HFT PIXEL Progress

Face to Face

13 May-2009

Wieman

1

Sector structures

2

ladder fabrication and tooling

3

ladder fabrication and tooling

4

ladder fabrication and tooling

5finalizing mechanical designs and developing rapid production methods

ladder fabrication and tooling

6

ladder withsilicon heaterchips(50 m thick)

wire bonding 50 m silicon to flex PC

7

vacuum chuck tosecure flex and siliconflat against solid surfaceto remove bounce

Any bounce then no bond

Good Newsafter a couple of minor modifications to the vacuum chuck thewire bonding machine is happyRhonda is happy

ladder to sector tooling fixtures (4 stations)

8

Air cooling of silicon detectors – Computational Fluid Dynamics (CFD) analysis

air flow path – flows along both inside and outside surface of the sector

• Silicon power: 100 mW/cm2 (~ power of sunlight)

• 240 W total Si + drivers

9

Air cooling – CFD analysis• air flow velocity 9-10 m/s• maximum temperature rise above

ambient: 12 deg C• sector beam surface – important

component to cooling• dynamic pressure force 1.7 times

gravity

stream lines with velocity

silicon surface temperature

velocity contours

10

Full sized cooling tests

Thermal camera window not shown

> 300 CFPM air flow for verification of cooling capability

Cooling tests will begin as soon as prototype sectors completed

9 inch diameter tube mocks upISC

11dust collector for air supply