heat transfer rates
DESCRIPTION
Heat Transfer Rates. Conduction: Fourier’s Law. heat flux [W/m 2 ]. thermal conductivity [W/m-K]. temperature gradient [K/m]. Convection: Newton’s Law of Cooling. fluid temperature [K]. heat flux [W/m 2 ]. heat transfer coefficient [W/m 2 -K]. surface temperature [K]. - PowerPoint PPT PresentationTRANSCRIPT
AME 60634 Int. Heat Trans.
D. B. Go 1
Heat Transfer Rates
heat flux[W/m2]
thermal conductivity[W/m-K]
temperature gradient[K/m]
heat flux[W/m2]
heat transfer coefficient[W/m2-K]
surface temperature[K]
fluid temperature[K]
emissive power[W/m2]
surface emissivity[ ]
Stefan-Boltzmann constant[5.67×10-8 W/m2-K4]
surface temperature[K]
Conduction: Fourier’s Law
Convection: Newton’s Law of Cooling
Radiation: Stefan-Boltzmann Law (modified)
AME 60634 Int. Heat Trans.
D. B. Go 2
Transient Conduction: Lumped Capacitance • General Transient Problem: Special Case negligible radiation,
heat flux & heat generation
Define: thermal time constant
t cVhAs,c
cV 1hAs,c
lumped capacitance thermal resistance
We can plot the normalized solution to the general problem
Notes:• The change in thermal energy storage due to the transient process is:
AME 60634 Int. Heat Trans.
D. B. Go 3
1-D Steady Conduction: Plane WallGoverning Equation:
Dirichlet Boundary Conditions:
qx kA dTdx
kAL
Ts,1 Ts,2
Solution:
Heat Flux:
Heat Flow:
temperature is not a function of k
T(x) Ts,1 Ts,2 Ts,1 xL
q x k dTdx
kL
Ts,1 Ts,2
Notes:• A is the cross-sectional area of the wall perpendicular to the heat flow• both heat flux and heat flow are uniform independent of position (x)• temperature distribution is governed by boundary conditions and length
of domain independent of thermal conductivity (k)
heat flux/flow are a function of k
AME 60634 Int. Heat Trans.
D. B. Go 4
1-D Steady Conduction: Cylinder WallGoverning Equation:
Dirichlet Boundary Conditions:
T(r1) Ts,1 ; T(r2) Ts,2
Notes:• heat flux is not uniform function of position (r)• both heat flow and heat flow per unit length are uniform independent of
position (r)
Solution:
Heat Flux:
Heat Flow:
T(r) Ts,1 Ts,2
ln r1 r2 ln r
r2
Ts,2
q r k dTdr
k Ts,1 Ts,2 r ln r2 r1
qr kA dTdr
2rL q r 2Lk Ts,1 Ts,2
ln r2 r1
q r qr
L
2k Ts,1 Ts,2 ln r2 r1 heat flow per unit length
heat flux is non-uniform
heat flow is uniform
AME 60634 Int. Heat Trans.
D. B. Go 5
1-D Steady Conduction: Spherical ShellGoverning Equation:
Dirichlet Boundary Conditions:
T(r1) Ts,1 ; T(r2) Ts,2
Solution:
Heat Flux:
Heat Flow:
T(r) Ts,1 Ts,1 Ts,2 1 r1 r 1 r1 r2
q r k dTdr
k Ts,1 Ts,2
r2 1 r1 1 r2
qr kA dTdr
4r2 q r 4k Ts,1 Ts,2
1 r1 1 r2
Notes:• heat flux is not uniform function of position (r)• heat flow is uniform independent of position (r)
heat flux is non-uniform
heat flow is uniform
AME 60634 Int. Heat Trans.
D. B. Go 6
Thermal Resistance
AME 60634 Int. Heat Trans.
D. B. Go 7
Thermal Circuits: Composite Plane Wall
Circuits based on assumption of (a) isothermal surfaces normal to x direction
or (b) adiabatic surfaces parallel to x direction
Rtot LE
kE A
kF A2LF
kG A2LG
1
LH
kH A
Rtot
2LE
kE A
2LF
kF A
2LH
kH A
1
2LE
kE A
2LG
kG A
2LH
kH A
1
1
Actual solution for the heat rate q is bracketed by these two approximations
AME 60634 Int. Heat Trans.
D. B. Go 8
Thermal Circuits: Contact ResistanceIn the real world, two surfaces in contact do not transfer heat perfectly
R t,c TA TB
q x Rt ,c
R t,cAc
Contact Resistance: values depend on materials (A and B), surface roughness, interstitial conditions, and contact pressure typically calculated or looked up
Equivalent total thermal resistance:
Rtot LA
kA Ac
R t,c
Ac
LB
kB Ac