About Hemlock Semiconductor GroupHemlock Semiconductor Group (Hemlock Semiconductor) is comprised

of several joint venture companies owned in majority by Dow Corning

Corporation. Hemlock Semiconductor is a leading provider of polycrystalline

silicon and other silicon-based products used in the manufacturing of semi-

conductor devices, and solar cells and modules. Hemlock Semiconductor

began its operations in 1961.

In total, Hemlock Semiconductor has announced investments of up to

$4.5 billion since 2005 to increase polysilicon capacity to meet the growing

needs of the solar industry.

About PolysiliconAn ultra-pure version of polysilicon is the base material for silicon wafers

used in electronic devices. Nearly one in three electronic devices in the

world contain polysilicon from Hemlock Semiconductor. Polysilicon is the

cornerstone material used to produce solar cells that convert energy from

the sun into electrical current. Polysilicon production is the first step in the solar

supply chain. A series of global solar manufacturing companies will convert

the polysilicon into thin wafers, which are used for solar cells. Ultimately, the

solar cells are built into solar panels and arrays that provide electrical power

for residential, commercial, municipal and utility-scale applications.

Hemlock Semiconductor Group’s World Headquarters andMichigan Site12334 Geddes RoadP.O. Box 80Hemlock, MI 48626 USA+1 989 301 5000

Hemlock Semiconductor Group’s Tennessee Site1000 Solar WayClarksville, TN 37040 USA+1 931 614 1000

LeadershipDenise BeachyPresident

Hemlock Semiconductor Group – Fast Facts

hscpoly.com

Image: HSCAV00180, HSCAV00132The information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that our products are safe, effective and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.

The sole warranty of the Hemlock Semiconductor Group companies is that our products will meet the sales specifications in effect at the time of shipment.

Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.

HEMLOCK SEMICONDUCTOR SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY.

HEMLOCK SEMICONDUCTOR DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES.

HSC is a registered trademark of Dow Corning Corporation.Dow Corning is a registered trademark of Dow Corning Corporation.XIAMETER is a registered trademark of Dow Corning Corporation.©2011, 2012, 2013, 2014 Hemlock Semiconductor Corporation and Hemlock Semiconductor, L.L.C. All rights reserved.

Printed in USA 30019679 Form No. 01-4107G-01

1957: Dow Corning implements technology to manufacture polycrystalline silicon

1960: Hemlock Semiconductor’s Michigan site built in Hemlock, Michigan, USA

1961: First year in production

1979: Hemlock Semiconductor Corporation is formed as a wholly owned subsidiary of Dow Corning Corporation

1984: Hemlock Semiconductor becomes a joint venture of Dow Corning and two of Japan’s largest single-crystal wafer manufacturers, Shin-Etsu Handotai Co., Ltd., and Mitsubishi Materials Corporation

1992: ISO 9002 registration received

1994: Hemlock Semiconductor becomes one of the world’s largest producers/suppliers of polycrystalline silicon

1998: Expansion to produce 35 percent more polycrystalline silicon completed; finishing expansion and technology enhancements provide an ultra-clean polysilicon product

2005: $500 million expansion that will increase capacity by 100 percent announced; construction begins

2007: $1 billion expansion to increase the company’s total annual output of polysilicon to 36,000 metric tons announced; construction begins

2008: The $500 million expansion announced in 2005 begins operating, increasing capacity to approximately 19,000 metric tons

2008: Investment of up to $2.2 billion announced to expand the Michigan site and to develop a new manufacturing site in Clarksville, Tennessee, USA

2009: Operation of Phase 1 of the $1 billion expansion announced in 2007 commences, increasing capacity to approximately 27,500 metric tons

2009: Construction begins on the Tennessee site

2009: Hemlock Semiconductor donates $2 million in laboratory equipment for the new Chemical Engineering Technology program at Austin Peay State University in Clarksville, Tennessee

2010: Tennessee site project team moves into the first on-site building

2011: Hemlock Semiconductor celebrates 50th anniversary

About Dow Corning CorporationDow Corning Corporation (dowcorning.com) is the majority shareholder in the Hemlock Semiconductor Group (hscpoly.com) joint ventures. Dow Corning provides performance- enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® (xiameter.com) brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States.

Global Media RelationsJarrod ErpeldingPhone: +1 989 301 5467Email: jarrod.erpelding@dowcorning.com Social Media

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Hemlock Semiconductor Group – Historical Timeline