hecto publishable final activity report issue2€¦ · project deliverable 6th fp - ist contract no...

Project Deliverable 6th FP - IST

Contract No 033868

D 0.4 – Final project presentation 1/38 public

D 0.4 – Final project presentation: Publishable final activity report

Identifier: Deliverable D 0.4 Class: Report Version: Issue 2 Version Date: 10/08/2010 Distribution: Public Responsible Partner: P1 KTH Filename: HECTO-D0-4-issue2.doc/pdf


Contract No 033868


DOCUMENT INFORMATION Project ref. No. FP6-IST-033868

Project acronym HECTO

Project full title High-speed Electro-optical Components for integrated Transmitter and receiver in Optical communications

Security (dissemination level) public

Contractual delivery date April 8th, 2010

Actual delivery date August 10th, 2010

Deliverable number 0.4

Deliverable name Final project presentation

Type Publishable final activity report

Status & version Issue 2

WP contributing all

WP responsible P1 KTH

Main contributors all

Editor(s) Urban Westergren

EU Project Officer Christoph Helmrath


Contract No 033868


DOCUMENT HISTORY Version Date Comments and actions Status

Issue 1 July 7th, 2010 1st complete form Submitted to PO

Issue 2 August 10th, 2010

Publishable DUP added Submitted to PO

TABLE OF CONTENTS DOCUMENT INFORMATION................................................................................................................2 DOCUMENT HISTORY .........................................................................................................................3 TABLE OF CONTENTS ........................................................................................................................3 1 INTRODUCTION AND PROJECT SUMMARY..............................................................................4 2 MOTIVATION.................................................................................................................................5 3 THE HECTO CONSORTIUM .........................................................................................................7 4 PROJECT OBJECTIVES...............................................................................................................8 5 PROJECT RESULTS.....................................................................................................................9 6 PUBLICATIONS ..........................................................................................................................14 7 PUBLISHABLE DISSEMINATION AND USE PLAN...................................................................18


Contract No 033868


1 INTRODUCTION AND PROJECT SUMMARY This document comprises the final project presentation (deliverable D0.4) of the project HECTO, which is also the publishable final activity report. The purpose of this deliverable is to present the project and its end results to the public and to explain the purpose and the impact of the project. In recent years efforts have been made to achieve higher data rates in optical communication systems. In the IST projects FASHION and TOPRATE it has been shown that datarates of 160Gbit/s can be transmitted using Optical Time Division Multiplexing. The focus of these projects has been in the optical domain rather than in realization of cost-efficient components. Further IST-projects address IP-based optical networks and develop concepts for optical packet-switched networks, e.g. IST-LASAGNE and IST-IP NOBEL. In packet switching networks, the next logical step after 10 Gigabit Ethernet (GbE) is 100GbE. The objective of HECTO has been the development of photonic components, transmitter and receiver, for high-performance and high-speed but cost-efficient communication systems. Applications are Time Division Multiplexed (TDM) optical systems with up to 160Gbit/s as well as optical packet-switching networks based on serial 100GbE signals requiring 112Gbit/s including forward-error correction. The bitrate 112Gb/s was chosen during the project by the HECTO partners as a result of interaction with ongoing international standardization. Transmitters have been developed with Travelling-Wave Electro-Absorption Modulators (TWEAM) with bandwidths of 100GHz or more, integrated with continuous-wave lasers. Electronic driver amplifiers and multiplexers have been developed for the connection between the modulators and external electronics at lower speeds. Receivers with bandwidths on the order of 100GHz have been developed with waveguide pin photodetectors integrated with electronic amplifiers, and the required high-speed electronics for electrical clock recovery and demultiplexing to lower speeds were also developed. The components have been tested in systems experiments. To ensure that they will meet the demands of the future market, technology application assessment accompanied the technical investigation and development. The HECTO project will allow European companies to gain share in the increasingly competitive photonic component and packet switching market. HECTO will form a basis for a cost-efficient extension of European networks, and the introduction of end-to-end broadband services for all European citizens. Information regarding HECTO may also be found at the project web site:

www.hecto.eu


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2 MOTIVATION By the end of the 20th century and the beginning of the 21st century, telecommunication and information technology started to strongly influence society. Today, all areas of society, politics, and economics make use of the possibilities offered by these technologies and as an example, the influence on economic processes is enormous. Also private users take more and more advantage of mobile communication and Internet. As the new techniques have come to play a key role in all social areas and in the lives of people, the requirements on the telecommunication technologies have changed dramatically. In today’s metro and core networks 10Gbit/s transmission systems with a total number of 80 wavelengths channels in the core (dense wavelength multiplexing systems, DWDM) and 16 channels in the metro area (coarse WDM) are established. Until the year 2001 the speed of development of optical SDH/SONET, transmission systems was enormous, from below 1Gbit/s to 2.5Gbit/s and today’s 10Gbit/s (SDH=Synchronous Digital Hierarchy is the international standard published by the International Telecommunications Union, ITU; SONET= Synchronous Optical NETwork is the United States version of the standard published by the American National Standards Institute, ANSI). At that time, all major system vendors promised to provide systems with a data rate of 40Gbit/s per channel soon. To be prepared for the next steps, many research projects envisaging 160Gbit/s transmission were started, among them the very successful IST projects FASHION and TOPRATE, but with the downturn of the communication industry the innovation nearly stopped. Suddenly, the best performing system with over a hundred wavelengths bridging a distance of several thousand of kilometers was of no interest, but a cheap system just satisfying short-term requirements. Recently the situation has become more relaxed again. Some operators now ask for the option to deploy 40Gbit/s systems, although no larger installation of this bit rate has been performed so far. Another topic from the past is also under strong discussion and has high chances of becoming realized in the next years: Automatically Switched Optical Network (ASON) in combination with Generalized Multi Protocol Label Switching (GMPLS) seems to be a very promising solution to reduce network costs, capital expenditure (CAPEX) as well as operational expenditures (OPEX). At the same time the Ethernet technology has expanded from local area networks (LAN) into the metro area networks where it won the race against the ATM-technology (ATM=Asynchronous Transfer Mode). Today, Ethernet is the definite standard in the local and metro area offering the best cost-benefit relation. Its evolution is an impressive success story up to now, with bitrates of 10Mbit/s in year 1990, 100Mbit/s in 1994, 1Gbit/s in 1998, and 10Gbit/s in 2002. It is now visible that technological advances in the area of high bandwidth optical transmission and high-speed electronics will allow climbing to the next Ethernet speed level of 100Gbit/s within the next few years. It may also be expected that the Ethernet will utilize these technological advances and enter the core networks. Especially the fact that the share of packet based data transport is rapidly growing and that voice traffic is already possible in packet networks as “Voice-over-IP” (VoIP) paves the ground for the Ethernet also in the central area of the data network. The figure below shows the intrusion of Ethernet into the Metro and Core parts of the network.


Contract No 033868


Traditional Transport Network


Ethernet MetroNetwork


OpticalPure packet equipment

SDH OpticalEthernet

Full EthernetNetwork


1GE 10GE

1GE 10G SDH N x 10G SDHin WDM

N x 10G SDHin WDM

1GE 10GE 100GE*

100GE Switching 100GE Transport

* later M x 100GE

Packet

Circuit

METRO CORE

Pure packet equipment





OpticalPure packet equipment

SDH OpticalEthernet



1GE 10GE

1GE 10G SDH N x 10G SDHin WDM

N x 10G SDHin WDM

1GE 10GE 100GE*

100GE Switching 100GE Transport

* later M x 100GE

Packet

Circuit

METRO CORE

Pure packet equipment

Figure 1. Ethernet in the Metro and Core parts of the network The packet data connection and IP is still a purely electrical technology, especially the switching, but to transport these packets at data rates of 10Gbit/s today or even 100Gbit/s in the future, there is no alternative to the optical domain. The optical single mode fiber provides the unique solution to transport such high data rates over long distances. Transmission experiments have been demonstrated in which for example 160Gbit/s signals were submitted error-free over several hundred kilometers of deployed fiber. However, to convert these high data rates between the electrical and the optical domain, sophisticated optical multiplexing and demultiplexing technologies have been applied. In order to make 100Gbit/s Ethernet or also higher data rate TDM technologies economically interesting, cost efficient electro-optical and opto-electrical components have to be provided. Within the project HECTO high-speed components for both directions have been developed: electrical to optical as well as optical to electrical signal converters. In order to achieve not only high-performance devices but also cost-efficient technologies, these converters were developed as integrated devices. In the transmitter and the receiver, the converters were accompanied by high-speed integrated electronic circuits, which also were developed within this project. Finally, the goal of the project has been not only to provide individual converters in both directions, but to develop both components in tight cooperation. Therefore, dedicated system experiments were performed to investigate the proper interaction between the transmitter component (electro-optical converter) and the receiver component (opto-electrical converter).


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This enabled the consortium to demonstrate that these components can be integrated into a high-speed transmission system. Finally, field experiments were successfully conducted to verify the applicability under reality conditions. 3 THE HECTO CONSORTIUM The consortium consists of 9 principal contractors (P1-9) from the EU Member states Denmark, Germany, Sweden and Greece. Three principal contractors are academic institutions (P1, P5, P9), three are industrial laboratories (P3, P7, P8), two are SMEs (P3, P7), and three are non-profit research institutes (P2, P4, P6). P1: Royal Institute of Technology (Kungliga Tekniska Högskolan, KTH), Laboratory of Photonics and Microwave Engineering (FMI), Kista, Sweden P2: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., Heinrich-Hertz-Institut (FhG/HHI), Berlin, Germany P3: Syntune AB, Kista, Sweden P4: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., Institut für Angewandte Festkörperphysik (FhG/IAF), Freiburg, Germany P5: DTU Fotonik, Lyngby, Denmark P6: Acreo AB, Kista, Sweden P7: U2T Photonics AG, Berlin, Germany P8: Nokia Siemens Networks (NSN) GmbH & Co. KG, Munich, Germany P9: University of Peloponnese (UoP), Tripolis, Greece The project has been managed by P1 who has handled the administrative functions. P1 has also been responsible for the design and characterization of the TWEAM, as well as process coordination in close collaboration with P3. P3 has developed epitaxy and the fabrication process of the TWEAM and the monolithically integrated laser-TWEAM, and fabricated these devices. The TWEAM chips were packaged by P7 and connected to the driver IC designed and fabricated by P4 who also designed and fabricated an electronic multiplexer. The role of P2 was to design, fabricate, and characterize receivers with detectors and amplifiers, which were connected to clock recovery circuits and electronic demultiplexers designed and fabricated by P4 and packaged by P7. P5 contributed to the modulator evaluation using equipment only available at this partner. Field tests were performed using the test-bed operated by P6. Techno-economic evaluation of systems working at bitrates up to 112Gbit/s and above were performed by P8 and P9 to ensure that the components will meet the demands of the future market Coordinator contact details The project has been coordinated by Associate Professor Urban Westergren, Laboratory of Photonics and Microwave Engineering, School of Information and Communication Technology, Royal Institute of Technology (Kungliga Tekniska Högskolan, KTH). Mail address: Electrum 229, SE-164 40 Kista, Sweden E-mail: [email protected], Telephone: +46 8 790 60 00 Project web site: www.hecto.eu


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4 PROJECT OBJECTIVES HECTO has been a 40 month project. The main objectives of the project are summarized as:

• To develop fully packaged transmitters and receivers suitable for optical systems based on serial 100GbE signals requiring about 110Gbit/s.

• To determine specifications for all interfaces of the photonic components taking into account emerging relevant standards, and to determine application areas for the components and their impact on the specifications.

• To test the fully packaged transmitters and receivers in laboratory systems test-beds and to perform test in field trials.

• To disseminate the results of the project, including field trials. • To exploit the results of the project, including plans for commercial exploitation by the

SME component vendors of the consortium.

Figure 2. Schematic summary of development of transmitter and receiver components

Packaging by FhG/IAF

Multiplexer and driver amplifer

Chip(s)

developed by FhG/IAF

Transmitter

Electrical input signals

(2x50Gbit/s)

Packaging by u2t

Modulator and CW laser

Chip developed by KTH

and Syntune

Optical output signal (100Gbit/s)

High-speed electrical interfaces (100Gbit/s)

Packaging by FhG/IAF

Clock-and-data recovery and demultiplexer

Chip developed by

FhG/IAF

Receiver

Electrical output signals (2x50Gbit/s)

Packaging by u2t

Photodetector and preamplifier

Chip developed

by FhG/HHI

Optical input signal (100Gbit/s)


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5 PROJECT RESULTS Work performed in the 1st and 2nd years In the first year of the project the work performed included:

• All internal interfaces were identified. • Specifications of the components and interfaces for the first fabrication run were

determined. • Relevant standardization bodies were identified and a plan of standardization

activities was made. • Designs were finished for the first of two planned technology runs of optical

modulator, electrical multiplexer and driver amplifier in the transmitter. • Designs were finished for the first of two planned technology runs of photoreceiver,

clock-and-data recovery and demultiplexer. • The technology runs for both the transmitter and the receiver were started

The results in the second year of the project included the first technology run where chips were fabricated and packaged in all semiconductor technologies in the project. The results during the second year were reported to the European Commission in the following 4 deliverables:

• A list of specification of all components, modules, and interfaces for the second production run taking into account results from the techno-economic evaluations

• A report on the characterization of the optical modulator, the electrical multiplexer, and the driver amplifier from the first technology run

• A report on the characterization of the photoreceiver and the CDR/DEMUX from the first fabrication run

• An intermediate report on Standardization and Exploitation. Work performed in the 3rd reporting period Since a large part of HECTO has involved hardware development (semiconductor chips) in two consecutive technology runs, the main results have been produced during the last reporting period of the project. The results during the 3rd reporting period, the last 16 months of the project, were reported to the European Commission in the following 5 deliverables:

• Report on the characterization of the optical modulator, the electrical multiplexer, and the driver amplifier from the second technology run

• Report on the characterization of the photoreceiver and the CDR/DEMUX from the second technology run

• Report on the final system laboratory and field experiments of 2nd run of transmitter and receiver

• Report on possible application fields for the technologies developed within the project including Standardization and Exploitation and an update of the recommendation of the specifications

• Final Project Presentation: Publishable final activity report (this report)


Contract No 033868


End results of the HECTO project The bitrate 112Gb/s was chosen during the project by the HECTO partners as a result of interaction with ongoing international standardization regarding 100GbE signals. Transmitters have been developed with Travelling-Wave Electro-Absorption Modulators (TWEAM) with bandwidths of 100GHz or more, integrated with continuous-wave lasers. Electronic driver amplifiers and multiplexers have been developed for the connection between the modulators and external electronics at lower speeds.

Figure 3. Typical appearance of the 112 Gbit/s 2:1 MUX modules developed by P4 FhG/IAF.

Figure 4. Modulator driver module developed by P4 FhG/IAF (RF input is on the bottom, output on the top; module size is 30 × 21 × 15mm3).


Contract No 033868


Figure 5: Finished DFB-TWEAM transmitter module, with chips developed by P1 KTH and P3 Syntune, packaging by P7 U2T, photo taken in the systems measurement

setup at P6 Acreo. Receivers with bandwidths on the order of 100GHz have been developed with waveguide pin diodes integrated with electronic amplifiers (pin-TWA), and the required high-speed electronic circuits for electrical clock recovery and demultiplexing to lower speeds were also developed.

Figure 6: Fabricated wafer from maskset WARP100ADV with various pin-TWAs developed by P2 FhG/HHI, comprising among others a pinTWA in cascode design, containing 10

HEMTs within the TWA.


Contract No 033868


Multiplexer & Driver amplifier Developed by FhG / IAF Packaging by FhG / IAF

DFB-TWEAM Developed by KTH & Syntune

Packaging by U2T

Technology applications by NSN & UoP

Component characterization by DTU & FhG / HHI Field trials by ACREO

Clock and Data Recovery & Demultiplexer

Developed by FhG / IAF Packaging by FhG / IAF

Photodetector & Preamplifier Developed by FhG / HHI

Packaging by U2T

112Gbit/s electrical interfaces

2x56Gbit/s electrical input signals

2x56Gbit/s electrical output signals

Transmitter

Receiver

112Gbit/s optical signal

Successful field trials

Figure 7. Typical appearance of the 107-112 Gbit/s CDR/1:2 DEMUX modules developed by P4 FhG/IAF (based on 0.7µm DHBTs) with 1mm input connector.

Figure 8. Summary of the HECTO project with all developed components and an example of

measured eyediagram at 112Gbit/s


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To ensure that the produced modules will meet the demands of the future market, technology application assessment accompanied the technical investigation and development. The components were successfully tested in systems experiments up to 112Gb/s. Successful field trials over more than 40km of field-installed fibre were conducted. Intentions for use and impact Aiming at components for high-speed conversion of electrical to optical signals and vice versa, the STREP HECTO contributes to the IST-2005-2.5.1 strategic objective "Photonic Components". HECTO has intended to design cost-efficient component solutions for the next generation of Ethernet. Especially for the future of packet switched networks, components developed within HECTO will enable an evolution of today's 10Gbit/s Metro Ethernet to 100Gbit/s Metro or even core Ethernet. The fact that the Ethernet technology comes at a cheaper price, compared with the expensive WDM equipment, will lead to significant cost reductions that will contribute to make the broadband access affordable. HECTO thus contributes to the availability of low-cost access and edge network equipment by providing integrated photonic components for the realization of 100Gbit/s Ethernet network elements. HECTO provides possibilities of developing necessary technologies to meet future demands on higher communication capacity and thus reinforces European strengths in areas where it has already established industrial and technological leadership. Developed integrated transmitters and receivers have been tested in fibre-optical systems to investigate advantages and disadvantages of different solutions to determine which types of photonic components are optimal in various systems, depending on communications distance etc. This has provided the possibility of studying the achievable performance at extremely high speeds, and the results will also aid in the determination of specifications for these photonic components. The feedback of this information in the project will also provide information that may be helpful in future standardization work, such as possible standards for Ethernet at higher rates than 10Gbit/s. HECTO has included participation of experts in standardization work for 10Gbit/s Ethernet who have provided experience and guidelines for a realistic determination of the demands of future communications networks at higher speeds. HECTO has involved the participation of two SMEs that are candidates for the commercial dissemination of the results of the project in future products. It is likely that commercial implementations will occur in a few years since these solutions will offer potential economic advantages by making it possible to increase the capacity of a communications network without requiring additional space such as a parallel systems increase would (parallel links/fibres or several wavelengths in one fibre). The techno-economic aspects of choices between different technical solutions have been investigated in the HECTO project to ensure that the technical work is relevant to the emerging future communications market. Initial exploitation of the results of HECTO in the measurement equipment market will be explored in direct contact with manufacturers of this type of equipment.


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Components developed by the HECTO consortium represent a step further on the extension of Ethernet to the core and metro area networks, and may be expected to strongly impact the telecommunication's industry as well as the network-user community in general. High-speed TDM networks, which today only can be realized with optical switching technologies, may become economically interesting with the ability of direct opto-electronic conversion of the signal at the maximum transmission speed. 6 PUBLICATIONS

1. Fischer, T.: “Technical and economic feasibility of a 1×100G serial LAN PHY”. IEEE 802.3 Interim Meeting of Higher Speed Study Group, Monterey, CA, USA, January 16-18, 2007, http://grouper.ieee.org/groups/802/3/hssg/public/jan07/fischer_01_0107.pdf.

2. Jansen, S. L.; Derksen, R. H.; Schubert, C.; Zhou, X.; Birk, M.; Weiske, C.-J.; Bohn, M.; van den Borne, D.; Krummrich, P. M.; Möller, M.; Horst, F.; Offrein, B. J.; de Waardt, H.; Khoe, G. D.; Kirstädter, A.: “107-Gb/s full-ETDM transmission over field installed fiber using vestigial sideband modulation”, OFC 2007, Anaheim, California, USA, March 25-29, Dig. Tech. Pap., OWE3.

3. Derksen, R. H., Schubert, C., Jansen, S., Zhou, X., Birk, M.: “Field trial on 107-Gbit/s transmission with pure electrical time division multiplex over 160 km”, Photonische Netze: Vorträge der 8. ITG-Fachtagung vom 7. bis 8. Mai 2007 in Leipzig, (ITG-Fachbericht 201), VDE-Verlag, Berlin, Offenbach, 135-139.

4. Lehmann, G.; Derksen, R. H.; Schubert, C.; Winter, M.: “100 Gigabit Ethernet transmission - physical layer issues”. OFC 2007, Anaheim, California, USA, March 25-29, Dig. Tech. Pap., OThD5 (invited).

5. Derksen, R. H.; Möller, M.; Schubert, C.: ”100 Gbit/s full-ETDM transmission technologies”. CSICS 2007, Portland, Oregon, USA, Oct. 14-17, Dig. Tech. Pap., 89-92 (invited).

6. Chacinski, M.G., Westergren, U., Thylén, L., Schatz, R., Stoltz, B.:“50 Gb/s Modulation and/or Detection with a Travelling-Wave Electro-Absorption Transceiver”, Optical Fiber Communication conference, OFC2008, Pres. no. JThA32

7. K. Schneider, R. Driad, R. E. Makon and G. Weimann: “Distributed Amplifier MMIC with 21 dB Gain and 90 GHz Bandwidth using InP-based DHBTs”, 2007 IEEE CSIC Symposium (CSICS) : IEEE Compound Semiconductor Integrated Circuit Symposium. Piscataway, NJ : IEEE, 2007, pp.67-70

8. R. Ludwig, C. Schubert; B. Huettl; C. Schmidt-Langhorst; R. Derksen, M. Moeller: “100 Gb/s ETDM receivers“, 20th Annual Meeting of IEEE LEOS, Lake Buena Vista, Florida, USA, Oct. 21-25, Dig. Tech. Pap., TuEE2 (invited)

9. A.Beling & al: “High-speed Miniaturized Photodiode and Parallel-fed Travelling-Wave Photodetectors Based on InP”, IEEE J. Sel.Topics in QE, Vol.13 (2007) pp 15-21.

10. H.-G. Bach: “Ultra High-speed Photodetectors and Photoreceivers for Telecom and Datacom also Aiming at THz Applications”, invited, April 25-27, 2007, Copenhagen, Denmark, Proceedings ECIO 2007, paper FB0.

11. H.-G.Bach: “Ultra-fast Efficient Photodiodes Exceeding 100 GHz Bandwidth”, invited paper, Int’l Conf. on Indium Phosphide & Related Materials (IPRM), May 14-18, 2007, Matsue, Japan (Proc. pp. 71-76).

12. M. Chacinski, U. Westergren, B. Willen, B. Stoltz, L. Thylen, “Electroabsorption Modulators Suitable for 100-Gb/s Ethernet”, IEEE Electron Device Letters, Volume 29, Issue 9, pp. 1014 – 1016, Sept. 2008

13. M. Chacinski, U. Westergren, B. Stoltz, L. Thylén, “Monolithically Integrated DFB-EA for 100 Gb/s Ethernet”, IEEE Electron Device Letters, vol29, no12, pp1312-1315, December 2008


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14. M. Chaciński, U. Westergren, B. Stoltz, L. Thylén, “Monolithically integrated DFB-EAT for transmission faster than 50 Gb/s”, paper Th2A.3, 2nd International Conference on Transparent Optical Networks- 'Mediterranean Winter' 2008 (ICTON-MW’08), Marrakesh, Morocco, 11-13 December 2008

15. R. Driad, R. Makon, V. Hurm, K. Schneider, F. Benkhelifa, R. Lösch, J. Rosenzweig, “InP DHBT-based ICs for 100 Gbit/s data transmission”, Proc. 20th Int. Conf. Indium Phosphide and Related Materials, 25-29 May 2008 (IPRM), paper TuB2.2.

16. V. Hurm, F. Benkhelifa, R. Driad, R. Lösch, R. Makon, H. Massler, J. Rosenzweig, M. Schlechtweg, H. Walcher, “InP DHBT-based distributed amplifier for 100 Gbit/s modulator driver operation”, Electron. Lett.,vol. 44, no. 12, pp. 705-706, June 2008.

17. R. Driad, R. Makon, F. Benkhelifa, R. Lösch, “InP DHBT technology for 100 Gbit/s applications”, Int. Conf. Compound Semiconductor Manufacturing Technology (CS MANTECH), Chicago, IL, 14-17 April 2008, paper 12.5

18. R. E. Makon, R. Driad, R. Lösch, J. Rosenzweig, M. Schlechtweg, “100 Gbit/s fully integrated DHBT-based CDR/1:2 DEMUX IC”, Tech. Dig. 30th IEEE Compound Semiconductor Integrated Circuit Symp. (CSICS), Monterey, CA, 12-15 Oct. 2008, pp. 149-152.

19. C. Schubert, R. Makon, A. G. Steffan, R. Driad, R. Ludwig, C. Schmidt-Langhorst, „Characterization of an InP-based Electrical 1:2 Demultiplexer in a 107 Gb/s OOK System“, accepted for oral presentation at OFC, San Diego, USA, March 2009

20. M. Chacinski, U. Westergren, B. Stoltz, L. Thylén: ”Monolithically Integrated DFB-EAT for >=50 Gb/s Transmission”, 2nd International Conference on Transparent Optical Networks- 'Mediterranean Winter' 2008 (ICTON-MW’08), Marrakesh, Morocco, 11-13 December 2, paper Th2A.3, 2008

21. U. Westergren: ”HECTO FP6-STReP”, European Workshop on Photonic Solutions for Wireless, Access and in-House Networks, Duisburg, 18-20 May 2009

22. M. Chacinski, U. Westergren, P-Y. Fonjallaz, R. Schatz: ”Simultaneous Direct Detection of Signals Carried on Baseband and Subcarrier”, European Workshop on Photonic Solutions for Wireless, Access and in-House Networks, Duisburg, 18-20 May 2009

23. S. Blaaberg, H.C.H. Mulvad, L.K. Oxenløwe, M. Chacinski, U. Westergren and B. Stoltz, “All-optical characterization of large-signal modulation bandwidth of a monolithically integrated DFB-EA”, Conference on Lasers and Electro-Optics, CLEO' 09, Baltimore, Maryland, U.S.A., May 2009. Paper CTuBB7.

24. U. Westergren, M. Chacinski, L. Thylén: ”Compact and efficient modulators for 100Gb/s ETDM for Telecom and Interconnect Applications”, Applied Physics A, Springer, Special issue on Photonics Interconnects, (June 2009) Vol. 95, No. 4, pp. 1039-1044

25. M. Chacinski, R. Schatz, U. Westergren, A. Djupsjöbacka: ”Extension of a 40 Gbps link with a directly detected 2.5 Gbps subcarrier channel”, 11th International Conference on Transparent Optical Networks (ICTON), Session (and paper) Mo.C5.4, June 2009

26. ”Miniaturized monolithic transceivers promise to boost Ethernet capacity”, Compound Semiconductor Magazine, Vol 15, No 5, July 2009, pp29-31, interview with U. Westergren

27. M. Heiland: ”Modeling of Device Characteristic Effects on Traveling-Wave Electroabsorption Modulator Performance”, MSc Thesis (Erasmus Mundus), KTH, Stockholm, Sweden, June 2009, TRITA-ICT-EX-2009:85

28. M. Chacinski, U. Westergren, B. Stolz, L. Thylen, R. Schatz, S. Hammerfeldt: ”Monolithically Integrated 100 GHz DFB-TWEAM”, Journal of Lightwave Technology, vol 27, no 16, pp 3410-3415, August 15, 2009

29. U. Westergren: ”Compact and efficient modulators for 100Gb/s and beyond”, International Nano-Optoelectronic Workshop, iNOW2009, Stockholm and Berlin, August 2-14, 2009

30. R. Driad, R.E. Makon, V. Hurm, F. Benkhelifa, R. Lösch, J. Rosenzweig, M. Schlechtweg "InP-based DHBT technology for high-speed mixed signal and digital applications" (INVITED), 21st Int. Conf. on InP and Related Materials, Newport Beach (USA), May 10-14, 2009


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31. M. Schlechtweg, A.Tessmann, I. Kallfass, A. Leuther, R. Weber, S. Chartier, R. Driad, R. E. Makon, V. Hurm, H. Massler, M. Kuri, F. Benkhelifa, R. Lösch, J. Rosenzweig, and O. Ambacher "High-Performance MMICs and High-Speed Mixed-Signal ICs Based on III/V HEMT and HBT Technology for Sensors and Communication" (INVITED), Semiconductor Conference Dresden, Dresden (Germany), April 29 - 30, 2009

32. M. Schlechtweg, A. Tessmann, I. Kallfass, A. Leuther, R. Weber, S. Chartier, R. Driad, R.E. Makon, V. Hurm, M. Seelmann-Eggebert, H. Massler, M. Kuri, M. Riessle, M. Zink, F. Benkhelifa, R. Lösch, J. Rosenzweig, O. Ambacher "MMICs and mixed-signal ICs based on III/V technology for highest frequencies and data rates", Frequenz (J. of RF-Engineering & Telecommunications), 63 (2009) p. 5-6

33. C. Matrakidis, D. Alexandropoulos, C.(T.) Politi, A. Stavdas, “Tx and Rx Component Modelling for 100 Gb/s Transmission Link Simulations,” ICO-PHOTONICS-DELPHI2009, 7-9 October 2009

34. V. Hurm, R. E. Makon, R. Driad, F. Benkhelifa, R. Lösch, H. Massler, M. Riessle, J. Rosenzweig, M. Schlechtweg, A. Tessmann, H. Walcher, “InP DHBT-based modulator driver module for 100 Gbit/s Ethernet applications”, Electron. Lett., vol. 45, no. 24, pp. 1264-1266, Nov. 2009.

35. R. E. Makon, R. Driad, R. Lösch, J. Rosenzweig, M. Schlechtweg, and O. Ambacher, “InP DHBT-based 1:2 DEMUX IC operating at up to 120 Gbit/s”, Electron. Lett., vol. 45, no. 25, pp. 1340-1342, Dec. 2009.

36. M. Chacinski: ”Dynamic Characterization of Semiconductor Lasers and Intensity Modulators”, Doctoral Thesis in Photonics, KTH, Stockholm, Sweden, September 2009, TRITA-ICT/MAP AVH Report 2009:8, ISSN 1653-7610, ISRN KTH/ICT-MAP/AVH-2009:8-SE

37. Ke Wang, Jie Li, Anders Djupsjöbacka, Sergei Popov, Gunnar Jacobsen, Robert Elvis Makon, Rachid Driad, Herbert Walcher, Andreas G. Steffan, Heinz-Gunter Bach, “100 Gb/s OOK Transmission Through 212 km Field SSMF Using Monolithically Integrated ETDM Receiver Module”, Asia Communications and Photonics Conference and Exhibition (ACP) 2009, paper TuE1.

38. Chacinski, M.; Westergren, U.; Thylen, L.; Stoltz, B.; Rosenzweig, J.; Driad, R.; Makon, R. E.; Li, J.; Steffan, A.: "ETDM Transmitter Module for 100-Gb/s Ethernet", IEEE Photonic Technology Letters, volume 22, issue 2, pp. 70-72, Jan 15th 2010

39. M. Chacinski, U. Westergren, B. Stoltz, R. Driad, R.E. Makon, V. Hurm, and A.G. Steffan, “100Gb/s ETDM Transmitter Module”, accepted for publication in IEEE Journal of Selected Topics in Quantum Electronics, 2010

40. M. Chacinski, U. Westergren, B. Stoltz, R. Driad, R. E. Makon, V. Hurm, J. Rosenzweig, Jie Li, A. G. Steffan: "Transceiver Modules Utilizing Travelling-Wave Electro-Absorption Modulator", Optical Fiber Communication Conference (OFC), March 21-25, 2010, San Diego, California, USA, Pres. number: OWN4

41. K. Wang, J. Li, A. Djupsjöbacka, M. Chacinski, U. Westergren, S. Popov, G. Jacobsen, V. Hurm, R. E. Makon, R. Driad, J. Rosenzweig, A. G. Steffan, G. G. Mekonnen, H.-G. Bach: "100Gbit/s Complete ETDM System Based on Monolithically Integrated Transmitter and Receiver Modules", Optical Fiber Communication Conference (OFC), March 21-25, 2010, San Diego, California, USA, Pres. number: NME1

42. H.-G. Bach, invited: “Photodetectors and Receivers for 100 GbE Applications”, 217th Electrochemical Society Meeting ECS 2010, 25.4. - 30.4.2010, Vancouver, Canada, paper/abstract #1063.

43. H.-G. Bach, R. Kunkel, G.G. Mekonnen, R. Zhang, D. Schmidt, invited: “Waveguide-integrated Components Based 100 Gb/s Photoreceivers: From Direct to Coherent Detection”, Proceedings 22th IPRM 2010, May 31 - June 4, 2010, Takamatsu, Japan, paper FrA1-1.


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44. C. Schubert, R. E. Makon, A. G. Steffan, R. Driad, H.-G. Bach, G.G. Mekonnen, R. Zhang, R. Ludwig, C. Schmidt-Langhorst: „InP-basierte elektrische und elektro-optische Komponenten für 112 Gbit/s OOK Systeme“, 11. ITG-Fachtagung Photonische Netze, 3.-4. Mai 2010, Deutsche Telekom Hochschule für Telekommunikation Leipzig.

45. Chenhui Jiang, Viktor Krozer, Heinz-Gunter Bach, Giorgis G. Mekonnen, Tom K. Johansen: „Broadband Packaging of Photodetectors for 100 Gbit/s Ethernet Applications“, 2010, submitted to IEEE Microwave and Wireless Components Letters.

46. Gebirie Yizengaw Belay, “Investigation and Optimization of Large Signal Effects on Travelling Wave Electroabsorption Modulator Performance and Optimization”, MSc thesis, KTH, June 2010

47. R. H. Derksen, K. Wang, J. Li, A. Djupsjöbacka, G. Jacobsen, M. Chaciński, U. Westergren, S. Popov, V. Hurm, R. E. Makon, R. Driad, H. Walcher, J. Rosenzweig, A. G. Steffan, G. G. Mekonnen, H.-G. Bach, C. Schubert, “Setting the stage for 100GbE serial standard - the HECTO project”, accepted for presentation at World Telecommunications Congress 2010 (WTC2010).

48. C. Schubert, Jie Li, H.-G. Bach, G.G. Mekonnen, R. Makon, R.H. Derksen, V. Hurm, A. Djupsjöbacka, M. Chacinski, U. Westergren, A.G. Steffan, R. Driad: "Characterization of a pin-TWA Photoreceiver in OOK-System Experiments up to 112 Gb/s", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for oral presentation

49. Jie Li, C. Schubert, R.H. Derksen, R. Makon, V. Hurm, A. Djupsjöbacka, M. Chacinski, U. Westergren, H.-G. Bach, G.G. Mekonnen, A.G. Steffan, R. Driad, H. Walcher, J. Rosenzweig: "112 Gb/s Field Trial of Complete ETDM System Based on Monolithically Integrated Transmitter & Receiver Modules for Use in 100GbE", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for poster presentation

50. M. Chacinski, U. Westergren, L. Thylén, R. Schatz, Jie Li, A. Djupsjöbacka, B. Stoltz: "Modulation and chirp evaluation of 100 GHz DFB-TWEAM", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for oral presentation

51. R.E. Makon, R. Driad, C. Schubert, R. Lösch, H. Walcher, J. Rosenzweig, M. Schlechtweg, and O. Ambacher "107-112 Gbit/s Fully Integrated CDR/1:2 DEMUX Using InP-based DHBTs", Proc. European Microwave Integrated Circuits (EuMIC) Conf., Paris (France), September 27-28, 2010


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7 PUBLISHABLE DISSEMINATION AND USE PLAN


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FINAL PLAN FOR USING AND DISSEMINATING THE KNOWLEDGE

Identifier: Plan for using and disseminating the knowledge Class: Report Period: From 01/11/2006 to 31/05/2010 Version Date: 05/10/2010 Distribution: Project officer Responsible Partner: P1 KTH Filename: HECTO_Publishable_Dissemination and use plan final_issue3.doc/pdf


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PLAN FOR USING AND DISSEMINATING THE KNOWLEDGE Section 1 - Exploitable knowledge and its Use Plans for exploitation are part of the following deliverables:

Del. no. Deliverable name WP

no. Lead participant

Estimated person-months

Dissemination level

Delivery date

Act. delivery date

D1.4 Intermediate report on Standardization and Exploitation 1 P8 6 PU M24 M24

D1.5

Report on possible application fields for the technologies developed within the project including Standardization and Exploitation and an update recommendation of the specifications

1 P8 9 PU M40 M40

The last of these reports was finalised and submitted together with the 3rd periodic activity report. The main points regarding exploitation by the SMEs of HECTO were:

• P3 Syntune plans commercialization of the modulator chip developed together with P1 KTH when a market appears.

• P3 Syntune plans prototype sampling to key potential customers shortly after the completion of HECTO.

• P7 U2T plans to develop all packaging technologies developed in the project in order to make them usable in future commercial applications and to ensure that it will be possible to reach the right price targets.

• P7 U2T plans to explore initial exploitation of the results of HECTO in the test and measurement equipment market in direct contact with manufacturers of this type of equipment.

The SMEs P3 Syntune and P7 U2T have continuously during the project provided information for the exploitation plan regarding the development of the market situation for the components developed in HECTO. This information has been entered into the public reports on exploitation in the table above (D1.4 and D1.5).


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For the initial exploitation of the results of HECTO, it is reasonable to assume that the measurement equipment market will have an immediate interest in the exploitation, and that it will precede the telecommunications market. Three major manufacturing companies of relevant measurement equipment were invited to evaluate the HECTO modules when these are available later in the project. These companies have also been invited to supply their opinions and advice regarding specifications to ensure that the transmitter and receiver modules are suitable as extensions of electrical measurement equipment to be used in optoelectrical measurements. The remaining partners of the project plan to exploit the results of the project as follows:

• P1 KTH plans to continue its research on high-speed and high-efficiency modulators. In the short term, P1 KTH will start at least one more MSc thesis project continuing the development work on TWEAM in HECTO.

• Regarding long term exploitation, the results of P2 FhG/HHI form the basis for the development of arrayed 4x100 Gbit/s pinTWA-photoreceivers, planed to be co-packaged with dedicated DEMUX circuits from partners within the European Union funded FP7 project POLYSYS, scheduled to be started on Oct. 1st 2010 (3 years). This 400 Gbit/s receiver is a subcomponent within an ultra-high-capacity optical cable transmission application, applying advanced ETDM technology. This will enable maturing InP technology into a higher yield OEIC fabrication technique and pushes the commercialization of pinTWA receiver OEICs as a key component to save costly EDFAs in high data capacity short range interconnections together with industry partners.

• P4 FhG/IAF has been in contact with among others measurement instrument manufacturers and intends to explore future exploitation possibilities of the electronics modules with them.

• P5 DTU does not plan any specific exploitation of project results. • P6 Acreo, as an independent research institute, has through the participation in this

project enhanced the knowledge and competence in the field of serial high-speed optical transmission systems, including the upgrade of the lab system testing facility to the signal baud rate up to 60 Gbaud, and the setting up and demonstration of a complete HECTO system working at the signal baud rate up to 112 Gbaud. The enhanced knowledge and competence obtained through the project will be exploited and used for applying for and participating in new projects, both in the academic (national and European) and industry world, especially when the interest for high baud rate serial transmission systems bounces back. In the case that the commercialization of the modules developed in HECTO happens, P6 Acreo is also willing to test these modules, to compare the performance with the modules developed during the project.

• There are three areas, where P8 NSN intends to use the results of the project: 1. 100GbE: HECTO has set the stage for a 100GbE serial standard. When in a few years this will be included in the standardisation of 100GbE and such 100GbE modules will be available for a reasonable price, P8 NSN will use these modules.


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2. BBA: As pointed out in D1.5, due to increasing traffic in general, traffic in the Terabit/s range has to be aggregated and cost-effectively processed at the interface between the access domain and the metro or core network. This requires components, which operate with speeds as high as possible, 100 Gbit/s at least. Already the broadband-access business of P8 NSN stated its interest in such high-speed processing components and will use these in its broadband-access solutions, when they will be available on the market. 3. Upcoming projects: In upcoming projects P8 NSN will build on the results of the project HECTO and the knowledge gained therein. This especially holds for research projects on ways towards advanced Tera-bit/s transmission systems. In this way the results of HECTO have already been used for the project proposal "Photonic Components Paving the Way for Advanced Terabit/s Transmission Systems for Power Efficient Data Centres of the Future" for the EU FP 7, call 5.

• The planned exploitation of project results by P9 UoP is broadly divided into two categories:

1. The analytical modelling techniques developed during the project will be also used in other research areas, including the wavelength routing system that takes physical layer effects into account that we have developed. Moreover they will form the basis for the development of even more advanced modelling techniques. 2. The simulation parameters extracted from the developed components as well as the relevant know-how will be used for the analysis of further systems and subsystems that are central to our research interests including wavelength converters and multi-granular cross connects.

Overview table

Exploitable Knowledge

(description)

Exploitable product(s)

or measure(s)

Sector(s) of application

Timetable for commercial

use

Patents or other IPR protection

Owner & Other

Partner(s) involved

1. EO converter design (electrical to modulated optical signal)

Packaged 100Gb/s EO converter

Test & Measurement market

Shortly after the project

According to descriptions in the DoW and the CA, no patents or other IPR protection at this time

P1 KTH, P3 Syntune, P7 U2T, ownership and rights according to the CA

2. Transmitter components design

Packaged 100Gb/s transmitters

Communication market

After a product development and qualifications phase (1-2 years after the project)


P1 KTH, P3 Syntune, P7 U2T, ownership and rights according to the CA

3. Receiver components

Packaged 100Gb/s

Communication and Test &

After improvement

According to descriptions

P2 HHI, P7 U2T,


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Exploitable Knowledge

(description)

Exploitable product(s)

or measure(s)

Sector(s) of application

Timetable for commercial

use

Patents or other IPR protection

Owner & Other

Partner(s) involved

design receivers (pin-TWA)

Measurement market

of the performance (Conversion Gain)

in the DoW and the CA, no patents or other IPR protection at this time

ownership and rights according to the CA

4. Improvement of photodiode components design

Packaged 100GHz photodiode modules

Test & Measurement market



P7 U2T, ownership and rights according to the CA

5. Advances in rf-design and simulation

All u2t products

Communication market



P7 U2T, ownership and rights according to the CA

Short texts per exploitable result: 1. EO converter design (electrical to modulated optical signal) The exploitable result is a packaged 100Gb/s EO converter. Partners involved: P1 KTH has developed DFB-TWEAM chip design methods, P3 Syntune has developed methods to fabricate DFB-TWEAM, P7 U2T has developed packaging methods. P3 Syntune plans commercialization of the modulator chip developed together with P1 KTH when a market appears. P3 Syntune plans prototype sampling to key potential customers shortly after the completion of HECTO. P7 U2T plans to develop the transmitter packaging technology in order to make it usable in future commercial applications and to ensure that it will be possible to reach the right price targets. Ownership and rights will be agreed according to the terms of the CA. P7 U2T plans to explore initial exploitation of the results of HECTO in the test and measurement equipment market in direct contact with manufacturers of this type of equipment. Competing technologies that have been demonstrated in field trials to be suitable for On-Off Keying at up to 112Gbit/s are not known today. No third party rights are known. Standards have not yet been established for 100GbE with serial signal. Some further additional research and development work is needed before products are ready, but the additional effort is limited. The partners believe they can carry out this additional work among the HECTO partners. No patents have been filed to date, but design details and know-how not described in publications may still be protected in the future.


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2. Transmitter components design The exploitable result is a packaged 100Gb/s transmitter. Partners involved: P1 KTH has developed DFB-TWEAM chip design methods, P3 Syntune has developed methods to fabricate DFB-TWEAM, P7 U2T has developed packaging methods. P7 U2T and P3 Syntune, with support from P1 KTH, plan exploitation of the packaged transmitter after a product development and qualifications phase (1-2 years after the project). Ownership and rights will be agreed according to the terms of the CA. Exploitation is planned in the communication market. Competing technologies that have been demonstrated in field trials to be suitable for On-Off Keying at up to 112Gbit/s are not known today. No third party rights are known. Standards have not yet been established for 100GbE with serial signal. Some further additional research and development work is needed before products are ready, but the additional effort is limited. The partners believe they can carry out this additional work among the HECTO partners. No patents have been filed to date, but design details and know-how not described in publications may still be protected in the future. 3. Receiver components design The exploitable result is a packaged 100Gb/s receiver (pin-TWA). Partners involved: P2 HHI has developed pin-TWA chip design methods, P7 U2T has developed packaging methods. P7 U2T and P2 HHI plan exploitation of the packaged receiver after improvement of the performance (Conversion Gain). Ownership and rights will be agreed according to the terms of the CA. Exploitation is planned in the communication and test&measurement market. Competing technologies that have been demonstrated in field trials to be suitable for On-Off Keying at up to 112Gbit/s are not known today. No third party rights are known. Standards have not yet been established for 100GbE with serial signal. Some further additional research and development work is needed before products are ready, but the additional effort is limited. The partners believe they can carry out this additional work among the HECTO partners. No patents have been filed to date, but design details and know-how not described in publications may still be protected in the future. 4. Improvement of photodiode components design The exploitable result is Improvement of photodiode components design. Partner involved: P7 U2T has developed packaging photodiodes. P7 U2T plan exploitation of packaged 100GHz photodiode modules. Ownership and rights will be agreed according to the terms of the CA. Exploitation is planned in the test&measurement market shortly after the project. Some further additional research and development work is needed before products are ready, but the additional effort is limited. The partner believes they can carry out this additional work. No patents have been filed to date, but design details and know-how not described in publications may still be protected in the future. 5. Advances in rf-design and simulation The exploitable result is advances in rf-design and simulation. Partner involved: P7 U2T has developed packaging photodiodes.P7 U2T plans exploitation of the knowledge in all its products. Exploitation is planned in the communication market shortly after the project. Some further additional research and development work is needed before products are ready, but the additional effort is limited. The partner believes they can carry out this additional work. No patents have been filed to date, but design details and know-how not described in publications may still be protected in the future.


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Section 2 – Dissemination of knowledge Dissemination in the 3rd reporting period Dissemination of work in and results of the project during the 3rd reporting period has been conducted in the following ways: P1 KTH has maintained a project web site, www.hecto.eu. P1 KTH has included public information about technologies used in HECTO, and mention of HECTO as a project, in lectures to MSc students in the KTH course “Photonics”. Over 30 students took part in the course, and most of these were international MSc students and European exchange students (through Erasmus) at MSc level. P1 KTH has included public information about technologies used in HECTO, and detailed description of HECTO as a project, in lectures to PhD students at both KTH and Chalmers Institute of Technology in the course “Photonic Devices and Circuits” November 2009 to February 2010. P7 U2T has presented the work on 100G components to its customers and potential customers in the test and measurement and systems market. P8 Nokia Siemens Networks has provided dissemination through:

• work in standardization bodies, IEEE Higher-Speed Study Group, IEEE 802.3ba Task Force and ITU-T

• contribution to the improvement of the HECTO web pages by clarifying copyright issues with respect to publication of HECTO-related publications on the HECTO web pages.

• establishing a description of HECTO on the web pages of Nokia Siemens Networks with a link to the HECTO-home page.

• updating of a Wikipedia page on 100GbE with link to the HECTO web site P9 UoP together with P1 KTH prepared a poster for presenting the project. The poster is shown in the following figure. P1 KTH also prepared a leaflet based on the poster. The poster has been printed and displayed at the conference ECOC2009 in Vienna by P9 UoP as well as locally by partners (for example at P1 KTH and P8 NSN).


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Figure 1: The HECTO poster

P9 UoP: ECOC 2008 Like in the previous reporting periods, HECTO was presented in an ECOC 2009 exhibition stand in Vienna between 20 and 24 September 2008. This year the stand was organised by the BONE network of excellence and was visited by many exhibition visitors. The HECTO poster was presented at the stand, and it attracted considerable interest among the visitors. Several other projects were represented including PHOSPHORUS, FUTON, ISIS, TRIUMPH, NOBEL2, POF-PLUS, and EUROFOS.


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Figure 2: View of the BONE stand at ECOC2009

Several of the partners have produced a number of publications related to and referring to HECTO, to a large extent as results of the hardware development in WP2 and WP3. Relevant submitted, accepted, or published publications are:

Publications by partners regarding technologies used and developed in HECTO

52. Fischer, T.: “Technical and economic feasibility of a 1×100G serial LAN PHY”. IEEE 802.3 Interim Meeting of Higher Speed Study Group, Monterey, CA, USA, January 16-18, 2007, http://grouper.ieee.org/groups/802/3/hssg/public/jan07/fischer_01_0107.pdf.

53. Jansen, S. L.; Derksen, R. H.; Schubert, C.; Zhou, X.; Birk, M.; Weiske, C.-J.; Bohn, M.; van den Borne, D.; Krummrich, P. M.; Möller, M.; Horst, F.; Offrein, B. J.; de Waardt, H.; Khoe, G. D.; Kirstädter, A.: “107-Gb/s full-ETDM transmission over field installed fiber using vestigial sideband modulation”, OFC 2007, Anaheim, California, USA, March 25-29, Dig. Tech. Pap., OWE3.

54. Derksen, R. H., Schubert, C., Jansen, S., Zhou, X., Birk, M.: “Field trial on 107-Gbit/s transmission with pure electrical time division multiplex over 160 km”, Photonische Netze: Vorträge der 8. ITG-Fachtagung vom 7. bis 8. Mai 2007 in Leipzig, (ITG-Fachbericht 201), VDE-Verlag, Berlin, Offenbach, 135-139.

55. Lehmann, G.; Derksen, R. H.; Schubert, C.; Winter, M.: “100 Gigabit Ethernet transmission - physical layer issues”. OFC 2007, Anaheim, California, USA, March 25-29, Dig. Tech. Pap., OThD5 (invited).

56. Derksen, R. H.; Möller, M.; Schubert, C.: ”100 Gbit/s full-ETDM transmission technologies”. CSICS 2007, Portland, Oregon, USA, Oct. 14-17, Dig. Tech. Pap., 89-92 (invited).


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57. Chacinski, M.G., Westergren, U., Thylén, L., Schatz, R., Stoltz, B.:“50 Gb/s Modulation and/or Detection with a Travelling-Wave Electro-Absorption Transceiver”, Optical Fiber Communication conference, OFC2008, Pres. no. JThA32

58. K. Schneider, R. Driad, R. E. Makon and G. Weimann: “Distributed Amplifier MMIC with 21 dB Gain and 90 GHz Bandwidth using InP-based DHBTs”, 2007 IEEE CSIC Symposium (CSICS) : IEEE Compound Semiconductor Integrated Circuit Symposium. Piscataway, NJ : IEEE, 2007, pp.67-70

59. R. Ludwig, C. Schubert; B. Huettl; C. Schmidt-Langhorst; R. Derksen, M. Moeller: “100 Gb/s ETDM receivers“, 20th Annual Meeting of IEEE LEOS, Lake Buena Vista, Florida, USA, Oct. 21-25, Dig. Tech. Pap., TuEE2 (invited)

60. A.Beling & al: “High-speed Miniaturized Photodiode and Parallel-fed Travelling-Wave Photodetectors Based on InP”, IEEE J. Sel.Topics in QE, Vol.13 (2007) pp 15-21.

61. H.-G. Bach: “Ultra High-speed Photodetectors and Photoreceivers for Telecom and Datacom also Aiming at THz Applications”, invited, April 25-27, 2007, Copenhagen, Denmark, Proceedings ECIO 2007, paper FB0.

62. H.-G.Bach: “Ultra-fast Efficient Photodiodes Exceeding 100 GHz Bandwidth”, invited paper, Int’l Conf. on Indium Phosphide & Related Materials (IPRM), May 14-18, 2007, Matsue, Japan (Proc. pp. 71-76).

63. M. Chacinski, U. Westergren, B. Willen, B. Stoltz, L. Thylen, “Electroabsorption Modulators Suitable for 100-Gb/s Ethernet”, IEEE Electron Device Letters, Volume 29, Issue 9, pp. 1014 – 1016, Sept. 2008

64. M. Chacinski, U. Westergren, B. Stoltz, L. Thylén, “Monolithically Integrated DFB-EA for 100 Gb/s Ethernet”, IEEE Electron Device Letters, vol29, no12, pp1312-1315, December 2008

65. M. Chaciński, U. Westergren, B. Stoltz, L. Thylén, “Monolithically integrated DFB-EAT for transmission faster than 50 Gb/s”, paper Th2A.3, 2nd International Conference on Transparent Optical Networks- 'Mediterranean Winter' 2008 (ICTON-MW’08), Marrakesh, Morocco, 11-13 December 2008

66. R. Driad, R. Makon, V. Hurm, K. Schneider, F. Benkhelifa, R. Lösch, J. Rosenzweig, “InP DHBT-based ICs for 100 Gbit/s data transmission”, Proc. 20th Int. Conf. Indium Phosphide and Related Materials, 25-29 May 2008 (IPRM), paper TuB2.2.

67. V. Hurm, F. Benkhelifa, R. Driad, R. Lösch, R. Makon, H. Massler, J. Rosenzweig, M. Schlechtweg, H. Walcher, “InP DHBT-based distributed amplifier for 100 Gbit/s modulator driver operation”, Electron. Lett.,vol. 44, no. 12, pp. 705-706, June 2008.

68. R. Driad, R. Makon, F. Benkhelifa, R. Lösch, “InP DHBT technology for 100 Gbit/s applications”, Int. Conf. Compound Semiconductor Manufacturing Technology (CS MANTECH), Chicago, IL, 14-17 April 2008, paper 12.5

69. R. E. Makon, R. Driad, R. Lösch, J. Rosenzweig, M. Schlechtweg, “100 Gbit/s fully integrated DHBT-based CDR/1:2 DEMUX IC”, Tech. Dig. 30th IEEE Compound Semiconductor Integrated Circuit Symp. (CSICS), Monterey, CA, 12-15 Oct. 2008, pp. 149-152.

70. C. Schubert, R. Makon, A. G. Steffan, R. Driad, R. Ludwig, C. Schmidt-Langhorst, „Characterization of an InP-based Electrical 1:2 Demultiplexer in a 107 Gb/s OOK System“, accepted for oral presentation at OFC, San Diego, USA, March 2009

71. M. Chacinski, U. Westergren, B. Stoltz, L. Thylén: ”Monolithically Integrated DFB-EAT for >=50 Gb/s Transmission”, 2nd International Conference on Transparent Optical Networks- 'Mediterranean Winter' 2008 (ICTON-MW’08), Marrakesh, Morocco, 11-13 December 2, paper Th2A.3, 2008

72. U. Westergren: ”HECTO FP6-STReP”, European Workshop on Photonic Solutions for Wireless, Access and in-House Networks, Duisburg, 18-20 May 2009

73. M. Chacinski, U. Westergren, P-Y. Fonjallaz, R. Schatz: ”Simultaneous Direct Detection of Signals Carried on Baseband and Subcarrier”, European Workshop on Photonic Solutions for Wireless, Access and in-House Networks, Duisburg, 18-20 May 2009


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74. S. Blaaberg, H.C.H. Mulvad, L.K. Oxenløwe, M. Chacinski, U. Westergren and B. Stoltz, “All-optical characterization of large-signal modulation bandwidth of a monolithically integrated DFB-EA”, Conference on Lasers and Electro-Optics, CLEO' 09, Baltimore, Maryland, U.S.A., May 2009. Paper CTuBB7.

75. U. Westergren, M. Chacinski, L. Thylén: ”Compact and efficient modulators for 100Gb/s ETDM for Telecom and Interconnect Applications”, Applied Physics A, Springer, Special issue on Photonics Interconnects, (June 2009) Vol. 95, No. 4, pp. 1039-1044

76. M. Chacinski, R. Schatz, U. Westergren, A. Djupsjöbacka: ”Extension of a 40 Gbps link with a directly detected 2.5 Gbps subcarrier channel”, 11th International Conference on Transparent Optical Networks (ICTON), Session (and paper) Mo.C5.4, June 2009

77. ”Miniaturized monolithic transceivers promise to boost Ethernet capacity”, Compound Semiconductor Magazine, Vol 15, No 5, July 2009, pp29-31, interview with U. Westergren

78. M. Heiland: ”Modeling of Device Characteristic Effects on Traveling-Wave Electroabsorption Modulator Performance”, MSc Thesis (Erasmus Mundus), KTH, Stockholm, Sweden, June 2009, TRITA-ICT-EX-2009:85

79. M. Chacinski, U. Westergren, B. Stolz, L. Thylen, R. Schatz, S. Hammerfeldt: ”Monolithically Integrated 100 GHz DFB-TWEAM”, Journal of Lightwave Technology, vol 27, no 16, pp 3410-3415, August 15, 2009

80. U. Westergren: ”Compact and efficient modulators for 100Gb/s and beyond”, International Nano-Optoelectronic Workshop, iNOW2009, Stockholm and Berlin, August 2-14, 2009

81. R. Driad, R.E. Makon, V. Hurm, F. Benkhelifa, R. Lösch, J. Rosenzweig, M. Schlechtweg "InP-based DHBT technology for high-speed mixed signal and digital applications" (INVITED), 21st Int. Conf. on InP and Related Materials, Newport Beach (USA), May 10-14, 2009

82. M. Schlechtweg, A.Tessmann, I. Kallfass, A. Leuther, R. Weber, S. Chartier, R. Driad, R. E. Makon, V. Hurm, H. Massler, M. Kuri, F. Benkhelifa, R. Lösch, J. Rosenzweig, and O. Ambacher "High-Performance MMICs and High-Speed Mixed-Signal ICs Based on III/V HEMT and HBT Technology for Sensors and Communication" (INVITED), Semiconductor Conference Dresden, Dresden (Germany), April 29 - 30, 2009

83. M. Schlechtweg, A. Tessmann, I. Kallfass, A. Leuther, R. Weber, S. Chartier, R. Driad, R.E. Makon, V. Hurm, M. Seelmann-Eggebert, H. Massler, M. Kuri, M. Riessle, M. Zink, F. Benkhelifa, R. Lösch, J. Rosenzweig, O. Ambacher "MMICs and mixed-signal ICs based on III/V technology for highest frequencies and data rates", Frequenz (J. of RF-Engineering & Telecommunications), 63 (2009) p. 5-6

84. C. Matrakidis, D. Alexandropoulos, C.(T.) Politi, A. Stavdas, “Tx and Rx Component Modelling for 100 Gb/s Transmission Link Simulations,” ICO-PHOTONICS-DELPHI2009, 7-9 October 2009

85. V. Hurm, R. E. Makon, R. Driad, F. Benkhelifa, R. Lösch, H. Massler, M. Riessle, J. Rosenzweig, M. Schlechtweg, A. Tessmann, H. Walcher, “InP DHBT-based modulator driver module for 100 Gbit/s Ethernet applications”, Electron. Lett., vol. 45, no. 24, pp. 1264-1266, Nov. 2009.

86. R. E. Makon, R. Driad, R. Lösch, J. Rosenzweig, M. Schlechtweg, and O. Ambacher, “InP DHBT-based 1:2 DEMUX IC operating at up to 120 Gbit/s”, Electron. Lett., vol. 45, no. 25, pp. 1340-1342, Dec. 2009.

87. M. Chacinski: ”Dynamic Characterization of Semiconductor Lasers and Intensity Modulators”, Doctoral Thesis in Photonics, KTH, Stockholm, Sweden, September 2009, TRITA-ICT/MAP AVH Report 2009:8, ISSN 1653-7610, ISRN KTH/ICT-MAP/AVH-2009:8-SE

88. Ke Wang, Jie Li, Anders Djupsjöbacka, Sergei Popov, Gunnar Jacobsen, Robert Elvis Makon, Rachid Driad, Herbert Walcher, Andreas G. Steffan, Heinz-Gunter Bach, “100 Gb/s OOK Transmission Through 212 km Field SSMF Using Monolithically Integrated ETDM Receiver Module”, Asia Communications and Photonics Conference and Exhibition (ACP) 2009, paper TuE1.


Contract No 033868


89. Chacinski, M.; Westergren, U.; Thylen, L.; Stoltz, B.; Rosenzweig, J.; Driad, R.; Makon, R. E.; Li, J.; Steffan, A.: "ETDM Transmitter Module for 100-Gb/s Ethernet", IEEE Photonic Technology Letters, volume 22, issue 2, pp. 70-72, Jan 15th 2010

90. M. Chacinski, U. Westergren, B. Stoltz, R. Driad, R.E. Makon, V. Hurm, and A.G. Steffan, “100Gb/s ETDM Transmitter Module”, accepted for publication in IEEE Journal of Selected Topics in Quantum Electronics, 2010

91. M. Chacinski, U. Westergren, B. Stoltz, R. Driad, R. E. Makon, V. Hurm, J. Rosenzweig, Jie Li, A. G. Steffan: "Transceiver Modules Utilizing Travelling-Wave Electro-Absorption Modulator", Optical Fiber Communication Conference (OFC), March 21-25, 2010, San Diego, California, USA, Pres. number: OWN4

92. K. Wang, J. Li, A. Djupsjöbacka, M. Chacinski, U. Westergren, S. Popov, G. Jacobsen, V. Hurm, R. E. Makon, R. Driad, J. Rosenzweig, A. G. Steffan, G. G. Mekonnen, H.-G. Bach: "100Gbit/s Complete ETDM System Based on Monolithically Integrated Transmitter and Receiver Modules", Optical Fiber Communication Conference (OFC), March 21-25, 2010, San Diego, California, USA, Pres. number: NME1

93. H.-G. Bach, invited: “Photodetectors and Receivers for 100 GbE Applications”, 217th Electrochemical Society Meeting ECS 2010, 25.4. - 30.4.2010, Vancouver, Canada, paper/abstract #1063.

94. H.-G. Bach, R. Kunkel, G.G. Mekonnen, R. Zhang, D. Schmidt, invited: “Waveguide-integrated Components Based 100 Gb/s Photoreceivers: From Direct to Coherent Detection”, Proceedings 22th IPRM 2010, May 31 - June 4, 2010, Takamatsu, Japan, paper FrA1-1.

95. C. Schubert, R. E. Makon, A. G. Steffan, R. Driad, H.-G. Bach, G.G. Mekonnen, R. Zhang, R. Ludwig, C. Schmidt-Langhorst: „InP-basierte elektrische und elektro-optische Komponenten für 112 Gbit/s OOK Systeme“, 11. ITG-Fachtagung Photonische Netze, 3.-4. Mai 2010, Deutsche Telekom Hochschule für Telekommunikation Leipzig.

96. Chenhui Jiang, Viktor Krozer, Heinz-Gunter Bach, Giorgis G. Mekonnen, Tom K. Johansen: „Broadband Packaging of Photodetectors for 100 Gbit/s Ethernet Applications“, 2010, submitted to IEEE Microwave and Wireless Components Letters.

97. Gebirie Yizengaw Belay, “Investigation and Optimization of Large Signal Effects on Travelling Wave Electroabsorption Modulator Performance and Optimization”, MSc thesis, KTH, June 2010

98. R. H. Derksen, K. Wang, J. Li, A. Djupsjöbacka, G. Jacobsen, M. Chaciński, U. Westergren, S. Popov, V. Hurm, R. E. Makon, R. Driad, H. Walcher, J. Rosenzweig, A. G. Steffan, G. G. Mekonnen, H.-G. Bach, C. Schubert, “Setting the stage for 100GbE serial standard - the HECTO project”, accepted for presentation at World Telecommunications Congress 2010 (WTC2010).

99. C. Schubert, Jie Li, H.-G. Bach, G.G. Mekonnen, R. Makon, R.H. Derksen, V. Hurm, A. Djupsjöbacka, M. Chacinski, U. Westergren, A.G. Steffan, R. Driad: "Characterization of a pin-TWA Photoreceiver in OOK-System Experiments up to 112 Gb/s", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for oral presentation

100. Jie Li, C. Schubert, R.H. Derksen, R. Makon, V. Hurm, A. Djupsjöbacka, M. Chacinski, U. Westergren, H.-G. Bach, G.G. Mekonnen, A.G. Steffan, R. Driad, H. Walcher, J. Rosenzweig: "112 Gb/s Field Trial of Complete ETDM System Based on Monolithically Integrated Transmitter & Receiver Modules for Use in 100GbE", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for poster presentation

101. M. Chacinski, U. Westergren, L. Thylén, R. Schatz, Jie Li, A. Djupsjöbacka, B. Stoltz: "Modulation and chirp evaluation of 100 GHz DFB-TWEAM", 36th European Conference on Optical Communication, ECOC2010, Sept 19-23, 2010, Torino, Italy, accepted for oral presentation


Contract No 033868


102. R.E. Makon, R. Driad, C. Schubert, R. Lösch, H. Walcher, J. Rosenzweig, M. Schlechtweg, and O. Ambacher "107-112 Gbit/s Fully Integrated CDR/1:2 DEMUX Using InP-based DHBTs", Proc. European Microwave Integrated Circuits (EuMIC) Conf., Paris (France), September 27-28, 2010

Popular presentations (some in domestic media in Sweden and Germany) P1 KTH: U. Westergren interviewed in: -Compound Semiconductor Magazine, ”Miniaturised monolithic transceivers promise to boost Ethernet capacity”, pp 29-31, July 2009 -Elektroniktidningen, “KTH-försök ger hopp om 100 Gbit Ethernet”, 20 April 2010 -Affärsvärlden, “Superbredbandet är här”, 21 April 2010 -Computer Sweden, “Rekordsnabb dataöverföring”, 22 April 2010 -PC för alla, “112 gigabit i sekunden när KTH trimmar fibernät”, 22 April 2010 -Datormagazin, ”Forskare fixar rekordsnabbt nätverk”, 23 April 2010 -Ingenjören, ”KTH testade fetaste nätverket”, 24 April 2010 P8 NSN: Several popular articles following the press release: ”EU funded collaboration results in simpler 100 Gigabit Ethernet networks” (a Google search gave about 300 hits in mid-June 2010)


Contract No 033868


Planned dissemination P1 KTH will maintain the project web site, www.hecto.eu including lists of titles and abstracts of all publications related to the project. P1 KTH will continue to include updated public information about technologies used in HECTO in lectures to MSc and PhD students in the course “Photonics” at KTH and in the PhD student course “Photonic Devices and Circuits” offered approximately bi-annually together with CTH. P2 FhG/HHI plans short term dissemination of the HECTO results by publications, in lectures to PhD students and through its own web site. P6 Acreo will maintain the already working complete HECTO system as a live demo showpiece for marketing activities of P6 Acreo. Furthermore, the already developed HECTO system and the separate Tx & Rx modules can also be used for educational activities within Acreo (in cooperation with, e.g., P1 KTH), both on the master level and for the PhD students. One example of this is that a live demo of HECTO system already had been carried out for the master students in the Photonics program of P1 KTH in April 2010, and will most likely be repeated even for the next few years. In addition, separate HECTO modules can also be used for other research purposes, e.g., the DFB-TWEAM module can be used both for data modulation and as a light carver to generate high repetition-rate optical pulse trains for the research in OTDM systems and optical signal processing. The generated optical pulse train can also be used as a pulsed local oscillator for high-speed OTDM coherent receivers. Several partners plan further publication of results also after the end date of the project, especially regarding the successful systems tests and field trial.


Contract No 033868


Overview table Planned/

actual Dates

Type

Type of

audience

Countries addressed

Size of audience

Partner responsible

/involved May 2007

Short lecture series and computer exercise

MSc and PhD students at KTH

Sweden 40 P1 KTH

June 2007


PhD students at KTH and CTH

Sweden 10 P1 KTH

2007 and continuing

Participation in the IEEE Higher Speed Study Group Meetings*

International companies involved in 100GbE standardization

Int** Large*** P8 NSN

March 2007

Participation in the conference OFC2007, Anaheim, California, USA

International companies and universities

Int** Large*** P8 NSN, P2 FhG/HHI

May 2007

Presentation at ITG-Fachbericht 201

Engineers and researchers

Germany P8 NSN

May 2007

Participation in the conference IPRM2007, Matsue, Japan


Int** Large*** P2 FhG/HHI

September 2007

Presentation of HECTO at the IST ECOC booth, Berlin, Germany

European companies and universities

Europe (and int**)

Large*** P9 UoP

October 2007

Participation in the conference CSICS 2007, Portland, Oregon, USA


Int** Large*** P4 FhG/IAF, P8 NSN

February 2008

Participation in the conference OFC2007, San Diego, USA


Int** Large*** P1 KTH

May 2008

Participation in the conference IPRM 2008*


Int** Large*** P4 FhG/IAF

May 2008


MSc and PhD students at KTH

Sweden 30 P1 KTH

April 2008

Participation in the conference CS MANTECH 2008*



2008-2009

Press releases to be sent to appropriate specialized press such as Fibre Systems Europe, Optics and Lasers in Europe, etc, when results are available

Both experts and a more general audience

Int** Large*** P8 NSN after input from the other partners

2008-2009

Translated or identical press releases to be distributed to technical publications at a national level or even national mass media to increase the public awareness of HECTO results.


National and Int**

Large*** P8 NSN after input from the other partners

September 2008

Presentation of HECTO at the exhibition at ECOC2008, Brussels, Belgium


Europe (and int**)

Large*** P9 UoP

2008 Posters and leaflets to be used for presentation of HECTO by partners


Int** Large*** P1 KTH and other partners

October 2008

Participation in the conference CSICS 2008*




Contract No 033868


Planned/actual Dates

Type

Type of

audience

Countries addressed

Size of audience

Partner responsible

/involved November 2008

Participation in the workshop High Speed Interconnects, Stuttgart, Germany


National and Int**

Small P4 FhG/IAF

May 2009

Participation in the conference IPRM 2009*



September 2009

Participation in the conference ECOC2009*


Europe (and int**)

Large*** All partners with relevant results

March 2009

Participation in the conference OFC2009, San Diego, USA*


Int** Large*** P2 FhG/HHI

March 2010

Participation in the conference OFC2010, San Diego, USA*


Int** Large*** P1 KTH, P6 Acreo

2010 Field trial demonstration with prototype transmitter and receiver*


Int** Large*** P6 Acreo

2010 Template data sheets Potential future customers among network operators

Int** Large*** P8 NSN

2010 Press releases* General public Int** Large*** P8 NSN

2010 Press releases* General public Int** Large*** P1 KTH *) For more details, see the list of publications above **) International ***) “Large” refers to audiences primarily consisting of for example conference participants but information also being made available to a wider range of people due to distribution of proceedings, printed versions of presentations etc


Contract No 033868


Section 3 – Publishable results Transmitters have been developed with Travelling-Wave Electro-Absorption Modulators (TWEAM) with bandwidths of 100GHz or more, integrated with continuous-wave lasers. Electronic driver amplifiers and multiplexers have been developed for the connection between the modulators and external electronics at lower speeds.

Figure 3. Typical appearance of the 112 Gbit/s 2:1 MUX modules developed by P4 FhG/IAF.

Figure 4. Modulator driver module developed by P4 FhG/IAF (RF input is on the bottom, output on the top; module size is 30 × 21 × 15mm3).


Contract No 033868


Figure 5: Finished DFB-TWEAM transmitter module, with chips developed by P1 KTH and P3 Syntune, packaging by P7 U2T, photo taken in the systems measurement

setup at P6 Acreo. Receivers with bandwidths on the order of 100GHz have been developed with waveguide pin diodes integrated with electronic amplifiers (pin-TWA), and the required high-speed electronic circuits for electrical clock recovery and demultiplexing to lower speeds were also developed.

Figure 6: Fabricated wafer from maskset WARP100ADV with various pin-TWAs developed by P2 FhG/HHI, comprising among others a pinTWA in cascode design, containing 10

HEMTs within the TWA.


Contract No 033868


Multiplexer & Driver amplifier Developed by FhG / IAF Packaging by FhG / IAF

DFB-TWEAM Developed by KTH & Syntune

Packaging by U2T

Technology applications by NSN & UoP

Component characterization by DTU & FhG / HHI Field trials by ACREO

Clock and Data Recovery & Demultiplexer

Developed by FhG / IAF Packaging by FhG / IAF

Photodetector & Preamplifier Developed by FhG / HHI

Packaging by U2T

112Gbit/s electrical interfaces

2x56Gbit/s electrical input signals

2x56Gbit/s electrical output signals

Transmitter

Receiver

112Gbit/s optical signal

Successful field trials

Figure 7. Typical appearance of the 107-112 Gbit/s CDR/1:2 DEMUX modules developed by P4 FhG/IAF (based on 0.7µm DHBTs) with 1mm input connector.

Figure 8. Summary of the HECTO project with all developed components and an example of

measured eyediagram at 112Gbit/s


Contract No 033868


To ensure that the produced modules will meet the demands of the future market, technology application assessment accompanied the technical investigation and development. The components were successfully tested in systems experiments up to 112Gb/s. Successful field trials over more than 40km of field-installed fibre were conducted.

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