high performance dram trend & future test...
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Confidential
High Performance DRAM Trend
& Future Test Requirements
DRAM Product Planning and Enabling OfficeSK hynix Inc.
1
Contents
II
ICT Trend
Memory Requirement by Key Applications
III Test Requirements
I
Visualization(VR/AR)
Connected(IoT)
Network & Storage
A.I. & Machine learning
Big Data
IT Trends Mobile & Wearable
ICT Mega Trend
The usage of smartphone to access data keeps increasing, and this makes client focus on developing Hybrid PCs for better mobility
Source : Stat Counter, 2014.12
Searching Info
2009 2014
99%
1%
65%
35%
Through PC Decreases
Through Mobile Increases
Good Mobility
High Performance
Developing toward..
Laptop Hybrid PC
DesktopFor Gaming, Workstation
Transition from PC Era to Mobile Era
As smartphone reached saturation, Wearable & IoT devices are leading the Post Mobile era and expand the area with smartphone as a Hub device
$387 $2602018F2012
Smartphone ASP Forecast
0
20
40
60
80
100
120
25%
102%
2008 20142010
SmartphoneGrowth Rate
-77%p
Post Mobile Application
Mobile NetworkAutomotive
Wearable Device & Sensor
Security
Smart Home Applications
Home Network
Hub / CentralControl device
Smartphone
Source : IDC 2014 / IDC, Gartner, Strategy Analytics, TrendSpectrum, 2014.12
Post-Mobile Era
* UHD: 3840 x 2160 QHD: 2560 x 1440
Higher
Resolution
Higher Data
Usage
Graphic
Performance
Improvement
Development of visualization in displays for UHD contents is driving hardware performance improvement.
110”
Computing
Mobile
5.7”4.x”3.5”
~10”
~30”
<30”
Time / Phase
TV
~ HD FHD/QHD UHD
Screen Size
Visualization for User Experience w/ UHD Contents
Source : Cisco 2015
IoE brings all things together through P2P, P2M, and M2M connections
& enables entirely new sets of applications and ways of business
IOEPeople to Machine(P2M)
Machine to Machine(M2M)
People to People(P2P)
• Mobility• Security• Borderless NTW
• Cloud• Vertical Solutions• Social Media
IoT
Collaboration
Data &Analytics
IoE (Internet of Everything)
• Data Center• Big Data• Cloud
M2M
P2P
P2M
Everything is Connected (Internet of Everything)
Automotive in IoT
Vehicle to Home Vehicle to Vehicle
Vehicle to Infrastructure
Cloud
Infotainment
Vehicle to Mobile/Wearable
Telematics Driver assistance
• Home gateway (Home appliance)
• Vehicle condition
• Control (window, air, light)
• Call (Pick me up)
• Navigation
• HUD (Head up display)
• Rear seat entertainment
• Data analysis (OEMs, insurance)
• UX (Driving pattern)
• System update
• Communicate with traffic infra
• Recognition (Speed, surround)
• Vehicle communication
• Parking assistance
• Pedestrian recognition
• Voice, motion recognition
• LTE network
• Emergency call
Source : SK hynix marketing
Autonomous Driving
• Sensor Fusion & DNN
A device is not solely operated itself but it connects devices around you for better services.
Performance
Power Consumption
Cost
HPC Extension
Mega datacenter Extension
Scale-up or Scale-out
Rack Disaggregation
Software Defined
Datacenter
Datacenter is evolving as the data increase explosively
And a strong network is vital to positioning Datacenter for the IoT era
NetworkIPv6, ONIE, SDN NFV
Data Center Oriented Infrastructure Changes
Source : SK hynix DRAM product planning & enabling office
DRAM Scaling Limits
ICT Trend & Value-chain
Big Data
IoT, IoE
Data in Motion
Analytics
simultaneous
Preparations
Data Center Traffic3.1ZB @’13 8.6ZB @’18 (CAGR23%)
Vertical Integration towardService-centric Industry
2006 (~um) 2016 (1x nm)
~9$
~0.x$# of Process StepsCAGR < 5%
Technology Complexity ∝ Capex Expenditure
# of Process StepsCAGR > 5%ASP CAGR -30%
(1Gb Eq.)
Follow the scalability requirement of system with
existing infra- structure
DDR4, P-DDR4, P-LPDDR4
Architecture Breakthrough to meet future system
performance requirement
Total OptimizationMemory hierarchy tiering Stacking technology
Evolutionary
Revolutionary
Database Serversin-MemoryComputing
System Architecture
HPC Memory Bandwidth/node100~500GB/s @’15 2~4TB/s @’19
Computing Intensive Data Intensive
Data
Query
?
Memory Hierarchy
Simultaneous
Changes
Networks
Role Sharing of Memory Solutions: B/W vs. Capacity
HBM*(B/W) HCM*
(Capacity)
* HBM : High Bandwidth Memory* HCM : High Capacity Memory
++
ICT Industry Outlook – Changes & Preparations
Contents
II
ICT Trend
Memory Requirement by Key Applications
III Test Requirements
I
DRAM Technology Changes – Evolutionary & Revolutionary
DRAM will have two separate tracks due to various market requirements
High CapacityMemory
High Bandwidth Memory
Persistent Memory
Bandwidth/ Latency
Density
Storage
DRAM
② RevolutionaryPath
② RevolutionaryPath
② RevolutionaryPath
① EvolutionaryPath
Longevity
“Market”
① Evolutionary Path : DRAM Volume Market with proven technology & Infrastructure② Revolutionary Path : Satisfy Performance hunger, requires New Solution/biz/Service model
DRAM Technology Trend – Evolutionary Path
Majority of DRAM solutions are continuously evolving and breaking through its limitations of bandwidth to meet the industry’s requirements
DRAM Bandwidth Trend by Mode (Mbps)
2000
36004000
5000
6000
7000 7000 7000
8000
10000
12000
14000
16000
10661333 1333
1600 1600 1866 2133
2133 24002666
32003733
4266
5333 5333
6400
667 8001066 1066
1600 16001866
3200 32003733
4266
5333
6400 6400
7466
2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
DDR3
P-LPDDR4
LPDDR4
LPDDR4XGDDR3
GDDR5
P-GDDR5
LPDDR2 LPDDR3DDR4
P-DDR4
* Source: SK hynix
Up to 30X of OLTP Performance Gains
Up to 100X of Faster Star Join Queries
90% of Disk Space SavingsCPU
~0.5 inch, delivers 256GB/s each
In-Package Memory In-Memory Computing
~5 inch, deliversmax. 25.6GB/s
Conventional DDR3/4 subsystem
100X of Area/Bandwidth
* Microsoft SQL Server Blog
MemoryRequest/Query
Results
CPU M/C
CPU M/C
Query
Results
Memory
Logi
c
Memory
Logi
c
Memory
Logi
c
Memory
Logi
c
DRAM Technology Trend – Revolutionary Path (1/2)
DRAM Technology Trend – Revolutionary Path (2/2)
CPU DD
R M
C
Existing Memory
I/O
Storage
[Existing System]
CPU
DD
R M
C Existing Memory
I/O
Storage
NEW
MC
Capacity Memory Solution
[New System]
HBM
Glo
bal
PH
Y
Flow Control
Media Controller
Co
mm
on
PH
Y
NewMemory
(DRAM, NAND, Emerging Memory)
Capacity Memory Solution
To Host
Memory Media Controller Memory Media
• I/O Performance Wall Limit
• DRAM Refresh Power Issues
• DRAM Reliability Issues
High Capacity & Memory-agnostic Solution
In-Memory Computing
Big data applications require instant data processing and analysis,
which makes companies turn to in-memory computing
HDD Time = 50 milisec
Memory Bandwidth >100GB/s
Database Analytic Servers Visualization & Reporting
Computing Intensive
Memory Bandwidth 1GB/s ~ 4GB/s
Data Results
RequestQuery
AnalyticsIn-memory Computing
Visualization & Reporting
Request/Query
Results
In-Memory Computing
Memory
CPU
In-MemoryComputing
50ns
* Source: SK hynix
Data Intensive
Gaming Graphics
High-end gaming Graphics drives needs for HBM products
with limited power consumption.
0
200
400
600
800
1000
1200
1400
8GB
12GB 16GB
24GB
32GB
System BW [GB/s]
□ HBM○ GDDR6○ GDDR5x- GDDR5
0
200
400
600
800
1000
1200
1400
0
4000
8000
12000
16000
20000
24000
28000
32000
2006 2008 2010 2012 2014 2016 2018 2020 2022
FB Size(MB)
* Raw data from Wikipedia
High-end Graphic Card FB Size/ Memory BW Trend
Density/ BW configuration
System BW(GB/s)
2018 2020
FB Size ~17GB ~24GB
Bandwidth ~630GB/s ~1000GB/s
20172014 2015 2016 2018 2019 2020 2021
LPDDR2, 800/1066
LPDDR3, 1600/1866
LPDDR4, 3200/3733
LPDDR4X, 3733/4266
LPDDR5, 4800/5333 (6400?)Arising LPDDR4 Derivatives for Low Power Request
LPDDR4/4X(~3200)
LPDDR4(3200/3733)
LPDDR4X(3733)
LPDDR4X(4266)
LPDDR4X(4266)
LPDDR5(4800/5333)
LPDDR5(6400?)
LPDDR4/4X(~3200)
LPDDR4/4X(3733~)
LPDDR4/4X(3733~)
LPDDR3(~1866)
LPDDR3(~1866)
LPDDR3(~1866)
Time
Performance
FOWLP
Source : SK hynix marketing
Mobile
High performance, high density while keeping low power Additionally requires thinner PKG thickness
Wire Bonding (WB)
Planer PKGw/ WB
Future Memory Hierarchy by Applications
#1. Cost optimum memory for general memory usage cases. #2. Additional Bandwidth and Low Power Memory Cost solution (2.5D or 3D Stacking)
HPC & Server
(B/W & Capacity)
Network& Graphics
(B/W)
Client-DT& NB
(B/W & Cost)
Mobile& Wearable
(LP, Small Form Factor, B/W &
Cost)
+
Bandwidth Solution
Cost Solution
+
Bandwidth Solution
Bandwidth Solution
+
Bandwidth Solution Capacity Solution
B/W
B/W &Capacity
B/W
B/WB/W & Cost
Post-DDR4
LP & Bandwidth Solution
LP & B/W
+
Post-DDR4
+
Contents
II
ICT Trend
Memory Requirement by Key Applications
III Test Requirements
I
Future Memory System with 2.5D and 3D Stack
PHYTSVDA ball
DRAM Slice
DRAM Slice
DRAM Slice
DRAM Slice
Interposer
SoC
PHY
Sid
e M
old
ing
Sid
e M
old
ing
SoC
DRAM Slice
DRAM Slice
PCB
2.5D Stack for HBMx Products- 1K IOs
3D Stack Concept- 512 IOs (WIDE IO SDR/DDR)
Industry has been focused on high bandwidth and low power solution with 2.5D and 3D stack products.
It requires advanced memory testing capability for wide IO memory cube.
Base die in KGSD consists of PHY, TSV and DA area. • PHY interconnects to host PHY• TSV interconnects to core slices• DA interconnects to PKG ball for DRAM test (limited pins)
Fine Ball Grid Array HBM in SiP
KGSD
ADD/CMD, DQ (RX/TX),
SIGNAL Connectivity Test
TSV OVERLAPDRAM POWER
Supply
DA BALL(Direct Access)
DFT(TEST Logic)
PHYTSV AreaDFT Area
Base Die
PHYTSVDA ball
DRAM Slice
DRAM Slice
DRAM Slice
DRAM Slice
Interposer
SoC
PHY
Sid
e M
old
ing
Sid
e M
old
ing
HBM2 KGSD
IEEE 1500 MBIST
DRAM CORE DIE
DRAM CORE DIE
DRAM CORE DIE
DRAM CORE DIE
DRAM BASE DIE
DAB
SLICE 3
SLICE 2
SLICE 1
SLICE 0
PHY
Future Test Requirements for Wide IO Products
DA pad (8DQs (for 1024 IO) and
address and control signals )
Requires to KGSD test via microbumps at PHY area without damage of itself.
HBM2 Memory Cube
Future Test Requirements for High Speed
CPU
Server CPU & Memory
………… Vref
Data Eye at Receiver
1600Mbps 3200Mbps 6400Mbps
Trend to have Rx equalizer in DRAM for multi-drop topologyNo way to measure eye margin at high speed interface along with multi-drop system.
?
Test Considerations
Each application needs the specific Packaging & test equipmentSpecially Commodity Memory needs Innovative pass/fail judge scheme under multi-
drop system beyond 4Gbps
PKGing Socket Testing
Mobile(PKG) Many ballsMulti-stacking
Fine pitchFine ball
P2PData eye for 8.5Gbps
High performance memory(2.5D/3D)
TSV stacking No SocketInterposer/Silicon
BISTIO Connectivity
Computing (DIMM) Conventional Narrow DIMM Pitch 고려 필요
Test timeData eye @ Multi-drop(up to 6.4Gbps)