heterogeneous integraon roadmap presented by william (bill...
TRANSCRIPT
HIRRoadmapWorkshopPresenta3on2017
HeterogeneousIntegra-onRoadmapPresentedbyWilliam(Bill)Chen
Presenta3onAgenda1.TechnologyRoadmapsfortheElectronicIndustry
• TheBeginningofITRS• Adifferentworld• TheendofITRS
2.HeterogeneousIntegra3onRoadmap(HIR)• There-inven-onofTechnologyRoadmap• CPMT,SEMI,EDS,Photonics&ASMEEPPDCollabora-on• HIRMissionStatement• TechnicalWorkingGroups
3.HIRtodayand2016Schedule4.Summary
HistoricalTransi3onOfITRS USDomes3c Interna3onal
1991MicroTech2000WorkshopReport
1997NTRS
2001ITRS
1998WorldSemiconductorCouncil
1999ITRS
1994NTRS
1992NTRS
2000
1998
2002
UpdateVersion
2003ITRS
UpdateVersion
UpdateVersion
UpdateVersion
OddYear:MajorRevisionEvenYear:TableUpdate
ITRSStructureIRC&TWGs
ITWG
• Policy• Goal• Schedule• Coordina3onamongITWGs
• Coordina3onamongAssocia3ons
IRC
TechnologyNeedsPoten3alSolu3ons
innear&longterms
TWG
TWG
TWG
TWG
TWG
ESIA
KSIA
SIA
TSIA
JEITASTRJ)
DesignTestFEP
etc
In2014ITRS2.0wascreatedtoaddanoverlayof7focusteams.OneoftheFocusteams,Heterogeneous
Integra3on,wastaskedtoaddressmarketchanges.
TechnologyRoadmapsProliferated
--ShortlyaNertheiNEMIRoadmapwasestablishedin1994,acollabora-onbetweeniNEMIandtheITRSAssemblyandPackagingTechnicalWorkingGroupbegan,whichcon-nuedthroughthe2015edi-onoftheITRS
--JissoRoadmap,establishedinJapanin2001,expandedtheTechnologyRoadmaptocoverabroaderrangeoftechnologyfromdesigntosystems
--IPCestablishedaroadmapin2006
--Manynewroadmapsappearedwithvaria-onsinfocusrangingfromtheEPCRoadmapwithRFIDfocustoMIT’sCommunica-onsTechnologyRoadmap,andtheNISTsponsoredPSMCRoadmap.
23yearslater...
….theworldhasevolvedandis
changinginwaysneverimagined.
Worldlargestcompaniesbymarketcapitaliza3onSource:TheEconomist,September17th2016.SpecialReportCompanies,page5.
2006DEC31st• ExxonMobil• GeneralElectric• Gazprom• Microsob• Ci3corp• BankofAmerica• RoyalDutchShell• BP• PetroChina• HSBC
2016Aug24th• Apple• Alphabet(Google)• Microsob• BerkshareHatheway• ExxonMobile• Amazon• Facebook• Johnson&Johnson• GeneralElectric• ChinaMobile
2006DEC31st• ExxonMobil• GeneralElectric• Gazprom• Microsob• Ci3corp• BankofAmerica• RoyalDutchShell• BP• PetroChina• HSBC
2016Aug24th• Apple• Alphabet(Google)• Microsob• BerkshareHatheway• ExxonMobile• Amazon• Facebook• Johnson&Johnson• GeneralElectric• ChinaMobile
CompaniesintheintheIncreasinglyConnectedWorldSource:TheEconomist,September17th2016.SpecialReportCompanies,page5.
IoTtoIoE
Smartdeviceseverywhere
Datatotheclouds FutureAutomo-ve
areality
TheEndOfTheITRS
--Thebravenewconnectedworld,IoT/IoE,SmartDevices&Migra3ontotheCloudcannolongerbepacedbyMoore’sLawScalingofCMOS
--SIAannouncedinfallof2015thatITRSwillbebroughttoclosurewiththe2015Edi3on.ThefinalITRSedi3onwaspublishedJuly8th2016.
--IEEECPMTSocietystartedplanningfortheHeterogeneousIntegra3onRoadmap(HIR)Ini3a3vetofillthevoidin2015.DiscussionsensuedwithEDS&SEMItore-inventtheTechnologyRoadmapfortoday’smarket&technologyneedsandlookahead15yearsintothefuture.
HeterogeneousIntegra3onRoadmapRe-inven3ngtheTechnologyRoadmapfortheElectronicIndustry
FocusedonSystemLevelIntegra3onofDiverseComponentsfortheworldofIoT/IoE,SmartDevicesandmigra3ontotheCloud
Semiconductors-Sensors-MEMS-Photonics-Systems
IEEECPMTIni3a3vetoCon3nueHeterogeneousIntegra3onRoadmapMission
--TheCPMTSocietybelievesitisimportanttocon-nuethisHeterogeneousIntegra-onRoadmapfunc-onfortheprofession,industryandtheen-retechnicalcommunity.
--TheBoarddecidedtobringtheHeterogeneousIntegra-onRoadmapfunc-onandac-vi-esintoCPMT,withtheinten-onofexpandingthecollabora-ontoincludeotherIEEETechnicalSocie-esandothersorganiza-onsthatsharesthevision.
--InMarch2016,CPMTBoardformallyendorsedlaunchingtheHeterogeneousIntegra-onRoadmap.
--SEMIhasalonghistoryofcollabora-onwithCPMT.SEMIdecidedtojoinincollabora-onoftheHeterogeneousIntegra-onRoadmapIni-a-veinApril,amonthaNerthevoleoftheCPMTBoG.
--IEEEElectronDevicesSociety(EDS)Board&PhotonicsSocietyBoardsvotedtojoinintheHIRcollabora-on.
--LastmonthASMEElectronic&PhotonicsDivision(EPPD)votedtojoininHIRcollabora-on
HIRCollabora3on
Todayfiveorganiza3onsCPMT,SEMI,EDS,Photonics&ASMEEPPDareworkingtogetherincollabora3ontodeliverthisHeterogeneousIntegra3onRoadmaptoserveourprofession,
industry,academia,andresearchins3tutes,tomeetthechallengesofthisnewworldofrapidmarketdisrup3onandboldtechnologyinnova3on.
HeterogeneousIntegra3onDefinedHeterogeneousIntegra3onreferstotheintegra3onofseparatelymanufacturedcomponentsintoahigherlevelassembly(SiP)that,intheaggregate,providesenhancedfunc3onalityandimprovedopera3ng
characteris3cs.
Inthisdefini3on,componentsshouldbetakentomeananyunitwhetherindividualdie,MEMSdevice,passivecomponentandassembledpackageorsub-systemthatareintegratedintoasinglepackage.Theopera3ngcharacteris3csshouldalsobetakeninitsbroadestmeaningincludingcharacteris3cssuchas
systemlevelperformanceandcostofownership.
HIRMissionStatement
ThemissionofthisHeterogeneousIntegra3onRoadmapistoprovideguidancetotheprofession,industry,academiaandgovernmentto
iden3fykeytechnicalchallengeswithsufficientlead3methattheydonotbecomeroadblockspreven3ngthecon3nuedprogressin
electronics.Thatprogressisessen-altothefuturegrowthoftheindustryandtherealiza-onofthepromiseofcon-nuedposi-ve
impactonmankind.Theapproachistoiden-fytherequirementsforheterogeneousintegra-onintheelectronicsindustrythrough2031,determinethedifficultchallengesthatmustbeovercometomeet
theserequirementsand,wherepossible,iden3fypoten3alsolu3ons.
Electronic/PhotonicSiPthroughHeterogeneousIntegra3on
MechanicalAssy-Laserwelding-Flexbending
Antenna-Packageintegra3onfor2.4G/5G/60GHz
Passives/IPD-IntegratedPassive
Devices
Die/PkgStacking-Diethinning
-Dieinterconnect
EmbeddedTechnology-Passivecomponent
-Ac3vedevice
Molding-MUF
-Exposeddie
WaferBumping/WLP-Lead-free/CuPillar-Fanout&2.5D+3D
Interconnec3onFlipChip&WireBond
SMT-Passives-Components-ConnectorsShielding
-Boardorpackagelevel-Compartmental
Photonics
PhotonicsLayerPICChip-op3calbus
Source:ASEwithaddi3ons
HybridFlexInterconnect
Fan Out SiP
• HeterogeneousIntegra-on• Mul--die,Passives,MEMs/Sensor
• SysteminPackage(SiP)
• ChipFirstandChipLast Die1
Die2 Die3
Mul-SourcedDie
XTAL
MEMS
MEMS,XTALs,etc
Passives
Die1
Die2
Die3
XTAL MEMS
FanOutSiP
+ +
FOChipFirst(eWLBLike)
FOChipLastPackageFOCLP
iPhone7Processor–MemoryHeterogeneousIntegra3onSource:PrismarkPartners
© Prismark Partners LLC 4
APPLE A10 FUSION• 14.4 x 15.5mm InFO PoP Package
– ~1300 balls at 0.4mm pitch – 825µm package height
• Memory package with 5 die (4 shown)– Die Thickness:105µm – 170µm EMC thickness over die– 3L substrate; 100µm thick– 386 balls at 0.3mm pitch – Underfill between packages
• Processor : 11.6 x ~10.8mm– 165µm thick; 12µm “top coat”– 50µm thick 3 Layer RDL
Photos source: Prismark/Binghamton University
916.6/193bp
AMDFiji(2.5D)PackageSource:ASE
Decouplingcapacitor
Decouplingcapacitor
s-ffener Stackedmemory GPU s-ffener
PackageSubstrate
Stackedmemory
GPUdieStackedmemoryHBM Stackedmemory
HBM
6
HIRTECHNICALWORKINGGROUPS(TWGs)
HIRisaddingaSupplyChainTWGfocusedonpre-compe33verequirementswithLeadershipfromIntel
HeterogeneousIntegra3onComponents1. SingleChipandMul3ChipPackaging(including
Substrates)
2. IntegratedPhotonics3. IntegratedPowerDevices4. MEMS&Sensors
5. RFandAnalogMixedSignal
CrossCumngtopics6. Materials&EmergingResearchMaterials
7. EmergingResearchDevices
8. Interconnect9. Test
Integra3onProcesses10. SiP11. 3D+2.5D12. WLP(faninandfanout)
PackagingforSpecializedApplica3ons13Mobile
14.IoT,Wearable&ConsumerElectronics
15.MedicalandHealth
16.Automo3ve
17.HighPerformanceCompu3ng
Design18.Co-Design&Simula3on–Tools&Prac3ceDevice,package,subsystem&systemlevels
FromITRStoHIRITRS:
1991-2015• Precompe22ve
• 15 years outlook & 25 years for emerging materials & devices
• Sponsored by five global semiconductor associa2ons. Appoint IRC & approve governance
• Volunteer driven
• Free access
• CMOS “Moore’s Law” node driven
• 17 Technical Working Groups
HIR:2016--
• Precompe22ve
• 15 years outlook & 25 years for emerging materials & devices
• Sponsored by IEEE technical socie2es & organiza2ons with similar outlook. Appoint IRC & approve governance
• Volunteer driven
• Free access
• Systems & applica2on driven
• 19 Technical Working Groups
HeterogeneousIntegra3onRoadmap§ RoadmapWebLinkhnp://cpmt.ieee.org/technology/heterogeneous-integra3on-roadmap.html• Background• Mission• Purpose• Comminee• Scope• Schedule
§ RoadmapComminee• WilliamChen,W.RBonoms,TomSalmon,SubuIyer,AmrHelmy,RaviMahajan
HowdowegetHIRofftheGround?
GlobalTechnicalConferences&Chapterworkshopstomeetfacetofacewiththetechnicalcommunityandinterested
contributorsworldwide
CalendarOfHIR2016Events1. ECTC+ITHERMLasVegas,NVUSA05/31-06/042. PaloAltoWorkshopbeforeSEMICONWEST,July10th20163. SEMICONWESTSanFrancisco,CAUSA,July11th,July11th,20164. JapanAugust9th,2016attheNagaseR&DCenterinTokyo5. TaiwanatITRIAugust12th,20166. ICEPTinWuhan,ChinaAugust16th,2016hhp://www.icept.org/en/7. ESTCGrenoble,FranceSeptember13th,20168. IEMT-EMAPPenang,MalaysiaSeptember20th,20169. ELECTRONICSPACKAGINGSYMPOSIUMBinghamton,NYUSAOctober5th,201610. IMPACTTaipei,TaiwanOctober26th,201611. ICSJKyoto,JapanNovember7th,201612. MEPTECHeterogeneousIntegra-onRoadmapSymposium,HolidayInn,SanJose,Ca.November14th,201613. EPTCSingaporeNovember30th,201614. IEDMSanFranciscoDecember2016
HIRConferencePresenta3ons2016• ConFabCPMTSessionLasVegasJune14th-BillBohoms
• 3DPEIMConferenceNCStateJune14th–BillChen
• ASMEInterPackWorkshopJune21st–BillChen
• MITMicrophotonicsCenterJune25th–BillBohoms
• SEMICONWestJuly13th–BillBohoms&BillChen
• IEMT-EMAPConference,Penang,Sept20th–BillChen
Thesepresenta3onsareresul3nginmanygroupsengagingincollabora3onwithHIR
HIR2017PlannedEvents1.ICEP2017(JIEP)YamagataJapan4/19-222.ECTCOrlando,FL,USA5/30-6/043.PaloAltoWorkshopbeforeSEMICONWEST,PaloAlto,CA,USA7/94.SEMICONWESTSanFrancisco,CAUSA7/105.InterPACK(ASME)SanFrancisco,CA,USA8/29-9/16.ELECTRONICSPACKAGINGSYMPOSIUM,NiskayunaNY,USA9/19-207. IEEE PHOTONICS CONFERENCE, Lake Buena Vista, FL, USA, 10/1-5 8.IMPACTTaipei,Taiwan10/25-269.ICSJKyoto,Japan11/20-2210.EPTCSingapore12/3-511.AugustAsiaworkshopsunderplanningA.ICEPT,HarbinChina8/16-19B.ITRIinHsinchu,TaiwanC.TokyoworkshopwithCPMTJapan,JIEP&SEMIJapan
HIRTECHNICALWORKINGGROUPS(TWGs)
HIRisaddingaSupplyChainTWGfocusedonpre-compe33verequirementswithLeadershipfromIntel
HeterogeneousIntegra3onComponents1. SingleChipandMul3ChipPackaging(including
Substrates
2. IntegratedPhotonics3. IntegratedPowerDevices4. MEMS
5. RFandAnalogMixedSignal
CrossCumngtopics6. Materials&EmergingResearchMaterials
7. EmergingResearchDevices
8. Interconnect9. Test
Integra3onProcesses10. SiP11. 3D+2.5D12. WLP(faninandfanout)
PackagingforSpecializedApplica3ons13.Mobile
14.IoTandWearable
15.MedicalandHealth
16.Automo3ve
17.HighPerformanceCompu3ng
Design18.Co-Design&Simula3on–Tools&Prac3ce
• Device,package,subsystem&systemlevels
HIRRoadmapCollabora3ons&GlobalOutreach
TechnicalOrganiza-ons
• MEPTEC• JointHeterogeneousIntegra-onSymposiumatSanJoseHolidayInnNovember14th,2016
• IEEEPowerElectronicsSociety• Jointplanningandcoopera-onongoing.
• IEEENanotechnologyCouncil• Discussionini-ated
• ITRI(Taiwan)• WorkshopSponsorAugust11,2016• Discussionongoing
TechnologyRoadmaps
• Interna-onalElectronicManufacturingIni-a-ve(INEMI)Roadmap• PSMR
• NIST,AIMPhotonics,MITPhotonics&INEMI
• IRDS• IEEEStandardsAssocia-on
• WideBandGapSemiconductorDevices• IEEEPowerElectronicSociety
HIR:FullEcosystemCollabora3on
EcosystemDesign
Materials
Equipment
IDM/Foundry OSAT
Fabless
EMS/PCBAssembly
System-OEM
FaceToFaceWorkshopsJuly2016Otherpar3cipantsonWebExConnec3on
FaceToFaceWorkshopsAugust2016
Tokyo,JapanAugust9,2016110Par3cipants
FaceToFaceWorkshopsAugust2016
Hsinchu,TaiwanAugust11,2016102Par3cipants
Wuhan,ChinaAugust12,201670+Par3cipants
FaceToFaceWorkshopsAugust2016
§ InthiseraofIoTquicklybecomingIoE,bigdata&analy-cstotheCloud,andsmartdeviceseverywhere,theroadmapmustbereinventedtomeettheneedsofourprofession,industry,academia,andreseachins-tutes.
§ TheHeterogeneousIntegra-onRoadmap(HIR)bringstogetherthetotalecosystemfromsystemtodevice,fromequipmenttomaterial,fromdesigntomanufacturing,andfromresearchtoindustry.• Iden-fyingdifficultchallenges• Proposingpoten-alsolu-onswherepossible
Projec3nga15yearhorizonformostareas,with25yearsforemergingresearchtopics
Summary
