hanking mumps chinano 2015 for publication
TRANSCRIPT
Hanking MUMPS‐ What is it and what will it become?
罕王MUMPS‐它是什么、它将成为什么?
Dr. Douglas SparksExecutive Vice PresidentHanking Electronics Ltd
Hanking Group’s Business Units
• Iron, Nickel & Gold Mining• Cast Iron & Steel Processing• Bearings• Retail Outlets• Investments• Electronics• 7000 employees
罕王集团商业板块
Location of Hanking Group’s Business Units
Hanking is an expanding, private company,headquartered in Shenyang, China
罕王集团全球布局
Why is Hanking Interested in MEMS?
Yole
为什么罕王对MEMS感兴趣
The MEMS Ecosystem
Wafers
Chemicals
Equipment
Support
Education
Fabs
People
Design
SoftwareASICs
MEMS生态环境
What Does it take to Launch MEMS Products?
Its more than just a wafer fab…
Unique Packaging (combo packages, fluid interfaces), Test, Calibration, Design, ASICs, Embedded Software
High volume MEMS manufacturing started in the 1980’s in the automotive industry in the USA, Europe and Japan:
Pressure sensors 1980’s which spread to medical blood pressureAccelerometers and Ink Jet Printers 1990’sGyros, Microphones 2000’s – consumer became the largest MEMS market
生产MEMS产品需要什么?
What is Hanking MUMPS?
Hanking MUMPS in China
MUMPS (Multiple User MEMS Process ) is a low cost method of getting new MEMS designs fabricated, which is needed in China. SOI, AlN-Piezoelectric and low stress poly processes and design rules are available.
The low price makes it ideal for Universities and start ups
罕王MUMPS在中国
SOI MUMPS
Si
Silicon
Silicon Substrate
SOIMUMPs10 or 25um structure layerDouble‐side pattern/etch2 Metal layers
Proven Design Rules & Process Steps
Piezo MUMPS‐ Piezoelectric ResonatorsAluminum Nitride (AlN)‐SOI
AlN
PIEZO MUMPs5 Mask LevelsAlN Layer 0.5um10 SOI um structure layer2 Metal layers
Si
Poly‐Si MUMPS
PolyMUMPs8 lithography levels, 7 physical layers3 Poly Layers1 Metal Layer Anti‐Stiction design features
Metal Plated MUMPS
12
Plated Nickel
Silicon Substrate
MetalMUMPs10 lithography layersThick electroplated Ni (18‐22um)
Switches, Inductors, Magnetics
What is Hanking MUMPS Becoming?
Helping Start Ups Transition from R&D to Development &
High Volume Manufacturing
MEMS Product Development Process
Concept Development Prototype Production
Hanking MUMPS China
Hanking 200mm MEMS Fab
Save Time & Money with MUMPs China
High Volume MEMS in China
UniversitiesIn China
Fabless MEMS companies In China
MEMS 产品开发流程
Hanking’s Network of MEMS Fabs
R&D and Prototype devices run in production fabs/foundries
DRIE, Wafer Bond, Deposition, Lithography…
Hanking MUMPS wafer fabrication
4”‐8” wafers Single steps or entire processes
罕王MEMS美国研发条件
Hanking Electronics' New MEMS Fab
Located outside of Shenyang
Backend fab was completed in 2015, frontend wafer fab to be completed in 2016
Hanking’s customers will have access to a high volume 8” MEMS fab
罕王微电子新MEMS厂房
Hanking MEMS Cleanroom
Class 100 MEMS cleanroom – and equipment install 2015 Pure MEMS fab, not a CMOS fab. CMOS wafers can be made elsewhere and then bonded to the MEMS wafers
罕王微电子洁净间
Hanking’s Backend Fab
Wafer Level Packaging – Dicing‐Wire Bond‐ Test & Calibration
Hanking Wafer Bonding Processes
• Anodic (borofloat glass substrates)• Eutectic (Al,Ge,Au,Si)• Solder (In, Sn, Au‐Sn, Au‐In, Cu‐Sn)• Glass Reflow (screen printed frit)• Adhesive‐ temporary or permanent• Gold‐Gold Thermocompression
WLP‐ 150mm and 200mm
晶圆对准、键合机
罕王微电子键合工艺
Sonoscan Ultrasonic Void/Bond Inspection
Monitoring voids in Silicon/glass wafer stacks and in plastic packages
Sonoscan 超声扫面空洞/键合 检查
Temporary Bonding‐ Carrier Wafers& Thin Wafers
Adhesive/Release spin, carrier wafer bonding, thinning and delamination after thinning
150mm, 200mm, 300mm wafer Wet etch and grind for thinning the wafers
临时键合‐载片& 薄片
Hong Kong
GuangzhouShenzhen
Taipei
Hsinchu
QingDao
Weihai
Shenyang
Harbin
Changchun
Beijing
Zhengzhou
Dalian
Taiyuan
ShijiazhuangTianjin
Lanzhou
Xian
Kunming
Chengdu
ChongqingWuhan
Shanghai
ChangshaHangzhou
NanjingHefei
Xiamen
Hong Kong
GuangzhouShenzhen
Taipei
Hsinchu
QingDao
Weihai
Shenyang
Harbin
Changchun
Beijing
Zhengzhou
Dalian
Taiyuan
ShijiazhuangTianjin
Lanzhou
Xian
Kunming
Chengdu
ChongqingWuhan
Shanghai
ChangshaHangzhou
NanjingHefei
Xiamen
Target Customers: Fabless MEMS Companies & Universities in China
There are more than 100 institutions and 500 researchers and more than 50 fabless MEMS design start‐ups in China
Fostering the MEMS Market in China
MUMPS China will help build new products in China
After 2‐3 years of product development Hanking’s MEMS fab will be ready to launch the successful new products into high volume applications.
培养中国MEMS市场
Hanking MUMPS – in China as a MEMS Development Partner
• Provides proof‐of‐concept prior to volume manufacturing – use MUMPS China
• Enables accessible and cost‐effective early‐stage development through standard processes
• Supports multiple process platforms for product flexibility as required
• Provides exploratory development and single step processes as needed
• Eventually they will use Hanking’s fab for high volume production
25
罕王MUMPS –中国MEMS开发的合作者
Hanking’s Commitment to MEMS
Hanking is developing a 127 acre industrial park near Shenyang, China, dedicated to MEMS-based sensor products. This will include a MEMS fab for 8” wafers, packaging facility and system assembly buildings for consumer, industrial, automotive and medical products.
In Liaoning province
罕王微电子对MEMS的承诺
Conclusion
Hanking MUMPS was a low cost multi‐user MEMS foundry service with established processes and design guidelines
Hanking MUMPS is Becoming:
A network provider of MEMS foundry steps and services. Building a backend and frontend 200mm MEMS wafer fab in China. This new fab will provide high volume MEMS manufacturing capability in China.
总结