hfss 3d geometry model development vendor partnering...modelithics and ansys are collaborating to...
TRANSCRIPT
Modelithics and ANSYS are collaborating to create a 3D Geometry Model
Development Vendor Partnering Program to enable the creation of a powerful,
multi-vendor 3D EM component library for HFSS used by design engineers
world-wide. The goal is to invite key vendors to cost share
model development and thereby accelerate their inclusion
within the already established Modelithics 3D Library for
ANSYS HFSS.
Modelithics Value-Adds:
Trusted relationships through the Modelithics Vendor Partner (MVP) Program.
Established business of supporting model libraries for EDA simulation tools.
Established format for 3D EM component model generation, validation, encryption and licensing.
Extensive measurement database for thousands of microwave components is available for model validation.
In-house capabilities allow for quick generation of new accurately de-embedded measurement data.
World’s Best RF & Microwave
Simulation Models
©Modelithics, Inc. 11/2018 Excellence in Modeling Since 2001!
Advantages for Vendors:
Meeting the Evolving Needs & Demands of Design Engineers Worldwide!
Provides a Competitive Advantage — lower cost than standard in-house modeling
Validated & Thoroughly Documented Models
Potential for Increased Component Sales = ROI!
Device IP Protected with Encryption Technology
Proprietary Device Information Required for 3D EM Analysis is Encrypted & Remains Confidential
Major OEMs are Requiring 3D Component Models
Don’t Get Left Behind!
Special Modeling Discounts also Available for Design Groups & OEMs.
Advantages of 3D Modeling:
Challenging design constraints require physics based models!
3D EM analysis offers designers insight into coupling and component interactions!
Increased customer first-pass design success!
HFSS™ 3D Geometry Model
Development Vendor Partnering
The Future
in Modeling!
Legend: Model to measurement comparison of S11 for closely-spaced capacitors mounted in shunt
configuration with component spacing varied. Red - closest spacing, blue - middle spacing, green -
furthest spacing. Solid lines – HFSS simulation results, Symbols – Measured Data.
Closely-Spaced Capacitors Mounted in Shunt Configuration
3D Simulation
World’s Best RF & Microwave
Simulation Models
©Modelithics, Inc. 10/2018 Excellence in Modeling Since 2001!
Modelithics 3D
Geometry Models
• Substrate Independent
• Full-wave 3D EM Simulation
• Predict Coupling and Shielding Effects
HFSS™ 3D Geometry Model
Development Vendor Partnering
Two Vendor Partner Options:
Level 1 - Participating: Provide access to 3D geometry/material
details to be shared under NDA, as needed to build accurate 3D EM
component models. Level 1 vendors are expected to also make
suggestions as to which of their components should be on the future
model development road map. Includes Cooperative MVP level.
Level 2- Premium: In addition to Level 1 geometry/material information, Level 2
vendors will provide cost shared funding to accelerate the development of Preferred
vendor’s component models on a priority basis over Level 1 projects. Includes
Sponsoring MVP level benefits*.
*Contact [email protected] for additional details.