234�5770�����E-mail:� [email protected]�www.u-blox.com�

Tech. Support:

Phone:�+41�1�722�74�74�[email protected]